SAF-TC1100-L100EBBB

D a t a S h ee t , V 1. 0, F e b 2 0 05 TC1100 32-Bit Single-Chip Microcontroller Advance Information Microcontrollers N e v e r s t o p t h i n k i n g . Edition 2005-02 Published by Infineon Technologies AG, St.-Martin-Strasse 53, 81669 München, Germany © Infineon Technologies AG 2005. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. D a t a S h ee t , V 1. 0, F e b 2 0 05 TC1100 32-Bit Single-Chip Microcontroller Advance Information Microcontrollers N e v e r s t o p t h i n k i n g . TC1100 Data Sheet Advance Information Revision History: 2005-02 Previous Version: none Page V1.0 Subjects (major changes since last revision) Controller Area Network (CAN): License of Robert Bosch GmbH We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: mcdocu.comments@infineon.com TC1100 Table of Contents Page 1 Summary of Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 2.1 2.2 2.3 2.4 General Device Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 4 5 6 3 3.1 3.2 3.3 3.3.1 3.3.2 3.3.3 3.4 3.4.1 3.4.2 3.4.3 3.5 3.6 3.7 3.8 3.9 3.10 3.11 3.12 3.13 3.14 3.15 3.16 3.17 3.18 3.19 3.20 3.21 3.22 3.23 3.24 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . On-Chip Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Memory Protection System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Protection for Direct translation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Protection for PTE based translation . . . . . . . . . . . . . . . . . . . . . . . . . . . Memory Checker . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . On-Chip Bus System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Local Memory Bus (LMB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Flexible Peripheral Interconnect Bus (FPI) . . . . . . . . . . . . . . . . . . . . . . LFI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LMB External Bus Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Direct Memory Access (DMA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Interrupt System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Parallel Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Asynchronous/Synchronous Serial Interface (ASC) . . . . . . . . . . . . . . . . . High-Speed Synchronous Serial Interface (SSC) . . . . . . . . . . . . . . . . . . . Inter IC Serial Interface (IIC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Micro Link Serial Bus Interface (MLI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . General Purpose Timer Unit (GPTU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Capture/Compare Unit 6 (CCU6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . System Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . System Control Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Boot Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Management System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . On-Chip Debug Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Clock Generation Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Identification Register Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16 17 24 24 25 25 26 26 26 27 28 30 32 34 35 38 40 42 44 46 48 50 52 53 54 55 57 60 61 62 4 4.1 4.1.1 4.1.2 Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Parameter Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Absolute Maximum Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 63 63 64 Data Sheet I-1 V1.0, 2005-02 TC1100 Table of Contents Page 4.1.3 4.2 4.2.1 4.2.2 4.2.3 4.2.4 4.3 4.3.1 4.3.2 4.3.3 4.3.4 4.3.5 4.3.6 4.3.7 4.3.8 4.3.8.1 4.3.8.2 4.3.8.3 4.3.8.4 4.3.8.5 4.3.8.6 4.3.9 4.3.9.1 4.3.9.2 Operating Condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input/Output Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Oscillator Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IIC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power, Pad and Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PLL Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input Clock Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Port Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Timing for JTAG Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Timing for OCDS Trace and Breakpoint Signals . . . . . . . . . . . . . . . . . . EBU Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SDCLKO Output Clock Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BFCLKO Output Clock Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Timing for SDRAM Access Signals . . . . . . . . . . . . . . . . . . . . . . . . . . Timing for Burst Flash Access Signals . . . . . . . . . . . . . . . . . . . . . . . Timing for Demultiplexed Access Signals . . . . . . . . . . . . . . . . . . . . . Timing for Multiplexed Access Signals . . . . . . . . . . . . . . . . . . . . . . . Peripheral Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SSC Master Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MLI Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 Data Sheet I-2 65 66 66 67 68 69 70 70 72 74 75 76 77 79 80 80 80 81 83 85 87 89 89 90 V1.0, 2005-02 Advance Information 32-Bit Single-Chip Microcontroller TriCore™ Family 1 TC1100 Summary of Features • High Performance 32-bit TriCore™ V1.3 CPU with 4-Stage Pipeline • Floating Point Unit (FPU) • Dual Issue super-scalar implementation – MAC Instruction maximum triple issue • Circular Buffer and bit-reverse addressing modes for DSP algorithms • Very fast interrupt response time • Hardware controlled context switch for task switch and interrupts • Memory Management Unit (MMU) • On-chip Memory – 28-Kbyte Data Memory (SPRAM) – 32-Kbyte Code Memory (SPRAM) – 16-Kbyte Instruction Cache (ICACHE) – 4-Kbyte Data Cache (DCACHE) – 64-Kbyte SRAM Data Memory Unit (DMU) – 16-Kbyte Boot ROM • On-chip Bus Systems – 64-bit High Performance Local Memory Bus (LMB) for fast access between caches and on-local memories and FPI Interface – On-chip Flexible Peripheral Interconnect Bus (FPI) for interconnections of functional units • DMA Controller with 8 channels for data transfer operations between peripheral units and memory locations • One high speed Micro Link Interface (MLI0) for controller communication and emulation • Flexible External Bus Interface Unit (EBU) to access external data memories • One Multifunctional General Purpose Timer Unit (GPTU) with three 32-bit timer/ counters • One Capture and Compare unit (CCU61) for PWM signal generation with – 3-channel, 16 bit Capture and Compare unit – 1-channel, 16 bit Compare unit • Two Asynchronous/Synchronous Serial Channels (ASC0/1) with baud-rate generator, parity, framing and overrun error detection, support FIFO and IrDA data transmission • Two High Speed Synchronous Serial Channels (SSC0/1) with programmable data length, FIFO support and shift direction • Inter-IC (IIC) module with two physical IIC buses • Digital I/O ports with 3.3 V I/O capabilities Data Sheet 1 V1.0, 2005-02 TC1100 Summary of Features Advance Information • • • • Level 2 On-chip Debug Support Power Management System Clock Generation Unit with PLL Maximum CPU and Bus clock frequency at 150 MHz without MMU and 120 MHz with MMU • Ambient temperature under bias: -40° to +85°C • P-LBGA-208 package Data Sheet 2 V1.0, 2005-02 Figure 2-1 Data Sheet 128 FPU 3 16 8 1 16 PORT2 8 4 IIC 2 Channels SBCU FPI BUS SSC0 BRKOUT STM SSC1 16 PORT1 2 ASC0 FIFO, I rDA Cerberus 3 EBU 16 PORT0 2 2 ASC1 FIFO, IrDA SCU (PWR) Power Management , Watchdog Ti mer, Reset PMI (Program Memory Interface) 32 KB Scrat ch PadRAM 16 KB I nst ructi on Cache 8 5 7 JTAG I/O BRKI N XTAL1 XTAL2 Control EBU_Control A[23: 0] AD[31: 0] Ext ernal Interrupts JTAG P LL 24 23 32 Block Diagram PORT3 13 GPTU 3Timers DMA Bus, 32Bit CCU6 CCU61 64 2.1 16 1 3 3 3 1 6 3 2 1 1 OCDS2 TriCoreTM 1M CPU CPS OCDS FPI Bus (Flexible Peripheral Interface), 32 Bi t DMI (Data Memory Interface) 28 KB Scrat ch PadRAM 4 KBDataCache General Device Information 8 LFI Bridge VSS VDD 2 PORT4 8 MLI 0 Boot-ROM 16Kbyt es LBCU LMB BUS 1.5-3.3 V TC1100 Block Diagram Advance Information C edar_BLK_TC1100 Mem Checker SMIF DMA 8 channels DMU 64 KB SRAM MMU LMB (Local Memory Bus) 64 Bit TC1100 General Device Information TC1100 Block Diagram V1.0, 2005-02 TC1100 General Device Information Advance Information 2.2 Logic Symbol General Control EBU Control PORST HDRST NMI HWCFG[0:2] RD RD/WR WAIT MR/W BFCLKI BFCLKO ALE BAA ADV CS[0:3] CSCOMB CKE Port 0 16-Bit 3 Port 1 16-Bit 4 Port 4 8-Bit MLI0, SCU TDO TMS BRKIN TC1100 OCDS / JTAG Control TRCLK 5 N.C. XTAL1 XTAL2 VDDOSC3 VSSOSC3 4 AD[0:31] VDD VDDP VSS Port 3 16-Bit TRST TCK TDI A[0:23] Digital Circuitry Power Supply SSC0/1, EBU, SCU, OCDS ASC0/1, SSC0/1, IIC, EBU, SCU SSC0/1, CCU61, OCDS Port 2 16-Bit RAS CAS SDCLKI SDCLKO BC[0:3] Alternate Functions GPTU, SSC0/1, ASC1, MLI0, EBU, SCU, External Interrupts Oscillator VDDOSC VSSOSC 9 6 14 MCB04945mod_TC1100 Figure 2-2 Data Sheet TC1100 Logic Symbol 4 V1.0, 2005-02 TC1100 General Device Information Advance Information 2.3 Pin Configuration A 16 Reser ved B C P3.10 P3.11 D E F G H J K P3.12 P2.15 P2.14 P2.11 P2.9 P2.8 P2.7 L M N V DDOSC XTAL1 XTAL2 P VDD OSC3 R T VSS Reser 16 ved P2.4 P0.1 P0.9 N.C. 15 HW HW CFG1 CFG0 P2.5 P2.3 P0.10 N.C. 14 P2.10 V DDP P2.2 P0.8 TDI 13 P2.6 P2.0 P0.5 TCK 12 P0.0 P2.1 P0.4 TRST 11 VSS 15 P3.0 P3.1 P3.8 P3.2 P3.3 P3.6 P3.5 P3.9 P3.15 P2.12 14 P1.9 P1.10 P1.11 P1.14 P1.13 P1.15 P3.4 P3.7 P3.14 P2.13 13 P1.8 P1.7 P1.5 V P1.12 VDD V V P3.13 12 P1.6 P1.3 P1.1 P1.2 11 BAA ADV P1.4 P1.0 10 A17 A18 A19 A20 9 A16 WAIT CS2 CS0 8 A15 CS3 AD0 CS1 7 BC3 BC2 AD1 AD16 6 BC1 AD2 AD3 RAS 5 BC0 AD17 AD4 CAS 4 AD18 AD19 AD20 V DDP V SS AD28 AD29 V DDP V SS A14 CKE V DDP 3 AD5 AD21 AD7 AD25 AD11 AD12 AD15 AD30 A10 A11 A12 A13 2 AD6 AD22 AD8 AD9 AD26 AD27 AD31 AD14 A5 A6 A7 A8 A9 RD VSS VSS 1 Reser ved AD23 AD24 BFCLKI BFCLKO AD10 A0 A1 A2 A3 A4 N.C. Reser ved K L M N P R T A B C DDP D V SS SS DDP P0.3 VSS 208-Pin P-LBGA Package Pin Configuration (top view) for TC1100 V DD V SS V SS VDD P0.7 P0.2 P0.6 TDO 10 V DD V SS V SS VDD P0.11 P0.12 P4.1 TMS 9 V DD V SS V SS VDD P0.14 P0.13 P4.0 V DD V SS V SS VDD P4.2 P0.15 P4.5 NMI P4.3 P4.4 P4.6 HW CFG2 6 HDRST P4.7 E F AD13 SDCLKO SDCLKI G H J VSS A23 CS MR/W COMB TRCLK 8 PORST BRKIN A22 ALE A21 7 5 4 RD/WR 3 2 1 MCP04950mod_TC1100 Figure 2-3 Data Sheet TC1100 Pins: P-BGA-208 Package (top view) 5 V1.0, 2005-02 TC1100 General Device Information Advance Information 2.4 Table 2-1 Symbol Pin Definitions and Functions Pin Definitions and Functions Pin P0 P0.0 N11 P0.1 P15 P0.2 P0.3 P0.4 P10 M15 R11 P0.5 R12 P0.6 R10 P0.7 N10 P0.8 R13 P0.9 R15 P0.10 R14 P0.11 N9 P0.12 P9 P0.13 P8 P0.14 N8 P0.15 P7 Data Sheet In PU/ Out PD1) Functions I/O Port 0 Port 0 is a 16-bit bi-directional general purpose I/O port that can be alternatively used for GPTU, ASC1, SSC0/ 1, MLI0, EBU and SCU. GPTU_0 GPTU input/output line 0 RXD1B ASC1 receiver input/output B GPTU_1 GPTU input/output line 1 TXD1B ASC1 transmitter output B GPTU_2 GPTU input/output line 2 GPTU_3 GPTU input/output line 3 GPTU_4 GPTU input/output line 4 SLSI1 SSC1 Slave Select input BREQ EBU Bus Request Output GPTU_5 GPTU input/output line 5 HOLD EBU Hold Request Input BRKOUT_B OCDS Break Out B GPTU_6 GPTU input/output line 6 HLDA EBU Hold Acknowledge Input/Output SLSO0_0 SSC0 Slave Select output 0 GPTU_7 GPTU input/output line 7 SLSO1_0 SSC1 Slave Select output 0 REQ0 External Trigger Input 0 TCLK0A MLI0 transmit channel clock output A TREADY0A MLI0 transmit channel ready input A REQ1 External Trigger Input 1 REQ2 External Trigger Input 2 TVALID0A MLI0 transmit channel valid output A REQ3 External Trigger Input 3 TDATA0A MLI0 transmit channel data output A RCLK0A MLI0 receive channel clock input A REQ4 External Trigger Input 4 REQ5 External Trigger Input 5 RREADY0A MLI0 receive channel ready output A REQ6 External Trigger Input 6 RVALID0A MLI0 receive channel valid input A REQ7 External Trigger Input 7 RDATA0A MLI0 receive channel data input A I/O I/O I/O O I/O I/O I/O I O I/O I O I/O I/O O I/O O I O I I I O I O I I I O I I I I PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC 6 V1.0, 2005-02 TC1100 General Device Information Advance Information Table 2-1 Symbol Pin Definitions and Functions (cont’d) Pin P1 P1.0 D11 P1.1 C12 P1.2 D12 P1.3 B12 P1.4 C11 P1.5 C13 P1.6 A12 P1.7 B13 P1.8 A13 P1.9 A14 P1.10 B14 P1.11 C14 P1.12 F13 P1.13 E14 P1.14 D14 Data Sheet In PU/ Out PD1) Functions I/O Port 1 Port 1 serves as 16-bit bi-directional general purpose I/O port which can be used for input/output for OCDS L2, SSC0/1, EBU and SCU. SWCFG0 Software configuration 0 OCDSA_0 OCDS L2 Debug Line A0 SWCFG1 Software configuration 1 OCDSA_1 OCDS L2 Debug Line A1 SWCFG2 Software configuration 2 OCDSA_2 OCDS L2 Debug Line A2 SWCFG3 Software configuration 3 OCDSA_3 OCDS L2 Debug Line A3 SWCFG4 Software configuration 4 OCDSA_4 OCDS L2 Debug Line A4 SWCFG5 Software configuration 5 OCDSA_5 OCDS L2 Debug Line A5 SWCFG6 Software configuration 6 OCDSA_6 OCDS L2 Debug Line A6 SWCFG7 Software configuration 7 OCDSA_7 OCDS L2 Debug Line A7 SWCFG8 Software configuration 8 OCDSA_8 OCDS L2 Debug Line A8 SWCFG9 Software configuration 9 OCDSA_9 OCDS L2 Debug Line A9 SWCFG10 Software configuration 