TLE9564QX
BLDC Motor System IC
1
Overview
Features
•
Low-drop voltage regulator 5 V, 250 mA for main supply
•
Three half-bridge gate drivers for external N-channel MOSFETs
•
Adaptive MOSFET gate control:
– Regulation of the MOSFET switching time
– Reduced switching losses in PWM mode
– High efficient constant gate charge
•
Control of reverse battery protection MOSFET
•
One low-side capable current sense amplifier (CSA) with configurable gain for protection and diagnosis
•
LIN Transceivers LIN2.2/SAE J2602 with programmable TXD time-out feature and LIN flash mode
•
Configurable wake-up sources
•
Three high-side outputs 7 Ω typ.
•
Six PWM inputs
– High-side and low-side PWM capable
– Active free-wheeling
– Up to 25 kHz PWM frequency
•
32 bit serial peripheral interface (SPI) with cyclic redundancy check (CRC)
•
Very low quiescent current consumption in Stop Mode and Sleep Mode
•
Periodic cyclic sense and cyclic wake in Normal Mode, Stop Mode and Sleep Mode
•
Reset and interrupt output
•
Drain-source monitoring and open-load detection
•
Configurable time-out and window watchdog
•
Overtemperature and short circuit protection features
•
Leadless power package with support of optical lead tip inspection
•
Green Product (RoHS compliant)
Datasheet
www.infineon.com
1
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Overview
Potential applications
•
Auxiliary pumps (fuel, water, etc.)
•
Blower motor
•
Engine cooling fan
•
Sunroof module
•
Transfer case
Product validation
Qualified for automotive applications. Product validation according to AEC-Q100.
Description
The TLE9564QX is a multifunctional system IC with integrated power supply, communication interfaces,
multiple half-bridges and support features in an exposed pad PG-VQFN-48 power package. The device is
designed for various motor control automotive applications.
To support these applications, the BLDC Motor System IC provides the main functions, such as a 5 V lowdropout voltage regulator, one LIN transceiver, three half-bridges for BDLC motor control, one current sense
amplifier and one 32 bit serial peripheral interface (SPI).
The device includes diagnostic and supervision features, such as drain-source monitoring and open-load
detection, short circuit protection, configurable time-out and window watchdog, as well as overtemperature
protection.
Type
Package
Marking
TLE9564QX
PG-VQFN-48
TLE9564QX
Datasheet
2
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Table of Contents
1
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3
3.1
3.2
3.3
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Hints for not functional pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4
4.1
4.2
4.3
4.4
General Product Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11
11
13
14
14
5
5.1
5.2
5.3
5.4
5.4.1
5.4.2
5.4.3
5.4.4
5.4.5
5.4.6
5.4.7
5.5
5.5.1
5.5.2
5.5.3
5.5.4
5.5.5
5.5.6
5.5.7
5.5.8
5.6
5.6.1
5.6.2
5.6.3
5.7
5.7.1
5.7.1.1
5.7.1.2
5.7.2
5.7.3
5.8
System Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Short State Machine Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Device Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Description of State Machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
State Machine Modes Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Init Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Normal Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sleep Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Restart Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Fail-Safe Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Software Development Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Transition Between States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Transition into Init Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Init Mode -> Normal Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Normal Mode -> Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Normal Mode -> Sleep Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stop Mode -> Normal Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sleep Mode -> Restart Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Restart Mode -> Normal Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Fail-Safe Mode -> Restart Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reaction on Detected Faults . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stay in Current State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Transition into Restart Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Transition into Fail-Safe Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Wake Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Cyclic Sense . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Configuration and Operation of Cyclic Sense . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Cyclic Sense in Low-power Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Cyclic Wake . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Internal Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VS Supply Multiplexing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
18
18
19
21
22
22
22
23
24
25
26
27
27
28
28
28
29
29
30
30
30
31
31
31
33
33
34
34
38
38
39
40
6
6.1
Voltage Regulator 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Datasheet
3
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
6.2
6.3
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
7
7.1
7.2
7.2.1
7.2.2
7.2.3
7.2.4
7.2.5
7.3
High-Side Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Under Voltage Switch Off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Over Voltage Switch Off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Over Current Detection and Switch Off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Open Load Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PWM, Timer and SYNC Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
45
45
45
45
46
46
46
46
48
8
8.1
8.1.1
8.2
8.2.1
8.2.2
8.2.3
8.2.4
8.2.5
8.2.6
8.2.7
8.2.8
8.2.9
8.3
LIN Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LIN Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LIN OFF Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LIN Normal Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LIN Receive Only Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LIN Wake Capable Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TXD Time-out Feature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Bus Dominant Clamping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Under-Voltage Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Slope Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Flash Programming via LIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
49
49
49
50
50
50
51
51
52
53
53
53
53
54
9
9.1
9.2
9.2.1
9.2.2
9.2.3
9.2.4
9.3
High-Voltage Wake Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
High-Voltage Wake Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Wake Input Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Wake configuration for Cyclic Sense . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Wake configuration for Synchronization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
59
59
60
60
60
61
61
62
10
10.1
10.2
Interrupt Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Block and Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
11
11.1
11.2
11.2.1
11.2.2
11.2.3
11.3
11.3.1
11.3.2
11.3.3
Gate Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MOSFET control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Static activation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Static activation of a high-side MOSFET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Static activation of a low-side MOSFET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Turn-off of the high-side and low-side MOSFETs of a half-bridge . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PWM operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Determination of the active and freewheeling MOSFET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Configurations in PWM mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PWM operation with 3 PWM inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Datasheet
4
67
67
68
69
72
72
73
73
73
76
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
11.3.3.1
11.3.3.2
11.3.3.3
11.3.3.4
11.3.3.5
11.3.4
11.3.5
11.3.6
11.4
11.5
11.6
11.7
11.8
11.9
Control signals with active free-wheeling (AFWx = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Control signals with passive free-wheeling (AFWx = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Time modulation of pre-charge and pre-discharge times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Operation at high and low duty cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Measurements of the switching times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
PWM operation with 6 PWM inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Status bits for regulation of turn-on and turn-off delay times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Gate driver current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Passive discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Slam mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
Parking braking mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
Charge pump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
Frequency modulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
Electrical characteristics gate driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
12
Supervision Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.1
Reset Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.1.1
Reset Output Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.1.2
Soft Reset Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.2
Watchdog Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.2.1
Time-Out Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.2.2
Window Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.2.3
Watchdog Setting Check Sum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.2.4
Watchdog during Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.2.5
Watchdog Start in Stop Mode due to Bus Wake . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.3
VSINT Power On Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.4
VSINT Under- and Overvoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.4.1
VSINT Undervoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.4.2
VSINT Overvoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.5
VS Under- and Overvoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.5.1
VS Undervoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.5.2
VS Overvoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.6
VS Under- Overvoltage for high-side . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.6.1
VS Undervoltage for high-side . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.6.2
VS Overvoltage for high-side . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.7
VCC1 Over-/ Undervoltage and Undervoltage Prewarning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.7.1
VCC1 Undervoltage and Undervoltage Prewarning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.7.2
VCC1 Overvoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.8
VCC1 Short Circuit Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.9
Thermal Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.9.1
Individual Thermal Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.9.2
Temperature Prewarning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.9.3
Thermal Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.10
Bridge driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.10.1
Bridge driver supervision with activated charge pump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.10.1.1
Drain-source voltage monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.10.1.2
Cross-current protection and drain-source overvoltage blank time . . . . . . . . . . . . . . . . . . . . . .
12.10.1.3
OFF-state diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Datasheet
5
114
114
114
115
116
117
118
118
119
119
120
121
121
121
122
122
122
123
123
123
124
124
125
125
126
126
126
126
128
128
128
129
130
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
12.10.1.4
Charge pump undervoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.10.1.5
Switching parameters of MOSFETs in PWM mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.10.2
Low-side drain-source voltage monitoring during braking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.10.3
VS or VSINT Overvoltage braking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.11
Current sense amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.11.1
Unidirectional and bidirectional operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.11.2
Gain configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.11.3
Overcurrent Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.11.4
CSO output capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.12
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
131
131
131
132
132
132
133
133
135
136
13
13.1
13.2
13.3
13.3.1
13.4
13.4.1
13.5
13.5.1
13.5.2
13.6
13.6.1
13.6.2
13.6.3
13.7
Serial Peripheral Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SPI Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Failure Signalization in the SPI Data Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SPI Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CRC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SPI Bit Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Register Banking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SPI control registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Device Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Control registers bridge driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SPI status information registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Device Status Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Status registers bridge driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Family and product information register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
144
144
145
147
148
150
151
153
155
174
195
196
206
218
219
14
14.1
14.2
14.2.1
14.2.2
14.3
14.4
Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Application Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ESD Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ESD according to IEC61000-4-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ESD according to SAE J2962 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Behavior of Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Further Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
221
221
224
224
224
225
225
15
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226
16
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227
Datasheet
6
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Block Diagram
2
Block Diagram
VSINT
VCC1
VCC1
VS
CP
VS
VCC1
MUX(VSINT,VS)
CP
Charge pump
SDI
Control Logic
CPC1N
SDO
SPI
CPC1P
CLK
CPC2N
CSN
CPC2P
state machine
CP
VCC1
VS
Reset
GH1
RSTN
watchdog
SH1
Interrupt
GH2
SH2
Interrupt
Generation
GH3
INTN/TEST
VS
SH3
Gate
Drivers
Reset
Generation
GL1
GL2
HSS output
HS1
HSS output
HS2
HSS output
HS3
CSA logic
GL3
MUX(VSINT,VS)
MUX(VSINT,VS)
SL
PWM1/CRC
Wake-up input
WK4/SYNC
Wake Logic
PWM2
PWM3
PWM
inputs
PWM4
Fail Safe
PWM5
PWM6
CP/VCC1
CSAP
CSA
CSO
CSAN
VS
TXDLIN
LIN transceiver
LIN
GND
RXDLIN
(Transceiver GND, Pin 16)
(Analog/dig. GND, Pin 6)
MUX(VSINT,VS): multiplexed VSINT & VS
Figure 1
Datasheet
GND
Block Diagram
7
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Pin Configuration
Pin Configuration
3.1
Pin Assignment
36 SH3
35 GH3
34 PWM3
33 CP
32 VS
31 CPC1N
30 CPC1P
29 CPC2P
28 CPC2N
27 PWM1/CRC
26 GH1
25 SH1
3
N.U. 37
N.U. 38
PWM4 39
GL3 40
N.U. 41
WK4/SYNC 42
HS1 43
HS2 44
HS3 45
PWM5 46
PWM6 47
VSINT 48
TLE9564
PG-VQFN-48
24 SH2
23 GH2
22 PWM2
21 GL1
20 GL2
19 SL
18 CSN
17 LIN
16 GND
15 N.U.
14 N.U.
13 N.U.
12 RXDLIN
11 TXDLIN
10 CLK
9 CSO
8 CSAN
7 CSAP
6 GND
5 SDI
4 SDO
3 INTN/TEST
2 RSTN
1 VCC1
Figure 2
Pin Configuration
3.2
Pin Definitions and Functions
Pin
Symbol
Function
1
VCC1
Voltage Regulator. Output voltage 1
2
RSTN
Reset Output. Active LOW, internally passive pull-up with open-drain output
3
INTN/TEST
Interrupt Output. Active LOW output, push-pull structure
TEST. Connect to GND (via pull-down) to activate Software Development Mode
4
SDO
SPI Data Output to Microcontroller (=MISO). Push-pull structure
5
SDI
SPI Data Input from Microcontroller (=MOSI). Internal pull-down
6
GND
Ground. Analog/digital ground
7
CSAP
Not Inverting input of Current Sense Amplifier.
Datasheet
8
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Pin Configuration
Pin
Symbol
Function
8
CSAN
Inverting input of Current Sense Amplifier.
9
CSO
Current Sense Amplifier Output.
10
CLK
SPI Clock Input. Internal passive pull-down
11
TXDLIN
Transmit LIN. Internal passive pull-up
12
RXDLIN
Receive LIN. Push-pull structure
13
N.U.
Not used.
14
N.U.
Not used.
15
N.U.
Not used.
16
GND
Ground. Transceiver ground (, LIN)
17
LIN
LIN Bus.
18
CSN
SPI Chip Select Not input. Internal passive pull-up
19
SL
Source Low Side.
20
GL2
Gate Low Side 2.
21
GL1
Gate Low Side 1.
22
PWM2
PWM input 2. Internal passive pull-up
23
GH2
Gate High Side 2.
24
SH2
Source High Side 2.
25
SH1
Source High Side 1.
26
GH1
Gate High Side 1.
27
PWM1/CRC
PWM input 1. Internal passive pull-down
CRC. Connect to GND (via pull-down) to activate CRC functionality
28
CPC2N
Negative connection to Charge Pump Capacitor 2.
29
CPC2P
Positive connection to Charge Pump Capacitor 2.
30
CPC1P
Positive connection to Charge Pump Capacitor 1.
31
CPC1N
Negative connection to Charge Pump Capacitor 1.
32
VS
Supply voltage for HSx, LIN, Bridge Drivers and Charge pump. Connected to
the battery voltage after reverse protection.
33
CP
Charge Pump output voltage.
34
PWM3
PWM input 3. Internal passive pull-down
35
GH3
Gate High Side 3.
36
SH3
Source High Side 3.
37
N.U.
Not used.
