IFX1763LDVXUMA1

IFX1763 Wide Input Range Low Noise 500mA LDO Data Sheet Rev. 1.1, 2014-10-30 Standard Power Wide Input Range Low Noise 500mA LDO 1 IFX1763 Overview Features • • • • • • • • • • • • • • • • • Low Noise down to 24 µVRMS (BW = 10 Hz to 100 kHz) 500 mA Current Capability Low Quiescent Current: 30 µA Wide Input Voltage Range: 1.8 V to 20 V 2.5% Output Voltage Accuracy (over full temperature and load range) Low Dropout Voltage: 320 mV Very low Shutdown Current: < 1 µA No Protection Diodes Needed Fixed Output Voltage: 3.3 V Adjustable Version with Output from 1.22 V to 20 V Stable with ≥ 3.3 µF Output Capacitor Stable with Aluminium, Tantalum or Ceramic Capacitors Reverse Battery Protection No Reverse Current Overcurrent and Overtemperature Protected DSO-8 Exposed Pad and TSON-10 Exposed Pad packages Green Product (RoHS compliant) PG-DSO-8 Exposed Pad PG-TSON-10 Applications • • • • • Microcontroller Supply Battery-Powered Systems Noise Sensitive Instruments Radar Applications Image Sensors The IFX1763 is not qualified and manufactured according to the requirements of Infineon Technologies with regards to automotive and/or transportation applications. For automotive applications please refer to the Infineon TLx (TLE, TLS, TLF.....) voltage regulator products. Type Package Marking IFX1763XEJ V PG-DSO-8 Exposed Pad 1763EV IFX1763XEJ V33 PG-DSO-8 Exposed Pad 1763EV33 IFX1763LD V PG-TSON-10 176LV IFX1763LD V33 PG-TSON-10 176LV33 Data Sheet 2 Rev. 1.1, 2014-10-30 IFX1763 Overview The IFX1763 is a micropower, low noise, low dropout voltage regulator. The device is capable of supplying an output current of 500 mA with a dropout voltage of 320 mV. Designed for use in battery-powered systems, the low quiescent current of 30 µA makes it an ideal choice. A key feature of the IFX1763 is its low output noise. By adding an external 0.01 µF bypass capacitor output noise values down to 24 µVRMS over a 10 Hz to 100 kHz bandwidth can be reached. The IFX1763 voltage regulator is stable with output capacitors as small as 3.3 µF. Small ceramic capacitors can be used without the series resistance required by many other regulators. Its internal protection circuitry includes reverse battery protection, current limiting and reverse current protection. The IFX1763 comes as fixed output voltage 3.3 V as well as adjustable device with a 1.22 V reference voltage. It is available in a DSO-8 Exposed Pad and as well as in a TSON-10 Exposed Pad package. Data Sheet 3 Rev. 1.1, 2014-10-30 IFX1763 Block Diagram 2 Block Diagram Note: Pin numbers in the block diagrams refer to the DSO-8 EP package type. Saturation Control IFX1763 IN 8 1 OUT EN 5 Bias BYP 4 Voltage reference Over Current Protection Temperature Protection Error Amplifier 2 SENSE 6 GND Figure 1 Block Diagram IFX1763 fixed voltage version Saturation Control IFX1763 ADJ IN 8 1 OUT EN 5 Bias BYP 4 Voltage reference Over Current Protection Temperature Protection Error Amplifier 2 ADJ 6 GND Figure 2 Data Sheet Block Diagram IFX1763 adjustable version 4 Rev. 1.1, 2014-10-30 IFX1763 Pin Configuration 3 Pin Configuration 3.1 Pin Assignment OUT 1 8 IN OUT 1 8 IN SENSE 2 7 NC ADJ 2 7 NC NC 3 6 GND NC 3 6 GND BYP 4 BYP 4 5 EN 9 9 5 EN IFX1763 XEJ V33 Figure 3 IFX1763XEJ V Pin Configuration of IFX1763 in PG-DSO-8 Exposed Pad for fixed voltage and adjustable version OUT OUT NC SENSE BYP 1 2 3 4 5 11 10 9 8 7 6 OUT OUT NC ADJ BYP IN IN NC EN GND Data Sheet 11 10 9 8 7 6 IN IN NC EN GND IFX1763LD V IFX1763LD V33 Figure 4 1 2 3 4 5 Pin Configuration of IFX1763 in PG-TSON-10 for fixed voltage and adjustable version 5 Rev. 1.1, 2014-10-30 IFX1763 Pin Configuration 3.2 Pin Definitions and Functions Pin Symbol Function 1 (DSO-8 EP) 1,2 (TSON-10) OUT Output. Supplies power to the load. For this pin a minimum output capacitor of 3.3 µF is required to prevent oscillations. Larger output capacitors may be required for applications with large transient loads in order to limit peak voltage transients or when the regulator is applied in conjunction with a bypass capacitor. For more details please refer to the section “Application Information” on Page 24. 2 (DSO-8 EP) 4 (TSON-10) SENSE Output Sense. For the fixed voltage version the SENSE pin is the input to the (fix voltage error amplifier. This allows to achieve an optimized regulation performance in version) case of small voltage drops Rp that occur between regulator and load. In applications where such drops are relevant they can be eliminated by connecting the SENSE pin directly at the load. In standard configurations the SENSE pin can be connected directly to the OUT pin. For further details please refer to the section “Kelvin Sense Connection” on Page 25. 2 (DSO-8 EP) 4 (TSON-10) Adjust. For the adjustable version the ADJ pin is the input to the error amplifier. ADJ (adjustable The ADJ pin voltage is 1.22V referenced to ground and allows an output voltage range from 1.22V to 20V - VDR. The ADJ pin is internally clamped to ±7 V. Please version) note that the bias current of the ADJ pin is flowing into the pin.1) 3, 7 (DSO-8 EP) NC 3, 8 (TSON-10) No Connect. The NC Pins have no connection to any internal circuitry. Connect either to GND or leave open. 4 (DSO-8) 5 (TSON-10) BYP Bypass. The BYP pin is used to bypass the reference of the IFX1763 to achieve low noise performance. The BYP-pin is clamped internally to ±0.6 V (i.e. one VBE). A small capacitor from the output to the BYP pin will bypass the reference to lower the output voltage noise2). If not used this pin must be left unconnected. 