10 OCDSA_10 OCDS L2 Debug Line A10 SWCFG11 Software configuration 11 OCDSA_11 OCDS L2 Debug Line A1 SLSO0_1 SSC0 Slave Select output 1 SWCFG12 Software configuration 12 OCDSA_12 OCDS L2 Debug Line A12 SLSO1_1 SSC1 Slave Select output 1 SWCFG13 Software configuration 13 OCDSA_13 OCDS L2 Debug Line A13 SLSO0_2 SSC0 Slave Select output 2 SLSO1_2 SSC1 Slave Select output 2 SWCFG14 Software configuration 14 OCDSA_14 OCDS L2 Debug Line A14 I O I O I O I O I O I O I O I O I O I O I O I O O I O O I O O O I O PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC 7 V1.0, 2005-02 TC1100 General Device Information Advance Information Table 2-1 Pin Definitions and Functions (cont’d) Symbol Pin In PU/ Out PD1) Functions P1.15 F14 I O I O SLSI0 RMW SWCFG15 OCDSA_15 P2 PUC I/O P2.0 P12 I/O O PUC P2.1 P11 PUC P2.2 P13 O I I/O P2.3 P14 I/O PUC P2.4 P2.5 N15 N14 I/O I/O PUC PUC P2.6 N12 I/O PUC P2.7 P2.8 P2.9 P2.10 P2.11 P2.12 K16 J16 H16 L13 G16 K15 PUC PUC PUC PUC PUC  P2.13 K14 P2.14 F16 P2.15 E16 I/O I/O O   I/O O I/O O I/O O I/O O Data Sheet PUC    SSC0 Slave Select Input EBU Read Modify Write Software configuration 15 OCDS L2 Debug Line A15 Port 2 Port 2 is a 16-bit bi-directional general purpose I/O port which can be alternatively used for ASC0/1, SSC0/1, IIC, EBU and SCU. RXD0 ASC0 receiver input/output line CSEMU EBU Chip Select Output for Emulator Region TXD0 ASC0 transmitter output line TESTMODE Test Mode Select Input MRST0 SSC0 master receive/slave transmit input/output MTSR0 SSC0 master transmit/slave receive input/output SCLK0 SSC0 clock input/output line MRST1A SSC1 master receive/slave transmit input/output A MTSR1A SSC1 master transmit/slave receive input/output A SCLK1A SSC1 clock input/output line A RXD1A ASC1 receiver input/output line A TXD1A ASC1 transmitter output line A   SDA0 IIC Serial Data line 0 SLSO0_3 SSC0 Slave Select output 3 SCL0 IIC clock line 0 SLSO1_3 SSC1 Slave Select output 3 SDA1 IIC Serial Data line 1 SLSO0_4 SSC0 Slave Select output 4 SCL1 IIC clock line 1 SLSO1_4 SSC1 Slave Select output 4 8 V1.0, 2005-02 TC1100 General Device Information Advance Information Table 2-1 Symbol Pin Definitions and Functions (cont’d) Pin P3 P3.0 A15 P3.1 B15 P3.2 In PU/ Out PD1) Functions I/O Port 3 Port 3 is a 16-bit bi-directional general purpose I/O port that can be alternatively used for CCU61, SSC0/1 and OCDS Level 2 debug lines. OCDSB_0 OCDS L2 Debug Line B0 COUT61_3 CCU61 compare channel 3 output OCDSB_1 OCDS L2 Debug Line B1 CC61_0 CCU61 input/output of capture/ compare channel 0 OCDSB_2 OCDS L2 Debug Line B2 COUT61_0 CCU61 output of capture/compare channel 0 OCDSB_3 OCDS L2 Debug Line B3 CC61_1 CCU61 input/output of capture/ compare channel 1 OCDSB_4 OCDS L2 Debug Line B4 COUT61_1 CCU61 output of capture/compare channel 1 OCDSB_5 OCDS L2 Debug Line B5 CC61_2 CCU61 input/output of capture/ compare channel 2 OCDSB_6 OCDS L2 Debug Line B6 COUT61_2 CCU61 output of capture/compare channel 2 OCDSB_7 OCDS L2 Debug Line B7 CTRAP1 CCU61 trap input SLSO0_5 SSC0 Slave Select output 5 OCDSB_8 OCDS L2 Debug Line B8 CCPOS1_0 CCU61 Hall input signal 0 SLSO1_5 SSC1 Slave Select output 5 OCDSB_9 OCDS L2 Debug Line B9 CCPOS1_1 CCU61 Hall input signal 1 SLSO0_6 SSC0 Slave Select output 6 OCDSB_10 OCDS L2 Debug Line B10 CCPOS1_2 CCU61 Hall input signal 2 SLSO1_6 SSC1 Slave Select output 6 OCDSB_11 OCDS L2 Debug Line B11 SLSO0_7 SSC0 Slave Select output 7 CC61_T12HR CCU61 Timer 12 hardware run O O O I/O PUC D15 O O PUC P3.3 E15 O I/O PUC P3.4 G14 O O PUC P3.5 G15 O I/O PUC P3.6 F15 O O PUC P3.7 H14 PUC P3.8 C15 P3.9 H15 P3.10 B16 P3.11 C16 O I O O I O O I O O I O O O I Data Sheet PUC PUC PUC PUC PUC 9 V1.0, 2005-02 TC1100 General Device Information Advance Information Table 2-1 Pin Definitions and Functions (cont’d) Symbol Pin In PU/ Out PD1) Functions P3.12 D16 PUC P3.13 K13 O O I O I/O OCDSB_12 SLSO1_7 CC61_T13HR OCDSB_13 MRST1B P3.14 J14 O I/O PUC OCDSB_14 MTSR1B P3.15 J15 O I/O PUC OCDSB_15 SCLK1B P4 PUC I/O OCDS L2 Debug Line B12 SSC1 Slave Select output 7 CCU61 Timer 13 hardware run OCDS L2 Debug Line B13 SSC1 master receive/slave transmit input/output B OCDS L2 Debug Line B14 SSC1 master transmit/slave receive input/output B OCDS L2 Debug Line B15 SSC1 clock input/output line B Port 4 Port 4 is an 8-bit bi-directional general purpose I/O port that can be alternatively used for MLI0 and SCU. TCLK0B MLI0 transmit channel clock output B TREADY0B MLI0 transmit channel ready input B TVALID0B MLI0 transmit channel valid output B TDATA0B MLI0 transmit channel data output B RCLK0B MLI0 receive channel clock input B RREADY0B MLI0 receive channel ready output B RVALID0B MLI0 receive channel valid input B RDATA0B MLI0 receive channel data input B BRKOUT_A OCDS Break Out A P4.0 P4.1 P4.2 P4.3 P4.4 P4.5 P4.6 P4.7 R8 R9 N7 N6 P6 R7 R6 P5 O I O O I O I I O PUC PUC PUC PUC PUC PUC PUC PUC HDRST N5 I/O PUA Hardware Reset Input/Reset Indication Output Assertion of this bi-directional open-drain pin causes a synchronous reset of the chip through external circuitry. This pin must be driven for a minimum 4 fCPU clock cycles. The internal reset circuitry drives this pin in response to a power-on, hardware, watchdog and power-down wake-up reset for a specific period of time. For a software reset, activation of this pin is programmable. PORST R5 I PUC Power-on Reset Input A low level on PORST causes an asynchronous reset of the entire chip. PORST is a fully asynchronous level sensitive signal. Data Sheet 10 V1.0, 2005-02 TC1100 General Device Information Advance Information Table 2-1 Pin Definitions and Functions (cont’d) Symbol Pin In PU/ Out PD1) Functions NMI T7 I PUC Non-Maskable Interrupt Input A high-to-low transition on this pin causes a NMI-Trap request to the CPU. TRST T11 I PDC JTAG Module Reset/Enable Input A low level at this pin resets and disables the JTAG module. A high level enables the JTAG module. TCK T12 I PUC JTAG Module Clock Input TDI T13 I PUC JTAG Module Serial Data Input TDO T10 O  JTAG Module Serial Data Output TMS T9 I PUC JTAG Module State Machine Control Input TRCLK T8 O  Trace Clock for OCDS_L2 Lines I I I PUC PUC PDC Hardware Configuration Inputs The Configuration Inputs define the boot options of the TC1100 after a hardware invoked reset operation. HWCFG0 M14 HWCFG1 L14 HWCFG2 T6 BRKIN T5 I PUC OCDS Break Input A low level on this pin causes a break in the chip’s execution when the OCDS is enabled. In addition, the level of this pin during power-on reset determines the boot configuration. CS0 CS1 CS2 CS3 D9 D8 C9 B8 O O O O PUC PUC PUC PUC EBU Chip Select Output Line 0 EBU Chip Select Output Line 1 EBU Chip Select Output Line 2 EBU Chip Select Output Line 3 Each corresponds to a programmable region. Only one can be active at one time. CSCOMB N3 O PUC EBU Chip Select Output for Combination Function (Overlay Memory and Global) SDCLKI J1 I  SDRAM Clock Input (Clock Feedback) SDCLKO H1 O  SDRAM Clock Output Accesses to SDRAM devices are synchronized to this clock. RAS D6 O PUC EBU SDRAM Row Address Strobe Output CAS D5 O PUC EBU SDRAM Column Address Strobe Output CKE L4 O PUC EBU SDRAM Clock Enable Output Data Sheet 11 V1.0, 2005-02 TC1100 General Device Information Advance Information Table 2-1 Pin Definitions and Functions (cont’d) Functions Symbol Pin In PU/ Out PD1) BFCLKI D1 I  Burst Flash Clock Input (Clock Feedback) BFCLKO E1 O  RD P2 O PUC Burst Flash Clock Output Accesses to Burst Flash devices are synchronized to this clock. EBU Read Control Line Output in master mode Input in slave mode RD/WR T3 O PUC WAIT B9 I PUC EBU Write Control Line Output in master mode Input in slave mode EBU Wait Control Line ALE R3 O PDC EBU Address Latch Enable Output MR/W P3 O PUC EBU Motorola-style Read/Write Output BAA A11 O PUC EBU Burst Address Advance Output For advancing address in a Burst Flash access ADV B11 O PUC EBU Burst Flash Address Valid Output Data Sheet 12 V1.0, 2005-02 TC1100 General Device Information Advance Information Table 2-1 Pin Definitions and Functions (cont’d) Functions Symbol Pin In PU/ Out PD1) AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15 AD16 AD17 AD18 AD19 AD20 AD21 AD22 AD23 AD24 AD25 AD26 AD27 AD28 AD29 AD30 AD31 C8 C7 B6 C6 C5 A3 A2 C3 C2 D2 F1 E3 F3 G1 H2 G3 D7 B5 A4 B4 C4 B3 B2 B1 C1 D3 E2 F2 F4 G4 H3 G2 I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC EBU Address/Data Bus Input/Output Lines EBU Address/Data Bus Line 0 EBU Address/Data Bus Line 1 EBU Address/Data Bus Line 2 EBU Address/Data Bus Line 3 EBU Address/Data Bus Line 4 EBU Address/Data Bus Line 5 EBU Address/Data Bus Line 6 EBU Address/Data Bus Line 7 EBU Address/Data Bus Line 8 EBU Address/Data Bus Line 9 EBU Address/Data Bus Line 10 EBU Address/Data Bus Line 11 EBU Address/Data Bus Line 12 EBU Address/Data Bus Line 13 EBU Address/Data Bus Line 14 EBU Address/Data Bus Line 15 EBU Address/Data Bus Line 16 EBU Address/Data Bus Line 17 EBU Address/Data Bus Line 18 EBU Address/Data Bus Line 19 EBU Address/Data Bus Line 20 EBU Address/Data Bus Line 21 EBU Address/Data Bus Line 22 EBU Address/Data Bus Line 23 EBU Address/Data Bus Line 24 EBU Address/Data Bus Line 25 EBU Address/Data Bus Line 26 EBU Address/Data Bus Line 27 EBU Address/Data Bus Line 28 EBU Address/Data Bus Line 29 EBU Address/Data Bus Line 30 EBU Address/Data Bus Line 31 BC0 BC1 BC2 BC3 A5 A6 B7 A7 O O O O PUC PUC PUC PUC EBU Byte Control Line 0 EBU Byte Control Line 1 EBU Byte Control Line 2 EBU Byte Control Line 3 Data Sheet 13 V1.0, 2005-02 TC1100 General Device Information Advance Information Table 2-1 Pin Definitions and Functions (cont’d) Functions Symbol Pin In PU/ Out PD1) A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 A23 K1 L1 M1 N1 P1 J2 K2 L2 M2 N2 J3 K3 L3 M3 K4 A8 A9 A10 B10 C10 D10 T4 R4 P4 O O O O O O O O O O O O O O O O O O O O O O O O PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC PUC XTAL1 XTAL2 M16 N16 I O   Oscillator/PLL/Clock Generator Input/Output Pins XTAL1 is the input to the main oscillator amplifier and input to the internal clock generator. XTAL2 is the output of the main oscillator amplifier circuit. For clocking of the device from an external source, XTAL1 is driven with the clock signal while XTAL2 is left unconnected. For crystal oscillator operation, XTAL1 and XTAL2 are connected to the crystal with the appropriate recommended oscillator circuitry. VDDOSC3 VSSOSC3 VDDOSC P16   Main Oscillator Power Supply (3.3 V) R16   Main Oscillator Ground L16   Main Oscillator Power Supply (1.5 V) Data Sheet EBU Address Bus Input/Output Lines EBU Address Bus Line 0 EBU Address Bus Line 1 EBU Address Bus Line 2 EBU Address Bus Line 3 EBU Address Bus Line 4 EBU Address Bus Line 5 EBU Address Bus Line 6 EBU Address Bus Line 7 EBU Address Bus Line 8 EBU Address Bus Line 9 EBU Address Bus Line 10 EBU Address Bus Line 11 EBU Address Bus Line 12 EBU Address Bus Line 13 EBU Address Bus Line 14 EBU Address Bus Line 15 EBU Address Bus Line 16 EBU Address Bus Line 17 EBU Address Bus Line 18 EBU Address Bus Line 19 EBU Address Bus Line 20 EBU Address Bus Line 21 EBU Address Bus Line 22 EBU Address Bus Line 23 14 V1.0, 2005-02 TC1100 General Device Information Advance Information Table 2-1 Pin Definitions and Functions (cont’d) Symbol Pin In PU/ Out PD1) Functions VSSOSC VDD L15   Main Oscillator Ground G7  G8 G9 G10 G13 K7,K8 K9 K10  Core and Logic Power Supply (1.5 V) VDDP D4 D13 H4 J13 M4 N13   Ports Power Supply (3.3 V) VSS E4  E13 H7 H8 H9 H10 H13 J4,J7 J8,J9 J10 M13 N4 R2,T2  Ground N.C. A1  A16 T1,R1 T14 T15 T16  Not Connected These pins must not be connected. 