TLE6232GPAUMA2

Data Sheet TLE 6232 GP Smart Six Channel Low-Side Switch Features Product Summary • Short Circuit Protection up to 24 V • Over-temperature Protection Supply voltage • Over-voltage Protection Drain source clamping voltage • 16 bit Serial Data Input and Diagnostic Output (2 bit/ch. acc. SPI protocol) On resistance • Direct Parallel Control of all six Channels for PWM Applications Output current (Channel 1-4) • General Fault Flag (Channel 5,6) • Low Quiescent Current • Compatible with 3V Micro Controllers • Electrostatic Discharge (ESD) Protection • Parallel Inputs High or Low Active Programmable • Green Product (RoHS compliant) • AEC qualified VS VDS(AZ)typ. RON1-4 RON 5,6 ID(NOM) ID(NOM) Application • µC Compatible Power Switch for 12 V and 24V Applications • Switch for Automotive and Industrial System • Solenoids, Relays and Resistive Loads • Robotic Controls 4.5 – 5.5 53 0.25 0.45 2 1 V V Ω Ω A A PG-DSO 36 General description Six Channel Low-Side Switch in Smart Power Technology (SPT) with a Serial Peripheral Interface (SPI) and six open drain DMOS output stages. The TLE 6232 GP is protected by embedded protection functions and designed for automotive and industrial applications. The output stages are controlled via an SPI Interface. Additionally all six channels can be controlled direct in parallel for PWM applications. Therefore the TLE 6232 GP is particularly suitable for engine management and powertrain systems. PRG GND RESET VS Block Diagram FAULT VS VBB IN1 Protection Functions as Ch. 1 LOGIC as Ch. 1 as Ch. 1 as Ch. 1 IN6 Output Stage as Ch. 1 16 SCLK SI CS OUT1 1 6 Serial Interface SPI 6 Output Control Buffer 6 OUT6 SO GND V2.3 Page 1 2009-11-18 Data Sheet TLE 6232 GP RESET FAULT VS Normal function GND VS SCB/Overload/OT PRG Open load IN1 IN2 as Ch.1 IN3 as Ch.1 IN4 as Ch.1 IN5 as Ch.1 IN6 as Ch.1 short to ground Output Stage OUT1 6 16 Channel 2 OUT2 Channel 3 OUT3 Channel 4 OUT4 Channel 5 OUT5 Channel 6 OUT6 SO 6 SI SCLK SPI Interface 16 bit Output Control Buffer CS GND Detailed Block Diagram V2.3 Page 2 2009-11-18 Data Sheet TLE 6232 GP Pin Description Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 Symbol GND NC OUT5 NC OUT1 IN5 IN1 Vs RESET CS PRG IN2 IN6 OUT2 NC OUT6 NC GND GND NC NC NC OUT3 NC IN3 FAULT SO SCLK SI IN4 NC OUT4 NC NC NC GND Pin Configuration (Top view) Function Ground not connected Power Output Channel 5 not connected Power Output Channel 1 Input Channel 5 Input Channel 1 Supply Voltage Reset Slave Select Program (inputs high or low-active) Input Channel 2 Input Channel 6 Power Output Channel 2 not connected Power Output Channel 6 not connected Ground Ground not connected not connected not connected Power Output Channel 3 not connected Input Channel 3 General Fault Flag Serial Data Output Serial Clock Serial Data Input Input Channel 4 not connected Power Output Channel 4 not connected not connected not connected Ground GND NC OUT5 NC OUT1 IN5 IN1 VS RESET CS PRG IN2 IN6 OUT2 NC OUT6 NC GND 1• 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 36 GND 35 NC 34 NC 33 NC 32 OUT4 31 NC 30 IN4 29 SI 28 SCLK 27 SO 26 FAULT 25 IN3 24 NC 23 OUT3 22 NC 21 NC 20 NC 19 GND Power SO 36 Heat Slug internally connected to ground pins V2.3 Page 3 2009-11-18 Data Sheet TLE 6232 GP Maximum Ratings for Tj = – 40°C to 150°C Parameter Supply Voltage Continuous Drain Source Voltage (OUT1...OUT8) Symbol VS VDS Input Voltage, All Inputs and Data Lines Operating Temperature Range Storage Temperature Range Output Current per Channel (see el. characteristics) VIN Tj Tstg ID(lim) Single pulse inductive Energy (internal clamping) Tj=125°C, Ch1-4: 3A linear decreasing Ch5,6: 1,5A linear decreasing Output Current per Channel @ TA = 25°C (All 6 Channels ON; Mounted on PCB ) 1) Power Dissipation (mounted on PCB) @ TA = 25°C E Electrostatic Discharge Voltage (Human Body Model) according to MIL STD 883D, method 