TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Features
•
•
•
•
•
•
•
•
•
•
3D (X, Y, Z) magnetic flux density sensing of ±160 mT
Programmable flux resolution down to 65 µT (typ.)
X-Y angular measurement mode
Diagnostic measurements to check digital parts, analog parts and Hall
probe of the sensor
Wake Up function and Power down mode with 7 nA (typ.) power
consumption
12-bit data resolution for each measurement direction plus 10-bit
temperature sensor
Variable update frequencies and power modes (configurable during
operation)
Temperature range Tj = -40°C…125°C, supply voltage range = 2.8 V…3.5 V
Triggering by external µC possible via I2C protocol
Interrupt signal to indicate a valid measurement to the microcontroller
PG-TSOP6-6-8
Potential applications
The TLE493D-P2B6 is designed for a wide range of magnetic sensing, including the following:
• Gear stick position
•
Control elements in the top column module and multi function steering wheel
• Multi function knobs
• Pedal/valve position sensing
Benefits
•
•
•
•
•
•
Component reduction due to 3D magnetic measurement principle
Wide application range addressable due to high flexibility
Platform adaptability due to device configurability
Supporting functional safety by means of integrated diagnostics
Very low system power consumption due to Wake-Up mode resulting in extended battery runtime
Disturbance of smaller stray fields are neglectable compared to the high magnetic flux measurement range
Product validation
Qualified for Automotive Applications. Product validation according to AEC-Q100.
Datasheet
www.infineon.com
Please read the Important Notice and Warnings at the end of this document
1.0
2021-01-12
TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Ordering information
Ordering information
Product type
Marking 1)
Ordering code
Package
Default address
write/read
TLE493D-P2B6 A0
P0
SP005557415
PG-TSOP6-6-8
6AH / 6BH
TLE493D-P2B6 A1
P1
SP005557413
PG-TSOP6-6-8
44H / 45H
TLE493D-P2B6 A2
P2
SP005557411
PG-TSOP6-6-8
F0H / F1H
TLE493D-P2B6 A3
P3
SP005557408
PG-TSOP6-6-8
88H / 89H
1
Engineering samples are marked with “SA”
Datasheet
2
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2021-01-12
TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Table of contents
Table of contents
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Potential applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Product validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1
1.1
1.1.1
1.1.2
1.1.3
1.2
1.3
1.4
1.5
Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Power mode control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Wake-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin configuration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Definition of magnetic field . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Sensitive area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2
2.1
2.2
2.3
2.4
2.5
2.6
2.7
Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Operating range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Magnetic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Temperature measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Overview of modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Interface and timing description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3
3.1
3.2
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Package parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Package outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Datasheet
3
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TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Functional description
1
Functional description
This three dimensional Hall effect sensor can be configured by the microcontroller. The measurement data is
provided in digital format to the microcontroller. The microcontroller is the master and the sensor is the slave. It
also provides test functions and the capability to Wake-Up a sleeping system.
1.1
General
Description of the block diagram and its functions.
F-OSC
Power Mode Control
LP-OSC
VDD
GND
Bias
Vertical
Hall plates
X-Direction
Wake-up
Lateral
Hall plates
Z-Direction
SCL; /INT
Comparator
ADC
MUX
Digital tracking,
demodulation &
I²C interface
SDA
Vertical
Hall plates
Y-Direction
Temperature
Figure 1
Block diagram
The IC consists of three main functional units containing the following building blocks:
•
The power mode control system, containing a low-power oscillator, basic biasing, accurate restart,
undervoltage detection and a fast oscillator.
•
The sensing unit, which contains the HALL biasing, HALL probes with multiplexers and successive tracking
ADC, as well as a temperature sensor is implemented.
•
The I2C interface, containing the register files and I/O pads
1.1.1
Power mode control
The power mode control provides the power distribution in the IC, a power-on reset function and a specialized
low-power oscillator as the clock source. It also manages the start-up behavior.