1) Refers to internal pull-up or pull-down device connected and corresponding type. The notation ‘’ indicates that the internal pull-up or pull-down device is not enabled. Note: P2.12 to P2.15 are always configured as open drain. Data Sheet 15 V1.0, 2005-02 TC1100 Functional Description Advance Information 3 Functional Description 3.1 On-Chip Memories The TC1100 provides the following on-chip memories: • Program Memory Interface (PMI) with – 32-Kbyte Scratch-pad Code RAM (SPRAM) – 16-Kbyte Instruction Cache Memory (ICACHE) • Data Memory Interface (DMI) with – 28-Kbyte Scratch-pad Data RAM (SPRAM) – 4-Kbyte Data Cache Memory (DCACHE) • Data Memory Unit (DMU) with – 64-Kbyte SRAM • 16-Kbyte Boot ROM (BROM) Data Sheet 16 V1.0, 2005-02 TC1100 Functional Description Advance Information 3.2 Address Map Table 3-1 defines the specific segment oriented address blocks of the TC1100 with its address range, size, and PMI/DMI access view. Table 3-2 shows the block address map of the Segment 15 which includes on-chip peripheral units and ports. Table 3-1 TC1100 Block Address Map Seg- Address ment Range 0 – 7 0000 0000H – 7FFF FFFFH 8 8000 0000H – 8FFF FFFFH 9 9000 0000H – 9FDF FFFFH 10 11 12 A000 0000H – AFBF FFFFH Size Description 2 GB MMU Space 256 MB External Memory Space mapped from Segment 10 256 MB Reserved via LMB via LMB DMU Space AFC0 0000H – 64 KB AFC0 FFFFH AFC1 0000H – ~4 MB Reserved AFFF FFFFH B000 0000H – 256 MB Reserved BFFF FFFFH via FPI via FPI C000 0000H – C000 FFFFH 64 KB DMU via LMB via LMB C001 0000H – CFFF FFFFH ~ 256 MB Reserved Data Sheet 252 MB External Memory Space DMI PMI Acc. Acc. via FPI via FPI via via LMB LMB via FPI via FPI 17 c a c h e d n o nc a c h e d c a c h e d V1.0, 2005-02 TC1100 Functional Description Advance Information TC1100 Block Address Map (cont’d) Seg- Address ment Range D000 0000H – D000 6FFFH D000 7000H – D3FF FFFFH D400 0000H – D400 7FFFH 13 Size Description 28 KB DMI Local Data RAM (LDRAM) ~ 64 MB Reserved 32 KB PMI Local Code Scratch Pad RAM (SPRAM) D400 8000H – D7FF FFFFH ~64 MB Reserved D800 0000H – DDFF FFFFH 96 MB E000 0000H – E7FF FFFFH 128 MB External Memory Space E800 0000H – E83F FFFFH 4 MB E840 0000H – E84F FFFFH 1 MB E850 0000H – E85F FFFFH 1 MB Data Sheet PMI Acc. via LMB via LMB PMI local via LMB via LMB – – External Memory Space Emulator Memory Space DE00 0000H – 16 MB DEFF FFFFH DF00 0000H – ~16 MB Reserved DFFF BFFFH Boot ROM Space DFFF C000H – 16 KB DFFF FFFFH 14 DMI Acc. DMI local via FPI via FPI via LMB access only from FPI bus side of LFI Reserved for mapped space access for lower 1 Mbyte of Local only Memory in Segment 13 from (Transformed by LFI bridge to FPI D000 0000H – D00F FFFFH) bus side of Reserved for mapped space for 1 Mbyte of Local Memory in LFI Segment 13 (Transformed by LFI bridge to D400 0000H – D40F FFFFH) Reserved for mapped space for lower 4 Mbytes of Local Memory in Segment 12 (Transformed by LFI bridge to C000 0000H – C03F FFFFH) 18 via LMB access only from FPI bus side of LFI access only from FPI bus side of LFI non-cached Table 3-1 V1.0, 2005-02 TC1100 Functional Description Advance Information Table 3-1 TC1100 Block Address Map (cont’d) Seg- Address ment Range 14 E860 0000H – EFFF FFFFH 15 F000 0000H FFFF FFFFH Table 3-2 Size Description 122 MB Reserved 256 MB See Table 3-2 DMI Acc. – via LMB or via FPI PMI Acc. – n o nvia c LMB or a via c FPI h e d Block Address Map of Segment 15 Symbol Description Address Range Size System Peripheral Bus (SPB) SCU System Control Unit (incl. WDT) F000 0000H - F000 00FFH 256 Bytes SBCU FPI Bus Control Unit F000 0100H - F000 01FFH 256 Bytes STM System Timer F000 0200H - F000 02FFH 256 Bytes OCDS On-Chip Debug Support (Cerberus) F000 0300H - F000 03FFH 256 Bytes – Reserved F000 0400H - F000 04FFH 256 Bytes – Reserved F000 0500H - F000 05FFH 256 Bytes GPTU General Purpose Timer Unit F000 0600H - F000 06FFH 256 Bytes – Reserved F000 0700H - F000 07FFH 256 Bytes – Reserved F000 0800H - F000 08FFH 256 Bytes – Reserved F000 0900H - F000 09FFH 256 Bytes – Reserved F000 0A00H - F000 0AFFH 256 Bytes – Reserved F000 0B00H - F000 0BFFH 256 Bytes P0 Port 0 F000 0C00H - F000 0CFFH 256 Bytes P1 Port 1 F000 0D00H - F000 0DFFH 256 Bytes P2 Port 2 F000 0E00H - F000 0EFFH 256 Bytes P3 Port 3 F000 0F00H - F000 0FFFH 256 Bytes P4 Port 4 F000 1000H - F000 10FFH 256 Bytes – Reserved F000 1100H - F000 11FFH 256 Bytes Data Sheet 19 V1.0, 2005-02 TC1100 Functional Description Advance Information Table 3-2 Block Address Map of Segment 15 (cont’d) Symbol Description Address Range Size – Reserved F000 1200H - F000 12FFH 256 Bytes – Reserved F000 1300H - F000 13FFH 256 Bytes – Reserved F000 1400H - F000 14FFH 256 Bytes – Reserved F000 1500H - F000 15FFH 256 Bytes – Reserved F000 1600H - F000 16FFH 256 Bytes – Reserved F000 1700H - F000 17FFH 256 Bytes – Reserved F000 1800H - F000 18FFH 256 Bytes – Reserved F000 1900H - F000 19FFH 256 Bytes – Reserved; these locations should not be written. F000 2000H - F000 20FFH 256 Bytes CCU61 Capture/Compare Unit 1 F000 2100H - F000 21FFH 256 Bytes – Reserved F000 2200H - F000 3BFFH – DMA Direct Memory Access Controller F000 3C00H - F0003EFFH 3 × 256 Bytes – Reserved F000 3F00H - F000 3FFFH – – Reserved; these locations should not be written. F000 4000H - F000 5FFFH 8 Kbytes – Reserved F000 6000H - F00E1FFFH – Reserved; these locations should not be written. F00E 2000H - F00E 219FH 416 Bytes – Reserved; these locations should not be written. F00E 21A0H - F00E 27FFH 1.6 Kbytes – Reserved; these locations should not be written. F00E 2800H - F00E 28FFH 256 Bytes – Reserved F00E 2900H - F00F FFFFH – – Units on SMIF Interface of DMA Controller – Reserved F010 0000H - F010 00FFH 256 Bytes SSC0 Synchronous Serial Interface 0 F010 0100H - F010 01FFH 256 Bytes SSC1 Synchronous Serial Interface 1 F010 0200H - F010 02FFH 256 Bytes ASC0 Async./Sync. Serial Interface 0 F010 0300H - F010 03FFH 256 Bytes ASC1 Async./Sync. Serial Interface 1 F010 0400H - F010 04FFH 256 Bytes Data Sheet 20 V1.0, 2005-02 TC1100 Functional Description Advance Information Table 3-2 Block Address Map of Segment 15 (cont’d) Symbol Description Address Range – Reserved; these locations should not be written. F010 0500H - F010 05FFH 256 Bytes I2C Inter IC F010 0600H - F010 06FFH 256 Bytes – Reserved F010 0700H - F010 BFFFH – MLI0 Micro Link Interface 0 F010 C000H -F010 C0FFH 256 Bytes – Reserved; these locations should not be written. F010 C100H - F010 C1FFH 256 Bytes MCHK Memory Checker F010 C200H - F010 C2FFH 256 Bytes – Reserved F010 C300H - F01D FFFFH – MLI0_ SP0 MLI0 Small Transfer Window 0 F01E 0000H - F01E 1FFFH 8 Kbytes MLI0_ SP1 MLI0 Small Transfer Window 1 F01E 2000H - F01E 3FFFH 8 Kbytes MLI0_ SP2 MLI0 Small Transfer Window 2 F01E 4000H - F01E 5FFFH 8 Kbytes MLI0_ SP3 MLI0 Small Transfer Window 3 F01E 6000H - F01E 7FFFH 8 Kbytes – Reserved; these locations should not be written. F01E 8000H - F01E 9FFFH 8 Kbytes – Reserved; these locations should not be written. F01E A000H - F01E BFFFH 8 Kbytes – Reserved; these locations should not be written. F01E C000H- F01E DFFFH 8 Kbytes – Reserved; these locations should not be written. F01E E000H - F01E FFFFH 8 Kbytes – Reserved F01F 0000H - F01F FFFFH – MLI0_ LP0 MLI0 Large Transfer Window 0 F020 0000H - F020 FFFFH 64 Kbytes MLI0_ LP1 MLI0 Large Transfer Window 1 F021 0000H - F021 FFFFH 64 Kbytes MLI0_ LP2 MLI0 Large Transfer Window 2 F022 0000H - F022 FFFFH 64 Kbytes MLI0_ LP3 MLI0 Large Transfer Window 3 F023 0000H - F023 FFFFH 64 Kbytes Data Sheet 21 Size V1.0, 2005-02 TC1100 Functional Description Advance Information Table 3-2 Block Address Map of Segment 15 (cont’d) Symbol Description Address Range Size – Reserved; these locations should not be written. F024 0000H - F024 FFFFH 64 Kbytes – Reserved; these locations should not be written. F025 0000H - F025 FFFFH 64 Kbytes – Reserved; these locations should not be written. F026 0000H - F026 FFFFH 64 Kbytes – Reserved; these locations should not be written. F027 0000H - F027 FFFFH 64 Kbytes – Reserved F028 0000H - F200 00FFH – – Reserved; these locations should not be written. F200 0100H - F200 05FFH 1280Bytes – Reserved F200 0600H - F7E0 FEFFH – CPU (Part of System Peripheral Bus) CPU SFRs CPU Slave Interface F7E0 FF00H - F7E0 FFFFH 256 Bytes Reserved F7E1 0000H - F7E1 7FFFH – MMU F7E1 8000H - F7E1 80FFH 256 Bytes Reserved F7E1 8100H - F7E1 BFFFH – Memory Protection Registers F7E1 C000H- F7E1 EFFFH 12 Kbytes Reserved F7E1 F000H - F7E1 FCFFH – Core Debug Register (OCDS) F7E1 FD00H- F7E1 FDFFH 256 Bytes Core Special Function Registers (CSFRs) F7E1 FE00H- F7E1 FEFFH 256 Bytes General Purpose Register (GPRs) F7E1 FF00H - F7E1 FFFFH 256 Bytes – Reserved F7E2 0000H - F7FF FFFFH – Local Memory Buses (LMB) EBU External Bus Interface Unit F800 0000H - F800 03FFH 1 Kbyte DMU Data Memory Unit F800 0400H - F800 04FFH 256 Bytes – Reserved F800 0500H - F87F FBFFH – DMI Data Memory Interface Unit F87F FC00H - F87F FCFFH 256 Bytes PMI Program Memory Interface Unit F87F FD00H - F87F FDFFH 256 Bytes LBCU Local Memory Bus Control Unit F87F FE00H - F87F FEFFH 256 Bytes Data Sheet 22 V1.0, 2005-02 TC1100 Functional Description Advance Information Table 3-2 Block Address Map of Segment 15 (cont’d) Symbol Description Address Range LFI LMB to FPI Bus Bridge F87F FF00H - F87F FFFFH 256 Bytes – Reserved F880 0000H - FFFF FFFFH – Data Sheet 23 Size V1.0, 2005-02 TC1100 Functional Description Advance Information 3.3 Memory Protection System The TC1100 memory protection system specifies the addressable range and read/write permissions of memory segments available to the currently executing task. The memory protection system controls the position and range of addressable segments in memory. It also controls the kinds of read and write operations allowed within addressable memory segments. Any illegal memory access is detected by the memory protection hardware, which then invokes the appropriate Trap Service Routine (TSR) to handle the error. Thus, the memory protection system protects critical system functions against both software and hardware errors. The memory protection hardware can also generate signals to the Debug Unit to facilitate tracing illegal memory accesses. In TC1100, TriCore™ supports two address spaces: the virtual address space and the physical address space. Both address space are 4 Gbytes in size and divided into 16 segments with each segment being 256 Mbytes. The upper 4 bits of the 32-bit address are used to identify the segment. Virtual segments are numbered 0 - 15. But a virtual address is always translated into a physical address before accessing memory. The virtual address is translated into a physical address using one of two translation mechanisms: (a) direct translation, and (b) Page Table Entry (PTE) based translation. If the virtual address belongs to the upper half of the virtual address space then the virtual address is directly used as the physical address (direct translation). If the virtual address belongs to the lower half of the address space, then the virtual address is used directly as the physical address if the processor is operating in physical mode (direct translation) or translated using a Page Table Entry if the processor is operating in virtual mode (PTE translation). These are managed by Memory Management Unit (MMU). Memory protection is enforced using separate mechanisms for the two translation paths. 3.3.1 Protection for Direct translation Memory protection for addresses that undergo direct translation is enforced using the range based protection that has been used in the previous generation of the TriCore™ architecture. The range based protection mechanism provides support for protecting memory ranges from unauthorized read, write, or instruction fetch accesses. The TriCore™ architecture provides up to four protection register sets with the PSW.PRS field controlling the selection of the protection register set. Because the TC1100 uses a Harvard-style memory architecture, each Memory Protection Register Set is broken down into a Data Protection Register Set and a Code Protection Register Set. Each Data Protection Register Set can specify up to four address ranges to receive particular protection modes. Each Code Protection Register Set can specify up to two address ranges to receive particular protection modes. Each of the Data Protection Register Sets and Code Protection Register Sets determines the range and protection modes for a separate memory area. Each contains register pairs which determine the address range (the Data Segment Protection Registers and Code Segment Protection Registers) and one register (Data Protection Data Sheet 24 V1.0, 2005-02 TC1100 Functional Description Advance Information Mode Register) which determines the memory access modes which apply to the specified range. 3.3.2 Protection for PTE based translation Memory protection for addresses that undergo PTE based translation is enforced using the PTE used for the address translation. The PTE provides support for protecting a process from unauthorized read, write, or instruction fetches by other processes. The PTE has the following bits that are provided for the purpose of protection: • Execute Enable (XE) enables instruction fetch to the page • Write Enable (WE) enables data writes to the page • Read Enable (RE) enables data reads from the page Furthermore, User-0 accesses to virtual addresses in the upper half of the virtual address space are disallowed when operating in virtual mode. In physical mode, User-0 accesses are disallowed only to segments 14 and 15. Any User-0 access to a virtual address that is restricted to User-1 or supervisor mode will cause a Virtual Address Protection (VAP) Trap in both the physical and virtual modes. 