38
N.U.
Not used.
39
PWM4
PWM input 4. Internal passive pull-down
40
GL3
Gate Low Side 3.
41
N.U.
Not used.
42
WK4/SYNC
Wake-up input 4/Sync.
43
HS1
High Side output 1.
44
HS2
High Side output 2.
Datasheet
9
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Pin Configuration
Pin
Symbol
Function
45
HS3
High Side output 3.
46
PWM5
PWM input 5. Internal passive pull-down
47
PWM6
PWM input 6. Internal passive pull-down
48
VSINT
Voltage regulator and main supply voltage. Connected to the battery voltage
after reverse protection
Cooling GND
Tab
Cooling Tab - Exposed Die Pad; For cooling purposes only, do not use as an
electrical ground1)
1) The exposed die pad at the bottom of the package allows better power dissipation of heat from the device via the
PCB. The exposed die pad is not connected to any active part of the IC. However, it should be connected to GND for
the best EMC performance.
Note:
The GND pin as well as the Cooling Tab must be connected to one common GND potential.
3.3
Hints for not functional pins
It must be ensured that the correct configurations are also selected, i.e. in case functions are not used that
they are disabled via SPI. Unused pins should be handled as follows:
•
N.U.: not used; internally bonded for testing purpose; leave open.
•
RSVD: must be connected to GND.
Datasheet
10
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
General Product Characteristics
4
General Product Characteristics
4.1
Absolute Maximum Ratings
Table 1
Absolute Maximum Ratings1)
Tj = -40°C to +150°C; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note or
Test Condition
Number
Voltages
Supply Voltage VS
VS, max
-0.3
–
28
V
–
P_4.1.1
Supply Voltage VS
VS, max
-0.3
–
40
V
Load Dump
P_4.1.2
Supply Voltage VSINT
VSINT, max
-0.3
–
28
V
–
P_4.1.3
Supply Voltage VSINT
VSINT, max
-0.3
–
40
V
Load Dump
P_4.1.4
Voltage Regulator 1
VCC1, max
-0.3
–
5.5
V
P_4.1.7
Charge Pump Output Pin
(CP)
VCP, max
VS - 0.8 –
VS + 17
V
ICP > - 200 µA if CP P_4.1.8
is disabled
CPC1P, CPC2P
VCPCxP, max
- 0.3
–
VS + 17
V
P_4.1.38
CPC1N, CPC2N
VCPCxN, max
- 0.3
–
VS + 0.3
V
P_4.1.39
Bridge Driver Gate High Side VGHx, max
(GHx)
-8.0
–
40
V
–
P_4.1.11
Bridge Driver Gate Low Side VGLx, max
(GLx)
-8.0
–
24
V
–
P_4.1.12
Voltage difference between VGS
GHx-SHx and between GLxSLx
-0.3
–
16
V
–
P_4.1.13
Bridge Driver Source High
(SHx)
VSHx, max
-8.0
–
40
V
–
P_4.1.14
Bridge Driver Source Low
Side SL
VSL, max
-8.0
–
6.0
V
–
P_4.1.15
Current Sense Amplifier
inputs (CSAP, CSAN)
VCSx, max
-8.0
–
+8.0
V
–
P_4.1.16
Current Sense Amplifier
Output CSO
VCSx, max
-0.3
–
VCC1
+ 0.3
V
–
P_4.1.17
Differential input voltage
range CSAPx - CSANx
VCSA,Diff
-8.0
–
8.0
V
–
P_4.1.18
Wake Input WKx
VWKx, max
-0.3
–
40
V
–
P_4.1.19
High Side HSx
VHSx, max
-0.3
–
VS, max +
0.3
V
–
P_4.1.20
LIN bus
VLIN, max
-27
–
40
V
–
P_4.1.21
Datasheet
11
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
General Product Characteristics
Table 1
Absolute Maximum Ratings1) (cont’d)
Tj = -40°C to +150°C; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter
Symbol
Values
Min.
PWM1/CRC, PWM2, PWM3,
PWM4, PWM 5, PWM6 Input
Pins
VPWM1-2-3-4-5- -0.3
Unit
Note or
Test Condition
Number
Typ.
Max.
–
40
V
–
P_4.1.25
6, max
Logic Input Pins (SDI, CLK, ) VI, max
-0.3
–
VCC1
+ 0.3
V
–
P_4.1.28
CSN
VCSN
-0.3
–
40
V
–
P_4.1.29
Logic Output Pins (SDO,
RSTN, INTN, , RXDLIN)
VO, max
-0.3
–
VCC1
+ 0.3
V
–
P_4.1.30
Junction Temperature
Tj
-40
–
150
°C
–
P_4.1.32
Storage Temperature
Tstg
-55
–
150
°C
–
P_4.1.33
VESD,11
-2
–
2
kV
HBM2)
Temperatures
ESD Susceptibility
ESD Resistivity
ESD Resistivity to GND, LIN
ESD Resistivity to GND
VESD,12
VESD,21
ESD Resistivity Pin 1,
VESD,22
12,13,24,25,36,37,48 (corner
pins) to GND
-8
-500
-750
–
8
–
500
–
750
kV
V
V
P_4.1.34
2)3)
P_4.1.35
4)
P_4.1.36
4)
P_4.1.37
HBM
CDM
CDM
1) Not subject to production test, specified by design.
2) ESD susceptibility, HBM according to ANSI/ESDA/JEDEC JS-001 (1.5 kΩ, 100 pF).
3) For ESD “GUN” Resistivity (according to IEC61000-4-2 “gun test” (150 pF, 330 Ω)), is shown in Application Information
and test report will be provided from IBEE.
4) ESD susceptibility, Charged Device Model “CDM” EIA/JESD22-C101 or ESDA STM5.3.1.
Notes
1. Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2. Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are
not designed for continuous repetitive operation.
Datasheet
12
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
General Product Characteristics
4.2
Functional Range
Table 2
Functional Range1)
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note or
Test Condition
Number
Supply Voltage
VSINT,func
VPOR,f
–
28
V
2)
P_4.2.1
Bridge Supply Voltage
VS,func
6.0
–
28
V
–
P_4.2.2
P_4.2.3
P_4.2.6
LIN Bus Voltage
VS_LIN,func
6
–
18
V
3)
Junction Temperature
Tj
-40
–
150
°C
–
1) Not subject to production test, specified by design.
2) Including Power-On Reset, Over- and Undervoltage Protection.
3) Parameter specification according to ISO 17987-4: rev 2016.
Note:
Within the functional range the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the related electrical characteristics
table.
Device Behavior Outside of Specified Functional Range
•
28 V < VSINT,func < 40 V: Device will still be functional including the state machine; the specified electrical
characteristics might not be ensured anymore. The VCC1 is working properly, however, a thermal shutdown
might occur due to high power dissipation. HSx switches might be turned OFF depending on HSx_OV
configurations. The specified SPI communication speed is ensured; the absolute maximum ratings are not
violated, however the device is not intended for continuous operation of VSINT > 28 V and a thermal
shutdown might occur due to high power dissipation. The device operation at high junction temperatures
for long periods might reduce the operating life time.
Note: 18 V < VS 5.5 V):
Device will still be functional; the specified electrical characteristics might not be ensured anymore:
– The voltage regulator will enter the low-drop operation mode.
– A reset could be triggered depending on the Vrthx settings.
– The LIN transmitter will be disabled if VS,UV is reached. .
– HSx switch behavior will depend on the respective configuration:
HS_UV_SD_DIS = ‘0’ (default): HSx will be turned OFF for VS < VS,UVD and will stay OFF.
HS_UV_SD_DIS = ‘1’: HSx stays on as long as possible. An unwanted overcurrent shut down may occur.
OC shut down bit set and the respective HSx switch will stay OFF.
– The specified SPI communication speed is ensured.
Note:
Datasheet
VS,UV < VS < 6.0 V: the charge pump might be deactivated due to a charge pump undervoltage
detection, resulting in a turn-off of the external MOSFETs.
13
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
General Product Characteristics
4.3
Thermal Resistance
Table 3
Thermal Resistance1)
Parameter
Symbol
Junction to Soldering Point Rth(JSP)
Junction to Ambient
Rth(JA)
Values
Unit
Min.
Typ.
Max.
–
7.2
–
–
27
–
Note or
Test Condition
Number
K/W
Exposed Pad
P_4.3.1
K/W
2)
P_4.3.2
1) Not subject to production test, specified by design.
2) Specified Rth(JA) value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board for a power
dissipation of 1.5 W; the product (chip+package) was simulated on a 76.2 x 114.3 x 1.5 mm3 with 2 inner copper layers
(2 x 70 µm Cu, 2 x 35 µm C); where applicable a thermal via array under the exposed pad contacted the first inner
copper layer and 300 mm2 cooling areas on the top layer and bottom layers (70 µm).
4.4
Current Consumption
Table 4
Current Consumption
Current consumption values are specified at Tj = 25°C, VSINT= VS = 13.5 V, all outputs open
(unless otherwise specified)
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit Note or
Test Condition
Number
INormal
–
4.5
5.5
mA
1)
VSINT = 5.5 V to 28 V;
Tj = -40°C to +150°C;
LIN=CP=off
P_4.4.1
Stop Mode current
consumption
(low active peak threshold)
IStop_1,25
–
50
65
µA
1)2)
CSA=LIN=off;
WKx=HSx=CP=off:
Cyclic Wak./Sen.=off
Watchdog = off;
no load on VCC1;
I_PEAK_TH = 0B
P_4.4.2
Stop Mode current
consumption
(low active peak threshold)
IStop_1,85
–
55
80
µA
1)2)3)
Tj = 85°C;
CSA=LIN=off;
WKx=HSx=CP=off:
Cyclic Wak./Sen.=off
Watchdog = off;
no load on VCC1;
I_PEAK_TH = 0B
P_4.4.3
Stop Mode current
IStop_2,25
consumption
(high active peak threshold)
–
70
95
µA
1)2)
P_4.4.4
Normal Mode
Normal Mode current
consumption
Stop Mode
Datasheet
14
CSA=LIN=off;
WKx=HSx=CP=off:
Cyclic Wak./Sen.=off
Watchdog = off;
no load on VCC1;
I_PEAK_TH = 1B
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
General Product Characteristics
Table 4
Current Consumption (cont’d)
Current consumption values are specified at Tj = 25°C, VSINT= VS = 13.5 V, all outputs open
(unless otherwise specified)
Parameter
Symbol
IStop_2,85
Stop Mode current
consumption
(high active peak threshold)
Values
Min.
Typ.
Max.
Unit Note or
Test Condition
Number
–
75
105
µA
1)2)3)
Tj = 85°C;
CSA=LIN=off;
Cyclic Wak./Sen.=off;
Watchdog = off;
no load on VCC1;
I_PEAK_TH = 1B
P_4.4.5
Sleep Mode
Sleep Mode current
consumption
ISleep,25
–
18
30
µA
1)
CSA=LIN=off;
WKx=HSx=CP=off:
Cyclic Wak./Sen.= off
P_4.4.6
Sleep Mode current
consumption
ISleep,85
–
28
40
µA
1)3)
Tj = 85°C;
CSA=LIN=off;
WKx=HSx=CP=off:
Cyclic Wak./Sen.=off
P_4.4.7
Feature Incremental Current Consumption
Current consumption for LIN ILIN,rec
module, recessive state
–
1.0
1.2
mA
3)4)
Normal/Stop
Mode;
LIN Normal Mode;
Tj = -40°C to +150°C;
VTXDLIN = VCC1;
no RL on LIN
P_4.4.8
Current consumption for LIN ILIN,dom
module, dominant state
–
1.5
1.7
mA
3)4)
Normal/Stop
Mode;
LIN Normal Mode;
Tj = -40°C to +150°C;
VTXDLIN = GND;
no RL on LIN
P_4.4.9
Current consumption for LIN ILIN,Rec_onlyN –
module, Receive Only Mode,
Normal Mode
0.1
0.2
mA
3)4)
Normal Mode;
LIN Receive Only
Mode;
VTXDLIN = VCC1
no RL on LIN
P_4.4.10
Current consumption for LIN ILIN,wake,25
wake capability
–
0.2
2
µA
4)
Stop/Sleep Mode;
LIN wake capable;
P_4.4.11
Current consumption for LIN ILIN,wake,85
wake capability
–
2
3
µA
3)4)
Stop/Sleep Mode;
Tj = 85°C;
LIN wake capable;
P_4.4.12
Current consumption for
each WK input
–
0.2
2
µA
1)5)6)7)
Datasheet
IWK,wake,25
15
Sleep Mode; WK P_4.4.22
wake capable;
no activity on WK pin;
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
General Product Characteristics
Table 4
Current Consumption (cont’d)
Current consumption values are specified at Tj = 25°C, VSINT= VS = 13.5 V, all outputs open
(unless otherwise specified)
Parameter
Min.
Typ.
Max.