• On start-up, this unit:
- activates the biasing, provides an accurate reset detector and fast oscillator
- sensor enters low power mode and can be configured via I2C interface
•
After re-configuration, a measurement cycle is performed, which consists of the following steps:
- activating internal biasing, checking for the restart condition and providing the fast oscillator
- HALL biasing
- measuring the three HALL probe channels sequentially (including the temperature). This is enabled by
default
- reentering configured mode
Datasheet
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TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Functional description
In any case functions are only executed if the supply voltage is high enough, otherwise the restart circuit will
halt the state machine until the required level is reached and restart afterwards. The functions are also restarted
if a restart event occurs in between (see parameter ADC restart level ).
1.1.2
Sensing
Measures the magnetic field in X, Y and Z direction. Each X-, Y- and Z-Hall probe is connected sequentially to a
multiplexer, which is then connected to an analog to digital converter (ADC). Optional, the temperature (default
= activated) can be determined as well after the three Hall channels.
1.1.3
Wake-Up
For each of the three magnetic channels (X/Y/Z), the Wake-Up function has an upper and lower comparison
threshold. Each component of the applied field is compared to the lower and upper threshold. If one of the
results is above or below these thresholds, an interrupt pulse /INT is generated. This is called a Wake-Up
function. The sensor signals a certain field strength change to the microcontroller. As long as all components
of the field stay within the envelope, no interrupt signal will be provided. Note however that the /INT can also
be inhibited during I2C activities, by activated collision avoidance. A Wake-Up interrupt /INT is the logical OR
among all Wake-Up interrupt envelopes of the three channels.
1.2
Pin configuration (top view)
Figure 2 shows the pinout of the TLE493D-P2B6.
Figure 2
TLE493D-P2B6 pinout
Table 1
TSOP6 pin description and configuration (see Figure 2)
Pin no.
Name
Description
1
SCL
/INT
Interface serial clock pin (input)
Interrupt pin, signals a finished measurement cycle, open-drain
2
GND
Connect to GND
3
GND
Ground pin
4
VDD
Supply pin
5
GND
Connect to GND
6
SDA
Interface serial data pin (input/output), open-drain
Datasheet
5
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2021-01-12
TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Functional description
1.3
Definition of magnetic field
A positive field is considered as south-pole facing the corresponding Hall element.
Figure 3 shows the definition of the magnetic directions X, Y, Z of the TLE493D-P2B6.
Figure 3
Definition of magnetic field direction
1.4
Sensitive area
The magnetic sensitive area for the Hall measurement is shown in Figure 4.
Figure 4
Datasheet
Center of sensitive area (dimensions in mm)
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TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Functional description
1.5
Application circuit
The use of an interrupt line is optional, but highly recommended to ensure proper and efficient readout of the
sensor data.
The pull-up resistor values of the I2C bus have to be calculated in such a way as to fulfill the rise and fall time
specification of the interface for the given worst case parasitic (capacitive) load of the actual application setup.
Please note: Too small resistive R1/2 values have to be prevented to avoid unnecessary power consumption
during interface transmissions, especially for low-power applications.
VDD
R2
R1
VDD
TLE493D
CBuf
C1
VDD
µC
RSCL
SCL
GND
GND
RSDA
SDA
Power
Supply
(/INT)
GND
R1 = 1.2kΩ
R2 = 1.2kΩ
C1 = 100nF
Optional (recommended for wire harness ): RSDA, RSCL
SDA, SCL capacitance < 200 pF each, including all stray capacitances
Figure 5
Application circuit with external power supply and µC
For additional EMC precaution in harsh environments, C1 may be implemented by two 100 nF capacitors in
parallel, which should be already given by CBuf near the µC and/or power supply.
Datasheet
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TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Specification
2
Specification
This sensor is intended to be used in an automotive environment. This chapter describes the environmental
conditions required by the device (magnetic, thermal and electrical).