5 (DSO-8 EP) 7 (TSON-10) EN Enable. With the EN pin the IFX1763 can be put into a low power shutdown state. The output will be off when the EN is pulled low. The EN pin can be driven by 5V logic or open-collector logic with pull-up resistor. The pull-up resistor is required to supply the pull-up current of the open-collector gate3) and the EN pin current4). Please note that if the EN pin is not used it must be connected to VIN. It must not be left floating. 6 (DSO-8 EP) 6,(TSON-10) GND Ground. For the ADJ version connect the bottom of the output voltage setting resistor divider directly to the GND pin for optimum load regulation performance. 8 (DSO-8 EP) IN 9, 10 (TSON-10) Input. Via the input pin IN the power is supplied to the device. A capacitor at the input pin is required if the device is more than 6 inches away from the main input filter capacitor or if bigger inductance is present at the IN pin5). The IFX1763 is designed to withstand reverse voltages on the Input pin with respect to GND and Output. In the case of reverse input (e.g. due to a wrongly attached battery) the device will act as if there is a diode in series with its input. In this way there will be no reverse current flowing into the regulator and no reverse voltage will appear at the load. Hence, the device will protect both - the device itself and the load. 9 (DSO-8 EP) 11 (TSON-10) Exposed Pad. To ensure proper thermal performance,solder Pin 11 (exposed pad) of TSON-10 to the PCB ground and tie directly to Pin 6. In the case of DSO8 EP as well solder exposed pad (Pin 9) to the PCB ground and tie directly to Pin 6. Data Sheet Tab 6 Rev. 1.1, 2014-10-30 IFX1763 Pin Configuration 1) The typical value of the ADJ pin bias current is 60 nA with a very good temperature stability.See also the corresponding Typical Performance Graph “Adjust Pin Bias current IADJ versus Junction Temperature TJ” on Page 20. 2) A maximum value of 10 nF can be used for reducing output voltage noise over the bandwidth from 10 Hz to 100 kHz. 3) Normally several microamperes. 4) Typical value is 1 µA. 5) In general the output impedance of a battery rises with frequency, so it is advisable to include a bypass capacitor in batterypowered circuits. Depending on actual conditions an input capacitor in the range of 1 to 10 µF is sufficient. Data Sheet 7 Rev. 1.1, 2014-10-30 IFX1763 General Product Characteristics 4 General Product Characteristics 4.1 Absolute Maximum Ratings Table 1 Absolute Maximum Ratings1) Tj = -40 °C to +150 °C; all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Parameter Symbol Values Unit Note / Number Test Condition Min. Typ. Max. -20 – 20 V – P_4.1.1 VOUT -20 VIN - VOUT -20 – 20 V – P_4.1.2 – 20 V – P_4.1.3 VSENSE -20 – 20 V – P_4.1.4 VADJ -7 – 7 V – P_4.1.5 VBYP -0.6 – 0.6 V VEN -20 – 20 V – P_4.1.7 Tj Tstg -40 – 150 °C – P_4.1.8 -55 – 150 °C – P_4.1.9 VESD VESD -2 – 2 kV HBM2) P_4.1.10 kV 3) P_4.1.11 Input Voltage Voltage VIN Output Voltage Voltage Input to Output Differential Voltage Sense Pin Voltage ADJ Pin Voltage BYP Pin Voltage P_4.1.6 Enable Pin Voltage Temperatures Junction Temperature Storage Temperature ESD Susceptibility All Pins All Pins -1 – 1 CDM 1) Not subject to production test, specified by design. 2) ESD susceptibility, HBM according to ANSI/ESDA/JEDEC JS001 (1.5k Ω, 100 pF) 3) ESD susceptibility, Charged Device Model “CDM” according JEDEC JESD22-C101 Notes 1. Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not designed for continuous repetitive operation. Data Sheet 8 Rev. 1.1, 2014-10-30 IFX1763 General Product Characteristics 4.2 Functional Range Table 2 Functional Range Parameter Symbol Values Unit Note / Test Condition Number Min. Typ. Max. Input Voltage Range (3.3 V fix voltage version) VIN 3.8 V – 20 V – P_4.2.1 Input Voltage Range (adjustable voltage version) VIN 2.3 – 20 V –1) P_4.2.2 Operating Junction Temperature Tj -40 – 125 °C – P_4.2.3 1) For the IFX1763 adjustable version the minimum limit of the functional range VIN is tested and specified with the ADJ- pin connected to the OUT pin. Note: Within the functional or operating range, the IC operates as described in the circuit description. The electrical characteristics are specified within the conditions given in the Electrical Characteristics table. 4.3 Thermal Resistance Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go to www.jedec.org. Table 3 Thermal Resistance1) Parameter Symbol Values Min. Typ. Max. – 7.0 – Junction to Ambient RthJC RthJA RthJA RthJA – 66 – Junction to Ambient RthJA – 52 – 6.4 Junction to Ambient RthJC RthJA RthJA RthJA Junction to Ambient RthJA Unit Note / Test Condition Number K/W – P_4.3.1 IFX1763X EJ (PG-DSO-8 Exposed Pad) Junction to Case Junction to Ambient Junction to Ambient – – 39 155 – – K/W K/W – 2) P_4.3.2 Footprint only 3) P_4.3.3 K/W 2 300 mm heatsink area on PCB3) P_4.3.4 – K/W 600 mm2 heatsink area on PCB3) P_4.3.5 – K/W – P_4.3.6 IFX1763 LD (PG-TSON-10) Junction to Case Junction to Ambient Junction to Ambient – 53 – K/W – 2) P_4.3.7 3) – 183 – K/W Footprint only – 69 – K/W 300 mm2 heatsink area on PCB3) P_4.3.8 P_4.3.9 – 57 – K/W 600 mm2 heatsink area on PCB3) P_4.3.10 1) Not subject to production test, specified by design. Data Sheet 9 Rev. 1.1, 2014-10-30 IFX1763 General Product Characteristics 2) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product (Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu). Where applicable a thermal via array under the exposed pad contacted the first inner copper layer. 