3.3.3 Memory Checker The Memory Checker module (MCHK) makes it possible to check the data consistency of memories. It uses DMA moves to read from the selected address area and to write the value read in a memory checker input register (the moves should be 32-bit moves). A polynomial checksum calculation is done with each write operation to the memory checker input register. Data Sheet 25 V1.0, 2005-02 TC1100 Functional Description Advance Information 3.4 On-Chip Bus System The TC1100 includes two bus systems: • Local Memory Bus (LMB) • Flexible Peripheral Interface Bus (FPI) The LMB-to-FPI (LFI) bridge interconnects the FPI bus and LMB Bus. 3.4.1 Local Memory Bus (LMB) The Local Memory Bus interconnects the memory units and functional units, such as CPU and DMU. The main objective of the LMB bus is to support devices with fast response time. This allows the DMI and PMI fast access to local memory and reduces load on the FPI bus. The TriCore™ system itself is located on the LMB bus. Via External Bus Unit, it interconnects TC1100 and external components. The Local Memory Bus is a synchronous, pipelined, split bus with variable block size transfer support. It supports 8, 16, 32 and 64 bits single beat transactions and variable length 64 bits block transfers. Features: The LMB provides the following features: • • • • • • • • • Synchronous, Pipelined, Multimaster, 64-bit high performance bus Optimized for high speed and high performance 32-bit address, 64-bit data buses Central, simple per cycle arbitration Slave controlled wait state insertion Address pipelining (max depth - 2) Supports Split transactions Supports Variable block size transfer Supports Locked transaction (read-modify-write) 3.4.2 Flexible Peripheral Interconnect Bus (FPI) The FPI Bus is an on-chip bus that is used in modular and highly integrated microprocessors and microcontrollers (systems-on-chips). FPI Bus is designed for memory mapped data transfers between its bus agents. Bus agents are on-chip function blocks (modules), equipped with an FPI Bus interface and connected via FPI Bus signals. An FPI Bus agent acts as an FPI Bus master when it initiates data read or data write operations once bus ownership has been granted to the agent. An FPI Bus agent that is addressed by an FPI Bus operation acts as an FPI Bus slave when it performs the requested data read or write operation. Data Sheet 26 V1.0, 2005-02 TC1100 Functional Description Advance Information Features: The FPI Bus is designed with the requirements of high-performance systems in mind. The features are: • • • • • • • • • • • Core independent Multimaster capability (up to 16 masters) Demultiplexed operation Clock synchronous Peak transfer rate of up to 800 Mbytes/sec (@ 100 MHz bus clock) Address and data bus scalable (address bus up to 32 bits, data bus up to 64 bits) 8-/16-/32- and 64-bit data transfers Broad range of transfer types from single to multiple data transfers Split transaction support for agents with long response time Burst transfer capability EMI and power consumption minimized 3.4.3 LFI The LMB-to-FPI Interface (LFI) block provides the circuitry to interface (bridge) the FPI bus and the Local Memory Bus (LMB). LFI Features: • Full support for bus transactions found within current TriCore™ 1.3 based systems: – Single 8/16/32-bit Write/Read transfers from FPI to LMB – Single 8/16/32/64-bit Write/Read transfers from LMB to FPI – Read-Modify-Write transfers of 8/16/32-bit in both directions – Burst transactions of 2, 4 or 8 data beats from the FPI to the LMB – Burst transactions of 2 or 4 data beats from the LMB to the FPI • Address decoding and translation as required by TriCore™ 1.3 implementation • FPI master interface supports full pipelining on FPI bus • LMB master interface supports pipelining on LMB within the scope of the LMB specification • FPI master interface can act as default master on FPI bus • Programmable support for split LMB to FPI read transactions • Retry generation on both FPI and LMB buses • Full support for abort, retry, error and FPI timeout conditions • Flexible LMB/FPI clock ratio support including dynamic clock switching support • LFI core clock may be shut down when no transactions are being issued to LFI from either bus and the LFI has no transactions in progress, thus saving power. Data Sheet 27 V1.0, 2005-02 TC1100 Functional Description Advance Information 3.5 LMB External Bus Unit The LMB External Bus Control Unit (EBU) of the TC1100 is the interface between external resources, like memories and peripheral units, and the internal resources connected to on-chip buses if enabled. The basic structure and external interconnections of the EBU are shown in Figure 3-1. 32 4 24 AD[31:0] BC[3:0] A[23:0] RD PMI RD/WR ALE 4 TriCore TM LMB MMU CS[3:0] CSCOMB ADV BAA DMI WAIT LFI MR/W EBU_LMB BFCLKI BFCLKO FPI CKE CAS To Peripherals RAS SDCLKI SDCLKO P0.4/BREQ Port 0 Control P0.5/HOLD P0.6/HLDA Port 2 Control P2.0/CSEMU Port 1 Control P1.15/RMW MCB04941_mod Figure 3-1 Data Sheet EBU Structure and Interface 28 V1.0, 2005-02 TC1100 Functional Description Advance Information The EBU is used primarily for any Local Memory Bus (LMB) master accessing external memories. The EBU controls all transactions required for this operation and in particular handles the arbitration between the internal EBU master and the external EBU master. The types of external devices/bus modes controlled by the EBU are: • • • • • • Intel-style peripherals (separate RD and WR signals) ROMs, EPROMs Static RAMs PC100 and PC133 SDRAMs (Burst Read/Write Capacity/Multi-Bank/Page support) Specific types of Burst Mode Flash devices Special support for external emulator/debug hardware Features: • • • • • • • • • • • • • • • Supports 64-bit Local Memory Bus (LMB) Supports external bus frequency: internal LMB frequency = 1:1 or 1:2 Provides highly programmable access parameters Supports Intel-style peripherals/devices Supports PC100 and PC133 (runs in maximum 120 MHz) SDRAM (burst access, multibanking, precharge, refresh) Supports 16- and 32-bit SDRAM data bus and 64-,128-, and 256-Mbit devices Supports Burst Flash devices Supports Multiplexed access (address and data on the same bus) when PC100 and PC133 SDRAM are not presented on the external bus Supports data buffering: Code Prefetch Buffer, Read/Write Buffer External master arbitration compatible to C166 and other TriCore™ devices Provides 4 programmable address regions (1 dedicated for emulator) Provides a CSGLB signal, bit programmable to combine one or more CS lines for buffer control Provides RMW signal reflecting read-modify-write action Supports Little Endian byte ordering Provides signal for controlling data flow of slow-memory buffer Data Sheet 29 V1.0, 2005-02 TC1100 Functional Description Advance Information 3.6 Direct Memory Access (DMA) The Direct Memory Access Controller executes DMA transactions from a source address location to a destination address location, without intervention of the CPU. One DMA transaction is controlled by one DMA channel. Each DMA channel has assigned its own channel register set. The total of 8 channels are provided by one DMA sub-block. The DMA module is connected to 3 bus interfaces in TC1100, the Flexible Peripheral Interconnect Bus (FPI), the DMA Bus and the Micro Link Bus. It can do transfers on each of the buses as well as between the buses. In addition, it bridges accesses from the Flexible Peripheral Interconnect Bus to the peripherals on the DMA Bus, allowing easy access to these peripherals by CPU. Clock control, address decoding, DMA request wiring, and DMA interrupt service request control are implementation specific and managed outside the DMA controller kernel. Features: • 8 independent DMA channels – Up to 8 selectable request inputs per DMA channel – Programmable priority of DMA channels within a DMA sub-block (2 levels) – Software and hardware DMA request generation – Hardware requests by selected peripherals and external inputs • Programmable priority of the DMA sub-block on the bus interfaces • Buffer capability for move actions on the buses (min. 1 move per bus is buffered) • Individually programmable operation modes for each DMA channel – Single mode: stops and disables DMA channel after a predefined number of DMA transfers – Continuous mode: DMA channel remains enabled after a predefined number of DMA transfers; DMA transaction can be repeated – Programmable address modification • Full 32-bit addressing capability of each DMA channel – 4-Gbyte address range – Support of circular buffer addressing mode • Programmable data width of a DMA transaction: 8-bit, 16-bit, or 32-bit • Micro Link supported • Register set for each DMA channel – Source and destination address register – Channel control and status register – Transfer count register • Flexible interrupt generation (the service request node logic for the MLI channels is also implemented in the DMA module) • All buses/interfaces connected to the DMA module must work at the same frequency. • Read/write requests of the FPI Bus Side to the Remote Peripherals are bridged to the DMA Bus (only the DMA is master on the DMA bus) Data Sheet 30 V1.0, 2005-02 TC1100 Functional Description Advance Information The basic structure and external interconnections of the DMA are shown in Figure 3-2. DMA Controller f DMA Clock Control Address Decoder SSC1 CCU61 MLI0 I2C SCU (Ext.Trg) Interrupt Control ASC1 2 2 8 2 1 DMA Request Wiring Matrix 4 8 Request Assignment and Priorisation Unit 0 Channel 00-07 Registers Bus Interface 1 M/S DMA Bus SSC0 ASC0 SSC0 SSC1 IIC Transaction Control Engine Bus Interface 2 SMIF 1 MLI0 DMA Bus ASC1 To FPI Bus DMA Sub-Block 0 2 Switch ASC0 Bus Interface 0 M/S Arbiter/ Switch Control Mem Check 4 4 SR [15:12] DMA Interrupt Control Unit SR [3:0] TC1100_DMAImplementation Figure 3-2 Data Sheet DMA Controller Structure and Interconnections 31 V1.0, 2005-02 TC1100 Functional Description Advance Information 3.7 Interrupt System An interrupt request can be serviced by the CPU, which is called “Service Provider”. Interrupt requests are referred to as “Service Requests” in this document. Each peripheral in the TC1100 can generate service requests. Additionally, the Bus Control Unit, the Debug Unit, the DMA Controller and even the CPU itself can generate service requests to the Service Provider. As shown in Figure 3-3, each unit that can generate service requests is connected to one or multiple Service Request Nodes (SRN). Each SRN contains a Service Request Control Register mod_SRC, where “mod” is the identifier of the unit requesting service. The SRNs are connected to the Interrupt Control Unit (ICU) via the CPU Interrupt Arbitration Bus. The ICU arbitrates service requests for the CPU and administers the Interrupt Arbitration Bus. Units that can generate service requests are: • • • • • • • • • • • • • • Asynchronous/Synchronous Serial Interfaces (ASC0 and ASC1) with 4 SRNs each High-Speed Synchronous Serial Interfaces (SSC0 and SSC1) with 3 SRNs each Inter IC Interface (IIC) with 3 SRNs Micro Link Interface MLI0 with 4 SRNs General Purpose Timer Unit (GPTU) with 8 SRNs Capture/Compare Unit (CCU61) with 4 SRNs External Interrupts with 4 SRNs Direct Memory Access Controller (DMA) with 4 SRNs DMA Bus with 1 SRN System Timer (STM) with 2 SRNs Bus Control Units (SBCU and LBCU) with 1 SRN each Central Processing Unit (CPU) with 4 SRNs Floating Point Unit (FPU) with 1 SRN Debug Unit (OCDS) with 1 SRN The CPU can make service requests directly to itself (via the ICU). The CPU Service Request Nodes are activated through software. Data Sheet 32 V1.0, 2005-02 TC1100 Functional Description Advance Information CPU Interrupt Arbitration Bus Service Requestors Service Req. Nodes Service Req. Nodes 4 4 ASC0 4 ASC1 3 SSC0 3 SSC1 4 MLI0 8 GPTU 2 STM 1 FPU 1 OCDS DMA BUS 1 4 SRNs 4 SRNs 3 SRNs 3 SRNs 4 SRNs 8 SRNs 2 SRNs 1 SRN 1 SRN 1 SRN Interrupt Service Providers 4 4 SRNs 4 Software Interrupts 4 CPU CPU Interrupt Control Unit 3 ICU Int. Req. 3 Int. Ack. PIPN CCPN 4 Service Req. Nodes 8 4 4 SRN Service Requestors 4 Ext. Int. 2 3 3 SRNs 3 IIC 1 4 1 1 1 1 4 4 SRNs 1 SRN 1 SRN 4 SRNs 4 1 1 4 CCU61 LBCU SBCU DMA InterruptSys_cedar_TC1100 Figure 3-3 Data Sheet Block Diagram of the TC1100 Interrupt System 33 V1.0, 2005-02 TC1100 Functional Description Advance Information 3.8 Parallel Ports The TC1100 has 72 digital input/output port lines, which are organized into four parallel 16-bit ports and one parallel 8-bit port, Port P0 to Port P4 with 3.3 V nominal voltage. The digital parallel ports can be used as general purpose I/O lines or they can perform input/output functions for the on-chip peripheral units. An overview on the port-toperipheral unit assignment is shown in Figure 3-4. Alternate Functions GPIO GPIO 16 Alternate Functions 16 GPTU/ ASC1 /SSC0/ GPIO0 SSC1/ MLI0/ EBU/ SCU/ External Interrupts GPIO3 SSC0/ SSC1/ CCU61/ OCDS 16 SSC0/ SSC1/ EBU/ SCU/ GPIO1 OCDS TC1100 Parallel Ports 8 GPIO4 MLI0/ SCU 16 ASC0/ ASC1/ SSC0/ GPIO2 SSC1/ IIC/ EBU/ SCU MCA04951mod_TC1100 Figure 3-4 Data Sheet Parallel Ports of the TC1100 34 V1.0, 2005-02 TC1100 Functional Description Advance Information 3.9 Asynchronous/Synchronous Serial Interface (ASC) Figure 3-5 shows a global view of the functional blocks of two Asynchronous/ Synchronous Serial interfaces (ASC0 and ASC1). Each ASC module (ASC0/ASC1) communicates with the external world via one pair of I/O lines. The RXD line is the receive data input signal (in synchronous mode also output). TXD is the transmit output signal. Clock control, address decoding, and interrupt service request control are managed outside the ASC module kernel. The Asynchronous/Synchronous Serial interfaces provide serial communication between the TC1100 and other microcontrollers, microprocessors or external peripherals. Each ASC supports full-duplex asynchronous communication and half-duplex synchronous communication. In synchronous mode, data is transmitted or received synchronous to a shift clock which is generated by the ASC internally. In asynchronous mode, 8-bit or 9-bit data transfer, parity generation, and the number of stop bits can be selected. Parity, framing, and overrun error detection are provided to increase the reliability of data transfers. Transmission and