2.1
Absolute maximum ratings
Stresses above those listed under “Absolute maximum ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at these or any other conditions above those
indicated in the operational sections of this specification is not implied. Furthermore, only single error cases are
assumed. More than one stress/error case may also damage the device.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability. During
absolute maximum rating overload conditions the voltage on VDD pin with respect to ground (GND) must not
exceed the values defined by the absolute maximum ratings.
Table 2
Absolute maximum ratings
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
Note or test condition
Junction temperature
Tj
-40
–
125
°C
Voltage on VDD
VDD
-0.3
–
3.5
V
Magnetic field
Bmax
–
–
±1
T
Voltage range on any pin to GND
Vmax
-0.1
–
3.5
V
open-drain outputs are
not current limited.
Unit
Note or test condition
Table 3
ESD protection2)
Ambient temperature TA = 25°C
Parameter
Symbol
Values
Min.
ESD voltage (HBM)3)
ESD voltage (CDM)4)
2
3
4
VESD
Typ.
Max.
–
–
±2.0
kV
R = 1.5 kΩ, C = 100 pF
–
–
±0.75
kV
for corner pins
–
–
±0.5
kV
all pins
Characterization of ESD is carried out on a sample basis, not subject to production test.
Human body model (HBM) tests according to ANSI/ESDA/JEDEC JS-001.
Charged device model (CDM), ESD susceptibility according to JEDEC JESD22-C101.
Datasheet
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TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Specification
2.2
Operating range
To achieve ultra low power consumption, the chip does not use a conventional, power-consuming restart
procedure. The focus of the restart procedure implemented is to ensure a proper supply for the ADC operation
only. So it inhibits the ADC until the sensor supply is high enough.
Table 4
Operating range
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note or test condition
Operating temperature
Tj
-40
–
125
°C
Tj = Ta +3 K in fast mode
Supply voltage
VDD
2.8
3.3
3.5
V
Supply voltage must be above
restart level
ADC restart level
Vres
2.2
2.5
2.8
V
Min. ADC operating level
ADC restart hysteresis
Vres-hys
–
50
–
mV
Register stable level
Vreg
–
–
2.5
V
Register values are stable above
this voltage level
The sensor relies on a proper supply ramp defined with tPUP, VOUS and IDD-PUP, see Figure 6. The I2C reset
feature of the sensor shall be used by the µC after power up. If supply monitoring is used in the system (e.g.
brown-out detector etc.), it is also recommended to use the I2C reset of the sensor following events detected by
this monitor.
In any case, an external supply switch (either provided by a system-basis-chip solution which includes a
supply-enable feature, a Bias-resistor-transistor device, a capable µC GPIO pin, etc.) shall allow a power-cycle of
the sensor as backup for high availability applications to cope with any form of VDD ramps (including potential
EMC influences), see Figure 6.
At power up, SDA and SCL shall be pulled to VDD using R1 and R2 of Figure 5 and not be driven to low by any
device or µC on SDA and SCL.
VDD
VOUS
3.3V
≈
tPUP
Figure 6
Datasheet
tAPC
t
VDD power up and power cycle for high availability
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TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Specification
Table 5
VDD power up and power cycle
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
Note or test condition
Power up ramp time
tPUP
–
–
10
µs
Availability power cycle5)
tAPC
–
150
400
µs
Power up over- undershoot
VOUS
3
3.3
3.5
V
Envelope which must not be
exceeded at the end of a power up.
–
–
10
mA
Current consumption during tPUP
Power up current consumption IDD-PUP
2.3
Electrical characteristics
This sensor provides different operating modes and a digital communication interface. The corresponding
electrical parameters are listed in Table 6. Regarding current consumption more information are available in
Chapter 2.6.
Table 6
Electrical setup
Values for VDD = 3.3 V ±5%, Tj = -40°C to 125°C (unless otherwise specified)
Parameter
Symbol
Values
Unit
Note or test condition
Min.
Typ.
Max.