3015.7 and EOS/ESD assn. standard S5.1 - 1993 DIN Humidity Category, DIN 40 040 IEC Climatic Category, DIN IEC 68-1 Thermal Resistance junction – case (die soldered on the frame) junction - ambient @ min. footprint junction - ambient @ 6 cm2 cooling area with heat pipes ID 1-4 ID 5,6 Ptot VESD Values -0.3 ... +7 45 - 0.3 ... + 7 - 40 ... + 150 - 55 ... + 150 ID(lim) min Unit V V V °C A mJ 40 20 1.1 0.55 A 3.3 W 2000 V E 40/150/56 RthJC RthJA 2 50 38 K/W PCB with heat pipes, backside 6 cm2 cooling area Minimum footprint 1) Output current rating so long as maximum junction temperature is not exceeded. At TA = 125 °C the output current has to be calculated using RthJA according mounting conditions. V2.3 Page 4 2009-11-18 Data Sheet TLE 6232 GP Electrical Characteristics Parameter and Conditions VS = 4.5 to 5.5 V ; Tj = - 40 °C to + 150 °C ; Reset = H (unless otherwise specified) Symbol Values min Unit typ max 1. Power Supply, Reset Supply Voltage2 VS 4.5 -- 5.5 V Supply Current IS -- -- 10 mA Supply Current in Standby Mode (RESET = L) Minimum Reset Duration IS(stdy) tReset,min -1 --- 10 -- µA µs RDS(ON) --- 0.25 -- 0.28 0.5 Ω RDS(ON) --- 0.45 -- 0.55 1 Ω VDS(AZ) 45 53 60 V Current Limit Channel 1-4 ID(lim) 1-4 ID(lim) 5,6 4 2 6 3 A Current Limit Channel 5,6 3 1.5 ID(lkg) -- -- 10 µA 2. Power Outputs ON Resistance VS = 5 V; ID = 1 A Channel 1-4 ON Resistance VS = 5 V; ID = 500 mA TJ = 25°C TJ = 150°C TJ = 25°C Channel 5,6 TJ = 150°C Output Clamping Voltage Output Leakage Current Output OFF VReset = L Turn-On Time Ch 1-4 ID = 2 A, resistive load Ch 5,6 ID = 1 A, resistive load tON -- 5 10 µs Turn-Off Time Ch 1-4 ID = 2 A, resistive load Ch 5,6 ID = 1 A, resistive load tOFF -- 5 10 µs Switch-On Slew Rate (resistive load) son 1 4 20 V/µs Switch-Off Slew Rate (resistive load) son 1 4 20 V/µs 3. Digital Inputs Input Low Voltage VINL - 0.3 -- 1.0 V Input High Voltage VINH 2.0 -- -- V Input Voltage Hysteresis Input Pull Down/Up Current (IN1 ... IN6) Input Pull Up Current (Reset) VINHys IIN(1..6) IIN(Res) 100 10 10 200 20 20 400 50 50 mV µA µA Input Pull Down Current (PRG) Input Pull Up Current ( CS , SI, SCLK) IIN(PRG) IIN(SI,SCLK) 10 10 20 20 50 50 µA µA VS - 1 -- -- V 4. Digital Outputs (SO, FAULT ) SO High State Output Voltage SO Low State Output Voltage ISOH = -2 mA 2 mA VSOL -- -- 0.4 V Output Tri-state Leakage Current CS = H, 0 ≤ VSO ≤ VS FAULT Output Low Voltage IFAULT = 2 mA ISOlkg -10 0 10 µA VFAULTL -- -- 0.4 V 2 ISOL = VSOH For VS < 4.5V the power stages are switched according the input signals and data bits or are definitely switched off. This under-voltage reset gets active at VS = 3V (typ. value) and is specified by design. V2.3 Page 5 2009-11-18 Data Sheet TLE 6232 GP Electrical Characteristics cont. Parameter and Conditions Symbol VS = 4.5 to 5.5 V ; Tj = - 40 °C to + 150 °C ; Reset = H (unless otherwise specified) 5. Diagnostic Functions Open Load Detection Voltage VDS(OL) Short to Ground Detection Voltage VDS(SHG) Values Unit min typ 0.52* 0.6* 0.68* Vs Vs Vs 0.32* 0.4* 0.48* Vs Diagnostic Current (incl. Leakage) UOUTi,j = 14V UOUTi,j = 0V Current Limitation; Overload Threshold Current Vs max V V Vs IOUTi,j -IOUTi,j ID(lim) 1-4 ID(lim) 5,6 Tth(sd) Thys td(fault) 325 50 580 130 980 250 µA µA 3 1.5 4 2 6 3 A A 170 5 -10 200 20 °C K 60 120 240 µs fSCK DC 200 50 100 100 ------ 5 ----- MHz ns ns ns ns Enable Lag Time (falling edge of CLK to rising edge of CS ) tlag Data Setup Time (required time SI to falling of CLK) tSU Data Hold Time (falling edge of CLK to SI) tH 150 20 20 ----- ---- ns ns ns Disable Time Transfer Delay Time3 ( CS high time between two accesses) Data Valid Time4 tDIS -- -- 100 ns tdt 150 -- -- ns tvalid ---- ---- 100 120 150 ns ns ns Over-temperature Shutdown Threshold Hysteresis Fault Delay Time 6. SPI-Timing Serial Clock Frequency (@ CSO ≤ 50pF) Serial Clock Period (1/fclk) Serial Clock High Time Serial