3) Specified RthJA value is according to JEDEC JESD 51-3 at natural convection on FR4 1s0p board; The Product (Chip+Package) was simulated on a 76.2 × 114.3 × 1.5 mm3 board with 1 copper layer (1 x 70µm Cu). Data Sheet 10 Rev. 1.1, 2014-10-30 IFX1763 Electrical Characteristics 5 Electrical Characteristics 5.1 Electrical Characteristics Table Table 4 Electrical Characteristics -40 °C < Tj < 125 °C; all voltages with respect to ground; positive current defined flowing out of pin; unless otherwise specified. Parameter Symbol Values Unit Note / Test Condition Number Min. Typ. Max. VIN,min – 1.8 2.3 V IOUT = 500 mA1)2)3) P_5.1.1 IFX1763XEJ V33 IFX1763LD V33 VOUT 3.220 3.30 3.380 V 1m A < IOUT < 500 mA, 4.3 V < VIN < 20 V P_5.1.2 IFX1763XEJ V IFX1763LD V VOUT 1.190 1.22 1.250 V 1m A < IOUT < 500 mA; 2.3 V < VIN < 20 V3) P_5.1.3 IFX1763XEJ V33 IFX1763LD V33 ∆VOUT – 1 20 mV P_5.1.4 IFX1763XEJ V IFX1763LD V ∆VOUT – 1 20 mV ∆VIN = 3.8 V to 20 V; IOUT = 1 mA ∆VIN = 2.0 V to 20 V; IOUT = 1 mA3) IFX1763XEJ V33 IFX1763LD V33 ∆VOUT – 9 22 mV IFX1763XEJ V33 IFX1763LD V33 ∆VOUT – – 38 mV IFX1763XEJ V IFX1763LD V ∆VOUT – 4 8 mV IFX1763XEJ V IFX1763LD V ∆VOUT – – 14 mV Dropout Voltage VDR – 100 130 mV Dropout Voltage VDR – – 190 mV Dropout Voltage VDR – 150 190 mV Dropout Voltage VDR – – 250 mV Dropout Voltage VDR – 190 220 mV Dropout Voltage VDR – – 300 mV Dropout Voltage VDR – 320 350 mV Minimum Operating Voltage 4) Output Voltage Line Regulation P_5.1.5 Load Regulation TJ = 25°C;VIN = 4.3 V; ∆ IOUT = 1 to 500 mA VIN = 4.3 V; ∆ IOUT = 1 to 500 mA TJ = 25°C; VIN = 2.3 V; ∆IOUT = 1 to 500 mA3) VIN = 2.3 V; ∆IOUT = 1 to 500 mA3) P_5.1.6 P_5.1.7 P_5.1.8 P_5.1.9 Dropout Voltage2)5)6) Data Sheet 11 IOUT = 10 mA; VIN = VOUT,nom; TJ = 25°C IOUT = 10 mA; VIN = VOUT,nom IOUT = 50 mA; VIN = VOUT,nom; TJ = 25°C IOUT = 50 mA; VIN = VOUT,nom IOUT = 100 mA; VIN = VOUT,nom; TJ = 25°C IOUT = 100 mA; VIN = VOUT,nom IOUT = 500 mA; VIN = VOUT,nom; TJ = 25°C P_5.1.10 P_5.1.11 P_5.1.12 P_5.1.13 P_5.1.14 P_5.1.15 P_5.1.16 Rev. 1.1, 2014-10-30 IFX1763 Electrical Characteristics Table 4 Electrical Characteristics (cont’d) -40 °C < Tj < 125 °C; all voltages with respect to ground; positive current defined flowing out of pin; unless otherwise specified. Parameter Symbol Values Unit Note / Test Condition Number Min. Typ. Max. VDR – – 450 mV IOUT = 500 mA; VIN = VOUT,nom P_5.1.17 GND Pin Current IGND – 30 60 µA P_5.1.18 GND Pin Current IGND – 50 100 µA GND Pin Current IGND – 300 850 µA GND Pin Current IGND – 0.7 2.2 mA GND Pin Current IGND – 3 8 mA GND Pin Current IGND – 11 22 mA GND Pin Current IGND – 11 31 mA – 0.1 1 µA VIN = VOUT,nom; IOUT = 0 mA VIN = VOUT,nom; IOUT = 1 mA VIN = VOUT,nom; IOUT = 50 mA VIN = VOUT,nom; IOUT = 100 mA VIN = VOUT,nom; IOUT = 250 mA VIN = VOUT,nom; IOUT = 500 mA; TJ ≥ 25°C VIN = VOUT,nom; IOUT = 500 mA; TJ < 25°C VIN = 6 V; VEN = 0 V; TJ = 25°C Vth,EN Vtl,EN IEN IEN – 0.8 2.0 V 0.25 0.65 – V – 0.01 – µA – 1 – Ibias,ADJ – 60 eno – 41 Dropout Voltage GND Pin Current5)7) Quiescent Current in Off-Mode Iq (EN-pin low) P_5.1.19 P_5.1.20 P_5.1.21 P_5.1.22 P_5.1.23 P_5.1.24 P_5.1.25 Enable Enable Threshold High Enable Threshold Low EN Pin Current 8) EN Pin Current 8) P_5.1.26 µA VOUT = Off to On VOUT = On to Off VEN = 0 V; TJ = 25°C VEN = 20 V; TJ = 25°C – nA TJ = 25°C P_5.1.30 – µVRMS COUT = 10 µF ceramic; CBYP = 10 nF; IOUT = 500 mA; P_5.1.27 P_5.1.28 P_5.1.29 9)11) Adjust Pin Bias Current ADJ Pin Bias Current 11) Output Voltage Noise Output Voltage Noise IFX1763XEJ V10) IFX1763LD V10) P_5.1.31 (BW = 10 Hz to 100 kHz) Output Voltage Noise IFX1763XEJ V10) IFX1763LD V10) eno Output Voltage Noise IFX1763XEJ V10) IFX1763LD V10) eno – 28 – µVRMS COUT = 10 µF ceramic P_5.1.32 +250mΩ resistor in series; CBYP = 10 nF; IOUT = 500 mA; (BW = 10 Hz to 100 kHz) – 29 – µVRMS COUT = 22 µF ceramic; CBYP = 10 nF; IOUT = 500 mA; P_5.1.33 (BW = 10 Hz to 100 kHz) Data Sheet 12 Rev. 1.1, 2014-10-30 IFX1763 Electrical Characteristics Table 4 Electrical Characteristics (cont’d) -40 °C < Tj < 125 °C; all voltages with respect to ground; positive current defined flowing out of pin; unless otherwise specified. Parameter Symbol Output Voltage Noise IFX1763XEJ V10) IFX1763LD V10) eno Output Voltage Noise IFX1763XEJ V33 IFX1763LD V33 eno Values Unit Min. Typ. Max. – 24 – Note / Test Condition µVRMS COUT = 22 µF ceramic Number P_5.1.34 +250mΩ resistor in series; CBYP = 10 nF; IOUT = 500 mA; (BW = 10 Hz to 100 kHz) – 45 – µVRMS COUT = 10 µF ceramic; CBYP = 10 nF; IOUT = 500 mA; P_5.1.35 (BW = 10 Hz to 100 kHz) Output Voltage Noise IFX1763XEJ V33 IFX1763LD V33 eno Output Voltage Noise IFX1763XEJ V33 IFX1763LD V33 eno – 35 – µVRMS COUT = 10 µF ceramic P_5.1.36 +250mΩ resistor in series; CBYP = 10 nF; IOUT = 500 mA; (BW = 10 Hz to 100 kHz) – 33 – µVRMS COUT = 22 µF ceramic; CBYP = 10 nF; IOUT = 500 mA; P_5.1.37 (BW = 10 Hz to 100 kHz) eno Output Voltage Noise IFX1763XEJ V33 IFX1763LD V33 – 30 – µVRMS COUT = 22 µF ceramic P_5.1.38 +250mΩ resistor in series; CBYP = 10 nF; IOUT = 500 mA; (BW = 10 Hz to 100 kHz) Power Supply Ripple Rejection11) Power Supply Ripple Rejection PSRR 50 65 – dB VIN - VOUT = 1.5V (avg); P_5.1.39 VRIPPLE = 0.5Vpp; fr = 120Hz; IOUT = 500mA 520 – – mA P_5.1.40 520 – – mA VIN = 7 V; VOUT = 0 V VIN = VOUT,nom + 1 V or Output Current