IDD_pd
–
7
130
nA
Tj = 25°C; power down mode
IDD_fm
1
3.4
5
mA
Fast mode
Input voltage low threshold7)
VIL
–
–
30
%VDD
All input pads
Input voltage high threshold7)
VIH
70
–
–
%VDD
All input pads
Input voltage hysteresis7)
VIHYS
5
–
–
%VDD
All input pads
–
–
0.4
V
All output pads, static load
Supply current 6)
Output voltage low level @ 3 mA load VOL
5
6
7
Not subject to production test - verified by design.
Currents at pull up resistors (Figure 5) needs to be considered for power supply dimensioning.
Based on I2C standard 1995 for VDD related input levels
Datasheet
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TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Specification
2.4
Magnetic characteristics
The magnetic parameters are specified for an end of line production scenario and for an application life
time scenario. The magnetic measurement values are provided in the two’s complement with 12 bit or 8 bit
resolution in the registers with the symbols Bx, By and Bz. Two examples, how to calculate the magnetic flux
density are shown in Table 10 and Table 11.
Initial magnetic characteristics8)
Table 7
Values for VDD = 3.3 V, Tj = 25°C (unless otherwise specified)
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note or test
condition
-40°C < Tj < 125°C
Magnetic linear range9) (full range)
Bxyz_LIN
-160
–
160
mT
Magnetic linear range9) (short range)
Bxyz_LINSR
-100
–
100
mT
Sensitivity X, Y, Z (full range)
Sx, Sy, Sz
6
7.7
10
Sensitivity X, Y, Z (short range)
SxSR, SySR, SzSR
12
15.4
20
LSB12/
mT
Z-Offset (full range and short range)
B0z
-1.8
±0.2
1.8
mT
@ 0 mT
XY-Offset (full range and short range)
B0xy
-0.75
±0.2
0.75
mT
@ 0 mT
X to Y magnetic matching10)
MXY
-5
±1
5
%
X/Y to Z magnetic matching10)
MX/YZ
-19
-4
11
%
Magnetic initial noise (rms)
(full range and short range)
Bineff
–
0.1
0.4
mT
rms = 1 sigma
Magnetic hysteresis9)
(full range and short range)
BHYS
–
1
–
LSB12
due to quantization
effects
MXY = 100 ⋅ 2 ⋅
Equation 1
Sx − Sy
%
Sx + Sy
M X /YZ = 100 ⋅ 2 ⋅
Equation 2
8
9
10
Parameter “X to Y magnetic matching”
Sx + Sy − 2 ⋅ Sz
%
Sx + Sy + 2 ⋅ Sz
Parameter “X/Y to Z magnetic matching”
Magnetic test on wafer level. It is assumed that initial variations are stored and compensated in the
external µC during module test and calibration.
Not subject to production test - verified by design/characterization.
See the magnetic matching definition in Equation 1 and Equation 2.
Datasheet
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TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Specification
Table 8
Sensor drifts11) valid for both full range and short range (unless indicated)
Values for VDD = 3.3 V ±5%, Tj = -40°C to 125°C, static magnetic field within full magnetic linear range (unless
otherwise specified)
Parameter
Symbol
Values
Min.
Unit Note or test condition
Typ.
Max.
Sensitivity drift X, Y, Z
SxD, SyD, SzD -15
±5
15
%
TC0
Offset drift X, Y
BO_DXY
-0.45
–
0.45
mT
@ 0 mT, TC0
Offset drift Z
BO_DZ
-1.6
–
1.6
mT
@ 0 mT, TC0
Offset drift Z
BO_DZ
-0.45
–
0.45
mT
@ 0 mT, TC0, Z Hall spin test
X to Y magnetic matching drift12)
MXY_D
-1.9
±0.5
1.9
%
TC0
-12
±5
12
%
TC0
X/Y to Z magnetic matching drift12) MX/YZ_D
Table 9
Temperature compensation, non-linearity and noise13)
Values for VDD = 3.3 V ±5%, Tj = -40°C to 125°C (unless otherwise specified)
Parameter
Symbol
Values
Unit
Note or test condition
Min.
Typ.
Max.