Clock Low Time Enable Lead Time (falling edge of CS to rising edge of CLK) tp(SCK) tSCKH tSCKL tlead CL = 50 pF CL = 100 pF CL = 150 pF 3 This time is necessary between two write accesses. To get the correct diagnostic information, the transfer delay time has to be extended to the maximum fault delay time td(fault)max = 200µs. 4 This parameter will not be tested but specified by design V2.3 Page 6 2009-11-18 Data Sheet TLE 6232 GP Description of the Power Stages 4 low side power switches for nominal currents up to 3A (power stages OUT1 to OUT4). Control is possible by input pins or via SPI. For TJ = 150°C the on-resistance of the power switches is below 500mΩ. 2 low side power switches for nominal currents up to 1.5A (power stages OUT5 and OUT6). Control is possible by input pins or via SPI. For TJ = 150°C the on-resistance of the power switches is below 1Ω. In order to increase the switching current or to reduce the power dissipation parallel connection of power stages is possible. Each of the 6 output stages is equipped with its own zener clamp, which limits the output voltage to a maximum of 60V. The outputs are provided with a current limitation set to a minimum of 1.5A resp. 3A. Each power stage is equipped with an own temperature sensor. Each output is protected by embedded protection functions5). In case of overload or shortcircuit to UBatt the current is internally limited and the corresponding bit combination is set (early warning). If this operation leads to an over-temperature condition, a second protection level (about 170°C) will change the output into a low duty cycle PWM (selective thermal shutdown with restart) to prevent critical chip temperatures. The following faults can be detected (individually for each output): - short to UBatt: (SCB/overload) can be detected when switches are - short to ground: (SCG) can be detected when switches are - open load: (OL) can be detected when switches are - over-temperature: (OT) will only be detected when switches are On state Off state Off state On state The fault conditions SCB, SCG and OL will not be stored until an integrated filtering time is expired (please note for PWM application). If, at one output, several errors occur in a sequence, always the last detected error will be stored (with filtering time). All fault conditions are encoded in two bits per switch and are stored in the corresponding SPI registers. Additionally there are two central diagnostic bits: one especially for over-temperature (latched result of an OR-operation out of the 6 signals of the temperature sensor) and one for fault occurrence at any output. A fault that has been detected and stored in the fault register must not be replaced by o.k.-state (11) unless it is read out by the RD_DIAG command sent by the microcontroller or an internal or external reset has been applied. I.e. the fault register will be cleared only by the RD_DIAG command. PRG - Program pin. PRG = High (VS): Parallel inputs Channel 1 to 6 are high active PRG = Low (GND): Parallel inputs Channel 1 to 6 are low active. If the parallel input pins are not connected (independent of high or low activity), channels 1 to 6 are switched OFF. PRG pin itself is internally pulled down when it is not connected. 5) The integrated protection functions prevent device destruction under fault conditions and may not be used in normal operation or permanently. V2.3 Page 7 2009-11-18 Data Sheet TLE 6232 GP The effect of the integrated under-voltage detection is similar to the effect of an external reset at pin Reset (except low current consumption): - locks all power switches regardless of their input signals - clears the fault registers - resets SPI control register Parallel Connection of Power Stages The power stages which are connected in parallel have to be switched on and off simultaneously. In case of overload the ground current and the power dissipation are increasing. The application has to take into account that all maximum ratings are observed (e.g. operating temperature TJ and total ground current IGND, see Maximal Ratings). The maximum current limitation value (or overload detection threshold) of the parallel connected power stages is the summation of the corresponding maximum values of the power stages (IOUT(lim)x + IOUT(lim)y + ....). 