Unit Note or
Test Condition
IWK,wake,85
–
0.5
3
µA
Current consumption for
IStop,HS,25
first High-Side in Stop Mode
–
250
375
µA
3)5)8)10)9)
P_4.4.24
Current consumption for
IStop,HS,85
first High-Side in Stop Mode
–
250
375
µA
3)5)8)10)9)
Stop Mode; Tj P_4.4.25
Current consumption for
cyclic sense function
–
Current consumption for
each WK input
Symbol
IStop,CS25
Values
1)3)5)6)7)
Number
Sleep Mode; Tj P_4.4.23
= 85°C;
WK wake capable;
no activity on WK pin;
Stop Mode;
HS with 100% duty
cycle (no load);
= 85°C;
HS with 100% duty
cycle (no load);
20
26
µA
5)8)10)11)
µA
3)5)8)10)11)
Stop Mode; WD P_4.4.26
= off;
Current consumption for
cyclic sense function
IStop,CS85
–
Current consumption for
watchdog active in Stop
Mode
IStop,WD25
–
18
23
µA
3)12)
Stop Mode;
Watchdog running;
P_4.4.28
Current consumption for
watchdog active in Stop
Mode
IStop,WD85
–
19
25
µA
3)12)
Stop Mode;
Tj = 85°C;
Watchdog running;
P_4.4.29
Current Sense Amplifier
ICSA1
–
–
4
mA
12)
CSA_OFF = 0B; VCSP P_4.4.31
= VCSAP = VCSAN = 0 V;
CSO_CAP = 0B;
CCSO = 330 pF
Current Sense Amplifier
ICSA2
–
–
10
mA
12)
CSA_OFF = 0B; VCSP P_4.4.36
= VCSAP = VCSAN = 0 V;
CSO_CAP = 1B;
CCSO = 2.2 nF
Current consumption in
parking braking mode
(LSx ON)
Iparking
–
10
14
µA
3)12)
Stop Mode or
P_4.4.32
Sleep Mode; Tj < 85°C;
PARK_BRK_EN = 1B
Current consumption Over
voltage braking mode
(LSx OFF)
IOV,LS_OFF
–
7
10
µA
3)12)
Stop Mode or
P_4.4.34
Sleep Mode; Tj < 85°C;
OV_BRK_EN = 1B
–
30
40
mA
Normal Mode;
Tj = -40°C to +150°C;
CPEN = 1; All HB OFF
Current consumption in VS ICP,BD
for Charge Pump and Bridge
Driver
24
32
Stop Mode; Tj P_4.4.27
= 85°C;
WD = off;
P_4.4.35
1) Measured at VSINT.
Datasheet
16
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
General Product Characteristics
2) If the load current on VCC1 will exceed the configured VCC1 active peak threshold, the current consumption will increase
by typ. 2.9 mA to ensure optimum dynamic load behavior. See also Chapter 6.
3) Not subject to production test, specified by design.
4) Additional current will be drawn from VS.
5) Current consumption adders of features defined for Stop Mode also apply for Sleep Mode and vice versa. Wake input
signals are stable (i.e. not toggling), cyclic wake/sense & watchdog are OFF (unless otherwise specified).
6) No pull-up or pull-down configuration selected.
7) The specified WKx current consumption adder for wake capability applies regardless how many WK inputs are
activated.
8) Additional current will be drawn from VS and VSINT.
9) Typical adder of additional high-side switch activation 200 µA.
10) HSx used for cyclic sense, Timerx with 20ms period, 0.1 ms on-time, no load.
In general the current consumption adder for cyclic sense in Stop Mode can be calculated with below equation:
IStop,CS_typ = 18 µA + (IStop,HS,25 x ton/TPer)
where the 18 uA is the base current consumption of the digital cyclic sense/wake functionality.
11) Also applies to cyclic wake but without adder from HS biasing contribution.
12) Additional current will be drawn from VSINT.
Notes
1. There is no additional current consumption contribution in Normal Mode due to PWM generators or Timers.
2. The quiescent current consumption in Stop Mode and Sleep Mode will increase for VSINT < 9 V.
Datasheet
17
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
System Features
5
System Features
This chapter describes the system features and behavior of the TLE9564QX:
•
State machine
•
Device configuration
•
State machine modes and mode transitions
•
Wake-up features such as cyclic sense and cyclic wake
5.1
Short State Machine Description
The BLDC Motor System IC offers six operating modes:
•
Init Mode: Power-up of the device and after a soft reset.
•
Normal Mode: The main operating mode of the device.
•
Stop Mode: The first-level power saving mode with the main voltage regulator VCC1 enabled.
•
Sleep Mode: The second-level power saving mode with VCC1 disabled.
•
Restart Mode: An intermediate mode after a wake event from Sleep Mode or Fail-Safe Mode or after a
failure (e.g. WD failure, VCC1 under voltage reset) to bring the microcontroller into a defined state via a
reset.
•
Fail-Safe Mode: A safe-state mode after critical failures (e.g. Temperature shutdown) to bring the system
into a safe state and to ensure a proper restart of the system.
A special mode, called Software Development Mode, is available during software development or debugging
of the system. All above mentioned operating modes can be accessed in this mode. However, the watchdog is
still running, but no reset to the microcontroller is applied. Watchdog failures are indicated over INTN pin
instead.
However, the watchdog reset signaling can be reactivated again in Software Development Mode. The
Watchdog will start always with the Long Open Windows (t_low).
The BLDC Motor System IC is controlled via a 32-bit SPI interface (refer to Chapter 13 for detailed
information). The configuration as well as the diagnosis is handled via the SPI.
The device offers various supervision features to support functional safety requirements. Refer to Chapter 12
for more information.
Datasheet
18
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
System Features
5.2
Device Configuration
Two features on the BLDC Motor System IC can be configured by hardware:
•
The selection of the normal device operation or the Software Development Mode.
•
Enabling/disabling the CRC on the SPI interface.
The configurations are done monitoring the follow pins:
•
INTN/TEST
•
PWM1/CRC
The hardware configuration can be done typically at device power-up, where the device is in Init Mode or (only
in case of CRC setting) in Restart Mode.
Software development Mode configuration detail
After the RSTN is released, the INTN/TEST pin is internally pulled HIGH with a weak pull-up resistor. Therefore
the default configuration is the device in normal operation.
In order to configure the Software Development Mode, the following conditions have to be fulfilled:
•
Init Mode from power-up
•
VCC1>Vrtx
•
POR=1
•
RSTN = HIGH
The Software Development Mode is configured using the following scheme:
•
Only one external pull-down on INTN/TEST pin followed by an arbitrary SPI command, the device latches
the Software Development Mode.
•
External pull-up or no pull-down on INTN/TEST pin enable the device in normal operation.
•
To enter Software Development Mode, a pull-down resistor to GND might be used.
Soft. Dev.
Mode OFF for tSDM_F to avoid supply glitches
The INTN/TEST is externally pulled-down
INTN/TEST
Intn_filt
Soft. Dev.
Mode ON
tSDM_F
RSTN
Mode
LATCHED (first SPI frame)
Entry in Software Development Mode
(not latched )
Init Mode
Successful latched Software Development Mode
Normal Mode
Time/us
Intn_filt: internal filtered INTN/TEST signal
Figure 3
Software Development Mode Selection Timing
Intn_filt is a filtered signal from INTN/TEST, with the filter time tSMD_F (P_11.2.7). Intn_filt starts (at the rising
edge if RSNT) wit the value 1.
Datasheet
19
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
System Features
Note:
If during monitoring the INTN/TEST pin for Software Development Mode entry, the device changes
the mode without SPI command, the device will not enter/stay in Software Development Mode.
CRC configuration detail
The CRC is configured using the following scheme:
•
Pull-down on PWM1/CRC enable the CRC.
•
No external components on PWM1/CRC disables the CRC.
In order to configure the CRC, the follow conditions have to be full filled:
•
Init Mode (from power-up) or Restart Mode
•
VCC1>Vrtx
•
POR=1
•
RSTN = LOW
The configuration selection is done during the reset delay time tRD1 with a continuous filter time of tCFG_F and
the configuration (depending on the voltage level at PWM1/CRC) is latched at the rising edge of RSTN.
VS_INT
VPOR,r
t
VCC1
VRT1,r
t
RSTN
Continuous Filtering with tCFG_F
tRD1
t
Configuration selection monitoring period
Figure 4
CRC configuration Selection Timing Diagram at the device power-up.
In case of mismatch between CRC setting between the device and µC (CRC_STAT), the device can accept two
recovery SPI commands (static patterns).
The pattern 67AA AA0EH (addr + rw_bit = 67 ; data = AAAA ; CRC = 0E ) enables the CRC.
The pattern E7AA AAC3H (addr + rw_bit = E7 ; data = AAAA ; CRC = C3) disables the CRC.
The patterns shall be send only in Normal Mode.
For additional details about the CRC setting and configuration, refer also to Chapter 13.3.1.
Datasheet
20
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
System Features
5.3
Block Description of State Machine
The state machine describes the different states of operation, the device may get into. The following figure
shows the state machine flow diagram.
Soft Reset
First battery connection
* The Software Development Mode is a super set of
state machine where the WD reset is not signaled,
LIN behavior differs in Init Mode. Otherwise, there are
no differences in behavior.
Config.: settings can be changed in
this device mode;
CSA
OFF
Init Mode *
(Long open window)
Fixed: settings stay as defined in
Normal Mode
VCC1
ON
CP(3)
OFF
HSx
OFF
BD(3)
OFF
LIN(2)
OFF
WD
fixed
Cyc.
Sense
Cyc.
Wake
OFF
OFF
(1) After Fail-Safe Mode entry, the device will stay for at
least typ. 1s in this mode (with RSTN low) after a TSD2
event and min. typ. 100ms after other Fail-Safe Events.
Only then the device can leave the mode via a wake-up
event. Wake events are stored during this time.
(2) For Software Development Mode LIN is ON in
Init Mode and stays ON when going from there to
Normal Mode.
Any SPI
command
(3) HB Passive off due to gate-source resistors.
CSA
config.
Normal Mode
Automatic
Reset is released
WD starts with long open window
VCC1
ON
CP
config.
HSx
config.
BD
config.
LIN
config.
WD
config.
Cyc.
Sense
Cyc.
Wake
config.
config.
SPI cmd
SPI cmd
WD trigger
SPI cmd
CSA
OFF
Sleep Mode
VCC1
OFF
LIN
VCC1 over voltage
(depend from VCC1_OV_MOD setting)
Wake cap./
OFF
CSA
OFF
Stop Mode
CP(3)
OFF
HSx
fixed
BD(3)
OFF
VCC1
ON
CP(3)
OFF
HSx
fixed
BD(3)
OFF
WD
OFF
Cyc.
Sense
Cyc.
Wake
WD
fixed
Cyc.
Wake
fixed
LIN
fixed
Cyc.
Sense
fixed
fixed
fixed
Wake up event
CSA
OFF
Restart Mode
Sleep Mode entry without any
wake source enabled
Watchdog Failure
VCC1 Under voltage
(RO pin is asserted)
VCC1
ON/
ramping
LIN
woken/OFF
CP(3)
OFF
HSx
OFF
BD(3)
OFF
WD
OFF
Cyc.
Sense
Cyc.
Wake
OFF
OFF
LS short circuit during
VS_OV event
After 4x consecutive VCC1
under voltage events
(if VS_INT > VS_INT_UV)
After 4x consecutive
Watchdog failure
Fail-Safe Mode (1)
CAN, LIN, WK, wake-up event
OR
Release of overtemperature TSD2
after a time depending on TSD2_DEL
VCC1 over voltage
(depend from VCC1_OV_MOD setting)
TSD2 event
VCC1
OFF
CP(3)
OFF
HSx
OFF
BD(3)
OFF
LIN
WD
OFF
Cyc.
Sense
Cyc.
Wake
OFF
Wake cap.
Figure 5
CSA
OFF
OFF
VCC1 Short to GND
State Diagram showing the operating modes
Description:
•
ON /OFF:= Indicate if the module is enabled or disabled either via SPI or from the device itself
•
config:= Settings can be changed in this mode
•
fixed:= Settings stay as defined in Normal Mode or Init Mode
•
active/inactive:= Indicate if the device activates/deactivates one specific feature
•
Wake capable:= Transceiver that is capable to detect one wake-up events
•
woken:= Transceiver that has detected one wake-up event
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BLDC Motor System IC
System Features
5.4
State Machine Modes Description
5.4.1
Init Mode
The device starts up in Init Mode after crossing the power-on reset VPOR,r threshold (see also Chapter 12.3) and
the watchdog will start with a long open window (tLW) after RSTN is released (High level).
In Init Mode, the device waits for the microcontroller to finish its startup and initialization sequence.
Init Mode
CSA
OFF
(Long open window)
Figure 6
Init Mode
Table 5
Init Mode Settings
VCC1
ON
CP
OFF
HSx
OFF
BD
OFF
LIN
OFF
WD
fixed
Cyc.
Sense
OFF
Cyc.
Wake
OFF
Part/Function
Value
Description
VCC1
ON
•
The VCC1 is ON
WD
fixed
•
Watchdog is fixed and set with a long open window (tLW)
HSx
OFF
•
All HSx are OFF
BD
OFF
•
Bridge Drivers is OFF
CP
OFF
•
Charge Pump is OFF
CSA
OFF
•
Current Sense Amplifier is OFF
LIN
OFF
•
LIN transceiver is OFF 1)
Cyc Sense
OFF
•
Cycle Sense is OFF
Cyc Wake
OFF
•
Cycle Wake is OFF
1) Exception: The LIN transceiver is ON during Software Development Mode
5.4.2
Normal Mode
The Normal Mode is the standard operating mode for the device. The VCC1 is active and all features are
configurable. Supervision and monitoring features are enabled.