reception of data is double-buffered. For multiprocessor communication, a mechanism is included to distinguish address bytes from data bytes. Testing is supported by a loop-back option. A 13-bit baud-rate generator provides the ASC with a separate serial clock signal that can be accurately adjusted by a prescaler implemented as a fractional divider. Data Sheet 35 V1.0, 2005-02 TC1100 Functional Description Advance Information f ASC0 Clock Control RXD_I0 Address Decoder ASC0 Module (Kernel) RXD_I1 P2.0/ RXD0 RXD_O P2.1/ TXD0 TXD_O EIR TBIR TIR RIR Interrupt Control Port Control to DMA f ASC1 Clock Control P2.8/ RXD1A RXD_I0 Address Decoder ASC1 Module (Kernel) RXD_O P0.0/ RXD1B TXD_O EIR TBIR TIR RIR Interrupt Control P2.9/ TXD1A RXD_I1 P0.1/ TXD1B to DMA MCB04485_mod_TC1100 Figure 3-5 General Block Diagram of the ASC Interfaces Features: • Full-duplex asynchronous operating modes – 8-bit or 9-bit data frames, LSB first – Parity bit generation/checking – One or two stop bits – Baud rate from 4.6875 MBaud to 1.1 Baud (@ 75 MHz clock) • Multiprocessor mode for automatic address/data byte detection Data Sheet 36 V1.0, 2005-02 TC1100 Functional Description Advance Information • Loop-back capability • Half-duplex 8-bit synchronous operating mode – Baud rate from 9.375 MBaud to 762.9 Baud (@ 75 MHz clock) • Support for IrDA data transmission up to 115.2 kBaud maximum • Double buffered transmitter/receiver • Interrupt generation – On a transmitter buffer empty condition – On a transmit last bit of a frame condition – On a receiver buffer full condition – On an error condition (frame, parity, overrun error) • FIFO – 8-byte receive FIFO (RXFIFO) – 8-byte transmit FIFO (TXFIFO) – Independent control of RXFIFO and TXFIFO – 9-bit FIFO data width – Programmable Receive/Transmit Interrupt Trigger Level – Receive and Transmit FIFO filling level indication – Overrun error generation – Underflow error generation Data Sheet 37 V1.0, 2005-02 TC1100 Functional Description Advance Information 3.10 High-Speed Synchronous Serial Interface (SSC) Figure 3-6 shows a global view of the functional blocks of two High-Speed Synchronous Serial interfaces (SSC0 and SSC1). Each SSC supports full-duplex and half-duplex serial synchronous communication up to 37.5 MBaud (@ 75 MHz module clock) with receive and transmit FIFO support. The serial clock signal can be generated by the SSC itself (master mode) or can be received from an external master (slave mode). Data width, shift direction, clock polarity and phase are programmable. This allows communication with SPI-compatible devices. Transmission and reception of data is double-buffered. A shift clock generator provides the SSC with a separate serial clock signal. Eight slave select inputs are available for slave mode operation. Eight programmable slave select outputs (chip selects) are supported in master mode. Features: • Master and slave mode operation – Full-duplex or half-duplex operation – Automatic pad control possible • Flexible data format – Programmable number of data bits: 2 to 16 bits – Programmable shift direction: LSB or MSB shift first – Programmable clock polarity: idle low or high state for the shift clock – Programmable clock/data phase: data shift with leading or trailing edge of the shift clock • Baud rate generation minimum at 572.2 Baud (@ 75 MHz module clock) • Interrupt generation – On a transmitter empty condition – On a receiver full condition – On an error condition (receive, phase, baud rate, transmit error) • Four-pin interface • Flexible SSC pin configuration • Up to eight slave select inputs in slave mode • Up to eight programmable slave select outputs SLSO in master mode – Automatic SLSO generation with programmable timing – Programmable active level and enable control • 4-stage receive FIFO (RXFIFO) and 4-stage transmit FIFO (TXFIFO) – Independent control of RXFIFO and TXFIFO – 2- to 16-bit FIFO data width – Programmable receive/transmit interrupt trigger level – Receive and transmit FIFO filling level indication – Overrun error generation – Underflow error generation Data Sheet 38 V1.0, 2005-02 TC1100 Functional Description Advance Information f SSC0 Clock Control Master fCLC0 Slave Address Decoder Slave SSC0 Module (Kernel) Master MRSTA MRSTB MTSR P2.2/MRST0 MTSRA MTSRB MRST P2.3/MTSR0 Port 2 Control SCLKA SCLKB SLCK P2.4/SCLK0 M/S Select Enable 1) 1) P2.12/SLSO03 P2.14/SLSO04 Interrupt Control EIR TIR RIR Slave to DMA Master SLSI1 SLSI[7:2] P1.15/SLSI0 1) SLSO0 SLSO[2:1] Port 1 Control P1.11/SLSO01 P1.13/SLSO02 SLSO[4:3] SLSO[7:5] P0.6/SLSO00 Port 0 Control P0.4/SLSI1 P0.7/SLSO10 P3.7/SLSO05 SLSI1 Slave f SSC1 Clock Control fCLC1 SLSI[7:2] SLSO0 SLSO[2:1] Master 1) P3.9/SLSO06 Port 3 Control P3.12/SLSO17 Port 1 Control SSC1 Module (Kernel) P3.8/SLSO15 P3.10/SLSO16 SLSO[4:3] SLSO[7:5] Address Decoder P3.11/SLSO07 P1.12/SLSO11 P1.14/SLSO12 P2.13/SLSO13 P2.15/SLSO14 Interrupt Control EIR TIR RIR Master Slave to DMA 1) M/S Select Enable1) Slave Master MRSTA MRSTB MTSR MTSRA MTSRB Data Sheet Port 2 Control P3.13/MRST1B P2.6/MTSR1A MRST P3.14/MTSR1B SCLKA SCLKB SLCK P2.7SCLK1A 1) Figure 3-6 P2.5/MRST1A These lines are not connected P3.15/SCLK1B MCB04486_mod General Block Diagram of the SSC Interfaces 39 V1.0, 2005-02 TC1100 Functional Description Advance Information 3.11 Inter IC Serial Interface (IIC) Figure 3-7 shows a global view of the functional blocks of the Inter IC Serial Interface (IIC). The IIC module has four I/O lines, located at Port 2. The IIC module is further supplied with clock control, interrupt control and address decoding logic. One DMA request can be generated by IIC module. Clock Control fIIC SDA0 P2.12/SDA0 SCL0 Address Decoder IIC Module INT_P Interrupt Control P2.13/SCL0 Port 2 Control SDA1 SCL1 P2.14/SDA1 P2.15/SCL1 INT_E INT_D to DMA Figure 3-7 General Block Diagram of the IIC Interface The on-chip IIC bus module connects the platform buses to other external controllers and/or peripherals via the two-line serial IIC interface. One line is responsible for clock transfer and synchronization (SCL), the other is responsible for the data transfer (SDA). The IIC bus module provides communication at data rates of up to 400 kbit/sec and features 7-bit addressing as well as 10-bit addressing. This module is fully compatible to the IIC bus protocol. The module can operate in three different modes: Master mode, where the IIC controls the bus transactions and provides the clock signal. Slave mode, where an external master controls the bus transactions and provides the clock signal. Multimaster mode, where several masters can be connected to the bus, i.e. the IIC can be master or slave. The on-chip IIC bus module allows efficient communication via the common IIC bus. The module unloads the CPU of low level tasks such as: • (De)Serialization of bus data • Generation of start and stop conditions • Monitoring the bus lines in slave mode Data Sheet 40 V1.0, 2005-02 TC1100 Functional Description Advance Information • Evaluation of the device address in slave mode • Bus access arbitration in multimaster mode Features: • • • • • • Extended buffer allows up to 4 send/receive data bytes to be stored Selectable baud rate generation Support of standard 100 kBaud and extended 400 kBaud data rates Operation in 7-bit addressing mode or 10-bit addressing mode Flexible control via interrupt service routines or by polling Dynamic access to up to 2 physical IIC buses Data Sheet 41 V1.0, 2005-02 TC1100 Functional Description Advance Information 3.12 Micro Link Serial Bus Interface (MLI) Figure 3-8 shows a global view of the functional blocks of the Micro Link Serial Bus Interface (MLI0). Clock Control fMLI0 TCLK TREADYA Address Decoder Interrupt Control DMA MLI Interface TVALIDA TDATA INT_O RCLKA RREADYA [3:0] INT_O Port 0 Control RDATAA MLI0 Module (Kernel) TCLK TREADYB TVALIDB TDATA RCLKB Port 4 Control RREADYB RVALIDB RDATAB Figure 3-8 P0.12/RCLK0A P0.13/ RREADY0A P0.14/ RVALID0A P0.15/ RDATA0A RVALIDA [7:4] P0.8/ TCLK0A P0.9/ TREADY0A P0.10/ TVALID0A P0.11/ TDATA0A P4.0/ TCLK0B P4.1/ TREADY0B P4.2/ TVALID0B P4.3/ TDATA0B P4.4/RCLK0B P4.5/ RREADY0B P4.6/ RVALID0B P4.7/ RDATA0B General Block Diagram of the MLI0 Interface The Micro Link Serial Bus Interface is dedicated to the serial communication between the other Infineon 32-bit controllers with MLI. The communication is intended to be fast due to an address translation system, and it is not necessary to have any special program in the second controller. Data Sheet 42 V1.0, 2005-02 TC1100 Functional Description Advance Information Features: • • • • • • • • • Serial communication from the MLI transmitter to MLI receiver of another controller Module supports connection of each MLI with up to four MLI from other controllers Fully transparent read/write access supported (= remote programming) Complete address range of target controller available Special protocol to transfer data, address offset, or address offset and data Error control using a parity bit 32-bit, 16-bit, and 8-bit data transfers Address offset width: from 1- to 16-bit Baud rate: fMLI / 2 (symmetric shift clock approach), baud rate definition by the corresponding fractional divider Data Sheet 43 V1.0, 2005-02 TC1100 Functional Description Advance Information 3.13 General Purpose Timer Unit (GPTU) Figure 3-9 shows a global view of the functional blocks of the General Purpose Timer Unit (GPTU). IN0 Clock Control fGPTU0 IN1 IN2 IN3 P0.0/GPTU_0 IN4 Address Decoder IN5 P0.1/GPTU_1 IN6 P0.2/GPTU_2 IN7 SR0 Interrupt Control Figure 3-9 GPTU Module Port 0 Control OUT0 P0.3/GPTU_3 P0.4/GPTU_4 SR1 OUT1 SR2 OUT2 P0.5/GPTU_5 SR3 OUT3 P0.6/GPTU_6 SR4 OUT4 SR5 OUT5 SR6 OUT6 SR7 OUT7 P0.7/GPTU_7 General Block Diagram of the GPTU Interface The GPTU consists of three 32-bit timers designed to solve such application tasks as event timing, event counting, and event recording. The GPTU communicates with the external world via eight I/O lines located at Port 0. The three timers of GPTU module, T0, T1 and T2, can operate independently of each other or can be combined: General Features: • • • • All timers are 32-bit precision timers with a maximum input frequency of fGPTU Events generated in T0 or T1 can be used to trigger actions in T2 Timer overflow or underflow in T2 can be used to clock either T0 or T1 T0 and T1 can be concatenated to form one 64-bit timer Features of T0 and T1: • Each timer has a dedicated 32-bit reload register with automatic reload on overflow • Timers can be split into individual 8-, 16-, or 24-bit timers with individual reload registers Data Sheet 44 V1.0, 2005-02 TC1100 Functional Description Advance Information • Overflow signals can be selected to generate service requests, pin output signals, and T2 trigger events • Two input pins can define a count option Features of T2: • Count up or down is selectable • Operating modes: – Timer – Counter – Quadrature counter (incremental/phase encoded counter interface) • Options: – External start/stop, one-shot operation, timer clear on external event – Count direction control through software or an external event – Two 32-bit reload/capture registers • Reload modes: – Reload on overflow or underflow – Reload on external event: positive transition, negative transition, or both transitions • Capture modes: – Capture on external event: positive transition, negative transition, or both transitions – Capture and clear timer on external event: positive transition, negative transition, or both transitions • Can be split into two 16-bit counter/timers • Timer count, reload, capture, and trigger functions can be assigned to input pins. T0 and T1 overflow events can also be assigned to these functions. • Overflow and underflow signals can be used to trigger T0 and/or T1 and to toggle output pins • T2 events are freely assignable to the service request nodes Data Sheet 45 V1.0, 2005-02 TC1100 Functional Description Advance Information 3.14 Capture/Compare Unit 6 (CCU6) Figure 3-10 shows a global view of the functional blocks of the Capture/Compare Unit (CCU61). The CCU6 module is further supplied with clock control, interrupt control, address decoding, and port control logic. One DMA request can be generated by the CCU6 module. The CCU6 provides two independent timers (T12, T13), which can be used for PWM generation, especially for AC-motor control. Additionally, special control modes for block commutation and multi-phase machines are supported. Timer 12 Features: • Three capture/compare channels, each channel can be used either as capture or as compare channel. • Generation of a three-phase PWM supported (six outputs, individual signals for highside and lowside switches) • 16-bit resolution, maximum count frequency = peripheral clock • Dead-time control for each channel to avoid short-circuits in the power stage • Concurrent update of the required T12/13 registers • Center-aligned and edge-aligned PWM can be generated • Single-shot mode supported • Many interrupt request sources • Hysteresis-like control mode Timer 13 Features: • • • • • One independent compare channel with one output 16-bit resolution, maximum count frequency = peripheral clock Can be synchronized to T12 Interrupt