TC0
–
±0
–
TC1
–
-750
–
Bx, By and Bz (option 1)
TC2
–
-1500
–
Bx, By and Bz (option 2)
TC3
–
+350
–
Bx, By and Bz (option 3)
Differential non linearity (full range)
DNL
–
±2
–
Differential non linearity (short range)
DNLSR
–
±4
–
Integral non linearity (full range)
INL
–
±2
–
Integral non linearity (short range)
INLSR
–
±4
–
Magnetic noise (rms)
BNeff
–
–
Z-magnetic noise (rms)
BNeffZ
–
XY-magnetic noise (rms)
BNeffXY
–
Temperature compensation14)
(full range and short range)
11
12
13
14
ppm/K Bx, By and Bz (default)
LSB12
Bx, By and Bz
LSB12
Bx, By and Bz
1
mT
rms = 1 sigma
–
0.5
mT
–
0.25
mT
rms = 1 sigma,
-40°C < Tj < 85°C
Not subject to production test, verified by design/characterization. Drifts are changes from the initial
characteristics Table 7 due to external influences.
See the magnetic matching definition in Equation 1 and Equation 2.
Not subject to production test, verified by design/characterization.
TCX must be set before magnetic flux trimming and measurements with the same value.
Datasheet
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TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Specification
Conversion register value to magnetic field value:
Table 10
[Dec]
Magnetic conversion table for 12 bit
MSB
Bit10
Bit9
Bit8
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
LSB
-2048
1024
512
256
128
64
32
16
8
4
2
1
1
1
1
0
0
0
0
1
1
1
1
[Bin] e.g. 1
The conversion is realized by the two’s complement. Please use following table for transformation:
Example for 12-bit read out: 1111 0000 1111B: -2048 + 1024 + 512 + 256 + 0 + 0 + 0 + 0 + 8 + 4 + 2 +1 = -241 LSB12
Calculation of magnetic flux density: -241 LSB12 x 0.13 mT/LSB12 = -31.3 mT
Table 11
Magnetic conversion table for 8 bit
MSB
Bit10
Bit9
Bit8
Bit7
Bit6
Bit5
LSB
[Dec]
-128
64
32
16
8
4
2
1
[Bin] e.g.
0
0
1
1
1
1
0
1
Example for 8-bit read out: 0011 1101B: 0 + 0 +32 + 16 + 8 + 4 + 0 + 1 = 61 LSB8
Calculation of magnetic flux density (full range): 61 LSB8 x 16 / 7.7 LSB8/mT = 127 mT
2.5
Temperature measurement
By default, the temperature measurement is activated. The temperature measurement can be disabled if it is
not needed and to increase the speed of repetition of the magnetic values.
Temperature measurement characteristics15)
Table 12
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
Note or test condition
Digital value @ 25°C
T25
1000
1180
1360
LSB12
Temperature resolution, 12 bit
TRes12
0.21
0.24
0.27
K/LSB12
referring to Tj
Temperature resolution, 8 bit
TRes8
–
3.84
–
K/LSB8
referring to Tj
Table 13
Temperature conversion table for 12 bit
The bits MSB to Bit2 are read out from the temperature value registers. Bit1 and LSB are added to get a 12-bit
value for calculation.
MSB
Bit10
Bit9
Bit8
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
[Dec]
-2048
1024
512
256
128
64
32
16
8
4
[Bin] e.g.
0
1
0
1
0
0
1
0
1
1
Example for 12-bit calculation: 0110 1010 11B: 0 + 1024 + 0 + 256 + 0 + 0 + 32 + 0 + 8 + 4 = 1324 LSB12
Calculation to temperature: (1324 LSB12 - 1180 LSB12) x 0.24 K/LSB12 + 25°C ≈ 60°C
15
The temperature measurement is not trimmed on the sensor. An external μC can measure the sensor
during module production and implement external trimming to gain higher accuracies. Temperature
values are based on 12 bit resolution. Please note: only bit 11 ... 2 are listed in the bitmap registers.