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BLDC Motor System IC
System Features
CSA
config.
Normal Mode
VCC1
ON
CP
config.
HSx
config.
BD
config.
LIN
config.
WD
config.
Cyc.
Sense
config.
Cyc.
Wake
config.
Figure 7
Normal Mode
Table 6
Normal Mode Settings
Part/Function
Value
Description
VCC1
ON
•
VCC1 is active
WD
config
•
Watchdog may be configured by SPI
HSx
config
•
The High Side Switches may be configured and switched ON or OFF by
SPI
BD/CP
config
•
The Bridge Drivers and Charge Pump may be configured and switched
ON or OFF by SPI
CSA
config
•
Current Sense Amplifier may be configurable and switched ON or OFF by
SPI
LIN
config
•
LIN may be configurable and switched ON or OFF by SPI
Cyc. Sense
config
•
Cyclic sense may be configured with the HSx, WKx inputs and Timer1 or
Timer2 or SYNC (WK4)
Cyc. Wake
config
•
Cyclic wake can be configured with the Timer1 or Timer 2
5.4.3
Stop Mode
The Stop Mode is the first level technique to reduce the overall current consumption by setting the voltage
regulator VCC1 into a low-power mode.
Note:
All settings have to be done before entering Stop Mode.
In Stop Mode any kind of SPI WRITE commands are ignored and the SPI_FAIL bit is set, except for changing to
Normal Mode, triggering a device Soft Reset, refreshing the watchdog as well as for reading and clearing the
SPI status registers.
Note:
Datasheet
A wake-up event on , LIN, WKx, Low-Side short circuit detection in parking braking mode or
overvoltage brake detection, could generate an interrupt on pin INTN (based on INTN masking
configuration; refer to Chapter 10) however, no change of the device mode will occur.
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System Features
CSA
OFF
Stop Mode
Figure 8
Stop Mode
Table 7
Stop Mode Settings
VCC1
ON
CP
OFF
HSx
fixed
BD
OFF
LIN
fixed
WD
fixed
Cyc.
Sense
fixed
Cyc.
Wake
fixed
Part/Function
Value
Description
VCC1
ON
•
VCC1 is ON
WD
fixed
•
Watchdog is fixed as configured in Normal Mode
HSx
fixed
•
HSx are fixed as configured in Normal Mode
BD/CP
OFF
•
The Bridge Drivers and Charge Pump are OFF
CSA
OFF
•
Current Sense Amplifier is OFF
LIN
fixed
•
LIN fixed as configured in Normal Mode
Cyc. Sense
fixed
•
Cyclic sense fixed as configured in Normal Mode
Cyc. Wake
fixed
•
Cyclic wake is fixed as configured in Normal Mode
Note:
In Stop Mode, it is possible to activate the Low-Side of Bridge Drivers (e.g. in case of parking braking
mode or overvoltage brake detection). Refer to Chapter 12.10 for additional details.
5.4.4
Sleep Mode
The Sleep Mode is the second level technique to reduce the overall current consumption to a minimum
needed to react on wake-up events or for the device to perform autonomous actions (e.g. cyclic sense).
Note:
All settings have to be done before entering Sleep Mode.
CSA
OFF
Sleep Mode
VCC1
OFF
CP
OFF
HSx
fixed
BD
OFF
LIN
WD
OFF
Cyc.
Sense
fixed
Cyc.
Wake
fixed
Wake cap./
OFF
Figure 9
Datasheet
Sleep Mode
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BLDC Motor System IC
System Features
Table 8
Sleep Mode Settings
Part/Function
Value
Description
VCC1
OFF
•
VCC1 is OFF
WD
OFF
•
Watchdog is OFF
HSx
fixed
•
HSx are fixed as configured in Normal Mode
BD/CP
OFF
•
The Bridge Drivers and Charge Pump are OFF
CSA
OFF
•
Current Sense Amplifier is OFF
LIN
Wake Cap/ •
OFF
Cyc. Sense
fixed
•
Cyclic sense fixed as configured in Normal Mode
Cyc. Wake
fixed
•
Cyclic wake is fixed
LIN fixed as configured (Wake Capable or OFF)
Note:
In Sleep Mode, it is possible to activate the Low-Side’s of Bridge Drivers (e.g. in case of parking
braking mode or overvoltage braking). Refer to Chapter 12.10 for additional details.
5.4.5
Restart Mode
The Restart Mode is a transition state where the RSNT pin is asserted.
CSA
OFF
Restart Mode
(RO pin is asserted)
VCC1
ON/
ramping
LIN
woken/
OFF
Figure 10
Restart Mode
Table 9
Restart Mode Settings
CP
OFF
HSx
OFF
BD
OFF
WD
OFF
Cyc.
Sense
OFF
Cyc.
Wake
OFF
Part/Function
Value
Description
VCC1
ON/
ramping
•
VCC1 is ON or ramping up
WD
OFF
•
WD will be disabled if it was activated before
HSx
OFF
•
HSx will be disabled if it was activated before
BD/CP
OFF
•
The Bridge Drivers and Charge Pump are OFF
CSA
OFF
•
Current Sense Amplifier is OFF
LIN
Woken/
wake
capable/
OFF
•
LIN may woken (in case of wake-up event on the Bus) or wake capable
or OFF
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BLDC Motor System IC
System Features
Table 9
Restart Mode Settings (cont’d)
Part/Function
Value
Description
Cyc. Sense
OFF
•
Cyclic sense will be disabled if it was activated before
Cyc. Wake
OFF
•
Cyclic wake will be disabled if it was activated before
5.4.6
Fail-Safe Mode
The purpose of this mode is to bring the system in a safe status after a failure condition by turning OFF the
VCC1 supply and powering off the microcontroller. After a wake event the system is then able to restart again.
CSA
OFF
Fail-Safe Mode
VCC1
OFF
CP
OFF
HSx
OFF
BD
OFF
LIN
WD
OFF
Cyc.
Sense
OFF
Cyc.
Wake
OFF
Wake cap.
Figure 11
Fail-Safe Mode
Table 10
Fail-Safe Mode Settings
Part/Function
Value
Description
VCC1
OFF
•
VCC1 is switched OFF
WD
OFF
•
WD is switched OFF
HSx
OFF
•
HSx are switched OFF
BD/CP
OFF
•
The Bridge Drivers and Charge Pump are OFF
CSA
OFF
•
Current Sense Amplifier is OFF
LIN
Wake Cap
•
LIN is forced to be Wake capable
Cyc. Sense
OFF
•
Cyclic sense is switched OFF
Cyc. Wake
OFF
•
Cyclic wake is switched OFF
Note
•
In Fail-Safe Mode, the default wake sources , LIN and WKx (if configured as wake inputs) are activated
automatically and all wake event bits will be cleared.
•
The Fail-Safe Mode will be maintained until a wake event on the default wake sources occurs. To avoid any
fast toggling behavior a filter time of typ. 100ms (tFS,min) is implemented. Wake events during this time will
be stored and will automatically lead to entering Restart Mode after the filter time.
In case of an VCC1 overtemperature shutdown (TSD2) the Restart Mode will be reached automatically after
a filter time of typ. 1s (tTSD2) without the need of a wake event once the device temperature has fallen below
the TSD2 threshold.
•
The parking braking mode is automatically disabled in Fail-Safe Mode.
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BLDC Motor System IC
System Features
5.4.7
Software Development Mode
The Software Development Mode is a dedicated device configuration especially useful for software
development.
Compared to the default device user mode operation, this mode is a super set of the state machine. The device
will start also in Init Mode and it is possible to use all the modes and functions with following differences:
•
Restart Mode or Fail-Safe Mode (depending on the configuration) is not reached due to watchdog failure
but the other reasons to enter these modes are still valid.
•
, LIN default value in Init Mode and entering Normal Mode from Init Mode is ON instead of OFF.
Table 11
Normal Mode Settings (Software Development Mode active)
Part/Function
Default
State
Description
VCC1
ON
•
VCC1 is active
WD
ON
•
WD is on, but will not trigger transition to Fail-Safe Mode or Restart
Mode
HSx
OFF
•
The High Side Switches may be configured and switched ON or OFF by
SPI
BD/CP
OFF
•
The Bridge Drivers and Charge Pump may be configured and switched
ON or OFF by SPI
LIN
ON
•
LIN may be configurable and switched ON or OFF by SPI
Cyc. Sense
OFF
•
Can be configured
Cyc. Wake
OFF
•
Can be configured
Software Development Mode entry
For timing and configuration details, refer to Chapter 5.2.
Note
•
After Init Mode, the pull-up is released as the INTN/TEST pin acts as output then to drive the INTN signal.
•
If the device enters Fail-Safe Mode due to VCC1 short circuit to GND during the Init Mode, the Software
Development Mode will not be entered and can only be reached at the next power-up of the device after
the VCC1 short circuit is removed.
•
The absolute maximum ratings of the pin INTN must be observed. To increase the robustness of this pin
during debugging or programming a series resistor between INTN and the connector can be added.
Watchdog in Software Development Mode
The Watchdog is enabled in Software Development Mode as default state. One INTN event is generated due
to wrong watchdog trigger.
It is possible to deactivate the integrated Watchdog module using the WD_SDM_DISABLE bit. After disabling
the Watchdog, no INTN events are generated and the WD_FAIL bit will also not be set anymore in case of a
trigger failure. It is also possible only to mask / unmask the INTN event of the WD in Software Development
Mode by using the bit WD_SDM. In case of unmasking, a WD trigger fail will only lead to WD_FAIL bit set.
5.5
Transition Between States
This chapter describes the transition between the modes triggered by power-up, SPI commands or wake-up
events.
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BLDC Motor System IC
System Features
5.5.1
Transition into Init Mode
The device goes into Init Mode in case of a power-up or after sending a soft-reset in Normal or Stop Mode.
Prerequisites:
•
Power OFF
•
Device in Normal Mode or Stop Mode with follow conditions:
– VSINT > VPOR,r
– RSTN High
Triggering Events:
•
A Soft Reset command (MODE = ‘11’). All SPI registers will be changed to their respective Soft Reset values.
Note
•
In case of Soft Reset command, a hardware RSTN event can be generated depending on the configuration.
An external Reset will be generated in case of SOFT_RESET_RO = 0B . In case of SOFT_RESET_RO = 1B, no
RSTN hardware event is generated in case of Soft Reset.
•
At power-up, the SPI bit VCC1_UV will not be set as long as VCC1 is below the VRT,x threshold and if VSINT
is below the VSINT,UV threshold. The RSTN pin will be kept LOW as long as VCC1 is below the selected
VRT1,r threshold. The reset delay counter will start after VRT1,r threshold is reached. After the first
threshold crossing of VCC1 > VRT1,R and RSTN transition from low to high, all subsequent undervoltage
events will lead to Restart Mode.
•
Wake events are ignored during Init Mode and will be lost.
•
The bit VSINT_UV will only be updated in Init Mode once RSTN resumes a high level.
5.5.2
Init Mode -> Normal Mode
This transition moves the device in the mode where all configurations are accessable via SPI command.
Prerequisites:
•
VSINT > VPOR,r
•
Init Mode
•
RSTN High
Triggering Events:
•
Any valid SPI command (from SPI protocol point of view) will bring the device to Normal Mode (i.e. any
register can be written, cleared and read) during the long open window where the watchdog has to be
triggered (refer also Chapter 13.2). The CRC is not taken into account for this transition.
•
For example:
– A SPI Sleep Mode command will still bring the device into Normal Mode. However, as this is an invalid
state transition, the SPI bit SPI_FAIL is set.
– Any invalid SPI command (from content point of view) will still bring the device into Normal Mode. The
SPI bit SPI_FAIL is set.
Note
•
It is recommended to use the first SPI command to trigger and to configure the watchdog.
5.5.3
Normal Mode -> Stop Mode
This transition is intended as first measure to reduce the current consumption. All the device features needed
in Stop Mode shall be configured in Normal Mode.
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BLDC Motor System IC
System Features
Prerequisites:
•
VCC1>Vrtx
•
Device in Normal Mode
Triggering Events:
•
State transition is only initiated by specific SPI command.
Note
•
An interrupt is triggered on the pin INTN when Stop Mode is entered and not all wake source signalization
flags were cleared.
•
If high-side switches are kept enabled during Stop Mode, then the device current consumption will
increase.
•
It is not possible to switch directly from Stop Mode to Sleep Mode. Doing so will also set the SPI_FAIL flag
and will bring the device into Restart Mode.
5.5.4
Normal Mode -> Sleep Mode
This transition is intended to reduce as much as possible the current consumption keeping active only wakeup sources. All wake-up sources configurations shall be done in Normal Mode.
Prerequisites:
•
VCC1>Vrtx
•
Device in Normal Mode
•
All wake source signalization flags were cleared (including the LSxDSOV_BRK bit)
•
At least one wake-up source activated
Triggering Events:
•
State transition is only initiated by specific SPI command.
Note
•
If the HSx outputs are kept enabled during Sleep Mode, then the device current consumption will increase
(see Chapter 4.4).
•
The Cyclic Sense function will not work properly anymore in case of a failure event (e.g. overcurrent, over
temperature, reset) because the configured HSx and Timers will be disabled.
•
If VCC1_UV or VCC1_OV (with Config to go to Restart Mode) occurs at the border of the Sleep Mode entry:
The device will go immeditaley into Restart Mode.
•
If TSD2 or VCC1_OV (with Config to go to Fail-Safe Mode) occurs at the border of the Sleep Mode entry: The
device will enter immediately Fail-Safe Mode.
•
As soon as the Sleep Mode command is sent, the Reset will go low.
•
It is not possible to switch all wake sources off in Sleep Mode. Doing so will set the SPI_FAIL flag and will
bring the device into Restart Mode.
5.5.5
Stop Mode -> Normal Mode
This transition is intented to set the device in Normal Mode where all the device integrated features are
availbale and configurable.
Prerequisites:
•
VCC1>Vrtx
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BLDC Motor System IC
System Features
•
Device in Stop Mode
Triggering Events:
•
State transition is only initiated by SPI command.
Note
•
None
5.5.6
Sleep Mode -> Restart Mode
This transition is the consequence of a detection of wake-up event by the device. This transition is used to
ramp up VCC1 after a wake in a defined way.
Prerequisites:
•
Device in Sleep Mode
•
At least one wake-up source active
Triggering Events:
•
A wake-up event on , LIN, WKx, Cyclic Sense, Cyclic Wake.
•
Bridge driver low-side short circuit detected during overvoltage braking or in parking braking mode.
Note
•
It is not possible to switch off all wake sources in Sleep Mode. Doing so will set the SPI_FAIL flag and will
bring the device into Restart Mode.
•
RSTN is pulled low during Restart Mode.
•
The Restart Mode entry is signalled in the SPI register DEV_STAT.
•
The wake-up events are flaged in WK_STAT register or DSOV register.
5.5.7
Restart Mode -> Normal Mode
From Restart Mode, the device goes automatically to Normal Mode.
Prerequisites:
•
Device in Sleep Mode or Fail-Safe Mode
Triggering Events:
•
Automatic
•
Reset is released
Note
•
The watchdog timer will start with a long open window starting from the moment of the rising edge of
RSTN and the watchdog period setting in the register WD_CTRL will be changed to the respective default
value.
5.5.8
Fail-Safe Mode -> Restart Mode
This transition is similar to device from Sleep Mode to Restart Mode and consequence of a detection of wakeup event by the device. This transition is used to ramp up VCC1 after a wake in a defined way.
Prerequisites:
•
Device in Fail-Safe Mode
Triggering Events:
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BLDC Motor System IC
System Features
•
A wake-up event on , LIN, WKx, TSD2 (released over temperature TDS2 after tTSD2).
•
Bridge Driver Low Side short circuit detected during VS/VSINT overvoltage braking mode or in parking
braking mode.
Note:
After leaving Fail-Safe Mode, the FAILURE bit in DEV_STAT register is set.
5.6
Reaction on Detected Faults
The device can react at some critical events either signalling the specific failure or changing the device mode.
The chapter describes actions taken from the device in case of critical events in particular related the device
mode change.
5.6.1
Stay in Current State
The following failures will not trigger any device mode changes, but will indicate the failures by an INTN event
(depending from the Interrupt Masking) and in dedicated status registers:
•
Failures on LIN
•
Failures in Bridge Driver and/or Charge Pump
•
Failures on HSx
5.6.2
Transition into Restart Mode
The Restart Mode can be entered in case of failure as shown in following figure.
VCC1 over voltage
(depend from VCC1_OV_MOD setting)
CSA
OFF
Restart Mode
Sleep Mode entry without any
wake source enabled
Watchdog Failure
VCC1 Under voltage
(RO pin is asserted)
VCC1
ON/
ramping
LIN
woken/OFF
Figure 12
CP
OFF
HSx
OFF
BD
OFF
WD
OFF
Cyc.
Sense
Cyc.
Wake
OFF
OFF
Move into Restart Mode
Prerequisites
•
In case of wake-up event from Sleep Mode or Fail Safe Mode
•
In case of Normal Mode
•
In case of Stop Mode
Trigger Events
•
VCC1 Undervoltage in case of Normal Mode or Stop Mode.
•
Watchdog trigger failure in case of Normal Mode or Stop Mode.
•
VCC1 Overvoltage (based on VCC1_OV_MOD) in case of Normal Mode or Stop Mode.
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BLDC Motor System IC
System Features
•
Sleep Mode entry without any wake-up sources enabled in Normal Mode or Stop Mode.
Note
•
None
Datasheet
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BLDC Motor System IC
System Features
5.6.3
Transition into Fail-Safe Mode
The Fail-Safe Mode can be entered in case of critical event as shown in the following figure.
After 4x consecutive VCC1
under voltage events
(if VS_INT > VS_INT_UV)
After 4x consecutive
Watchdog failure
Fail-Safe Mode
VCC1 over voltage
(depend from VCC1_OV_MOD setting)
TSD2 event
VCC1
OFF
CP
OFF
HSx
OFF
BD
OFF
LIN
WD
OFF
Cyc.
Sense
Cyc.
Wake
OFF
Wake cap.
Figure 13
CSA
OFF
OFF
VCC1 Short to GND
Move into Fail-Safe Mode
Prerequisites:
•
Critical events on VCC1
•
Watchdog trigger failures
Trigger Events:
•
Device thermal shutdown (TSD2) (see also Chapter 12.9.3).
•
VCC1 is shorted to GND (see also Chapter 12.8).
•
VCC1 over voltage (based on VCC1_OV_MOD).
•
4 consecutive Watchdog trigger failure.
•
4 consecutive VCC1 under voltage events.
5.7
Wake Features
Following wake sources are implemented in the device:
•
Static Sense: WKx inputs are permanently active as wake sources.
•
Cyclic Sense: WKx inputs only active during on-time of cyclic sense period. Internal timers are activating
HSx during on-time for sensing the WKx inputs.
•
Cyclic Wake: wake controlled by internal timers, wake inputs are not used for cyclic wake.
•
LIN wake: Wake-up via Bus messages (refer to Chapter 8.2.4).
Note:
Datasheet
Differences of 'cyclic sense' and 'cyclic wake':
In both cases a timer is active. With 'cyclic sense' one of the high-side drivers is switched on
periodically and supplies some external circuits connected to the WK inputs. For the design, this
means that the WK input states are only sampled at the end of the selected HS on-phase which is set
by the corresponding SPI settings for GPIO HS and the timer. 'Cyclic wake' means that the timer is a
wake source and thus generates periodic interrupts as long as it is enabled.
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System Features
5.7.1
Cyclic Sense
The cyclic sense feature is intended to reduce the quiescent current of the device and the application.
In the cyclic sense configuration, one high-side driver is switched on periodically controlled by TIMER_CTRL
or WK4/SYNC pin. One high-side driver supplies external circuitries e.g. switches and/or resistor arrays, which
are connected to one wake input WKx (see Figure 14). Any edge change of the WKx input signal during the ontime of the cyclic sense period causes a wake event. Depending on the device mode, either the INTN is pulled
low (Normal Mode and Stop Mode) or the device is woken enabling the VCC1 (after Sleep Mode).
HSx
HSx
HS_CTRL
10k
10k
WKx
WKx
Signal
TIMER_CTRL
Period / On-Time
Switching
Circuitry
INTN
STATE MACHINE
to uC
Figure 14
Cyclic Sense Working Principle
5.7.1.1
Configuration and Operation of Cyclic Sense
The correct sequence to configure the cyclic sense is shown in Figure 15. All the configurations have to be
performed before the on-time is set in the TIMER_CTRL registers. The settings “OFF / LOW” and “OFF / HIGH”
define the voltage level of the respective HS driver before the start of the cyclic sense. The intention of this
selection is to avoid an unintentional wake due to a voltage level change at the start of the cyclic sense.
Cyclic Sense will start as soon as the respective on-time has been selected independently from the assignment
of the HS and filter configuration. The correct configuration sequence is as follows:
•
Configure the initial level.
•
Mapping of a Timer to the respective HSx outputs.
•
Configuring the respective filter timing and WK pins.
•
Configuring the timer period and on-time.
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BLDC Motor System IC
System Features
Cyclic Sense Configuration
Assign TIMERx_ON to OFF/Low or
OFF/High in TIMER_CTRL
Timer1, Timer2
Assign Timer to selected HSx switch
in HS_CTRL
Timer1, Timer2
WKx
with above selected timer
Enable WKx as wake source with
configured Timer in WK_CTRL
Select WKx pull-up / pull-down
configuration in WK_CTRL
No pull-up/-down, pull-down or pullup selected, automatic switching
Select Timer Period and desired
On-Time in TIMER_CTRL
Period: 10, 20, 50, 100, 200ms, 1s, 2s
On-Time: 0.1, 0.3, 1.0, 10, 20ms
A new timer configuration will become
active immediately, i.e. as soon as CSN
goes high
Cyclic Sense starts / ends by
setting / clearing On-time
Figure 15
Datasheet
Cyclic Sense: Configuration and Sequence
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BLDC Motor System IC
System Features
Cyclic Sense Configuration
Assign WK4 as SYNC input on
WK_CTRL
Assign SYNC to selected HSx switch
in HS_CTRL
Enable WKx as wake source with
configured SYNC in WK_CTRL
Select WKx pull-up / pull-down
configuration in WK_CTRL
WKx except WK4
with SYNC
No pull-up/-down, pull-down or pullup selected, automatic switching
Cyclic Sense starts / ends by
sensing SYNC rise/fall edge
Figure 16
Cyclic Sense: Configuration and Sequence in case of SYNC usage
Note
•
All configurations of period and on-time can be selected. However, recommended on-times for cyclic
sense are 0.1ms, 0.3ms and 1ms for quiescent current saving reasons. The SPI_FAIL will be set if the ontime is longer than the period.
•
If the sequence is not ensured before entering Sleep Mode, then the cyclic sense function might not work
properly, e.g. an interrupt could be missed or an unintentional interrupt could be triggered. However, if
cyclic sense is the only wake source and it is not configured properly, then Restart Mode will be entered
immediately because no valid wake source was set.
•
During the HSx on phase in cyclic-sensing, the WKx level is sampled only once (one sample point). In case,
a level change will appear during HSx on phase, but before the sampling, as the sampling will happen at
the end of the on time, the level change will not be detected and has to wait for the next sensing-cycle.
A wake event caused by cyclic-sensing will also set the corresponding bit WKx_WU.
During Cyclic Sense, WK_LVL_STAT is updated only with the sampled voltage levels of the WKx pin in Normal
Mode or Stop Mode.
The functionality of the sampling and different scenarios are depicted in Figure 17 to Figure 19. The behavior
in Stop Mode and Sleep Mode is identical except that in Normal Mode and Stop Mode INTN will be triggered to
signal a change of WKx input level and in Sleep Mode, VCC1 will power-up instead. A wake event will be
triggered regardless if the bit WKx_WU is already set.
Datasheet
36
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
System Features
Cyclic Sense
HSx static ON
Period
HSx
Filter time
tFWK1
Filter time
tFWK1
On Time
t
1st sample taken
as reference
Figure 17
Wake detection possible
on 2nd sample
Cyclic Sense Timing
HSx
Filter time
High
Low
Switch
Spike
open
closed
WKx
High
Low
n-1
INTN
n
Learning
Cycle
WKn-1= Low
n+1
WKn= Low
WKn = WKn-1
no wake event
High
WKn = WKn+1 = Low
(but ignored because
change during filter time)
WKn = WKn+1
no wake event
n+2
WKn+2= High
WKn+2 ≠WKn+1
wake event
Low
INTN &
WK Bit Set
Start of
Cyclic Sense
Figure 18
Datasheet
Cyclic Sense Example Timing for Stop Mode, HSx starts LOW, GND based WKx input
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Rev. 1.0
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TLE9564QX
BLDC Motor System IC
System Features
HSx
Filter time
High
Low
Switch
Spike
open
closed
WKx
High
Low
n-1
n
Learning
Cycle
WKn-1= Low
VCC1
High
n+1
WKn= Low
WKn = WKn-1
no wake event
WKn = WKn+1 = Low (but
ignored because change during
filter time), WKn = WKn+1
no wake event
Transition to Normal
via Restart Mode
Sleep Mode
Low
WK Bit Set
Start of
Cyclic Sense
Figure 19
n+2
WKn+2= High
WKn+2 ≠WKn+1
wake event
Cyclic Sense Example Timing for Sleep Mode, HSx starts with ON, GND based WKx input
The cyclic sense function will be disabled in case of following conditions:
•
in case Fail-Safe Mode is entered, the HSx switch will be disabled and the WKx pin will be changed to static
sensing. An unintended wake-up event could be triggered when the WKx input is changed to static sensing.
•
In Normal Mode, Stop Mode, or Sleep Mode in case of an overcurrent, or overtemperature, or under- or
overvoltage event, the respective HS switch will be disabled.
5.7.1.2
Cyclic Sense in Low-power Mode
If cyclic sense is intended for Stop Mode or Sleep Mode, it is necessary to activate cyclic sense in Normal Mode
before going to the low-power mode. A wake event due to cyclic sense will set the bit WKx_WU. In Stop Mode
a wake event will trigger an interrupt, in Sleep Mode the wake event will send the device via Restart Mode to
Normal Mode.