generation at period-match and compare-match Single-shot mode supported Additional Features: • • • • • • • Block commutation for Brushless DC-drives implemented Position detection via Hall-sensor pattern Automatic rotational speed measurement for block commutation Integrated error handling Fast emergency stop without CPU load via external signal (CTRAP) Control modes for multi-channel AC-drives Output levels can be selected and adapted to the power stage Data Sheet 46 V1.0, 2005-02 TC1100 Functional Description Advance Information /CTRAP P3.7 /CTRAP1 CCPOS0 P3.8 /CCPOS10 CCPOS1 P3.9 /CCPOS11 CCPOS2 P3.10 /CCPOS12 CC60 P3.1 /CC610 COUT60 Interrupt Control SRC0 SRC1 SRC2 SRC3 CCU61 Module (Kernel) CC61 COUT61 P3.2 /COUT610 Port 3 Control CC62 COUT62 COUT63 T12HR T13HR To DMA P3.3 /CC611 P3.4 /COUT611 P3.5 /CC612 P3.6 /COUT612 P3.0 /COUT613 P3.11 / CCU61_T12HR P3.12 / CCU61_T13HR TC1100_CCU6_imple Figure 3-10 General Block Diagram of the CCU6 Interface Data Sheet 47 V1.0, 2005-02 TC1100 Functional Description Advance Information 3.15 System Timer The STM within the TC1100 is designed for global system timing applications requiring both high precision and long range. The STM provides the following features: • • • • • • • Free-running 56-bit counter All 56 bits can be read synchronously Different 32-bit portions of the 56-bit counter can be read synchronously Flexible interrupt generation on partial STM content compare match Driven by clock fSTM after reset (default after reset is fSTM = fSYS = 150 MHz) Counting starts automatically after a reset operation STM is reset under following reset causes: – Wake-up reset (PMG_CON.DSRW must be set) – Software reset (RST_REQ.RRSTM must be set) – Power-on reset • STM (and the clock divider) is not reset at watchdog reset and hardware reset (HDRST = 0) The STM is an upward counter, running with the system clock frequency fSYS (after reset fSTM = fSYS). It is enabled per default after reset, and immediately starts counting up. Other than via reset, it is not possible to affect the contents of the timer during normal operation of the application; it can only be read, but not written to. Depending on the implementation of the clock control of the STM, the timer can optionally be disabled or suspended for power-saving and debugging purposes via a clock control register. The maximum clock period is 256/fSTM. At fSTM = 150 MHz (maximum), for example, the STM counts 15.2 years before overflowing. Thus, it is capable of continuously timing the entire expected product lifetime of a system without overflowing. Data Sheet 48 V1.0, 2005-02 TC1100 Functional Description Advance Information STM M odu le 31 23 15 0 7 C o m p a re R e g is te r C M P 0 31 23 15 7 0 C o m p a re R e g is te r C M P 1 S T M IR 1 In te rru p t C o n tro l C lo c k C o n tro l 55 47 39 31 23 15 7 0 5 6 -B it S y s te m T im e r S T M IR 0 E n a b le / D is a b le 00H CAP fSTM 00H T IM 6 T IM 5 A d d re s s Decoder T IM 4 T IM 3 PORST T IM 2 T IM 1 T IM 0 M C A 04795_m od Figure 3-11 Block Diagram of the STM Module Data Sheet 49 V1.0, 2005-02 TC1100 Functional Description Advance Information 3.16 Watchdog Timer The Watchdog Timer (WDT) provides a highly reliable and secure way to detect and recover from software or hardware failure. The WDT helps to abort an accidental malfunction of the TC1100 in a user-specified time period. When enabled, the WDT will cause the TC1100 system to be reset if the WDT is not serviced within a user-programmable time period. The CPU must service the WDT within this time interval to prevent the WDT from causing a TC1100 system reset. Hence, routine service of the WDT confirms that the system is functioning properly. In addition to this standard “Watchdog” function, the WDT incorporates the ENDINIT feature and monitors its modifications. A system-wide line is connected to the ENDINIT bit implemented in a WDT control register, serving as an additional write-protection for critical registers (besides supervisor mode protection). Registers protected via this line can be modified only when supervisor mode is active and bit ENDINIT = 0. A further enhancement in the TC1100’s Watchdog Timer is its reset prewarning operation. Instead of immediately resetting the device upon detection of an error, the WDT first issues a Non-Maskable Interrupt (NMI) to the CPU before finally resetting the device at a specified time period later. This gives the CPU a chance to save system state to memory for later examination of the cause of the malfunction, thus providing an important aid in debugging. Features: • 16-bit Watchdog counter • Selectable input frequency: fSYS/256 or fSYS/16384 • 16-bit user-definable reload value for normal Watchdog operation, fixed reload value for time-out and prewarning modes • Incorporation of the ENDINIT bit and monitoring of its modifications • Sophisticated password access mechanism with fixed and user-definable password fields • Proper access always requires two write accesses. The time between the two accesses is monitored by the WDT. • Access Error Detection: Invalid password (during first access) or invalid guard bits (during second access) trigger the Watchdog reset generation • Overflow Error Detection: An overflow of the counter triggers the Watchdog reset generation • Watchdog function can be disabled; access protection and ENDINIT monitor function remain enabled • Double Reset Detection: If a Watchdog induced reset occurs twice without a proper access to its control register in between, a severe system malfunction is assumed and the TC1100 is held in reset until a power-on reset. This prevents the device from being periodically reset if, for instance, connection to the external memory has been lost such that even system initialization could not be performed. Data Sheet 50 V1.0, 2005-02 TC1100 Functional Description Advance Information • Important debugging support is provided through the reset prewarning operation by first issuing an NMI to the CPU before finally resetting the device after a certain period of time. Data Sheet 51 V1.0, 2005-02 TC1100 Functional Description Advance Information 3.17 System Control Unit The System Control Unit (SCU) of the TC1100 handles the system control tasks. All of these system functions are tightly coupled; thus, they are conveniently handled by one unit, the SCU. The system tasks of the SCU are: • Clock Control – Clock generation – Oscillator and PLL control • Reset and Boot Control – Generation of all internal reset signals – Generation of external hardware and software reset signal • Power Management Control – Enabling of several power management modes • Configuration input sampling • FPU interrupts • External Request Unit • Parity Error Control • Fault SRAM Fuse Box • CSCOMB Control • EBU Pull-Up Control • NMI Control and Status • DMA Request Signal Selection Data Sheet 52 V1.0, 2005-02 TC1100 Functional Description Advance Information 3.18 Boot Options The TC1100 booting schemes provides a number of different boot options for the start of code execution. Table 3-3 shows the boot options available in the TC1100. Table 3-3 Boot Selections BRKIN1) TM1) HWCFG Type of Boot [2:0] 1 1 PC Start Value (User Entry) 000 Bootstrap Loader DFFF FFFCH2) Serial boot from ASC to PMI scratch (D400 0000H) pad, run loaded program 001 Reserved 010 Bootstrap Loader DFFF FFFCH2) Serial boot from SSC to PMI scratch (D400 0000H) pad, run loaded program 011 External memory, EBU as master DFFF FFFCH2) (A000 0000H) 100 External memory, EBU as slave DFFF FFFCH2) (A000 0000H) 101 Reserved (STOP) ---- 110 PMI scratch pad D400 0000H 111 Reserved (STOP) DFFF FFFCH2) ---- 1 0 000-111 Reserved (STOP) DFFF FFFCH2) 0 1 000 Tristate chip ---- 001 Go to external emulator space DFFF FFFCH2) (DE00 0000H) 010 Reserved (STOP) ---- 011 OSC and PLL Bypass ---- 100-111 Reserved (STOP) DFFFFFFCH2) 000-111 Reserved (STOP) DFFFFFFCH2) 0 0 1) This input signal is active low. 2) This is the BootROM entry address; the start address of user program in parentheses. Data Sheet 53 V1.0, 2005-02 TC1100 Functional Description Advance Information 3.19 Power Management System The TC1100 power management system allows software to configure the various processing units to adjust automatically in order to draw the minimum necessary power for the application. There are four power management modes: • • • • Run Mode Idle Mode Sleep Mode Deep Sleep Mode Table 3-4 describes the features of the power management modes. Table 3-4 Power Management Mode Summary Mode Description Run The system is fully operational. All clocks and peripherals are enabled, as determined by software. Idle The CPU clock is disabled, waiting for a condition to return it to run mode. Idle mode can be entered by software when the processor has no active tasks to perform. All peripherals remain powered and clocked. Processor memory is accessible to peripherals. A reset, Watchdog Timer event, a falling edge on the NMI pin, or any enabled interrupt event will return the system to run mode. Sleep The system clock continues to be distributed only to those peripherals programmed to operate in sleep mode. The other peripheral modules will be shut down by the suspend signal. Interrupts from operating peripherals, the Watchdog Timer, a falling edge on the NMI pin, or a reset event will return the system to run mode. Entering this state requires an orderly shut-down controlled by the Power Management State Machine. Deep Sleep The system clock is shut off; only an external signal will restart the system. Entering this state requires an orderly shut-down controlled by the Power Management State Machine (PMSM). Besides these explicit software-controlled power-saving modes, special attention has been paid in the TC1100 to automatic power-saving in operating units that are currently not required or idle. In this case, they are shut off automatically until their operation is required again. Data Sheet 54 V1.0, 2005-02 TC1100 Functional Description Advance Information 3.20 On-Chip Debug Support The On-Chip Debug Support of the TC1100 consists of the following building blocks: • • • • • • • • • OCDS L1 module of TriCore™ OCDS L2 interface of TriCore™ OCDS L1 module in the BCU of the FPI Bus OCDS L1 facilities within the DMA OCDS L2 interface of DMA OCDS System Control Unit (OSCU) Multi Core Break Switch (MCBS) JTAG based Debug Interface (Cerberus JDI) Suspend functionality of peripherals Features: • TriCore™ L1 OCDS: – Hardware event generation unit – Break by DEBUG instruction or break signal – Full Single-Step support in hardware, possible also with software break – Access to memory, SFRs, etc. on the fly • DMA L1 OCDS: – Output break request on errors – Suspension of pre-selected channels • Level 2 trace port with 16 pins that outputs either TriCore™, or DMA trace • OCDS System Control Unit (Cerberus OSCU) – Minimum number of pins required (no OCDS enable pin) – Hardware allows hot attach of a debugger to a running system – System is secure (can be locked from internal) • Multi Core Break Switch (Cerberus MCBS): – TriCore™, DMA, break pins, and BCUs as break sources – TriCore™ as break targets; other parts can in addition be suspended – Synchronous stop and restart of the system – Break to Suspend converter Figure 3-12 shows a basic block diagram of the building blocks. Data Sheet 55 V1.0, 2005-02 TC1100 Functional Description Advance Information . OCDS L1 BCU TriCoreTM OCDS L1 Watchdog timer TMS TCK JTAG Controller Cerberus TDO TDI OSCU JDI Debug I/F TRST Periph.n DMA FPI BRKIN Break and Suspend Signals OCDS L2 Enable, Control and Reset 16 OCDS2[15:0] DMA L2 Multiplexer Periph.1 MCBS Break Switch BRKOUT Figure 3-12 OCDS Support Basic Block Diagram Data Sheet 56 V1.0, 2005-02 TC1100 Functional Description Advance Information 3.21 Clock Generation Unit The Clock Generation Unit (CGU) allows a flexible clock generation for TC1100. The power consumption is indirectly proportional to the frequency, whereas the performance of the microcontroller is directly proportional to the frequency. During user program execution the frequency can be programmed for an optimal ratio between performance and power consumption. Therefore, the power consumption can be adapted to the actual application state. Features: The Clock Generation Unit serves several purposes: • PLL feature for multiplying clock source by different factors • Direct Drive for direct clock input • Comfortable state machine for secure switching between basic PLL, direct, or prescaler operation • Sleep and power-down mode support The Clock Generation Unit in the TC1100, shown in Figure 3-13, consists of an oscillator circuit and one Phase-Locked Loop (PLL). The PLL can convert a low-frequency external clock signal to a high-speed internal clock for maximum performance. The PLL also has fail-safe logic that detects degenerate external clock behavior such as abnormal frequency deviations or a total loss of the external clock. It can execute emergency actions if it looses the lock on the external clock. In general, the Clock Generation Unit (CGU) is controlled through the System Control Unit (SCU) module of the TC1100. XTAL1 Clock Generation Unit CGU Oscillator Circuit XTAL2 fOSC Osc. Run Detect. 