Datasheet
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TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Specification
2.6
Overview of modes
For a good adaptation on application requirements this sensor is equipped with different modes. An overview is
listed in Table 14.
Table 14
Overview of modes16)
Mode
Measurements
Typ. fUpdate17)
Description
Power down
No measurements
–
Lowest possible supply current IDD
0.05 Hz - 770 Hz
(8 steps)
Cyclic measurements and ADCconversions with different update rates
Bx, By, Bz, T
5.8 kHz
Bx, By, Bz
7.8 kHz
Bx, By
11.6 kHz
Measurements and ADC conversions are
running continuously.
An I2C clock speed up to 1 MHz and use of
the interrupt /INT is required.
Bx, By, Bz, T
4.5 kHz
Bx, By, Bz
5.6 kHz
Bx, By
8.5 kHz
Low power mode
Bx, By, Bz, T
(full range and short range) Bx, By, Bz
Bx, By
Fast mode
(full range)
Fast mode
(short range)
Master controlled mode
Bx, By, Bz, T
(full range and short range) Bx, By, Bz
Up to fast mode
values
Measurements triggered by the
microcontroller via I2C
Bx, By
Typical IDD current consumption estimation formula (e.g. full range and all channels):
I DD ≈ I DD_fm ⋅ fUpdate ⋅ tBx + tBy + tBz + tTemp
Equation 3
16
17
IDD estimation formula
Not subject to production test - verified by design/characterization.
This is the frequency at which specified measurements are updated.
Datasheet
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TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Specification
2.7
Interface and timing description
This chapter refers to how to set the boundary conditions in order to establish a proper interface
communication.
Table 15
Interface and timing18)
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
Note or test condition
Bx, By and Bz conversion time
(full range)
tBx,
tBy,
tBz
32
43
54
μs
Bx, By and Bz conversion time
(short range)
tBx_SR,
tBy_SR,
tBz_SR
44
59
74
μs
Temp conversion time
(all ranges)
tTemp
32
43
54
μs
/INT pulse width
tINT
1.8
2.5
3.2
μs
/INT delay
tINT_d
1.8
2.5
3.2
μs
Allowed I2C bit clock frequency19)
fI2C_clk
–
400
1000
kHz
Low period of SCL clock
tL
0.5
–
–
μs
1.3 μs for 400-kHz mode
High period of SCL clock
tH
0.4
–
–
μs
0.6 μs for 400-kHz mode
SDA fall to SCL fall hold time
(hold time start condition to clock)
tSTA
0.4
–
–
μs
0.6 μs for 400-kHz mode
SCL rise to SDA rise setup time
(setup time clock to stop condition)
tSTOP
0.4
–
–
μs
0.6 μs for 400-kHz mode
SDA rise to SDA fall hold time
(wait time from stop to start cond.)
tWAIT
0.4
–
–
μs
0.6 μs for 400-kHz mode
SDA setup before SCL rising
tSU
0.1
–
–
μs
SDA hold after SCL falling
tHOLD
0
–
–
μs
Fall time SDA/SCL signal20)
tFALL
–
0.25
0.3
µs
Rise time SDA/SCL signal20)
tRISE
–
0.5
–
µs
I2C timings
R = 1.2 kΩ
The fast mode, shown in Figure 7, requires a very strict I2C behavior synchronized with the sensor conversions
and high bit rates. In this mode, a fresh measurement cycle is started immediately after the previous cycle was
completed.
Other modes are available for more relaxed timing and also for a synchronous microcontroller operation of
sensor conversions. In these modes, a fresh measurement cycle is only started if it is triggered by an internal or
external trigger source.
18
19
20
Not subject to production test - verified by design/characterization
Dependent on R-C-combination on SDA and SCL. Ensure reduced capacitive load for speeds above
400 kHz.
Dependent on used R-C-combination.
Datasheet
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TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Specification
In the default measurement configuration (Bx, By, Bz and T), shown in Figure 7, the measurement cycle ends
after the temperature measurement.