Before returning to Sleep Mode, the wake status registers WK_STAT and DSOV must be cleared. Trying to go
to Sleep Mode with uncleared wake flags will lead to a direct wake-up from Sleep Mode by going via Restart
Mode to Normal Mode and triggering of RSTN.
5.7.2
Cyclic Wake
For the cyclic wake feature one timer is configured as internal wake-up source and will periodically trigger an
interrupt on INTN in Normal Mode and Stop Mode. During Sleep Mode, the timer triggers and wakes up the
device again. The device enters via Restart Mode the Normal Mode.
The correct sequence to configure the cyclic wake is shown in Figure 20. The sequence is as follows:
Datasheet
38
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
System Features
Cyclic Wake Configuration
Disable Timer1 and Timer2 as a wake
source in TIMER_CTRL
To avoid unintentional interrupts
Select Timer1 or Timer2 as a wake
source in TIMER_CTRL
No interrupt will be generated,
if the timer is not enabled as a wake source
Select Timer Period and any
On-Time in TIMER_CTRL
Periods: 10, 20, 50, 100, 200ms, 1s, 2s
On-times: any
(OFF/LOW & OFF/HIGH are not allowed)
Cyclic Wake starts / ends by
setting / clearing On-time
INTN is pulled low at every rising
edge of On-time except first one
Figure 20
Cyclic Wake: Configuration and Sequence
Note:
The on-time is only used to enable the cyclic wake function regardless of the value of the on time, i.e.
the on time value has no meaning to the cyclic wake function as long as it is not ‘000’ or ‘110’ or ‘111’.
As in cyclic sense, the cyclic wake function will start as soon as the on-time is configured. An interrupt is
generated for every start of the on-time except for the very first time when the timer is started.
5.7.3
Internal Timers
Two integrated timers can be used to control the below features:
•
Cyclic Wake, i.e. to wake up the microcontroller periodically in Normal Mode, Stop Mode and Sleep Mode.
•
Cyclic Sense, i.e. to perform cyclic sensing using the wake input WKx and the HSx by mapping the timer
accordingly via the HS_CTRL register.
Datasheet
39
Rev. 1.0
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TLE9564QX
BLDC Motor System IC
System Features
5.8
VS Supply Multiplexing
VMAX SWITCH
+
-
VSINT
1
INTERNAL SUPPLY
MUX
VS
Figure 21
0
VS Supply Multiplexing
The internal supply voltage is multiplexed from VSINT and VS, choosing continuously the larger of both. In
case of transient low VBAT, the buffered supply voltage takes over the internal supply, avoiding loss of power.
Note:
Datasheet
Only the internal digital logic of the device is supplied by the VMAX SWITCH. In case of a power loss
of either VS or VSINT, the internal register values will not be lost.
40
Rev. 1.0
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TLE9564QX
BLDC Motor System IC
Voltage Regulator 1
6
Voltage Regulator 1
6.1
Block Description
VCC1
VSINT
Vref
1
Overtemperature
Shutdown
Bandgap
Reference
State
Machine
INH
GND
Figure 22
Module Block Diagram
Functional Features
•
5 V low-drop voltage regulator.
•
Undervoltage monitoring with adjustable reset level and VCC1 undervoltage prewarning (refer to
Chapter 12.7 and Chapter 12.8 for more information).
•
Short circuit detection and switch off with undervoltage fail threshold, device enters Fail-Safe Mode.
•
Effective capacitance must be ≥ 1 µF at nominal voltage output for stability. A 2.2 µF ceramic capacitor
(MLCC) is recommended for best transient response.
•
Output current capability up to IVCC1,lim.
Datasheet
41
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Voltage Regulator 1
6.2
Functional Description
The Voltage Regulator 1 (=VCC1) is “ON” in Normal Mode and Stop Mode and is disabled in Sleep Mode and in
Fail-Safe Mode. The regulator can provide an output current up to IVCC1,lim.
For low-quiescent current reasons, the output voltage tolerance is decreased in Stop Mode because only the
less accurate low-power mode regulator will be active for small loads. If the load current on VCC1 exceeds the
selected threshold (IVCC1,Ipeak1,r or IVCC1,Ipeak2,r) then the high-power mode regulator will be also activated to
support an optimum dynamic load behavior. The current consumption will then increase (approx. 2.8 mA
additional quiescent current). The device mode stays unchanged.
If the load current on VCC1 falls below the selected threshold (IVCC1,Ipeak1,f or IVCC1,Ipeak2,f), then the low-quiescent
current mode is resumed again by disabling the high-power mode regulator.
Both regulators (low-power mode and high-power mode) are active in Normal Mode.
Two different active peak thresholds can be selected via SPI:
•
I_PEAK_TH = ‘0’(default): the lower VCC1 active peak threshold 1 is selected with lowest quiescent current
consumption in Stop Mode.
•
I_PEAK_TH = ‘1’: the higher VCC1 active peak threshold 2 is selected with an increased quiescent current
consumption in Stop Mode.
Datasheet
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Rev. 1.0
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TLE9564QX
BLDC Motor System IC
Voltage Regulator 1
6.3
Electrical Characteristics
Table 12
Electrical Characteristics
VSINT = 5.5 V to 28 V; Tj = -40°C to +150°C; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified).
Parameter
Min.
Typ.
Max.
Unit Note or
Test Condition
Output Voltage including Line VCC1,out1
and Load Regulation
4.9
5.0
5.1
V
1)
Output Voltage including Line VCC1,out2
and Load Regulation
(Full Load Current Range)
4.9
5.0
5.1
V
1)
Normal Mode;
6 V < VSINT < 28 V;
10 µA < IVCC1 < 250 mA
P_6.3.2
Output Voltage including Line VCC1,out3
and Load Regulation
(Higher Accuracy Rage)
4.95
–
5.05
V
2)
Normal Mode; 20 mA
< IVCC1 < 80 mA;
8 V < VSINT < 18 V;
25°C < Tj < 150°C
P_6.3.3
Output Voltage including Line VCC1,out4
and Load Regulation
(low-power mode)
4.9
5.05
5.2
V
Stop Mode;
10 µA < IVCC1 < IVCC1,Ipeak
P_6.3.4
Output Drop Voltage
VCC1,d1
–
200
400
mV
IVCC1 = 50 mA,
VSINT = 5 V
P_6.3.9
Output Drop Voltage
VCC1,d2
–
300
500
mV
IVCC1 = 150 mA,
VSINT = 5 V
P_6.3.10
VCC1 Active Peak Threshold 1 IVCC1,Ipeak1,r
(Transition threshold
between low-power and highpower mode regulator)
–
3.25
5.0
mA
2)
ICC1 rising;
VSINT = 13.5 V;
I_PEAK_TH = ‘0’
P_6.3.17
VCC1 Active Peak Threshold 1 IVCC1,Ipeak1,f
(Transition threshold
between high-power and lowpower mode regulator)
1.2
1.7
–
mA
2)
ICC1 falling;
VSINT = 13.5V;
I_PEAK_TH = ‘0’
P_6.3.18
VCC1 Active Peak Threshold 2 IVCC1,Ipeak2,r
(Transition threshold
between low-power and highpower mode regulator)
6
–
20
mA
2)
ICC1 rising;
VSINT = 13.5 V;
I_PEAK_TH = ‘1’
P_6.3.19
VCC1 Active Peak Threshold 2 IVCC1,Ipeak2,f
(Transition threshold
between high-power and lowpower mode regulator)
5
–
15
mA
2)
ICC1 falling;
VSINT = 13.5V;
I_PEAK_TH = ‘1’
P_6.3.20
Overcurrent Limitation
260
360
500
mA
current following out of P_6.3.21
pin, VCC1= 0V 2)
Datasheet
Symbol
IVCC1,lim
Values
43
Number
Normal Mode; 10 µA < P_6.3.1
IVCC1 < 150 mA;
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Voltage Regulator 1
Table 12
Electrical Characteristics (cont’d)
VSINT = 5.5 V to 28 V; Tj = -40°C to +150°C; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified).
Parameter
Symbol
Min.
Typ.
Max.
Unit Note or
Test Condition
Minimum Output Capacitance CVCC1,min
for stability
13)
–
–
µF
2)
P_6.3.22
Maximum Output
Capacitance
–
–
47
µF
2)
P_6.3.23
CVCC1,max
Values
Number
1) In Stop Mode, the specified output voltage tolerance applies when IVCC1 has exceeded the selected active peak
threshold (IVCC1,Ipeak1,r or IVCC1,Ipeak2,r) but with increased current consumption.
2) Not subject to production test, specified by design.
3) Value is meant to be an effective value at rated output voltage level.
Datasheet
44
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
High-Side Switch
7
High-Side Switch
7.1
Block Description
VS
HSx
HS Gate Control
Overcurrent Detection
Open Load (On)
Figure 23
High-Side Module Block Diagram
Features
•
All HSx supplied by VS
•
Under voltage switch off configurable via SPI.
•
Dedicated over voltage switch off per each HSx in Normal Mode- configurable via SPI.
•
Overvoltage switch off in Stop Mode and Sleep Mode- configurable via SPI.
•
Overcurrent detection and switch off.
•
Open load detection in ON-state.
•
PWM capability with internal or external timers configurable via SPI.
•
Switch recovery after removal of OV or UV condition configurable via SPI.
7.2
Functional Description
The High-Side switches can be used for control of LEDs, as supply for the wake inputs and for other loads
(except inductive load). The High-Side outputs can be controlled either directly via SPI by the integrated
timers or by the integrated PWM generators or by external sync signal (using WK4/SYNC pin).
The high-side outputs are supplied by VS pin. The topology supports improved cranking condition behavior.
The configuration of the High-Sides (Permanent On, PWM, cyclic sense, etc.) drivers must be done in Normal
Mode. The configuration is taken over in Stop Mode or Sleep Mode and cannot be modified. When entering
Restart Mode or Fail-Safe Mode the HSx outputs are disabled.
7.2.1
Under Voltage Switch Off
All HS drivers in on-state are switched off in case of under voltage on VS. The feature can be disabled by setting
the SPI bit HS_UV_SD_DIS .
Datasheet
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TLE9564QX
BLDC Motor System IC
High-Side Switch
After release of under voltage condition, the HSx switch goes back to programmed state in which it was
configured via SPI. This behavior is only valid if the bit HS_UV_REC is set. Otherwise the switches will stay off
and the respective SPI control bits are cleared.
The under voltage is signaled in the bit HS_UV, no other error bits are set.
7.2.2
Over Voltage Switch Off
The HS drivers in on-state are switched off in case of over voltage on VS.. In Normal Mode the HSx can be kept
in on-state above the VS overvoltage threshold if the HSx_OV_SDN_DIS bit is set.
In Stop Mode or Sleep Modes all HS drivers can be kept in on-state if HS_OV_SDS_DIS bit is set.
When the HSx are configured to switch off in case of over voltage condition, after release of over voltage
condition, the HS switch goes back to programmed state in which it was configured via SPI. This behavior is
only valid if the respective bit HSx_OV_REC is set. Otherwise the switch will stay off and the respective SPI
control bits are cleared. This configuration is available for each HSx.
The over voltage is signaled in the bit HS_OV, no other error bits are set.
7.2.3
Over Current Detection and Switch Off
If the load current exceeds the over current shutdown threshold for a time longer then the over current
shutdown filter time the output is switched off.
The over current condition and the switch off is signaled with the respective HSx_OC_OT bit in the register
HS_OL_OC_OT_STAT. The HSx configuration is then reset to 000 by the device. To activate the High-Side
again the HSx configuration has to be set to ON (001) or be programmed to a timer function. It is
recommended to clear the over current bit before activation the High-Side switch, as the bits are not cleared
automatically by the device.
7.2.4
Open Load Detection
Open load detection on the High-Side outputs is done during on state of the output. If the current in the
activated output falls below the open load detection current threshold, the open load is detected and signaled
via the respective bit HS1_OL, HS2_OL, HS3_OL, or HS4_OL in the register HS_OL_OC_OT_STAT. The HighSide output stays activated.. If the open load condition disappears the Open Load bit in the SPI can be cleared.
The bits are not cleared automatically by the device.
7.2.5
PWM, Timer and SYNC Function
Each integrated HSx can be configured in different ways, in particular:
•
Static OFF
•
Static ON
•
Timer 1
•
Timer 2
•
Internal generator PWM1
•
Internal generator PWM2
•
Internal generator PWM3
•
Internal generator PWM4
•
SYNC (via WK4)
Note:
Datasheet
PWMx mentioned in this chapter refer to the internal PWM generators, which are configured by the
registers HS_CTRL and PWM_CTRL. They can be used to control the internal high-side switches HSx.
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TLE9564QX
BLDC Motor System IC
High-Side Switch
Note:
PWMx mentioned in this chapter do not refer to the PWMx pins. The PWMx pins are used for the PWM
operation of the bridge drivers, to control the external MOSFETs.
Static configuration (ON/OFF)
This configuration set the HSx permanently ON or OFF. This configuration is available in Normal Mode, Stop
Mode and Sleep Mode.
The configuration shall be done via SPI.