2 power stages of the same type (see note 1) 3 power stages of the same type (see note 1,2) 2 power stages with the same clamping voltage, but different nominal current (see note 3) Max. Nominal Current Max. Clamping Energy On Resistance (Imax,OUTx+Imax,OUTy) x 0.9 0.8 x (Ex + Ey) 0.5 xRON ,OUTx , y (Imax,OUTx+Imax,OUTy+ Imax,OUTz) x 0.8 0.7 x (Ex + Ey + Ez) (Imax,OUTx+Imax,OUTy) x 0.8 Min (Eclpx , Eclpy) 0.34 xRON ,OUTx , y , z RON ,OUTx xRON ,OUTy RON ,OUTx + RON ,OUTy Note 1: Power stages of the same type have the same nominal current Note 2: Only for 3A power stages Note 3: Parallel connection of power stage type 3A/53V with type 1.5A/53V SPI Interface The serial SPI interface makes possible communication between TLE6232 and the microcontroller. TLE 6232 GP always works in slave mode whereas the microcontroller provides the master function. The maximum baud rate is 5MBaud. Applying a chip select signal at CS and setting bit 7 and bit 6 of the instruction byte to „1“ and „0“ TLE 6232 GP is selected by the SPI master. SI is the data input (Signal In), SO the data output (Signal Out). Via SCLK (Serial Clock Input) the SPI clock is given by the master. V2.3 Page 8 2009-11-18 Data Sheet TLE 6232 GP SPI Signal Description CS - Chip Select. The system microcontroller selects the TLE 6232 GP by means of the CS pin. Whenever the pin is in a logic low state, data can be transferred from the µC and vice versa. CS High to Low transition: - diagnostic status information is transferred from the power outputs into the shift register. - serial input data can be clocked in from then on - SO changes from high impedance state to logic high or low state corresponding to the SO bits CS Low to High transition: - transfer of SI bits from shift register into output buffers - reset of diagnosis register To avoid any false clocking the serial clock input pin SCLK should be logic low state during high to low transition of CS . When CS is in a logic high state, any signals at the SCLK and SI pins are ignored and SO is forced into a high impedance state. SCLK - Serial Clock. The system clock pin clocks the internal shift register of the TLE 6232 GP. The serial input (SI) accepts data into the input shift register on the falling edge of SCLK while the serial output (SO) shifts diagnostic information out of the shift register on the rising edge of serial clock. It is essential that the SCLK pin is in a logic low state whenever chip select CS makes any transition. The number of clock pulses will be counted during a chip select cycle. The received data will only be accepted, if exactly 16 clock pulses were counted during CS is active. SI - Serial Input. Serial data bits are shifted in at this pin, the most significant bit first. SI information is read in on the falling edge of SCLK. Input data is latched in the shift register and then transferred to the control buffer of the output stages. The input data consists of two bytes - a "control byte” followed by a "data byte". The control byte contains the information as to whether the data byte will be accepted or ignored (see diagnostics section). The data byte contains the input information for the six channels. A logic high level at this pin (within the data byte) will switch on the power switch, provided that the corresponding parallel input is also switched on (AND-operation for channel 1 to 6). SO - Serial Output. Diagnostic data bits are shifted out serially at this pin, the most significant bit first. SO