In 3-channel measurement configuration (Bx, By and Bz), the temperature channel is not converted and
updated. Thus, the measurement cycle ends after the Bz measurement.
In X/Y angular measurement configuration (Bx and By), the Bz and temperature channel are not converted and
updated. Thus, the measurement cycle ends after the By measurement.
SCL falling edge
@ ACK bit
reads X[n-1]
SCL falling edge SCL falling edge SCL falling edge
@ ACK bit
@ ACK bit
@ ACK bit
reads Y[n-1]
reads Z[n-1]
reads T[n-1]
*) setup/hold time for i2c readout to register value.
time must be either:
or:
status output starts
with odd parity bit of
last 6 bytes transmitted
1
tS/H ≥ f
i2c_clk
(update after read)
i2c bus protocol
SCL / SDA
S i2c_adr
transmission direction
Mà S
sens_reg X[n-1]MSBs Y[n-1]MSBs Z[n-1]MSBs T[n-1]MSBs
Mà S
Sà M
Sà M
Sà M
Sà M
Z[n-1]LSBs
T[n-1]LSBs
Sà M
STATUS
(update before read)
P
Sà M
S i2c_adr
tS/H *)
Mà S
tBy
tBz
tTemp
X[n-1]
Sà M
tBx
X[n]
Y[n-1]
Y[n]
Z[n-1]
Z value register
Z[n]
T[n-1]
T value register
Bx
By
T[n]
Bz
T
Bx
I2C readout frame, ADC conversion and related timing
Figure 7
tRISE
tFALL
tH
tL
tSTOP
t WAIT
tSTA
70% VDD
SCL
pin
30% VDD
70% VDD
SDA
pin
30% VDD
t HOLD
t SU
1 bit transfer
Datasheet
Mà S
tINT
tINT_d
1 / update_rate (fast mode)
Y value register
Figure 8
sens_reg X[n-1]MSBs
corresponds to 10bit addressing:
two bytes following a S condition
(i2c standard 1995, section 13.1)
tS/H *)
tBx
ADC conversion
chan. (fast mode)
first register
address is 0,
trigger bits are 0
addressing options;
R/W bit is 1
tS/H *)
tINT
tINT_d
X value register
X[n-1]LSBs
Y[n-1]LSBs
Sà M
1
tS/H ≤ - f
i2c_clk
tS/H *)
µC can start
readout after
/INT is high
again
/INT
shadowed LSBs
from prev.
MSBs read
STOP cond .
START cond .
I2C timing specification
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TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Package information
3
Package information
3.1
Package parameters
Table 16
Package parameters
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Notes
Thermal resistance21)
Junction ambient
RthJA
–
–
200
K/W
Junction to air for
PG-TSOP-6-6-8
Thermal resistance
Junction lead
RthJL
–
–
100
K/W
Junction to lead for
PG-TSOP-6-6-8
Soldering moisture level22)
MSL 1
260°C
Figure 9
Image of TLE493D-P2B6 in TSOP6
Figure 10
Footprint PG-TSOP6-6-8 (compatible to PG-TSOP6-6-5, all dimensions in mm)
21
22
According to Jedec JESD51-7
Suitable for reflow soldering with soldering profiles according to JEDEC J-STD-020D.1 (March 2008)
Datasheet
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TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Package information
3.2
Package outlines
Figure 11
Package outlines (all dimensions in mm)
Datasheet
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TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Package information
Figure 12
Packing (all dimensions in mm)
Further information about the package can be found here:
http://www.infineon.com/cms/en/product/packages/PG-TSOP6/PG-TSOP6-6-8/
Datasheet
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TLE493D-P2B6
High Accuracy Low Power 3D Hall Sensor with I2C Interface
Revision history
Revision history
Document
version
Date of
release
Description of changes
V1.0
2021-01-12
Initial release
Datasheet
20
1.0
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Trademarks
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Edition 2021-01-12
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2021 Infineon Technologies AG
All Rights Reserved.
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aspect of this document?
Email: erratum@infineon.com
Document reference
IFX-xtl1604393071312
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