Timer configuration (TIMER1 or TIMER2)
Two Timers are dedicated to control the ON phase of dedicated HS outputs.
The Timers are mapped to the dedicated HS outputs. Period and the duty cycle can be independently
configured with via SPI.
PWM configuration (PWM1..PWM4)
Several internal PWM generators are dedicated to generate a PWM signal on the HSx output, e.g. for brightness
adjustment or compensation of supply voltage fluctuation. The PWM generators are mapped to the dedicated
HS outputs, and the duty cycle can be independently configured with a 10-bit resolution via SPI (PWM_CTRL).
Two different frequencies can be selected independently for every PWM generator in the register PWM_CTRL.
In order to assign and configure the PWMx to specific HSX, the follow steps have to be followed:
•
Configure duty cycle and frequency for respective PWM generator in PWM_CTRL.
•
Assign PWM generator to respective HS switch(es) in HSx_CTRL.
•
The PWM generation will start right after the HSx is assigned to the PWM generator (HS_CTRL) .
Note:
The min. on-time during PWM is limited by the actual on- and off-time of the respective HS switch,
e.g. the PWM setting ‘00 0000 0001’ could not be realized.
SYNC configuration (using WK4)
Another possible configuration is to use the WK4 (set as SYNC pin) and mapped to one dedicated HSx output.
The configuration of the WK4/SYNC bit is done using the WK_EN bits. If the WK_EN=10B (SYNC selected), all
bits in WK4 bank are ignored and wake-up capability on WK4 is not available.
Only after the WK4/SYNC configuration, the HSx can be configured for SYNC usage (HSx = 1000B).
Datasheet
47
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
High-Side Switch
7.3
Table 13
Electrical Characteristics
Electrical Characteristics
VSINT = 5.5 V to 28 V; Tj = -40°C to +150°C; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note or
Test Condition
Number
Output HS1, HS2, HS3, HS4
Static Drain-Source ON
Resistance HSx
RON,HS25
–
7
–
Ω
Ids = 60 mA,
Tj < 25°C
P_7.3.1
Static Drain-Source ON
Resistance HSx
RON,HS150
–
11.5
16
Ω
Ids = 60 mA,
Tj < 150°C
P_7.3.2
Leakage Current HSx / per
channel
Ileak,HS
–
–
2
µA
1)
0 V < VHSx
< VS_HS;
Tj < 85°C
P_7.3.3
Output Slew Rate (rising)
SRraise,HS
0.8
–
2.5
V/µs
1)
20 to 80%
VS = 6 to 18 V
RL = 220 Ω
P_7.3.4
Output Slew Rate (falling)
SRfall,HS
-2.5
–
-0.8
V/µs
1)
80 to 20%
VS = 6 to 18 V
RL = 220 Ω
P_7.3.5
Switch-on time HSx
tON,HS
3
–
30
µs
CSN = HIGH to
0.8 × VS;
RL = 220 Ω;
VS = 6 to 18 V
P_7.3.6
Switch-off time HSx
tOFF,HS
3
–
30
µs
CSN = HIGH to
0.2 × VS;
RL = 220 Ω;
VS = 6 to 18 V
P_7.3.7
Short Circuit Shutdown
Current
ISD,HS
150
245
300
mA
VS = 6 to 20 V
P_7.3.8
Short Circuit Shutdown
Filter Time
tSD,HS
12
16
22
µs
2)
P_7.3.9
Open Load Detection
Current
IOL,HS
0.4
–
2
mA
hysteresis
included
P_7.3.10
Open Load Detection
hysteresis
IOL,HS,hys
–
0.45
–
mA
1)
P_7.3.11
Open Load Detection Filter
Time
tOL,HS
160
220
270
µs
2)
P_7.3.12
1) Not subject to production test, specified by design.
2) Not subject to production test, tolerance defined by internal oscillator tolerance.
Datasheet
48
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
LIN Transceiver
8
LIN Transceiver
8.1
Block Description
VS
SPI Mode Control
Driver
RBUS
Output
Stage
TxD Input
Temp.Protection
Current
Limit
VCC1
RTxD
TXDLIN
Timeout
LIN
To SPI Diagnostic
Receiver
VCC1
Filter
VSHS
RXDLIN
Wake
Receiver
Figure 24
8.1.1
Block Diagram
LIN Specifications
The LIN network is standardized by international regulations.
The device is compliant to:
•
ISO17987-4: rev. 2016
•
SAE-J2602-2
Datasheet
49
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
LIN Transceiver
8.2
Functional Description
The LIN Bus is a single wire, bi-directional bus, used for in-vehicle networks. The LIN transceivers implemented
inside the TLE9564QX are the interface between the microcontroller and the physical LIN Bus. The digital
output data from the microcontroller are driven to the LIN bus via the TXDLIN pin on the TLE9564QX. The
transmit data stream on the TXDLIN is converted to a LIN bus signal with optimized slew rate to minimize the
EME level of the LIN network. The RXDLIN sends back the information from the LIN bus to the microcontroller.
The receiver has an integrated filter network to suppress noise on the LIN Bus and to increase the EMI (Electro
Magnetic Immunity) level of the transceiver.
Two logical states are possible on the LIN Bus according to the LIN specification.
Every LIN network consists of a master node and one or more slave nodes. To configure the TLE9564QX for
master node applications, a resistor in the range of 1 kΩ and a reverse diode must be connected between the
LIN bus and the power supply VS.
The different transceiver modes can be controlled via the SPI LIN bits.
Figure 25 shows the possible transceiver mode transitions when changing the devicemode.
Device Mode
LIN Transceiver Mode
Stop Mode
Receive Only
Wake Capable
Normal Mode
OFF
Normal Mode
Receive Only
Wake Capable
Normal Mode
OFF
Sleep Mode
Restart Mode
Fail-Safe Mode
Wake Capable
OFF
Woken1
OFF
Wake Capable
1
after a wake event on LIN Bus
Behavior after Restart Mode - not coming from Sleep Mode due to a wake up of the respective transceiver:
If the transceivers had been configured to Normal Mode, or Receive Only Mode, then the mode will be changed to Wake
Capable. If it was Wake Capable, then it will remain Wake Capable. If it had been OFF before Restart Mode, then it will
remain OFF.
Behavior in Software Development Mode:
LIN default value in INIT MODE and entering Normal Mode from Init Mode is ON instead of OFF.
Figure 25
8.2.1
LIN Mode Control Diagram
LIN OFF Mode
The LIN OFF Mode is the default mode after power-up of the device. It is available in all device modes and is
intended to completely stop LIN activities or when LIN communication is not needed. In LIN OFF Mode, a
wake-up event on the bus will be ignored.
8.2.2
LIN Normal Mode
The LIN Transceiver is enabled via SPI in Normal Mode. LIN Normal Mode is designed for normal data
transmission/reception within the LIN network. The mode is available in Normal Mode and in Stop Mode.
Datasheet
50
Rev. 1.0
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TLE9564QX
BLDC Motor System IC
LIN Transceiver
Transmission
The signal from the microcontroller is applied to the TXDLIN input of the device. The bus driver switches the
LIN output stage to transfer this input signal to the LIN bus line.
Enabling Sequence
The LIN transceiver requires an enabling time tLIN,EN before a message can be sent on the bus. This means that
the TXDLIN signal can only be pulled LOW after the enabling time. If this is not ensured, then the TXDLIN needs
to be set back to high (=recessive) until the enabling time is completed.
Only the next dominant bit will be transmitted on the bus.
Figure 26 shows different scenarios and explanations for LIN enabling.
V TXDLIN
LIN
Mode
t LIN,EN
t LIN ,EN
t
t LIN,EN
LIN
NORMAL
LIN OFF
t
VLIN_ BUS
Recessive
Dominant
t
Correct sequence ,
Bus is enabled after t LIN, EN
Figure 26
tLIN, EN not ensured , no
transmission on bus
recessive TXD level
required before start of
transmission
tLIN, EN not ensured ,
no transmission on bus
recessive TXD
level required
LIN Transceiver Enabling Sequence
Reduced Electromagnetic Emission
To reduce electromagnetic emissions (EME), the bus driver controls LIN slopes symmetrically. The
configuration of the different slopes is described in Chapter 8.2.8.
Reception
Analog LIN bus signals are converted into digital signals at RXDLIN via the differential input receiver.
8.2.3
LIN Receive Only Mode
In LIN Receive Only Mode (RXD only), the driver stage is de-activated but reception is still possible. This mode
is accessible by an SPI command and is available in Normal Mode and Stop Mode.
8.2.4
LIN Wake Capable Mode
This mode can be used in Stop Mode, Sleep Mode, Restart Mode and Normal Mode by programming via SPI
and it is used to monitor bus activities. It is automatically accessed in Fail-Safe Mode. A wake up is detected,
if a recessive to dominant transition on the LIN bus is followed by a dominant level of longer than tWK,Bus
followed by a dominant to recessive transition. The dominant to recessive transition will cause a wake up of
the LIN transceiver.
Datasheet
51
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
LIN Transceiver
A wake-up results in different behavior of the device, as described in below Table 14. As a signalization to the
microcontroller, the RXDLIN pin is set LOW and will stay LOW until the LIN transceiver is changed to any other
mode. After a wake-up event the transceiver can be switched to LIN Normal Mode for communication.
Table 14
Action due to a LIN BUS Wake-up
Mode
Mode after Wake
VCC1
INTN
RXDLIN
Normal Mode
Normal Mode
ON
LOW
LOW
Stop Mode
Stop Mode
ON
LOW
LOW
Sleep Mode
Restart Mode
Ramping Up
HIGH
LOW
Restart Mode
Restart Mode
ON
HIGH
LOW
Fail-Safe Mode
Restart Mode
Ramping up
HIGH
LOW
Rearming the transceiver for wake capability
After a BUS wake-up event, the transceiver is woken. However, the LIN transceiver mode bits will still show
wake capable (=‘01’) so that the RXDLIN signal will be pulled low.
There are two possibilities how the LIN transceiver’s wake capable mode is enabled again after a wake event:
•
The LIN transceiver mode must be toggled, i.e. switched to LIN Normal Mode, LIN Receive Only Mode or LIN
OFF Mode, before switching to LIN Wake Capable Mode again.
•
Rearming is done automatically when the device is changed to Stop Mode, Sleep Mode or Fail-Safe Mode
to ensure wake-up capability.
Wake-Up in Stop Mode and Normal Mode
In Stop Mode, if a wake-up is detected, it is signaled by the INTN output and in the WK_STAT SPI register. It is
also signaled by RXDLIN put to LOW. The same applies for the Normal Mode. The microcontroller should set
the device to Normal Mode, there is no automatic transition to Normal Mode.
For functional safety reasons, the watchdog will be automatically enabled in Stop Mode after a Bus wake
event in case it was disabled before (if bit WD_EN_ WK_BUS was configured to HIGH before).
Wake-Up in Sleep Mode
One wake-up event on the LIN Bus from Sleep or Fail-Safe Mode automatically transfers the device into the
Restart Mode and from there to Normal Mode. The corresponding RXD pin in set to LOW. The microcontroller
is able to detect the low signal on RXD and to read the wake source out of the WK_STAT register via SPI. No
interrupt is generated when coming out of Sleep or Fail-Safe Mode. The microcontroller can now switch the
LIN transceiver into LIN Normal Mode via SPI to start communication.
8.2.5
TXD Time-out Feature
If the TXDLIN signal is dominant for the time t >tTxD_LIN _TO, the TXD time-out function deactivates the LIN
transmitter output stage temporarily. The transceiver remains in recessive state. The TXD time-out function
prevents the LIN bus from being blocked by a permanent LOW signal on the TXDLIN pin, caused by a failure.
The failure is stored in the SPI flag LIN_FAIL. The LIN transmitter stage is activated again after the dominant
time-out condition is removed. The transceiver configuration stays unchanged.
Datasheet
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TLE9564QX
BLDC Motor System IC
LIN Transceiver
Recovery of the
microcontroller error
TxD Time-Out due to
microcontroller error
Normal Communication
ttimeout
ttorec
Release after TxD
Time-out
Normal Communication
TXDLIN
t
LIN
t
Figure 27
8.2.6
TXD Time-Out Function
Bus Dominant Clamping
If the LIN bus signal is dominant for a time t > tBUS_LIN_TO in LIN Normal Mode and LIN Receive Only Mode, then
a bus dominant clamping is detected and the SPI bit LIN_FAIL is set. The transceiver configuration stays
unchanged.
8.2.7
Under-Voltage Detection
In case the supply voltage is dropping below the VS undervoltage detection threshold (VS < VS,UV), the
TLE9564QX disables the output and receiver stages. If the power supply reaches a higher level than the
undervoltage detection threshold (VS> VS,UV), the TLE9564QX continues with normal operation. The
transceiver configuration stays unchanged.
8.2.8
Slope Selection
The LIN transceiver offers a LIN Low-Slope Mode for 10.4 kBaud communication and a LIN Normal-Slope Mode
for 20 kBaud communication. The only difference is the behavior of the transmitter. In LIN Low-Slope Mode,
the transmitter uses a lower slew rate to further reduce the EME compared to Normal-Slope Mode. This
complies with SAE J2602 requirements.By default, the device works in LIN Normal-Slope Mode. The selection
of LIN Low-Slope Mode is done by an SPI bit LIN_LSM and will become effective as soon as CSN goes ‘HIGH’.