is in a high impedance state until the CS pin goes to a logic low state. New diagnostic data will appear at the SO pin following the rising edge of SCLK. RESET - Reset pin. If the reset pin is in a logic low state, it clears the SPI shift register and switches all outputs OFF. An internal pull-up structure is provided on chip. In case of inactive chip select signal (High) or bit 7 and bit 6 of the instruction byte differing from1“ and „0“ the data output SO remains into tri-state. V2.3 Page 9 2009-11-18 Data Sheet TLE 6232 GP SPI Interface Power Stages 1...6 Power Stages 1...6 SCON_REG MUX_REG CS SCLK CS SPI Control: SCK SI SO State Machine Clock Counter Control Bits Parity Generator Shift Register DIA_REG Power Stages 1...6 SPI Communication A SPI communication starts with a SPI instruction (SI control word) sent from the controller to TLE 6232 GP. Simultaneously the device sends the first SO byte back to the µC. During a writing cycle the controller sends the data after the SPI instruction, beginning with the MSB. During a reading cycle, after having received the SPI instruction, TLE 6232 GP sends the corresponding data to the controller, also starting with the MSB. The SPI Interface consists of three register: - MUX_REG: 8-bit (1 byte) length for parallel operation mode (IN1 ... IN6 enabled or not) V2.3 Page 10 2009-11-18 Data Sheet TLE 6232 GP - SCON_REG: 8-bit (1 byte) length for serial control of the outputs (serial data bits) - DIAG_REG: 16-bit (2 byte) length. Contains the diagnostic information (2 bits per channel), a common over-temperature bit and a common fault bit. Registers MUX_REG and SCON_REG are writeable as well as readable from the microcontroller. The DIAG_REG can only be read from the µC. This leads to five different control bytes which are recognized by the IC. The following table shows the different modes. MSB WR_SCON SI: SO: RD_SCON SI: SO: WR_MUX SI: SO: RD_MUX SI: SO: RD_DIAG SI: SO LSB H L L H H L X X Z Z F OT DIA6 DIA5 H L L H L H X X Z Z F OT DIA6 DIA5 H L H L H L X X Z Z F OT DIA6 DIA5 H L H L L H X X Z Z F OT DIA6 DIA5 H L L L L L X X Z Z F OT DIA6 DIA5 MSB LSB D6 D5 D4 D3 D2 D1 X X DIA4 DIA3 DIA2 Write to SCON Register. DIA1 X X X X X X X X SCON6 .. . SCON1 H H Read SCON Register M6 M5 M4 M3 M2 M1 X X Write to MUX Register. DIA4 DIA3 DIA2 DIA1 X X X X X X X X Read MUX Register MUX6 . . MUX1 H H X X DIA4 SI Control Byte X X X X DIA3 DIA2 X X Read DIAG Register DIA1 SI Data Byte Note: ’X’ means ’don’t care’, because data will be ignored ’Dx’ represents the serial data bits, either being H (= OFF) or L (= ON) ’Mx’ enables parallel control of channel x H (=parallel) or L (=serial) ’Z’ means tri-state ’F’ is the common fault flag ’OT’ is the common over-temperature flag ’DIAx’ is the 2 bit diagnosis information per channel All other possible control bytes will lead to an ignorance of the data bits, but the full diagnosis information (like RD_DIAG command) is provided at the SO line. A reset of all fault registers (and OT bit) the will only be done if the RD_DIAG command was clocked in. Characteristics of the SPI Interface If the slave select signal at CS is High or bit 7 and bit 6 of the instruction byte differ from „1“ and „0“, the state machine is set on default condition, i.e. the state machine expects an instruction. If the 5V-reset (RESET) is active, the SPI output SO is switched into tri-state. In order to increase the possible number of SPI participants on one and the same CS signal, bits 7 and 6 of the instruction byte are fixed as shown above. While receiving the first two bits of the instruction byte the data output SO has to be in tri-state. After having received the first two bits TLE6232 has to decide if it is addressed (bit 7 = high, bit 6 = low). In this case the remaining 6 bits of the instruction byte and the data byte are accepted and the diagnostic feedback respectively the data