1:1/1:2 Divider P Divider >1 Phase Detect. PLL VCO f VCO 1 MUX 0 fSYS MUX K:1/K:2 Divider fCPU N Divider Lock Detector OGC MOSC OSCR Register OSC_CON PDIV OSC [2:0] DISC PLL_ LOCK NDIV [6:0] VCO_ SEL[1:0] VCO_ KDIV SYS PLL_ BYPASS [3:0] FSL BYPASS Register PLL_CLC SystemControl Unit SCU MCA04940mod Figure 3-13 Clock Generation Unit Block Diagram Data Sheet 57 V1.0, 2005-02 TC1100 Functional Description Advance Information The oscillator circuit, which is designed to work with an external crystal oscillator or an external stable clock source, consists of an inverting amplifier with XTAL1 as input and XTAL2 as output. Figure 3-14 shows the recommended external oscillator circuitries for both operating modes, i.e. external crystal mode and external input clock mode. V DDOSC VDDOSC3 XTAL1 4 - 25 MHz VDDOSC f OSC External Clock Signal TC1100 Oscillator XTAL1 f OSC TC1100 Oscillator XTAL2 C1 VDDOSC3 XTAL2 C2 Fundamental Mode Crystal V SSOSC V SSOSC Figure 3-14 Oscillator Circuitries When using an external clock signal, it must be connected to XTAL1 and XTAL2 is left open (unconnected). When supplying the clock signal directly, not using a crystal and the oscillator, the input frequency can be in the range of 0 - 40 MHz if the PLL is not used, 4 - 40 MHz in case the PLL is used. When using a crystal, its frequency can be within the range of 4 MHz to 25 MHz. An external oscillator load circuitry must be used, connected to both pins, XTAL1 and XTAL2. It consists normally of the two load capacitances, C1 and C2. For some crystals, a series damp resistor may be necessary. The exact values and related operating range are dependant on the crystal and have to be determined and optimized together with the crystal vendor using the negative resistance method. As starting point for the evaluation and for non-productive systems, the following load capacitor values might be used. Table 3-5 Load Capacitors Select Fundamental Mode Crystal Frequency Load Capacitors (approx., MHz) C1, C2 (pF) 4 33 8 18 12 12 16 10 Data Sheet 58 V1.0, 2005-02 TC1100 Functional Description Advance Information Table 3-5 Load Capacitors Select (cont’d) Fundamental Mode Crystal Frequency Load Capacitors (approx., MHz) C1, C2 (pF) 20 10 24 10 A block capacitor between VDDOSC3 and VSSOSC, VDDOSC and VSSOSC is recommended, too. Data Sheet 59 V1.0, 2005-02 TC1100 Functional Description Advance Information 3.22 Power Supply The TC1100 provides an ingenious power supply concept in order to improve the EMI behavior as well as to minimize the crosstalk within on-chip modules. Figure 3-15 shows the TC1100’s power supply concept, where certain logic modules are individually supplied with power. This concept improves the EMI behavior by reduction of the noise cross coupling. V SS (1.5 V) V DD DMU OSC DMI PMI CPU & Peripheral Logic GPIO Ports (P0-P4) VDDOSC3 (3.3V) VDDOSC (1.5V) VSS VSS VDDP (3.3 V) VSS EBU Ports MCB04953mod Figure 3-15 TC1100 Power Supply Concept Data Sheet 60 V1.0, 2005-02 TC1100 Functional Description Advance Information 3.23 Power Sequencing During power-up, reset pin PORST has to be held active until both power supply voltages have reached at least their minimum values. During the power-up time (rising of the supply voltages from 0 to their regular operating values), it must be ensured, that the core VDD power supply reaches its operating value first, and then followed by the GPIO VDDP power supply. During the rising time of the core voltage, it must be ensured that 0< VDD-VDDP VDD or VIN < VSS) the voltage on VDD pins with respect to ground (VSS) must not exceed the values defined by the absolute maximum ratings. Data Sheet 64 V1.0, 2005-02 TC1100 Electrical Parameters Advance Information 4.1.3 Operating Condition The following operating conditions must be complied with in order to ensure correct operation of the TC1100. All parameters specified in the following table refer to these operating conditions, unless otherwise indicated. Parameter Digital supply voltage Digital ground voltage Digital core supply current Ambient temperature under bias CPU clock Overload current Short circuit current Symbol min. max. Unit Notes Conditions VDD VDDP VSS IDD TA 1.43 1.58 V – 3.14 3.47 V – V – fSYS IOV ISC Limit Values 0 – 525 mA – -40 +85 °C – –1) 150 MHz – -1 1 mA -3 3 -1 1 -3 3 |50| 2)3) duty cycle ≤ 25% mA 4) duty cycle ≤ 25% 3) Absolute sum of overload + short circuit currents Σ|IOV| + |ISC| – Inactive device pin current (VDD = VDDP = 0) IID -1 1 mA – External load capacitance CL – 50 pF – ESD strength – 2000 – V Human Body Model (HBM) mA duty cycle ≤ 25% |100| 1) The TC1100 uses a static design, so the minimum operation frequency is 0 MHz. However, due to test time restriction no lower frequency boundary is tested. 2) Overload conditions occur if the standard operating conditions are exceeded, i.e. the voltage on any pin exceeds the specified range (i.e. VOV > VDDP + 0.5 V or VOV < VSS - 0.5 V). The absolute sum of input overload currents on all digital I/O pins may not exceed 50 mA. The supply voltage must remain within the specified limits. 3) Not subject to production test, verified by design/characterization. 4) Applicable for digital inputs. Data Sheet 65 V1.0, 2005-02 TC1100 Electrical Parameters Advance Information 4.2 DC Parameters 4.2.1 Input/Output Characteristics VSS = 0 V; TA = -40°C to +125°C Parameter Symbol Limit Values min. Unit Test Condition max. GPIO pins, Dedicated pins and EBU pins VIL VIH Input low voltage Input high voltage Output high voltage Pull-up current 1) Pull-down current 2) Pin Capacitance 4) -0.3 0.8 V LvTTL SR 2.0 VDDP + 0.3 V LvTTL 0.4 V IOL = 2mA – V IOH = -2mA 149 µA − 7.2 µA – 156 µA – 15.7 µA – ±350 nA VIN = 0V VIN = 0V VIN = VDDP VIN = VDDP 0 < VIN < VDDP – 10 pF VOL CC – VOH CC 2.4 |IPUA| CC − Output low voltage Input leakage current SR 3) |IPUC| CC |IPDA| CC |IPDC| CC IOZ1 CC CIO CC f = 1 MHz TA = 25 °C 1) The current is applicable to the pins, for which a pull-up has been specified. Refer to Table 2-1. IPUx refers to the pull-up current for type x in absolute values. 2) The current is applicable to the pins, for which a pull-down has been specified. Refer to Table 2-1. IPDx refers to the pull-down current for type x in absolute values. 3) Excluded following pins: NMI, TRST, TCK, TDI, TMS, ALE, P2.1,HWCFG0, HWCFG1, HWCFG2, BRKIN, PORST, HDRST. 4) Not subject to production test, verified by design/characterization Data Sheet 66 V1.0, 2005-02 TC1100 Electrical Parameters Advance Information 4.2.2 Oscillator Characteristics VSS = 0 V; TA = -40°C to +125°C Parameter Symbol Limit Values min. Unit Test Condition max. Oscillator Pins VILX SR -0.3 Input high voltage at XTAL1 VIHX SR – 0.6 Quartz oscillation peak-peak VPPOSC Input low voltage at XTAL1 VILX SR -0.3 Input high voltage at XTAL1 VIHX SR 1.4 Input low voltage at XTAL1 IOSCIN 1) Quartz mode: using a quartz crystal 2) Bypass mode: using an external clock Data Sheet V 1) 3 V 1) – V 1) 0.1 V 2) VDDC + V 2) 25 µA SR amplitude at oscillator Input Oscillator input current – – 67 0.3V V1.0, 2005-02 TC1100 Electrical Parameters Advance Information 4.2.3 IIC Characteristics Each IIC Pin is an open drain output pin with different characteristics than other pins. The related characteristics are given in the following table. Parameter Output low voltage Symbol VOL CC Limit Values min. max. – 0.4 Unit Test Conditions V 3 mA sink current 6 mA sink current 0.6 Input high voltage1) VIH SR 0.7VDDP VDDP+0.5 V – Input low voltage1) VIL SR -0.5 0.3VDDP – 1) V Not subject to production test, verified by design/characterization. Note: No 5 V IIC interface is supported with these pads. Only voltages lower than 3.63 V must be applied to these pads. Note: IIC pins have no pull-up and pull-down devices. Data Sheet 68 V1.0, 2005-02 TC1100 Electrical Parameters Advance Information 4.2.4 Power Supply Current Parameter Active mode supply current Idle mode supply current Deep sleep mode supply current Symbol IDD IID IDS Limit Values Unit Test Conditions typ. 1) max. 314 679 mA Sum of IDDS 2) 153 345 mA 156 322 mA 74 154 mA 66 130 mA 6 15 mA 2 19 mA 2 19 mA 3.6 58 µA IDD at VDD 3) IDD at VDDP Sum of IDDS2)4) IDD at VDD3)4) IDD at VDDP4) Sum of IDDS2)5) IDD at VDD3)5) IDD at VDDP5) 1) Typical values are measured at 25°C, CPU clock at 150 MHz, and nominal supply voltage that is 3.3 V for VDDP, VDDOSC3 and 1.5 V for VDD, VDDOSC. These currents are measured using a typical application pattern. The power consumption of modules can increase or decrease using other application programs. 2) These power supply currents are defined as the sum of all currents at the VDD power supply lines: VDD + VDDP + VDDOSC3 + VDDOSC 3) This measurement includes the TriCoreTM and Logic power supply lines. 4) CPU is in idle state, input clocks to all peripherals are enabled. 5) Clock generation is disabled at the source. Data Sheet 69 V1.0, 2005-02 TC1100 Electrical Parameters Advance Information 4.3 AC Parameters 4.3.1 Power, Pad and Reset Timing Parameter Symbol Min. VDDP voltage to ensure defined pad VDDPPA CC states1) Oscillator start-up time2) Minimum PORST active time after power supplies are stable at operating levels Limit Values Unit min. max. 0.6 – V 30 ms – ms tOSCS CC – tPOA CC 50 HDRST pulse width tHD CC 1024 cycles3) Ports inactive after any reset active2) tPI CC – fSYS 30 ns 1) This parameter is valid under assumption that PORST signal is constantly at low level during the power-up/ power-down of the VDDP. 2) Not subject to production test, verified by design/characterization. 3) Any HDRST activation is internally prolonged to 1024 FPI bus clock cycles. Data Sheet 70 V1.0, 2005-02 TC1100 Electrical Parameters Advance Information V DDPPA V DDPPA VDDP VDD V DDPR to sc s OSC tP O A tP O A PORST th d th d HDRST P ads ta te u n d e fin e d 2) 1) 2) P ads tpi 1 ) a s p ro g ra m m e d 1) 2) Pads ta te u n d e fin e d 2 ) T ri-s ta te , p u ll d e v ic e a c tiv e re s e t_ b e h Figure 4-1 Data Sheet Power and Reset Timing 71 V1.0, 2005-02 TC1100 Electrical Parameters Advance Information 4.3.2 PLL Parameters When PLL operation is configured (PLL_CLC.LOCK = 1), the on-chip phase locked loop is enabled and provides the master clock. The PLL multiplies the input frequency by the factor F (fMC = fOSC × F) which results from the input divider, the multiplication factor (N Factor), and the output divider (F = NDIV+1 / (PDIV+1 × KDIV+1)). The PLL circuit synchronizes the master clock to the input clock. This synchronization is done smoothly, i.e. the master clock frequency does not change abruptly. Due to this adaptation to the input clock, the frequency of fMC is constantly adjusted so it is locked to fOSC. The slight variation causes a jitter of fMC which also affects the duration of individual TCMs. The timing listed in the AC Characteristics refers to TCPs. Because fCPU is derived from fMC, the timing must be calculated using the minimum TCP possible under the respective circumstances. The actual minimum value for TCP depends on the jitter of the PLL. As the PLL is constantly adjusting its output frequency in order to correspond to the applied input frequency (crystal or oscillator), the relative deviation for periods of more than one TCP is lower than for one single TCP (see formula and Figure 4-2). This is especially important for bus cycles using waitstates and for the operation of timers, serial interfaces, etc. For all slower operations and longer periods (e.g. pulse train generation or measurement, lower baud rates, etc.) the deviation caused by the PLL jitter is negligible. The value of the accumulated PLL jitter depends on the number of consecutive VCO output cycles within the respective timeframe. The VCO output clock is divided by the output prescaler (K = KDIV+1) to generate the master clock signal fMC. Therefore, the number of VCO cycles can be represented as K × N, where N is the number of consecutive fMC cycles (TCM). For a period of N × TCM, the accumulated PLL jitter is defined by the corresponding deviation DN: DN [ns] = ±(1.5 + 6.32 × N / fMC); fMC in [MHz], N = number of consecutive TCMs. So, for a period of 3 TCMs @ 20 MHz and K = 12: D3 = ±(1.5 + 6.32 × 3 / 20) = 2.448 ns. This formula is applicable for K × N < 95. For longer periods, the K×N=95 value can be used. This steady value can be approximated by: DNmax [ns] = ±(1.5 + 600 / (K × fMC)). Data Sheet 72 V1.0, 2005-02 TC1100 Electrical Parameters Advance Information A cc. jitter D N ns K =1 5 K =1 2 K =1 0 K =8 K =6 K =5 ±8 ±7 ±6 M Hz ±5 10 ±4 ±3 ±2 z MH 20 Hz 40 M ±1 0 5 1 15 10 20 25 N m cb 0441 3_xc.vsd Figure 4-2 Approximated Accumulated PLL Jitter Note: The bold lines indicate the minimum accumulated jitter which can be achieved by selecting the maximum possible output prescaler factor K. Different frequency bands can be selected for the VCO, so the operation of the PLL can be adjusted to a wide range of input and output frequencies: Table 4-1 VCO Bands for PLL Operation PLL_CLC.VCOSEL VCO Frequency Range Base Frequency Range 1) 00 400 ... 500 MHz 250 ... 320 MHz 01 500 ... 600 MHz 300 ... 400 MHz 10 600 ... 700 MHz 350 ... 