Limitation IOUT,limit IOUT,limit Output Current Limit Output Current Limit P_5.1.41 2.3 V12); ∆VOUT = -0.1 V Input Reverse Leakage Current Ileak,rev – – 1 mA VIN = -20 V; VOUT = 0 V P_5.1.42 Fixed Voltage Versions IReverse – 10 20 µA P_5.1.43 Adjustable Voltage Version IReverse – 5 10 µA VOUT = VOUT,nom; VIN < VOUT,nom; TJ = 25°C VOUT = 1.22 V; VIN < 1.22 V; TJ = 25°C3) Input Reverse Leakage Reverse Output Current Data Sheet 13) 13 P_5.1.44 Rev. 1.1, 2014-10-30 IFX1763 Electrical Characteristics Table 4 Electrical Characteristics (cont’d) -40 °C < Tj < 125 °C; all voltages with respect to ground; positive current defined flowing out of pin; unless otherwise specified. Parameter Symbol Values Unit Note / Test Condition Number Min. Typ. Max. 3.3 – – µF CBYP = 0 nF P_5.1.45 14) – 3 Ω – P_5.1.46 11) Output Capacitor Output Capacitance ESR COUT ESR – 1) This parameter defines the minimum input voltage for which the device is powered up and provides the maximum output current of 500 mA. Due to the nominal output voltage of 3.3 V of the fixed voltage version or depending on the chosen setting of the external voltage divider as well as on the applied conditions the device may either regulate its nominal output voltage or it may be in tracking mode. For further details please also refer to the VOUT specification in Table 4. 2) For the IFX1763XEJ V and IFX1763LD V adjustable versions the dropout voltage for certain output voltage / load conditions will be restricted by the minimum input voltage specification. 3) The adjustable versions of the IFX1763 are tested and specified for these conditions with the ADJ pin connected to the OUT pin. 4) The operation conditions are limited by the maximum junction temperature. The regulated output voltage specification will only apply for conditions where the limit of the maximum junction temperature is fulfilled. It will therefore not apply for all possible combinations of input voltage and output current at a given output voltage. When operating at maximum input voltage, the output current must be limited for thermal reasons. The same holds true when operating at maximum output current where the input voltage range must be limited for thermal reasons. 5) To satisfy requirements for minimum input voltage, the adjustable version of the IFX1763 is tested and specified for these conditions with an external resistor divider (two 250 kΩ resistors) for an output voltage of 2.44 V. The external resistors will add a 5 µA DC load on the output. 6) The dropout voltage is the minimum input to output voltage differential needed to maintain regulation at a specified output current. In dropout, the output voltage will be equal to VIN - VDR. 7) GND-pin current is tested with VIN=VOUT,nom or VIN = 2.3 V, whichever is greater, and a current source load. This means that this parameter is tested while being in dropout condition and thus reflects a worst case condition. The GND-pin current will in most cases decrease slightly at higher input voltages - please also refer to the corresponding typical performance graphs. 8) The EN pin current flows into EN pin. 9) The ADJ pin current flows into ADJ pin. 10) ADJ pin connected to OUT pin. 11) Not subject to production test, specified by design. 12) whichever of the two values of VIN is greater in order to also satisfy the requirements for VIN,min. 13) Reverse output current is tested with the IN pin grounded and the OUT pin forced to the rated output voltage. This current flows into the OUT pin and out of the GND pin. 14) CBYP = 0 nF, COUT ≥ 3.3 µF; please note that for cases where a bypass capacitor at BYP is used - depending on the actual applied capacitance of COUT and CBYP - a minimum requirement for ESR may apply. For further details please also refer to the corresponding typical performance graph. Note: The listed characteristics are ensured over the operating range of the integrated circuit. Typical characteristics specified mean values expected over the production spread. If not otherwise specified, typical characteristics apply at TA = 25 °C and the given supply voltage. Data Sheet 14 Rev. 1.1, 2014-10-30 IFX1763 Typical Performance Characteristics 6 Typical Performance Characteristics Dropout Voltage VDR versus Output Current IOUT Guaranteed Dropout Voltage VDR versus Output Current IOUT 500 500 450 450 400 400 350 350 300 300 VDR [mV] VDR [mV] Δ = Guaranteed Limits 250 250 200 200 150 150 100 100 Tj = −40 °C Tj = 25 °C 50 Tj ≤ 25 °C 50 Tj = 125 °C 0 0 100 200 300 IOUT [A] 400 Dropout Voltage VDR versus Junction Temperature TJ Tj ≤ 125 °C 0 500 0 100 200 300 IOUT [A] 400 500 Quiescent Current versus Junction Temperature TJ 500 50 IOUT = 10 mA 450 IOUT = 100 mA 40 IOUT = 500 mA 350 35 300 30 Iq [µA] VDR [mV] 400 45 IOUT = 50 mA 250 25 200 20 150 15 100 10 50 5 0 −50 Data Sheet 0 50 Tj [°C] 0 −50 100 15 VIN = 6 V IOUT = 0 mA . VEN = VIN 0 50 Tj [°C] 100 Rev. 1.1, 2014-10-30 IFX1763 Typical Performance Characteristics Output Voltage VOUT versus Junction Temperature TJ (IFX1763XEJ V33) Output / ADJ Pin Voltage VOUT versus Junction Temperature TJ (IFX1763XEJ V) 3.36 1.24 1.235 3.34 1.23 ADJ Pin Voltage [V] VOUT [V] 3.32 3.3 1.225 1.22 1.215 3.28 1.21 3.26 1.205 IOUT = 1 mA 3.24 −50 0 IOUT = 1 mA 50 Tj [°C] 1.2 −50 100 800 40 700 35 600 30 500 25 400 300 100 20 15 VOUT,nom = 3.3 V IOUT,nom = 0 mA VEN = VIN Tj = 25 °C 200 100 0 50 Tj [°C] Quiescent Current Iq versus Input Voltage VIN (IFX1763XEJ V) IGND [µA] IGND [µA] Quiescent Current Iq versus Input Voltage VIN (IFX1763XEJ V33) 0 0 2 4 6 8 10 5 0 10 VIN [V] Data Sheet VOUT,nom = 1.22 V RLoad = 250 kΩ VEN = VIN Tj = 25 °C 16 0 5 10 VIN [V] 15 20 Rev. 1.1, 2014-10-30 IFX1763 Typical Performance Characteristics GND Current IGND versus Input Voltage VIN (IFX1763XEJ V33) GND Current IGND versus Input Voltage VIN (IFX1763XEJ V) 1200 400 RLoad = 3.3 kΩ / IOUT = 1 mA* RLoad = 1.22 kΩ / IOUT = 1 mA* RLoad = 330 Ω / IOUT = 10 mA* RLoad = 122 Ω / IOUT = 10 mA* 350 RLoad = 66 Ω / IOUT = 50 mA* 1000 RLoad = 24.4 Ω / IOUT = 50 mA* [* for VOUT = 3.3 V] Tj = 25°C [* for VOUT = 1.22 V] Tj = 25°C 300 800 IGND [µA] IGND [µA] 250 600 200 150 400 100 200 50 0 0 2 4 6 8 0 10 0 2 4 VIN [V] GND Current IGND versus Input Voltage VIN (IFX1763XEJ V33) 10 16000 RLoad = 33.0 Ω / IOUT = 100 mA* RLoad = 12.2 Ω / IOUT = 100 mA* RLoad = 11.0 Ω / IOUT = 300 mA* 14000 RLoad = 4.07 Ω / IOUT = 300 mA* 14000 RLoad = 6.60 Ω / IOUT = 500 mA *. RLoad = 2.44 Ω / IOUT = 500 mA *. [* for VOUT = 3.3 V] Tj = 25°C 12000 [* for VOUT = 1.22 V] Tj = 25°C 12000 10000 IGND [µA] 10000 IGND [µA] 8 GND Current IGND versus Input Voltage VIN (IFX1763XEJ V) 16000 8000 8000 6000 6000 4000 4000 2000 2000 0 6 VIN [V] 0 2 4 6 8 0 10 VIN [V] Data Sheet 0 2 4 6 8 10 VIN [V] 17 Rev. 1.1, 2014-10-30 IFX1763 Typical Performance Characteristics GND Current IGND versus Output Current IOUT EN Pin Threshold (On-to-Off) versus Junction Temperature TJ 1.2 12 1 mA 500 mA 10 1 8 0.8 VEN,th [V] IGND [mA] VIN = VOUT,nom + 1 V Tj = 25 ° C 6 0.6 4 0.4 2 0.2 0 0 100 200 300 IOUT [mA] 400 EN Pin Threshold (Off-to-On) versus Junction Temperature TJ 0 −50 500 0 50 Tj [°C] 100 EN Pin Input Current versus EN Pin Voltage VEN 1.2 1.4 Tj = 25 °C VIN = 20 V 1 mA 500 mA 1.2 1 1 IEN [µA] VEN,th [V] 0.8 0.6 0.8 0.6 0.4 0.4 0.2 0 −50 Data Sheet 0.2 0 50 Tj [°C] 0 100 18 0 5 10 VEN [V] 15 20 Rev. 1.1, 2014-10-30 IFX1763 Typical Performance Characteristics Current Limit versus Input Voltage VIN EN Pin Input Current versus Junction Temperature TJ 1.6 1 VEN = 20 V VOUT = 0 V Tj = 25 ° C 0.9 1.4 0.8 1.2 0.7 IOUT,max [A] IEN [µA] 1 0.8 0.6 0.5 0.4 0.6 0.3 0.4 0.2 0.2 0 −50 0.1 0 50 Tj [°C] 0 100 Current Limit versus Junction Temperature TJ 0 1 2 3 4 VIN [V] 5 6 7 Reverse Output Current versus Output Voltage VOUT 1.2 90 VOUT.nom = 1.22 V (ADJ) VIN = 7 V VOUT = 0 V VOUT.nom = 3.3 V (V33) 80 1 70 VIN = 0 V Tj = 25 °C 60 IOUT,rev [µA] IOUT,max [A] 0.8 0.6 0.4 50 40 30 20 0.2 10 0 −50 Data Sheet 0 50 Tj [°C] 0 100 0 2 4 6 8 10 VOUT [V] 19 Rev. 1.1, 2014-10-30 IFX1763 Typical Performance Characteristics Minimum Input Voltage1) versus Junction Temperature TJ Reverse Output Current versus Junction Temperature TJ 20 2.5 VOUT.nom = 1.22 V (ADJ) 18 VOUT.nom = 3.3 V (V33) 16 VIN = 0 V 12 1.5 VIN,min [V] IOUT,rev [µA] 14 2 10 8 1 6 4 0.5 IOUT = 100 mA 2 IOUT = 500 mA 0 −50 0 50 Tj [°C] 0 −50 100 0 50 Tj [°C] 100 Adjust Pin Bias current IADJ versus Junction Temperature TJ Load Regulation versus Junction Temperature TJ 5 140 V33: VIN = 4.3 V VOUT.nom = 3.3 V ADJ: VIN = 2.3 V VOUT.nom = 1.22 V 120 0 100 IADJ [nA] ΔVLoad [mV] −5 −10 80 60 −15 40 −20 20 ΔILoad = 1 mA to 500 mA −25 −50 1) 0 50 Tj [°C] 0 −50 100 0 50 Tj [°C] 100 VIN,min is referred here as the minimum input voltage for which the requested current is provided and VOUT reaches 1 V. Data Sheet 20 Rev. 1.1, 2014-10-30 IFX1763 Typical Performance Characteristics ESR(COUT) with CBYP = 10 nF versus Output Capacitance COUT ESR Stability versus Output Current IOUT (for COUT = 3.3 µF) 3 1 10 CByp = 10 nF measurement limit 2.5 ESR(COUT) [Ω] ESR(COUT) [Ω] 2 ESRmax CByp = 0 nF 0 10 ESRmin CByp = 0 nF ESRmax CByp = 10 nF ESRmin CByp = 10 nF stable region above blue line 1.5 1 COUT = 3.3 µF (0.06 Ω is measurement limit) 0.5 −1 10 0 100 200 300 IOUT [mA] 400 0 500 Input Ripple Rejection PSRR versus Frequency f 2 3 4 5 COUT [µF] 6 7 Input Ripple Rejection PSRR versus Junction Temperature TJ 68 100 VIN = VOUTnom + 1.5 V Vripple = 0.5 Vpp COUT = 10 µF 90 66 80 64 70 62 PSRR [dB] PSRR [dB] 60 50 40 60 58 30 56 20 IOUT =500mA CBYP =0 nF IOUT =500mA CBYP =10nF 10 54 IOUT =50mA CBYP =0 nF Data Sheet 100 1k f [Hz] IOUT =500mA CBYP =0 nF IOUT =500mA CBYP =10nF IOUT =50mA CBYP =10nF 0 10 VIN = VOUTnom + 1.5 V Vripple = 0.5 Vpp fripple = 120 Hz COUT = 10 µF 10k 52 −50 100k 21 0 50 Tj [°C] 100 Rev. 1.1, 2014-10-30 IFX1763 Typical Performance Characteristics Output Noise Spectral Density (ADJ) versus Frequency (COUT = 10 µF, IOUT = 50 mA1)) Output Noise Spectral Density (ADJ) versus Frequency (COUT = 22 µF, IOUT = 50 mA1)) 1 1 10 10 COUT = 22 µF IOUT = 50 mA √ Output Spectral Noise Density μV/ Hz √ Output Spectral Noise Density μV/ Hz COUT = 10 µF IOUT = 50 mA 0 10 −1 10 CByp = 0 nF; ESR(COUT)=0 CByp = 10 nF; ESR(COUT)=0 CByp = 10 nF; ESR(COUT)=250mΩ −2 10 1 10 2 10 3 4 10 f [Hz] 10 0 10 −1 10 CByp = 0 nF; ESR(COUT)=0 CByp = 10 nF; ESR(COUT)=0 CByp = 10 nF; ESR(COUT)=250mΩ −2 10 5 10 Output Noise Spectral Density (3.3 V) versus Frequency (COUT = 10 µF, IOUT = 50 mA1)) 1 10 2 10 3 4 10 f [Hz] 10 Output Noise Spectral Density (3.3 V) versus Frequency (COUT = 22µF, IOUT = 50mA1)) 1 1 10 10 COUT = 22 µF IOUT = 50 mA √ Output Spectral Noise Density μV/ Hz √ Output Spectral Noise Density μV/ Hz COUT = 10 µF IOUT = 50 mA 0 10 −1 10 CByp = 0 nF; ESR(COUT)=0 CByp = 10 nF; ESR(COUT)=0 CByp = 10 nF; ESR(COUT)=250mΩ −2 10 5 10 1 10 2 10 3 10 f [Hz] 4 10 0 10 −1 10 CByp = 0 nF; ESR(COUT)=0 CByp = 10 nF; ESR(COUT)=0 CByp = 10 nF; ESR(COUT)=250mΩ −2 10 5 10 1 10 2 10 3 10 f [Hz] 4 10 5 10 1) Load condition 50mA is representing a worst case condition with regard to output voltage noise performance. Data Sheet 22 Rev. 1.1, 2014-10-30 IFX1763 Typical Performance Characteristics Transient Response CBYP = 0nF (IFX1763XEJ V33) 0,15 0,3 COUT = 10 µF CBYP = 0 nF VIN = 6 V 0,2 COUT = 10 µF CBYP = 10 nF VIN = 6V 0,1 0,1 VOUT Deviation / [V] VOUT Deviation / [V] Transient Response CBYP = 10nF (IFX1763XEJ V33) 0 -0,1 0,05 0 -0,05 -0,1 -0,2 -0,15 -0,3 0 100 200 300 400 500 Time (μs) 600 700 800 900 0 1000 20 30 40 50 Time / [μs] 60 70 80 90 100 30 40 50 Time / [μs] 60 70 80 90 100 600 600 IOUT : 100 to 500mA IOUT : 100 to 500mA 500 500 400 400 Load Step / [V] Load Step / [mA] 10 300 300 200 200 100 100 0 0 0 100 Data Sheet 200 300 400 500 Time (μs) 600 700 800 900 0 1000 23 10 20 Rev. 1.1, 2014-10-30 IFX1763 Application Information 7 Application Information Note: The following information is given as a hint for the implementation of the device only and shall not be regarded as a description or warranty of a certain functionality, condition or quality of the device. IFX1763 VIN IN V OUT OUT CIN SENSE 1µF EN CBYP COUT 10nF 10µF R Load BYP GND GND Figure 5 Typical Application Circuit IFX1763 (fixed voltage version) IFX1763 ADJ VIN IN V OUT OUT CIN R2 ADJ CBYP 1µF EN R1 10nF BYP COUT R Load 10µF GND GND Calculation of V OUT: Figure 6 V OUT = 1.22V x (1 + R2 / R1) + (IADJ x R2) Typical Application Circuit IFX1763 (adjustable version) Note: This is a very simplified example of an application circuit. The function must be verified in the real application1)2). 1) Please note that in case a non-negligible inductance at IN pin is present, e.g. due to long cables, traces, parasitics, etc, a bigger input capacitor CIN may be required to filter its influence. As a rule of thumb if the IN pin is more than six inches away from the main input filter capacitor an input capacitor value of CIN = 10 µF is recommended. 2) For specific needs a small optional resistor may be placed in series to very low ESR output capacitors COUT for enhanced noise performance (for details please see “Bypass Capacitance and Low Noise Performance” on Page 25). Data Sheet 24 Rev. 1.1, 2014-10-30 IFX1763 Application Information The IFX1763 is a 500 mA low dropout regulator with very low quiescent current and Enable-functionality. The device is capable of supplying 500 mA at a dropout voltage of 320 mV. Output voltage noise numbers down to 24 µVRMS can be achieved over a 10 Hz to 100 kHz bandwidth with the addition of a 10 nF reference bypass capacitor. The usage of a reference bypass capacitor will additionally improve transient response of the regulator, lowering the settling time for transient load conditions. The device has a low operating quiescent current of typical 30 µA that drops to less than 1 µA in shutdown (EN-pin pulled to low level). The device also incorporates several protection features which makes it ideal for battery-powered systems. It is protected against both reverse input and reverse output voltages. In battery backup applications where the output can be held up by a backup battery when the input is pulled to ground the device behaves like it has a diode in series with its output and prevents reverse current flow. 7.1 Adjustable Operation The adjustable version of the IFX1763 has an output voltage range of 1.22 V to 20 V - VDR. The output voltage is set by the ratio of two external resistors, as it can be seen in Figure 6 (for the calculation of VOUT the formula given in the figure can be used). The device controls the output to maintain the ADJ pin at 1.22 V referenced to ground. The current in R1 is then equal 1.22 V / R1 and the current in R2 equals the current in R1 plus the ADJ pin bias current. The ADJ pin bias current, which is ~ 60 nA @ 25°C, flows through R2 into the ADJ pin. The value of R1 should be not greater than 250 kΩ in order to minimize errors in the output voltage caused by the ADJ pin bias current. Note that when the device is shutdown (i.e. low level applied to EN pin) the output is turned off and consequently the divider current will be zero. For details of the ADJ pin bias current see also the corresponding typical performance graph Figure “Adjust Pin Bias current IADJ versus Junction Temperature TJ” on Page 20. 7.2 Kelvin Sense Connection For the fixed voltage version of the IFX1763 the SENSE pin is the input to the error amplifier. An optimum regulation will be obtained at the point where the SENSE pin is connected to the OUT pin of the regulator. In critical applications however small voltage drops can be caused by the resistance Rp of the PC-traces and thus may lower the resulting voltage at the load. This effect may be eliminated by connecting the SENSE pin to the output as close as possible at the load (see Figure 7). Please note that the voltage drop across the external PC trace will add up to the dropout voltage of the regulator. IFX1763 IN VIN CIN RP OUT SENSE EN COUT R Load BYP GND RP Figure 7 Kelvin Sense Connection 7.3 Bypass Capacitance and Low Noise Performance The IFX1763 regulator may be used in combination with a bypass capacitor connecting the OUT pin to the BYP pin in order to minimize output voltage noise1).This capacitor will bypass the reference of the regulator, providing 1) a good quality low leakage capacitor is recommended. Data Sheet 25 Rev. 1.1, 2014-10-30 IFX1763 Application Information a low frequency noise pole. The noise pole provided by such a bypass capacitor will lower the output voltage noise in the considered bandwidth. For a given output voltage actual numbers of the output voltage noise will - next to the bypass capacitor itself - be dependent on the capacitance of the applied output capacitor and its ESR: In case of the IFX1763XEJ V applied with unity gain (i.e. VOUT = 1.22 V) the usage of a bypass capacitor of 10 nF in combination with a (low ESR) ceramic COUT of 10 µF will result in output voltage noise numbers of typical 41 µVRMS. This Output Noise level can be reduced to typical 28 µVRMS under the same conditions by adding a small resistor of ~250 mΩ in series to the 10 µF ceramic output capacitor acting as additional ESR. A reduction of the output voltage noise can also be achieved by increasing capacitance of the output capacitor. For COUT = 22 µF (ceramic low ESR) the output voltage noise will be typically around 29 µVRMS and can again be further lowered to 24 µVRMS by adding a small resistance of ~250 mΩ in series to COUT. In case of the fix voltage version IFX1763XEJ V33 the output voltage noise for the described cases vary from 45 µVRMS down to 30 µVRMS. For further details please also see “Output Voltage Noise11)” on Page 12,, of the Electrical Characteristics. Please note that next to reducing the output voltage noise level the usage of a bypass capacitor has the additional benefit of improving transient response which will be also explained in the next chapter. However one needs to take into consideration that on the other hand the regulator start-up time is proportional to the size of the bypass capacitor and slows down to values around 15 ms when using a 10 nF bypass capacitor in combination with a 10 µF COUT output capacitor. 7.4 Output Capacitance Requirements and Transient Response The IFX1763 is designed to be stable with a wide range of output capacitors. The ESR of the output capacitor is an essential parameter with regard to stability, most notably with small capacitors. A minimum output capacitor of 3.3 µF with an ESR of 3 Ω or less is recommended to prevent oscillations. Like in general for LDO’s the output transient response of the IFX1763 will be a function of the output capacitance. Larger values of output capacitance decrease peak deviations and thus improve transient response for larger load current changes. Bypass capacitors, used to decouple individual components powered by the IFX1763 will increase the effective output capacitor value. Please note that with the usage of bypass capacitors for low noise operation either larger values of output capacitors are needed or a minimum ESR requirement of COUT may have to be considered (see also Figure “ESR(COUT) with CBYP = 10 nF versus Output Capacitance COUT” on Page 21 as example). In conjunction with the usage of a 10 nF bypass capacitor an output capacitor COUT ≥ 6.8 µF is recommended. The benefit of a bypass capacitor to the transient response performance is impressive and illustrated as one example in Figure 8 where the transient response of the IFX1763XEJ V33 to one and the same load step from 100 mA to 500 mA is shown with and without a 10 nF bypass capacitor: for the given configuration of COUT = 10 µF with no bypass capacitor the load step will settle in the range of less than 100 µs while for COUT = 10 µF in conjunction with a 10 nF bypass capacitor the same load step will settle in the range of 10 µs. Due to the shorter reaction time of the regulator by adding the bypass capacitor not only the settling time improves but also output voltage deviations due to load steps are sharply reduced. 0,3 VOUT Deviation / [V] C_BYP = 0nF COUT = 10 µF CBYP = 0 vs 10nF VIN = 6 V 0,2 C_BYP = 10nF 0,1 0 -0,1 -0,2 -0,3 0 Figure 8 Data Sheet 100 200 300 400 500 Time (μs) 600 700 800 900 1000 Influence of CBYP: example of transient response to one and the same load step with and without CBYP of 10 nF (IOUT 100 mA to 500 mA, IFX1763XEJ V33) 26 Rev. 1.1, 2014-10-30 IFX1763 Application Information 7.5 Protection Features The IFX1763 regulators incorporate several protection features which make them ideal for usage in batterypowered circuits. In addition to normal protection features associated with monolithic regulators like current limiting and thermal limiting the device is protected against reverse input voltage, reverse output voltage and reverse voltages from output to input. Current limit protection and thermal overload protection are intended to protect the device against current overload conditions at the output of the device. For normal operation the junction temperature must not exceed 125°C. The input of the device will withstand reverse voltages of 20 V. Current flowing into the device will be limited to less than 1 mA (typically less than 100 µA) and no negative voltage will appear at the output. The device will protect both itself and the load. This provides protection against batteries being plugged backwards. The output of the IFX1763 can be pulled below ground without damaging the device. If the input is left open-circuit or grounded, the output can be pulled below ground by 20 V. Under such conditions the output of the device by itself behaves like an open circuit with practically no current flowing out of the pin1). In more application relevant cases however where the output is either connected to the SENSE pin (fix voltage variant) or tied either via an external voltage divider or directly to the ADJ pin (adjustable variant) a small current will be present from this origin. In the case of the fixed voltage version this current will typically be below 100 µA while for the adjustable version it depends on the magnitude of the top resistor of the external voltage divider 2). If the input is powered by a voltage source the output will source the short circuit current of the device and will protect itself by thermal limiting. In this case grounding the EN pin will turn off the device and stop the output from sourcing the short-circuit current. The ADJ pin of the adjustable device can be pulled above or below ground by as much as 7 V without damaging the device. If the input is grounded or left open-circuit, the ADJ pin will act inside this voltage range like a large resistor (typically 100 kΩ) when being pulled above ground and like a resistor (typically 5 kΩ) in series with a diode when being pulled below ground. In situations where the ADJ pin is at risk of being pulled outside its absolute maximum ratings ±7 V the ADJ pin current must be limited to 1 mA (e.g. in cases where the ADJ pin is connected to a resistor divider that would pull the ADJ pin above its 7 V clamp voltage). Let’s consider for example the case where a resistor divider is used to provide a 1.5 V output from the 1.22 V reference and the output is forced to 20 V. The top resistor of the resistor divider must then be chosen to limit the current into the ADJ pin to 1 mA or less when the ADJ pin is at 7 V. The 13 V difference between output and ADJ pin divided by the 1 mA maximum current into the ADJ pin requires a minimum resistor value of 13 kΩ. In circuits where a backup battery is required, several different input/output conditions can occur. The output voltage may be held up while the input is either pulled to ground, pulled to some intermediate voltage or is left open-circuit. Current flow back into the output will follow the curve as shown in Figure 9 below. When the IN pin of the fixed voltage version is forced below the OUT pin, or the OUT pin is pulled above the IN pin, the input current will drop to very small values – typically down to less than 2 µA, once VOUT exceeds VIN by some 300 mV or more. This can happen if the input of the device is connected to a discharged battery and the output is held up by either a backup battery or a second regulator circuit. The state of the EN pin will have no effect on the reverse output current when the output is pulled above the input. 1) typically < 1 µA for the mentioned conditions, VOUT being pulled below ground with other pins either grounded or open. 2) In case there is no external voltage divider applied i.e. the ADJ pin is directly connected to the output and the output is pulled below ground by 20 V the current flowing out of the ADJ pin will be typically ~ 4 mA. Please ensure in such cases that the absolute maximum ratings of the ADJ pin are respected. Data Sheet 27 Rev. 1.1, 2014-10-30 IFX1763 Application Information 90 VOUT.nom = 1.22 V (ADJ) VOUT.nom = 3.3 V (V33) 80 70 VIN = 0 V Tj = 25 °C IOUT,rev [µA] 60 50 40 30 20 10 0 0 2 4 6 8 10 VOUT [V] Figure 9 Data Sheet Reverse Output Current 28 Rev. 1.1, 2014-10-30 IFX1763 Package Outlines 8 Package Outlines 0.35 x 45˚ 1.27 0.41±0.09 2) 0.2 8˚ MAX. 0.19 +0.06 0.08 C Seating Plane C M 0.1 C D 2x 1.7 MAX. Stand Off (1.45) 0.1+0 -0.1 3.9 ±0.11) 0.64 ±0.25 C A-B D 8x D 0.2 6 ±0.2 M D 8x Bottom View 8 1 5 1 4 8 4 5 2.65 ±0.2 3 ±0.2 A B 4.9 ±0.11) 0.1 C A-B 2x Index Marking 1) Does not include plastic or metal protrusion of 0.15 max. per side 2) Dambar protrusion shall be maximum 0.1 mm total in excess of lead width 3) JEDEC reference MS-012 variation BA 2.58 ±0.1 1.63 ±0.1 Z 0.71 ±0.1 Pin 1 Marking 0.25 ±0.1 3.3 ±0.1 0.05 0.5 ±0.1 0.53 ±0.1 1.48 ±0.1 0.36 ±0.1 0.55 ±0.1 0.1 ±0.1 3.3 ±0.1 0.96 ±0.1 1±0.1 0 +0.05 PG-DSO-8 Exposed Pad package outlines 0.2 ±0.1 Figure 10 PG-DSO-8-27-PO V01 Pin 1 Marking 0.25 ±0.1 PG-TSON-10-2-PO V02 Z (4:1) 0.07 MIN. Figure 11 PG-TSON-10 Package Outlines Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). For further information on alternative packages, please visit our website: http://www.infineon.com/packages. Data Sheet 29 Dimensions in mm Rev. 1.1, 2014-10-30 IFX1763 Revision History 9 Revision History Revision Date Changes 1.1 2014-10-30 Updated Data Sheet including additional package type PG-TSON-10: • PG-TSON-10 package variants added: Product Overview, Pin Configuration Thermal Resistance, Wording, etc added / updated accordingly. • Typical Performance Graphs: some legends entries updated and corrected (Figure “Minimum Input Voltage versus Junction Temperature TJ” on Page 20 and Figure “Input Ripple Rejection PSRR versus Junction Temperature TJ” on Page 21). • Application Information updated: Clarification and correction of wording. Typical values updated and footnotes added. • Editorial changes throughout the document. 1.0 2014-02-13 Data Sheet - Initial Release Data Sheet 30 Rev. 1.1, 2014-10-30 Edition 2014-10-30 Published by Infineon Technologies AG 81726 Munich, Germany © 2014 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems and/or automotive, aviation and aerospace applications or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that lifesupport automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.