byte content (MUX, SCON) is sent to the microcontroller. Otherwise instruction and data bits are rejected and SO remains in tri-state. V2.3 Page 11 2009-11-18 Data Sheet TLE 6232 GP On a reading access the bit pattern of the data byte at the SPI input SI will be ignored. The first SO byte sent out simultaneously by the TLE 6232 GP always contains the common fault bit, the over-temperature bit and the diagnostic information of channels 6 and 5 (2 bits each). Depending on the SI control byte, the second SO byte contains the requested information. - Read back of SCON_REG (SCON bits 6 to 1 and two high bits) - Read back of MUX_REG (MUX information for channel 6 to 1 and two high bits) - Diagnostic information of channel 4 to 1 (2 bits per channel) On a writing access always the full diagnostic information of the 6 channels (2 bit per channel) and the over-temperature and common fault bit is performed. Invalid instruction/access: An instruction is invalid, if the following condition is fulfilled: - an unused instruction code is detected (see tables with SPI instructions). If an invalid instruction is detected, a writing access on a register of TLE6232 GP is not allowwed. In addition an access is invalid if the number of SPI clock pulses counted during active CS differs from exactly 16 clock pulses (falling edges are counted). - On a writing access the received data is only taken over into the internal registers and - the fault register is only cleared by the RD_DIAG command, if exactly 16 SPI clock pulses were counted while CS active. Writing access / 8 bit + 8 bit resp. SS SPI Instruction SI 1 0 - - - - - Data/8 Bit - MSB SO MSB Z Z F OT DIA6 DIA5 DIA4 DIA3 DIA2 DIA1 MSB Reading access / 8 bit + 8 bit SS SI 1 0 SPI Instruction - - - - - XXXX XXXX - MSB SO V2.3 Data/8 Bit Z Z F OT DIA6 DIA5 MSB MSB Page 12 2009-11-18 Data Sheet TLE 6232 GP Serial/Parallel Control of the Power Stages 1...6 (SPI-Instructions: WR_MUX, RD_MUX, WR_SCON, RD_SCON) The following table shows the truth table for the control of the power stages 1...6. The register MUX_REG prescribes parallel or serial control of the power stages. The register SCON_REG prescribes the state of the power stage in case of serial control. RST 0 1 1 1 1 1 1 PRG X X X 0 0 1 1 INx X X X 0 1 0 1 MUXx X 0 0 1 1 1 1 SCONx X 0 1 X X X X Output OUTx of Power Stage x, x = 1..6 OUTx off Serial Control: OUTx on Serial Control: OUTx off Parallel Control: OUTx on Parallel Control: OUTx off Parallel Control: OUTx off Parallel Control: OUTx on Note: Serial Data bits are low active. Parallel Inputs are high or low active depending on the PRG pin. Description of the SPI Registers Register: 7 MUX6 State of Reset: Access by Controller: Bit 7 6 5 4 3 2 1-0 MUX_REG 6 MUX5 FFH 5 MUX4 3 MUX2 2 MUX1 1 1 0 1 1 1 0 1 Read/Write Name MUX6 MUX5 MUX4 MUX3 MUX2 MUX1 Register: SCON_REG 7 6 5 SCON6 SCON5 SCON4 State of FFH Reset: Access by Read/Write Controller: Bit Name 7 SCON6 6 SCON5 5 SCON4 4 SCON3 3 SCON2 2 SCON1 1-0 Diagnostics/Encoding of Failures V2.3 4 MUX3 Description Serial or parallel control of power stage 6 Serial or parallel control of power stage 5 Serial or parallel control of power stage 4 Serial or parallel control of power stage 3 Serial or parallel control of power stage 2 Serial or parallel control of power stage 1 No function: HIGH on reading 4 SCON3 3 SCON2 2 SCON1 Description State of serial control of power stage 6 State of serial control of power stage 5 State of serial control of power stage 4 State of serial control of power stage 3 State of serial control of power stage 2 State of serial control of power stage 1 No function: HIGH on reading Page 13 2009-11-18 Data Sheet TLE 6232 GP Description of the SPI Registers (SPI Instructions: RD_DIAG) Register: DIAG_REG1 7 6 5 ST7 ST6 ST5 State of FFH Reset: Access by Read only Controller: Bit Name 7-6 DIA4 5-4 DIA3 3-2 DIA2 1-0 DIA1 4 ST4 3 ST3 2 ST2 1 ST1 0 ST0 Description Diagnostic Bits of power stage 4 Diagnostic Bits of power stage 3 Diagnostic Bits of power stage 2 Diagnostic Bits of power stage 1 Note: This byte is always clocked out (second SO-byte), except the SI control words says: RD_SCON or RD_MUX. But: The content of the fault register will only be deleted if the control command ’RD_DIAG’ was clocked in and 16 clock pulses were counted. Register: 7 Z State of Reset: Access by Controller: Bit 7-6 5 4 3-2 1-0 DIA_REG2 6 Z FFH 5 F 4 OT 3 ST11 2 ST10 1 ST9 0 ST8 Read only Name Z F OT DIA6 DIA5 Description Bit 7 and 6 are always tri-state Common error flag Common over-temperature flag Diagnostic Bits of power stage 6 Diagnostic Bits of power stage 5 Encoding of the Diagnostic (Status) Bits of the Power Stages ST(2*x-1) ST(2*x-2) State of power stage x x = 1..6 1 1 Power stage o.k. 1 0 Overload, short circuit to battery (SCB) or over-temperature (OT) 0 1 Open load (OL) 0 0 Short circuit to ground (SCG) Note: DIA_REG2 is always clocked out as first byte F, OT Bit = 1: No Fault F, OT Bit = 0: Fault, Over-temperature The over-temperature bit is the latched result of an OR-operation out of the 6 signals of the temperature sensor) The general fault bit shows the fault occurrence at any of the outputs. Reset of the Diagnostic Information The diagnostic information will only be reset after the RD_DIAG command on the rising edge of slave select or a reset signal is applied (RESET = low). V2.3 Page 14 2009-11-18 Data Sheet TLE 6232 GP Timing Diagrams CS SCLK C SI O N T R O L Byte 7 6 5 4 10 9 8 7 6 5 4 3 2 1 2 1 MSB 15 SO 0 LSB 14 13 12 11 3 0 Figure 2: Serial Interface CS 0.7VS tdt 0.2 VS tlag trSI tSCKH tlead 0.7VS SCLK 0.2VS tSCKL tSU tH tfSI 0.7VS SI 0.2VS Figure 3: Input Timing Diagram 0.7 VS CS SCLK 0.2 V S tvalid tDis 0.7 VS SO SO 0.2 V S SO 0.7 VS 0.2 V S Figure 4: SO Valid Time Waveforms V2.3 Enable and Disable Time Waveforms Page 15 2009-11-18 Data Sheet TLE 6232 GP VIN t tOFF tON VDS 80% 20% t Figure 5: Power Outputs Timing is valid for resistive load with parallel and serial control. Rising edge of chip select initiates the switching Application Circuits VBB VS = 5V C 10k PRG VS OUT1 FAULT OUT2 RESET IN1 µC e.g. C167 IN6 MTSR SI MRST SO CLK CLK P xy CS TLE 6232 GP OUT6 GND V2.3 Page 16 2009-11-18 Data Sheet TLE 6232 GP Parallel SPI Configuration Engine Management Application TLE 6232 GP in combination with TLE 6240 GP (16-fold switch) for relays and general purpose loads and TLE 6220 GP (quad switch) to drive the injector valves. This arrangement covers the numerous loads to be driven in a modern Engine Management/Powertrain system. From 26 channels in sum 18 can be controlled direct in parallel for PWM applications. Injector 1 4 P x.1-4 4 PWM Channels MTSR SI SO MRST CLK CS CLK P x.y CS 4 TLE 6220 GP Quad Injector 2 Injector 3 Injector 4 6 PWM Channels P x.1-6 µC SI SO C167 CLK P x.y CS TLE 6232 GP Hex 8 8 PWM Channels P x.1-8 SI SO CLK P x.y V2.3 CS TLE 6240 GP 16-fold Page 17 2009-11-18 Data Sheet TLE 6232 GP Package and Ordering Code (All dimensions in mm) PG-DSO 36 TLE 6232 GP Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). V2.3 Page 18 2009-11-18 Data Sheet TLE 6232 GP Revision History Version V2.2 -> V2.3 Date 18.11.2009 V2.1 -> V2.2 Changes Package changed to PG-DSO-36 Ordering Code / Q-Nr. removed V2.0 -> V2.1 05.04.2007 Layout Changes, correct green package name implemented P-DSO36-12 à PG-DSO-36-26 V1.2 -> V2.0 05.03.2007 Changes to Green Product Version: - AEC, RoHS Logo and Feature List content added - Package Name P-DSO -> PG-DSO - Change History added - Disclaimer re-newed V1.2 08.10.2003 Initial Version of “grey” product V2.3 Page 19 2009-11-18 Data Sheet TLE 6232 GP Edition 2007-04-17 Published by Infineon Technologies AG 81726 Munich, Germany © 11/19/09 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. V2.3 Page 20 2009-11-18