480 MHz 11 Reserved 2) 1) Base Frequency Range is the free running operation frequency of the PLL, when no input clock is available. 2) This option cannot be used. Data Sheet 73 V1.0, 2005-02 TC1100 Electrical Parameters Advance Information 4.3.3 AC Characteristics (Operating Conditions apply) 2.4V 2.0V 2.0V test points 0.4V 0.8V 0.8V AC inputs during testing are driven at 2.4V for a logic “1” and 0.4V for a logic “0”. Timing measurements are made at VIHmin for a logic “1” and VILmax for a logic “0”. Figure 4-3 Data Sheet Input/Output Waveforms for AC Tests - for GPIO, Dedicated and EBU pins 74 V1.0, 2005-02 TC1100 Electrical Parameters Advance Information 4.3.4 Input Clock Timing (Operating Conditions apply) Parameter Symbol Limits min Oscillator clock frequency with PLL Input clock frequency driving at XTAL1 with PLL max 25 MHz 40 MHz 55 % SR Input Clock Duty Cycle (t1 /t2) Input Clock at XTAL1 fOSC SR 4 fOSCDD - Unit SR 45 VIHX 0.5 VDD VILX t1 t2 tOSCDD Figure 4-4 Data Sheet Input Clock Timing 75 V1.0, 2005-02 TC1100 Electrical Parameters Advance Information 4.3.5 Port Timing (Operating Conditions apply; CL = 50 pF) Parameter Symbol Limits min Port data valid from TRCLK 1) up to 120 MHz2) t1 CC − Unit max 13 ns 1) Port data is output with respect to the FPI clock. The TRCLK is used as a reference here since the FPI clock is not available as an external pin and TRCLK is same frequency as CPU clock. Port lines maintain their states for at least 2 CPU clocks. 2) 120 MHz is verified by design/characterization. TRCLK FPI_CLK t1 Figure 4-5 Data Sheet New State Old State Port Lines Port Timing 76 V1.0, 2005-02 TC1100 Electrical Parameters Advance Information 4.3.6 Timing for JTAG Signals (Operating Conditions apply; CL = 50 pF) Parameter Symbol Limits min TCK clock period tTCK SR t1 SR t2 SR t3 SR t4 SR TCK high time TCK low time TCK clock rise time TCK clock fall time TCK − ns 10 − ns 29 − ns − 0.4 ns − 0.4 ns 0.9 VDD 0.1 VDD t2 t4 tTCK Data Sheet max 50 0.5 VDD t1 Figure 4-6 Unit t3 TCK Clock Timing 77 V1.0, 2005-02 TC1100 Electrical Parameters Advance Information Parameter Symbol Limits min TMS setup to TCK t1 t2 t1 t2 t3 t4 t5 TMS hold to TCK TDI setup to TCK TDI hold to TCK TDO valid output from TCK TDO high impedance to valid output from TCK TDO valid output to high impedance from TCK Unit max SR 7.85 − ns SR 3.0 − ns SR 10.9 − ns SR 3.0 − ns CC − 10.7 ns CC − 23.0 ns CC − 26.0 ns TCK t1 t2 t1 t2 TMS TDI t4 t3 t5 TDO Figure 4-7 Data Sheet JTAG Timing 78 V1.0, 2005-02 TC1100 Electrical Parameters Advance Information 4.3.7 Timing for OCDS Trace and Breakpoint Signals (Operating Conditions apply; CL(TRCLK) = 25 pF, CL = 50 pF) Parameter Symbol Limits min BRK_OUT valid from TRCLK t1 t1 t1 t1 OCDS2_STATUS[4:0] valid from TRCLK OCDS2_INDIR_PC[7:0] valid from TRCLK OCDS2_BRKPT[2:0] valid from TRCLK Unit max CC − 5.2 ns CC 0 5 ns CC 0 5 ns CC 0 5 ns TRCLK t1 CPU Trace Signals Note: Figure 4-8 Data Sheet t1 Old State New State CPU Trace Signals include BRK_IN, BRK_OUT, OCDS2_INDIR_PC[7:0] and OCDS_BRKPT[2:0]. OCDS2_STATUS[4:0], OCDS Trace Signals Timing 79 V1.0, 2005-02 TC1100 Electrical Parameters Advance Information 4.3.8 EBU Timings 4.3.8.1 SDCLKO Output Clock Timing (Operating Conditions apply; CL = 50 pF) Parameter Limits1) Symbol min SDCLKO period SDCLKO high time SDCLKO low time SDCLKO rise time SDCLKO fall time t1 t2 t3 t4 t5 max Limits2) min Unit max CC 10 – 8.3 – ns CC 3 − 2.5 − ns CC 3 − 2.5 − ns CC − 2.5 − 2.5 ns CC − 2.5 − 2.5 ns 1) The parameters are applicable for PC100 SDRAM access and the maximum SDCLKO is up to 100 MHz. 2) The parameters are applicable for PC133 SDRAM access and the maximum SDCLKO is up to 120 MHz. 4.3.8.2 BFCLKO Output Clock Timing (Operating Conditions apply; CL = 50 pF) Parameter Clock period BFCLKO high time BFCLKO low time BFCLKO rise time BFCLKO fall time Limit 1) Symbol t1 t2 t3 t4 t5 Unit min max min max CC 20 – 16.7 – ns CC 6.6 – 7.5 – ns CC 6.6 – 7.5 – ns CC – 3.5 – 3.5 ns CC – 2.5 – 2.5 ns 1) The CPU runs at 150 MHz and the Burst Flash runs at divided by 3 clock. 2) The CPU runs at 120 MHz and the Burst Flash runs at divided by 2 clock. Data Sheet Limit 2) 80 V1.0, 2005-02 TC1100 Electrical Parameters Advance Information 0.5 VDD BFCLKO / SDCLKO t2 t3 t5 t1 Figure 4-9 4.3.8.3 EBU Clock Output Timing Timing for SDRAM Access Signals (Operating Conditions apply; CL = 50 pF1)) Parameter Limits2) Symbol Limits3) Unit min max min max SDCLKO period t1 t1 t2 t3 t4 t5 CC CSx, RAS, CAS, RD/WR, BC(3:0) output hold time from SDCLKO AD(31:0) output valid time from SDCLKO CKE output valid time from SDCLKO CKE output hold time from SDCLKO Address output valid time from SDCLKO Address output hold time from SDCLKO CSx, RAS, CAS, RD/WR, BC(3:0) output valid time from SDCLKO AD(31:0) output hold time from SDCLKO AD(31:0) input setup time to SDCLKO AD(31:0) input hold time from SDCLKO 10 – 8.3 – ns CC − 8.0 − 6.8 ns CC 0 − 0.8 − ns CC − 8.0 − 6.8 ns CC 1.0 − 0.8 − ns CC − 8.0 − 6.8 ns t6 CC 1.0 − 0.8 − ns t7 t8 t9 t10 CC − 8.0 − 6.8 ns CC 1.0 − 0.8 − ns SR 4.0 − 2.9 − ns SR 3.0 − 3.0 − ns 1) If application conditions other than 50 pf capacitive load are used, then the proper correlation factor should be used for your specific application condition. For design team, the load should be set according to the system requirement. 2) The parameters are applicable for PC100 SDRAM access and the maximum SDCLKO is up to 100 MHz. 3) The parameters are applicable for PC133 SDRAM access and the maximum SDCLKO is up to 120 MHz. Data Sheet 81 V1.0, 2005-02 TC1100 Electrical Parameters Advance Information Write Access SDCLKO t1 CKE t2 t3 Address t4 ROW Column t5 CSx t5 t6 t6 RAS t5 t6 CAS t5 RD/WR t6 t5 BC[3:0] t6 t7 t8 AD[31:0] D(0) D(n) Read Access SDCLKO CKE Address t1 t3 t4 ROW t5 CSx RAS Column t5 t6 t6 t5 t6 CAS RD/WR BC[3:0] t5 t6 t10 t9 AD[31:0] D(0) D(n) SDRAM_Timing Figure 4-10 SDRAM Access Timing Data Sheet 82 V1.0, 2005-02 TC1100 Electrical Parameters Advance Information 4.3.8.4 Timing for Burst Flash Access Signals (Operating Conditions apply; CL = 50 pF) Parameter Symbol Limits min Address output valid time from BFCLKO t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 Address output hold time from BFCLKO CSx output valid time from BFCLKO RD output valid time from BFCLKO ADV output valid time from BFCLKO ADV output hold time from BFCLKO BAA output valid time from BFCLKO BAA output hold time from BFCLKO AD(31:0) input setup time to BFCLKO AD(31:0) input hold time from BFCLKO WAIT input setup time to BFCLKO WAIT input hold time from BFCLKO Data Sheet 83 Unit max CC − 11.0 ns CC 10.0 − ns CC − 9.0 ns CC − 10.0 ns CC − 10.0 ns CC 3.0 − ns CC − 10.0 ns CC 3.0 − ns SR 5.0 − ns SR 3.0 − ns SR 5.0 − ns SR 3.0 − ns V1.0, 2005-02 TC1100 Electrical Parameters Advance Information Address Phase(s) Command Command Burst Delay Phase(s) Phase(s) Phase(s) Burst Phase(s) Recovery New Addr. Phase Phase(s) BFCLKO t2 t1 Address Address CSx t3 ADV t5 RD BAA D[31:0] t6 t4 t8 t7 D(0) t9 t10 D(n-1) t11 t12 WAIT BF_Timing Figure 4-11 Burst Flash Access Timing Note: Output delays are always referenced to BFCLKO. The reference clock for input characteristics depends on bit BFCON.FDBKEN. BFCON.FDBKEN = 0: BFCLKO is the input reference clock. BFCON.FDBKEN = 1: BFCLKI is the input reference clock (EBULMB clock feedback enabled). Data Sheet 84 V1.0, 2005-02 TC1100 Electrical Parameters Advance Information 4.3.8.5 Timing for Demultiplexed Access Signals (Operating Conditions apply; CL = 50 pF) 1) Parameter Symbol Limits min Unit max CSx, RD/WR, RD, MR/W, BC(3:0) output valid time from output clock t1 CC − 9 ns CSx, RD/WR, RD, MR/W, BC(3:0) output hold time from output clock t2 CC 0.0 − ns Address output valid time from output clock t3 t4 t7 t8 t9 t10 t11 t12 t13 t14 t16 CC − 9 ns CC 0.0 − ns SR 12 − ns SR 3 − ns CC − 9 ns CC 0.0 − ns SR 1.3 − ns SR 3 − ns CC − 8 ns CC 1.3 − ns CC 0 − ns Address output hold time from output clock WAIT input setup time to output clock WAIT input hold time from output clock AD(31:0) output valid time from output clock AD(31:0) output hold time from output clock AD(31:0) input setup time to output clock AD(31:0) input hold time from output clock RMW output valid time from output clock RMW output hold time from output clock AD(31:0) output hold time from RD/WR 1) The purpose for characterization of Asynchronous access is to provide the performance of all of the signals to user. User can decide whether an extra cycle is needed or not based on above parameters to generate signals with correct timing sequence. It is user’s responsibility to program the correct phase length according to the memory/peripheral device specification and EBU specification. Data Sheet 85 V1.0, 2005-02 TC1100 Electrical Parameters Advance Information Write Access Address Phase(s) Command Delay Phase(s) (ext.) Command Delay Phase(s) (int.) Command Phase(s) Data Hold Phase(s) Recovery Phase SDCLKO t 15 t3 Address t4 Address t2 t1 CSx t1 RD/WR t2 t16 t1 MR/W t5 CMDELAY t6 t7 WAIT t1 t8 t1 BC[3:0] t2 t2 t9 t10 AD[31:0] DataOut Read Access Address Phase(s) SDCLKO/ SDCLKI Command Delay Phase(s) (ext.) Command Delay Phase(s) (int.) Recovery Phase Command Phase(s) t15 t3 Address CSx t4 Address t2 t1 t2 t1 RD t2 MR/W t5 CMDELAY t6 t7 WAIT t1 t8 t1 BC[3:0] t2 t 11 AD[31:0] RMW t 12 DataIn t 14 t 13 Demux_Timing Figure 4-12 Demultiplexed Asynchronous Device Access Timing Data Sheet 86 V1.0, 2005-02 TC1100 Electrical Parameters Advance Information 4.3.8.6 Timing for Multiplexed Access Signals (Operating Conditions apply; CL = 50 pF)1) Parameter Symbol Limits min Unit max ALE, CSx, RD/WR, RD, MR/W, BC(3:0) output valid t1 time from output clock CC − 9 ns ALE, CSx, RD/WR, RD, MR/W, BC(3:0) output hold t2 time from output clock CC 0.0 − ns AD(31:0) output valid time from output clock CC − 9 ns CC 0.0 − ns SR 1.4 − ns SR 3 − ns SR 12 − ns SR 3 − ns CC − 8 ns CC 1.3 − ns CC 8.5 − ns CC 0 − ns AD(31:0) output hold time from output clock AD(31:0) input setup time to output clock AD(31:0) input hold time from output clock WAIT input setup time to output clock WAIT input hold time from output clock RMW output valid time from output clock RMW output hold time from output clock ALE width AD(31:0) output hold time from RD/WR t3 t4 t5 t6 t9 t10 t11 t12 t13 t14 1) The purpose for characterization of Asynchronous access is to provide the performance of all of the signals to user. User can decide whether an extra cycle is needed or not based on above parameters to generate signals with correct timing sequence. It is user’s responsibility to program the correct phase length according to the memory/peripheral device specification and EBU Specification. Data Sheet 87 V1.0, 2005-02 TC1100 Electrical Parameters Advance Information Write Access Address Phase(s) Address Hold Phase(s) Command Command Delay Delay Phase(s) Phase(s) (int.) (ext.) Command Phase(s) Data Hold Phase(s) Recovery Phase(s) SDCLKO t13 t3 AD[31:0] t4 t3 Data Address t4 t2 t1 CSx t1 RD/WR t2 t 14 t1 MR/W t7 CMDELAY t8 t9 WAIT t1 t 10 t1 BC[3:0] t2 t2 Read Access Address Phase(s) SDCLKO/ SDCLKI Address Hold Phase(s) Command Delay Phase(s) (int.) CSx Command Phase(s) Recovery Phase(s) t13 t3 AD[31:0] Command Delay Phase(s) (ext.) t5 t4 Address t6 Data t2 t1 t1 RD t2 1 t2 MR/W t7 CMDELAY t8 t9 WAIT t1 t1 BC[3:0] RMW t 10 t2 t 12 t 11 Mux_Timing Figure 4-13 Write Access in Multiplexed Access Data Sheet 88 V1.0, 2005-02 TC1100 Electrical Parameters Advance Information 4.3.9 Peripheral Timings 4.3.9.1 SSC Master Mode Timing (Operating Conditions apply; CL = 50 pF) Parameter Symbol SCLK clock period t0 t1 t2 t3 MTSR/SLSOx delay from SCLK MRST setup to SCLK MRST hold from SCLK 1) Limit Values Unit min. max. CC 2*TSSC 1) – ns CC 0 8 ns SR 10 – ns SR 5 – ns TSSCmin = TSYS = 1/fSYS. When fSYS = 120MHz, t0 = 16.7ns t0 SCLK1)2) t1 t1 MTSR1) t2 t3 Data valid MRST1) t1 SLSOx2) 1) This timing is based on the following setup: CON.PH = CON.PO = 0. 2) The transition at SLSOx is based on the following setup: SSOTC.TRAIL = 0 and the first SCLK high pulse is in the first one of a transmission. SSC_Tmg1 Figure 4-14 SSC Master Mode Timing Data Sheet 89 V1.0, 2005-02 TC1100 Electrical Parameters Advance Information 4.3.9.2 MLI Interface Timing (Operating Conditions apply; CL = 50 pF) Parameter Symbol TCLK/RCLK clock period t0 MLI outputs delay from TCLK t5 t6 t7 t8 MLI inputs setup to RCLK MLI inputs hold to RCLK RREADY output delay from TCLK 1) Limit Values Unit min. max. 2*TMLI 1) – ns CC 0 8 ns SR 4 – ns SR 4 – ns CC 0 8 ns CC/SR TMLImin = TSYS = 1/fSYS. When fSYS = 120MHz, t0 = 16.7ns t0 0.9 VDDP TCLK 0.1 VDDP t5 t5 TDATA TVALID TREADY t0 RCLK t6 t7 RDATA RVALID t8 t8 RREADY MLI_Tmg1 Figure 4-15 MLI Interface Timing Note: The generation of RREADY is in the input clock domain of the receiver. The reception of TREADY is asynchronous to TCLK. Data Sheet 90 V1.0, 2005-02 TC1100 Package Outline Advance Information 5 Package Outline Plastic Package, P-LBGA-208-2 (SMD) (Low Profile Ball Figure 5-1 P-LBGA-208-2 Package You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products. Dimensions in mm SMD = Surface Mounted Device Data Sheet 91 V1.0, 2005-02 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG