FUJITSU SEMICONDUCTOR
DATA SHEET
DS405-00001-0v02-E
ASSP for Power Supply Applications
6MHz Synchronous Rectification
Buck-Boost DC/DC Converter IC
MB39C326
DESCRIPTION
The MB39C326 is a high efficiency, low noise synchronous, Buck-boost DC/DC converter designed for
powering the radio frequency power amplifiers (RFPA) in 3G/GSM mobile handsets and other mobile
applications. It provides up to 800 mA of output current over an input voltage range of 2.5 V to 5.5 V. The
maximum average current in the switches is limited to a typical value of 2000 mA.
FEATURES
x
x
x
x
x
x
x
x
x
x
x
x
x
x
High efficiency
Input voltage range
Adjustable output voltage range
Input current limit value
Output current
: Up to 95%
: 2.5 V to 5.5 V
: 0.4 V to 5.0 V
: 2A/1A/0.5A
: 1200mA (Buck, output at 3.3V)
: 800mA (Boost, output at 3.3V)
Quiescent current
: 50µA
6MHz PWM operation allows 0.5µH small form inductor
Less than 20µs step response for 3G
Automatic Transition between Buck mode and boost mode
Power-Save Mode for improved efficiency at light load current
Selectable output voltage with external resistor
Built-in Over temperature protection circuit
Built-in Under voltage lockout protection circuit
Package
: WL-CSP (20pin 0.4 mm-ball-pitch 2.15×1.94 mm)
APPLICATIONS
x
x
x
x
Products that use 1-cell lithium batteries for the power supply
RF power amplifier
Cell-phone
RF-PC card and PDA
Copyright©2011 FUJITSU SEMICONDUCTOR LIMITED All rights reserved
2011.12
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PIN ASSIGNMENTS
TOP VIEW
4
EN
ILIMSEL
VCC
XPS
VSEL VSELSW
GND
3
GND
GND
FB
2
VDD
SWOUT DGND
SWIN
VOUT
VDD
SWOUT DGND
SWIN
VOUT
D
E
1
A
B
C
PIN DISCRIPTIONS
Pin No.
Pin Name
I/O
A4
E3
C3,D3,E4
B4
B1,B2
D1,D2
C1,C2
C4
D4
A1,A2
A3
B3
E1,E2
EN
FB
GND
ILIMSEL
SWOUT
SWIN
DGND
VSEL
VSELSW
VDD
VCC
XPS
VOUT
I
I
I
I
I
I
I
I
I
O
Description
IC Enable input pin (H: Enable, L: Shutdown)
Voltage feedback pin
Control / Logic ground pins
Current limit mode pin
Connection pins for Inductor
Connection pins for Inductor
Power ground pins
Output voltage select pin (H:Using R3 L:No using R3)
Connection pin for output voltage setting resistor R3
Electric power input pin for DCDC converter output voltage
Electric power input pin for IC control block
Power save mode pin (H: Normal mode, L: Power save mode)
Buck-boost converter output pins
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BLOCK DIAGRAM
0.5 µH
SWOUT
10 µF (1608)
SWIN
SW1
VDD
CIN
L1
SW4
2.2 µF (1608)
VOUT
COUT
Current
Sensor
SW2
2.5 V to 5.5 V
VBATT
SW3
DGND
VCC
Gate Controller
EN
ILIMSEL
XPS
Device
Control
BGR
UVLO
GND
Error
Amp
R1
FB
R3
Over Temp
Protection
R2
VSELSW
Oscillator
VSEL
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FUNCTION
(1) Gate Controller
It is controlled the synchronous rectification operation of built-in 2-P-ch MOS FETs and 2-N-ch MOS FETs
according to frequency (6 MHz) set with a oscillator at the normal operation.
(2) Error Amp & phase compensation circuit
This compares the feedback voltage and the reference voltage (VREF). This IC contains the phase
compensation circuit which optimizes the IC operation. Therefore, it is unnecessary to consideration of the
phase compensation circuit, and external parts for the phase compensation.
(3) Band gap reference circuit
A high accuracy reference voltage is generated with BGR (band gap reference) circuit.
(4) Oscillator
The internal oscillator output a 6 MHz clock signal to set a switching frequency.
(5) Over temperature protection circuit
The over temperature protection circuit is built-in as a protection circuit. When junction temperature
reaches +125°C, the over temperature protection circuit turns off all N-ch MOS FETs and P-ch MOS FETs.
Also, when the junction temperature falls to +110°C, this IC operates normally.
(6) Over current protection circuit (Current Sensor + Device Control)
The over current protection circuit detects the current (ILX) which flows from built-in P-ch MOS FET
connected to VDD into an external inductor. The over current protection circuit controls the peak value of
current.
(7) Power save mode operation
Power Save mode is used to improve efficiency at the light load. The XPS pin should be set at low to enable
power save mode. When the load current is lower than 300 mA, this IC operates with PFM (Pulse
Frequency Modulation). It should be used above VOUT =0.8 V. If the output voltage becomes lower than the
setting value at the light load, switching is performed several times and the output voltage rises. If the
output voltage reaches the setting value, it changes to the stop state, all of the four FETs are turned off, and
the switching loss and the consumption power for the circuit are suppressed.
x Function Table
Mode
XPS
PWM mode
H
Power save mode
L
ILIMSEL
H
L
H
L
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FUJITSU SEMICONDUCTOR CONFIDENTIAL
Input voltage
range[V]
Min
Max
Output voltage
range[V]
Min
Max
3.1
4.8
0.4
4.2
2.5
5.5
0.8
5.0
Current limit
[A]
2.0
1.0
0.5
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ABSOLUTE MAXIMUM RATINGS
Parameter
Power supply voltage
Signal input voltage
Power dissipation
Storage temperature
Symbol
VMAX
VINMAX
PD
TSTG
VESDH
ESD Voltage
VESDM
VESDC
Condition
VDD, VCC
EN, XPS, VSEL, ILIMSEL
Human Body Model
(100 pF, 1.5 kΩ)
Machine Model (200 pF, 0Ω)
Charged device model
Rating
Unit
Min
Max
-0.3
-0.3
-65
+7.0
VDD+0.3
1080
+150
V
V
mW
-1000
+1000
V
-200
-1
+200
+1
V
kV
°C
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Condition
Power supply voltage
VDD
Signal input voltage
VIDD
VDD, VCC
EN, XPS, VSEL,
ILIMSEL
-
Operating Ambient temperature
Inductor value
Ta
L
Min
Value
Typ
Max
2.5*
3.7
5.5*
V
0.0
-
VDD
V
-40
-
0.5
+85
-
°C
μH
Unit
* : Depending on the setting condition. See "xFunction Table" in "FUNCTION (7) Power save mode
operation".
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device's electrical characteristics are warranted when the device is
operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges.
Operation outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on
the data sheet. Users considering application outside the listed conditions are advised to contact
their representatives beforehand.
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ELECTRICAL CHARACTERISTICS
The specifications apply under the recommended operating condition.
Parameter
Input voltage
Output voltage
Symbol
Condition
Min
Value
Typ
Max
2.5
3.7
5.5
3.1
-
4.8
0.8
-
5.0
0.4
-
500*
4.2
-
mV
Unit
VFB
XPS=L/XPS = H,
ILIMSEL = L
XPS = H, ILIMSEL = H
XPS = L/XPS = H,
ILIMSEL = L
XPS = H, ILIMSEL = H
-
IOUT
VIN = 2.5 V, VOUT = 4.5 V
800
-
-
mA
IOUT = 0 to IOMAX
IOUT = 0 to IOMAX
SWOUT
XPS=H
XPS=L, ILIMSEL = H
XPS=L, ILIMSEL = L
EN = L
EN = H, XPS = L,
VIN = 3.7 V, VOUT = 3.4 V,
IOUT = 0 mA
-
2.0
-
2.5
2.0*
1.0*
0.5*
6*
-
10
20
3.0
2
mV
mV
A
A
A
A
MHz
μA
-
50
-
μA
-
135*
-
°C
°C
VIN
VOUT
Feedback voltage
Maximum output
current
Line Regulation
Load Regulation
Output current limit
VLINE
VLOAD
IPK
Input current limit
ILIMIT
Oscillation frequency
Shutdown current
fOSC
ISD
Quiescent current
IQ
Over temperature
protection
TOTPH
V
V
TOTPL
110*
VUVLOH
2.0*
V
UVLO
Threshold voltage
VUVLOL
1.9*
V
VIL
EN, XPS, VSEL, ILIMSEL
0.0
VDD×0.3
V
Signal input threshold
voltage
VIH
EN, XPS, VSEL, ILIMSEL
VDD×0.7
VDD
V
Signal input current
ICTL
EN, XPS, VSEL, ILIMSEL
0.1
μA
*: This parameter is not be specified. This should be used as a reference to support designing the circuits.
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TYPICAL APPLICATIONS CIRCUIT
L1
0.5 µH
BB-DCDC1 (for GSM)
Cin
VBATT
2.5 V to 5.5 V 10 µF
SWOUT
VDD
SWIN
VOUT
Cout1
Super Capacitor
100 mF
VCC
FB
EN
XPS
VSEL
VSELSW
ILIMSEL
GND
DGND
L2
0.5 µH
BB-DCDC2 (for 3G)
SWOUT
VDD
VCC
EN
SWIN
VOUT
Cout2
2.2 µF
FB
XPS
VSEL
VSELSW
ILIMSEL
GND
DGND
DAC
DBB
GSM PA
ADC
ANT
SW
WCDMA PA
DUP
Dig RF
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APPLICATION NOTES
z Programming the Output Voltage
Output voltage is calculated using the equation (1) below.
Use R1 resistor value of 620 kΩ. Built-in phase compensation circuit is generated according to this resistor
value.
(1) Not using a selectable voltage option
VOUT= VFB×
R1+R2
R2
(VFB = 500 mV)
L1
SWOUT
VBATT
VDD
CIN
SWIN
VOU T
VOUT
VCC
R1
EN
FB
XPS
COU T
R2
VSELSW
VSEL
ILIMSEL
DGND
GND
(2) Using a selectable voltage option
When VSEL=L
VOUT= VFB×
R1+R2
R2
When VSEL=H
VOUT= VFB×
R1+(R2|| R3)
R2|| R3
L1
SWOUT
VBATT
CIN
VDD
VCC
EN
SWIN
R1
FB
R3
XPS
VSEL
VOU T
VOUT
COU T
R2
VSELSW
ILIMSEL
GND
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(3) When the output variable is dynamically performed
R1
R3
VO = -
×VDAC + VFB×(
R1
R3
R1
R2
+
+1)
(VFB = 500mV)
SWOUT
VBATT
VDD
VCC
CIN
SWIN
VOU T
VOUT
R1
FB
EN
XPS
VSELSW
VSEL
COU T
R3
R2
ILIMSEL
DGND
GND
DAC
z Relationship between DAC and output when setting to R1=620kΩ,
R2=110kΩ and R3=330kΩ
VOUT - DAC
4.50
4.00
3.50
VOUT (V)
3.00
2.50
2.00
1.50
1.00
0.50
0.00
0.000
0.500
1.000
1.500
2.000
2.500
DAC voltage (V)
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EXAMPLE OF STANDARD OPERATION CHARACTERISTICS
Efficiency vs. Load Current
100
VIN = 3.7 V
L= 0.47 µH
90
Efficiency η [%]
80
70
60
VOUT = 0.6 V
VOUT = 1.2 V
50
VOUT = 2.5 V
VOUT = 4.0 V
40
VOUT = 4.5 V
30
100
10
1000
Load Current IOUT [mA]
Maximum Output Current IOMAX [mA]
Maximum Output Current vs. Input Voltage
3000
2500
2000
1500
1000
500
VOUT = 2.5 V
VOUT = 4.5 V
0
2
2.5
3
3.5
4
4.5
5
VDD Supply Voltage [V]
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Power dissipation vs. Operation ambient temperature
1.2
1.08
1.0
Pd [W]
0.8
0.6
0.4
0.2
0.0
-50
-25
0
+25
+50
+75
+100
Temperature [°C]
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USAGE PRECAUTION
1. Do not configure the IC over the maximum ratings.
If the IC is used over the maximum ratings, the LSI may be permanently damaged.
It is preferable for the device to be normally operated within the recommended usage conditions.
Usage outside of these conditions can have a bad effect on the reliability of the LSI.
2. Use the devices within recommended operating conditions.
The recommended operating conditions are the recommended values that guarantee the normal
operations of LSI.
The electrical ratings are guaranteed when the device is used within the recommended operating
conditions and under the conditions stated for each item.
3. Printed circuit board ground lines should be set up with consideration for common
impedance.
4. Take appropriate measures against static electricity.
x Containers for semiconductor materials should have anti-static protection or be made of conductive
material.
x After mounting, printed circuit boards should be stored and shipped in conductive bags or containers.
x Work platforms, tools, and instruments should be properly grounded.
x Working personnel should be grounded with resistance of 250 kΩ to 1 MΩ in series between body and
ground.
5. Do not apply negative voltages.
The use of negative voltages below -0.3 V may cause the parasitic transistor to be activated on LSI
lines, which can cause malfunctions.
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ORDERING INFORMATION
Part number
Package
MB39C326PW
20-pin plastic WLP
(WLP-20P-M01)
Remarks
EV BOARD ORDERING INFORMATION
EV board number
EV board version No.
Remarks
MB39C326-EVB-01
MB39C326-EVB-01 REV5.0
20pin-WL-CSP
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RoHS COMPLIANCE INFORMATION OF LEAD (Pb) FREE VERSION
The LSI products of FUJITSU SEMICONDUCTOR with "E1" are compliant with RoHS Directive, and has
observed the standard of lead, cadmium, mercury, Hexavalent chromium, polybrominated biphenyls (PBB),
and polybrominated diphenyl ethers (PBDE). A product whose part number has trailing characters "E1" is
RoHS compliant.
LABELING SAMPLE (Lead free version)
Lead-free mark
JEITA logo
MB123456P - 789 - GE1
(3N) 1MB123456P-789-GE1
1000
(3N)2 1561190005 107210
JEDEC logo
G
Pb
QC PASS
PCS
1,000
MB123456P - 789 - GE1
2006/03/01
ASSEMBLED IN JAPAN
MB123456P - 789 - GE1
1561190005
The part number of a lead-free product has the
trailing characters "E1".
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FUJITSU SEMICONDUCTOR CONFIDENTIAL
1/1
0605 - Z01A
1000
"ASSEMBLED IN CHINA" is printed on
the label of a product assembled in China.
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MB39C326PW RECOMMENDED CONDITIONS OF MOISTURE SENSITIVITY
LEVEL
[FUJITSU SEMICONDUCTOR Recommended Mounting Conditions]
Item
Condition
Mounting Method
Mounting times
Storage period
Storage conditions
IR (infrared reflow), warm air reflow
2 times
Before opening
Please use it within two years after
manufacture.
From opening to the 2nd reflow
5°C to 30°C, 70% RH or less (the lowest possible humidity)
[Parameters for Each Mounting Method]
IR (infrared reflow)
260 °C
255 °C
170 °C
to
190 °C
(b)
RT
(a)
H rank: 260°C Max
(a) Temperature Increase gradient
(b) Preliminary heating
(c) Temperature Increase gradient
(d) Actual heating
(d’)
(e) Cooling
(c)
(d)
(e)
(d')
: Average 1°C/s to 4°C/s
: Temperature 170°C to 190°C, 60s to 180s
: Average 1°C/s to 4°C/s
: Temperature 260°C Max; 255°C or more, 10s or less
: Temperature 230°C or more, 40s or less
or
Temperature 225°C or more, 60s or less
or
Temperature 220°C or more, 80s or less
: Natural cooling or forced cooling
Note : Temperature : the top of the package body
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PACKAGE DIMENSIONS
20-pin plastic WLP
Lead pitch
0.4 mm
Package width ×
package length
2.15 mm × 1.94
Lead shape
Soldering ball
Sealing method
Print
Mounting height
0.625 mm Max.
Weight
0.005 g
Code
(Reference)
S-WF BGA20-2.15 × 1.94-0.40
(WLP-20P-M01)
20-pin plastic WLP
(WLP-20P-M01)
2.15 ± 0.05(.085 ±. 002)
(1.60(.063))
0.40(.016)TYP
X
4
1.94 ± 0.05
(.076 ±. 002)
3
(1.20(.047))
2
Y
1
0.40(.016)
TYP
E
D
C
INDEX (Laser Marking)
B
1-0.13
20-ø0.26 ± 0.04
(20-ø.010±.002)
A
(.005 )
ø0.05(.002) M XYZ
0.625(.025)MAX
Z
0.05(.002) Z
C
0.21 ± 0.04
(.008 ±. 002)
2011 FUJITSU SEMICONDUCTOR LIMITED W20001Sc-1-1
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
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FUJITSU SEMICONDUCTOR LIMITED
Nomura Fudosan Shin-yokohama Bldg. 10-23, Shin-yokohama 2-Chome,
Kohoku-ku Yokohama Kanagawa 222-0033, Japan
Tel: +81-45-415-5858
http://jp.fujitsu.com/fsl/en/
For further information please contact:
North and South America
FUJITSU SEMICONDUCTOR AMERICA, INC.
1250 E. Arques Avenue, M/S 333
Sunnyvale, CA 94085-5401, U.S.A.
Tel: +1-408-737-5600
Fax: +1-408-737-5999
http://us.fujitsu.com/micro/
Asia Pacific
FUJITSU SEMICONDUCTOR ASIA PTE. LTD.
151 Lorong Chuan,
#05-08 New Tech Park 556741 Singapore
Tel : +65-6281-0770 Fax : +65-6281-0220
http://sg.fujitsu.com/semiconductor/
Europe
FUJITSU SEMICONDUCTOR EUROPE GmbH
Pittlerstrasse 47, 63225 Langen, Germany
Tel: +49-6103-690-0 Fax: +49-6103-690-122
http://emea.fujitsu.com/semiconductor/
FUJITSU SEMICONDUCTOR SHANGHAI CO., LTD.
30F, Kerry Parkside, 1155 Fang Dian Road,
Pudong District, Shanghai 201204, China
Tel : +86-21-6146-3688 Fax : +86-21-6146-3660
http://cn.fujitsu.com/fss/
Korea
FUJITSU SEMICONDUCTOR KOREA LTD.
902 Kosmo Tower Building, 1002 Daechi-Dong,
Gangnam-Gu, Seoul 135-280, Republic of Korea
Tel: +82-2-3484-7100 Fax: +82-2-3484-7111
http://kr.fujitsu.com/fsk/
FUJITSU SEMICONDUCTOR PACIFIC ASIA LTD.
10/F., World Commerce Centre, 11 Canton Road,
Tsimshatsui, Kowloon, Hong Kong
Tel : +852-2377-0226 Fax : +852-2376-3269
http://cn.fujitsu.com/fsp/
Specifications are subject to change without notice. For further information please contact each office.
All Rights Reserved.
The contents of this document are subject to change without notice.
Customers are advised to consult with sales representatives before ordering.
The information, such as descriptions of function and application circuit examples, in this document are presented solely
for the purpose of reference to show examples of operations and uses of FUJITSU SEMICONDUCTOR device; FUJITSU
SEMICONDUCTOR does not warrant proper operation of the device with respect to use based on such information. When
you develop equipment incorporating the device based on such information, you must assume any responsibility arising
out of such use of the information.
FUJITSU SEMICONDUCTOR assumes no liability for any damages whatsoever arising out of the use of the information.
Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as
license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of
FUJITSU SEMICONDUCTOR or any third party or does FUJITSU SEMICONDUCTOR warrant non-infringement of
any third-party's intellectual property right or other right by using such information. FUJITSU SEMICONDUCTOR
assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would
result from the use of information contained herein.
The products described in this document are designed, developed and manufactured as contemplated for general use,
including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not
designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless
extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury,
severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic
control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use
requiring extremely high reliability (i.e., submersible repeater and artificial satellite).
Please note that FUJITSU SEMICONDUCTOR will not be liable against you and/or any third party for any claims or
damages arising in connection with above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such
failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and
prevention of over-current levels and other abnormal operating conditions.
Exportation/release of any products described in this document may require necessary procedures in accordance with the
regulations of the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws.
The company names and brand names herein are the trademarks or registered trademarks of their respective owners.
Edited: Sales Promotion Department
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