Only the LIN Slope is changed. The selection is accessible in Normal Mode only.
8.2.9
Flash Programming via LIN
The device allows LIN flash programming, e.g. of another LIN Slave with a communication of up to 115 kBaud.
This feature is enabled by de-activating the slope control mechanism via a SPI command (bit LIN_FLASH) and
will become effective as soon as CSN goes ‘HIGH’. The SPI bit can be set in Normal Mode.
Note:
Datasheet
It is recommended to perform flash programming only at nominal supply voltage VS = 13.5 V to
ensure stable data communication.
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BLDC Motor System IC
LIN Transceiver
8.3
Table 15
Electrical Characteristics
Electrical Characteristics
VSHS = 5.5 V to 18 V, Tj = -40°C to +150°C, RL = 500 Ω, all voltages with respect to ground, positive current flowing
into pin (unless otherwise specified)
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit Note or Test Condition
Number
Receiver Output (RXD pin)
HIGH Level Output Voltage
VRXD,H
0.8 ×
VCC1
–
–
V
IRXD = -2 mA;
VBus = VS
P_9.3.1
LOW Level Output Voltage
VRXD,L
–
–
0.2 ×
VCC1
V
IRXD = 2 mA;
VBus = 0 V
P_9.3.2
0.7 ×
VCC1
V
Recessive State
P_9.3.3
Transmission Input (TXD pin)
HIGH Level Input Voltage
VTXD,H
–
–
TXD Input Hysteresis
VTXD,hys
–
0.12 × –
VCC1
V
1)
P_9.3.4
LOW Level Input Voltage
VTXD,L
0.3 ×
VCC1
–
–
V
Dominant State
P_9.3.5
TXD Pull-up Resistance
RTXD
20
40
80
kΩ
VTXD = 0 V
P_9.3.6
Receiver Threshold Voltage, VBus,rd
Recessive to Dominant Edge
0.4 ×
VS
0.45 × –
VS
V
Receiver Dominant State
–
–
V
Receiver Threshold Voltage, VBus,dr
Dominant to Recessive Edge
–
0.55 × 0.60 × V
VS
VS
Receiver Recessive State
VBus,rec
0.6 ×
VS
–
Receiver Center Voltage
VBus,c
Receiver Hysteresis
LIN Bus Receiver (LIN Pin)
VBus,dom
0.4 ×
VS
LIN 2.2 Param. 17
P_9.3.8
P_9.3.9
V
LIN 2.2 Param 18
P_9.3.10
0.475 0.5 ×
× VS
VS
0.525 V
× VS
LIN 2.2 Param 19
6 V < VS < 18 V
P_9.3.11
VBus,hys
0.07 × 0.1 ×
VS
VS
0.175 V
× VS
Vbus,hys = Vbus,dr - Vbus,rd
LIN 2.2 Param 20
P_9.3.12
Wake-up Threshold Voltage
VBus,wk
0.40 × 0.5 ×
VS
VS
0.6 ×
VS
V
–
P_9.3.13
Dominant Time for Bus
Wake-up
tWK,Bus
30
150
µs
2)
P_9.3.14
Datasheet
–
P_9.3.7
–
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TLE9564QX
BLDC Motor System IC
LIN Transceiver
Table 15
Electrical Characteristics (cont’d)
VSHS = 5.5 V to 18 V, Tj = -40°C to +150°C, RL = 500 Ω, all voltages with respect to ground, positive current flowing
into pin (unless otherwise specified)
Parameter
Symbol
Values
Unit Note or Test Condition
Min.
Typ.
Max.
Number
LIN Bus Transmitter (LIN Pin)
Bus Serial Diode Voltage
Drop
Vserdiode
0.4
0.7
1.0
V
1)
VTXD = VCC1;
LIN 2.2 Param 21
P_9.3.15
Bus Recessive Output
Voltage
VBUS,ro
0.8 ×
VS
–
VS
V
VTXD = HIGH Level
P_9.3.16
Bus Short Circuit Current
IBUS,sc
40
100
150
mA
VBUS = 18 V;
LIN 2.2 Param 12
P_9.3.20
Leakage Current
Loss of Ground
IBUS,lk1
-1000 -450
20
µA
VS = 12 V = GND;
0 V < VBUS < 18 V;
LIN 2.2 Param 15
P_9.3.21
Leakage Current
Loss of Battery
IBUS,lk2
–
–
20
µA
VS = 0 V;
VBUS = 18 V;
LIN 2.2 Param 16
P_9.3.22
Leakage Current
Driver Off
IBUS,lk3
-1
–
–
mA
VS = 18 V;
VBUS = 0 V;
LIN 2.2 Param 13
P_9.3.23
Leakage Current
Driver Off
IBUS,lk4
–
–
20
µA
VS = 8 V;
VBUS = 18 V;
LIN 2.2 Param 14
P_9.3.24
Bus Pull-up Resistance
RBUS
20
30
47
kΩ
Normal Mode
LIN 2.2 Param 26
P_9.3.25
LIN Input Capacitance
CBUS
20
25
pF
1)
P_9.3.26
Receiver propagation delay
bus dominant to RXD LOW
td(L),R
–
1
6
µs
VCC = 5 V;
CRXD = 20 pF;
LIN 2.2 Param 31
P_9.3.27
Receiver propagation delay
bus recessive to RXD HIGH
td(H),R
–
1
6
µs
VCC = 5 V;
CRXD = 20 pF;
LIN 2.2 Param 31
P_9.3.28
Receiver delay symmetry
tsym,R
-2
–
2
µs
tsym,R = td(L),R - td(H),R;
LIN 2.2 Param 32
P_9.3.29
LIN Transceiver Enabling
Time
tLIN,EN
8
13
18
µs
2)
Bus Dominant Time Out
tBUS_LIN
–
20
–
ms
1)2)
P_9.3.31
–
20
–
ms
1)2)
P_9.3.32
–
10
–
µs
1)2)
P_9.3.33
CSN = HIGH to first valid P_9.3.30
transmitted TXD dominant
_TO
TXD Dominant Time Out
tTxD_LIN
VTXD = 0 V
_TO
TXD Dominant Time Out
Recovery Time
Datasheet
ttorec
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TLE9564QX
BLDC Motor System IC
LIN Transceiver
Table 15
Electrical Characteristics (cont’d)
VSHS = 5.5 V to 18 V, Tj = -40°C to +150°C, RL = 500 Ω, all voltages with respect to ground, positive current flowing
into pin (unless otherwise specified)
Parameter
Symbol
Values
Min.
Typ.
Unit Note or Test Condition
Number
Max.
Duty Cycle D1
(For worst case at 20 kbit/s)
LIN 2.2 Normal Slope
D1
0.396 –
–
3)
THRec(max) = 0.744 × VS;
THDom(max) = 0.581 × VS;
VS = 7.0 … 18 V;
tbit = 50 µs;
D1 = tbus_rec(min)/2 tbit;
LIN 2.2 Param 27
P_9.3.34
Duty Cycle D2
(for worst case at 20 kbit/s)
LIN 2.2 Normal Slope
D2
–
0.581
3)
THRec(min.) = 0.422 × VS;
THDom(min.) = 0.284 × VS;
VS = 7.6 … 18 V;
tbit = 50 µs;
D2 = tbus_rec(max)/2 tbit;
LIN 2.2 Param 28
P_9.3.35
–
Duty Cycle D3
D3
(for worst case at 10.4 kbit/s)
SAE J2602 Low Slope
0.417 –
–
3)
THRec(max) = 0.778 × VS
THDom(max) = 0.616 × VS;
VS = 7.0 … 18 V;
tbit = 96 µs;
D3 = tbus_rec(min)/2 tbit;
LIN 2.2 Param 29
P_9.3.36
Duty Cycle D4
D4
(for worst case at 10.4 kbit/s)
SAE J2602 Low Slope
–
0.590
3)
P_9.3.37
–
THRec(min.) = 0.389 × VS;
THDom(min.) = 0.251 × VS;
VS = 7.6 … 18 V;
tbit = 96 µs;
D4 = tbus_rec(max)/2 tbit;
LIN 2.2 Param 30
1) Not subject to production test, specified by design.
2) Not subject to production test, tolerance defined by internal oscillator tolerance.
3) Bus load conditions concerning LIN Specification 2.2 CLIN, RLIN = 1 nF, 1 kΩ / 6.8 nF, 660 Ω/ 10 nF, 500 Ω.
Datasheet
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TLE9564QX
BLDC Motor System IC
LIN Transceiver
VS
TxD
100 nF
RxD
RLIN
CRxD
LIN
CLIN
Figure 28
Datasheet
WK
GND
Simplified Test Circuit for Dynamic Characteristics
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TLE9564QX
BLDC Motor System IC
LIN Transceiver
tBit
TxD
t Bit
t Bit
(input to
transmitting node )
tBus _dom (max )
V SUP
(Transceiver supply
of transmitting
node )
t Bus_rec (min )
THRec (max)
THDom (max)
Thresholds of
receiving node 1
TH Rec(min )
TH Dom(min )
Thresholds of
receiving node 2
tBus _dom (min )
t Bus_ rec(max )
RxD
(output of receiving
node 1)
t d(L ),R (1)
td (H),R(1 )
RxD
(output of receiving
node 2)
t(L ),R (2)
td (H),r(2)
Duty Cycle1 = t BUS_ rec(min ) / (2 x tBIT )
Duty Cycle2 = t BUS_ rec(max ) / (2 x tBIT )
Figure 29
Datasheet
Timing Diagram for Dynamic Characteristics
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Rev. 1.0
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TLE9564QX
BLDC Motor System IC
High-Voltage Wake Input
9
High-Voltage Wake Input
9.1
Block Description
Internal Supply
IPU_WK
+
WKx
IPD_WK
t WK
VRef
Logic
Figure 30
Wake Input Block Diagram
Features
•
High-Voltage inputs with a 3 V (typ.) threshold voltage.
•
Wake-up capability for power saving modes.
•
Edge sensitive wake feature low to high and high to low.
•
Pull-up and Pull-down current sources, configurable via SPI.
•
Selectable configuration for static sense or cyclic sense.
•
In Normal Mode and Stop Mode the level of the WKx pin can be read via SPI unless WK4 is configured as
SYNC.
•
Synchronization with HSx via WK4 (for cyclic sense).
Datasheet
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Rev. 1.0
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TLE9564QX
BLDC Motor System IC
High-Voltage Wake Input
9.2
High-Voltage Wake Function
9.2.1
Functional Description
The wake inputs pin are edge-sensitive inputs with a switching threshold of typically 3 V. Both transitions, high
to low and low to high, result in a signalization by the device. The signalization occurs either in triggering the
interrupt in Normal Mode and Stop Mode or by a wake up of the device in Sleep Mode and Fail-Safe Mode.
Two different wake detection modes can be selected via SPI:
•
Static sense: WK inputs are always active.
•
Cyclic sense: WK inputs are only active for a certain time period (see Chapter 5.7.1).
A filter time tFWKx is implemented to avoid an unintentional wake-up due to transients or EMC disturbances
in static sense configuration.
The filter time (tFWKx) is triggered by a level change crossing the switching threshold and a wake signal is
recognized if the input level will not cross again the threshold during the selected filter time.
Figure 31 shows a typical wake-up timing and filtering of transient pulses.
VWKx
VWKTh,f
VWKth,f
t
VINTN
tFWK
tFWK
tINTN
t
No Wake Event
Figure 31
Wake Event
Wake-up Filter Timing for Static Sense
The wake-up capability for the WKx pin can be enabled or disabled via SPI command.
A wake event via the WKx pin can always be read in the register WK_STAT.
The actual voltage level of the WKx pin (low or high) can always be read in Normal Mode, Stop Mode and Init
Mode in the register WK_LVL_STAT. During Cyclic Sense, the register shows the sampled levels of the
respective WKx pin.
9.2.2
Wake Input Configuration
To ensure a defined and stable voltage levels at the internal comparator input it is possible to configure
integrated current sources via the SPI register WK_CTRL.
Datasheet
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BLDC Motor System IC
High-Voltage Wake Input
Table 16
Pull-Up / Pull-Down Resistor
WKx_PUPD_ WKx_PUPD_ Current Sources Note
1
0
0
0
no current
source
WK input is floating if left open (default setting)
0
1
pull-down
WK input internally pulled to GND
1
0
pull-up
WK input internally pulled to internal 5V supply
1
1
Automatic
switching
If a high level is detected at the WK input the pull-up source is
activated, if low level is detected the pull down is activated.
Note:
If a WK input is not used, the respective WK input must be tied to GND on board to avoid unintended
floating state of the pin.
One additional configuration is related the filter time of each Wake-up module. The bits WK_FILT permit to set
the filter time in static sensing or in cyclic sensing.
Note:
When the device mode is changed to normal (from INIT), in case of static sense, if the WK pin is set,
the WK_STAT register is set in this time (also the interrupt pin).
9.2.3
Wake configuration for Cyclic Sense
The wake-up inputs can also be used for cyclical sensing signals during low-power modes. For this function
the WKx input performs a cyclic sensing of the voltage level during the on-time of specific HSx.
A transition of the voltage level will trigger a wake-up event.
See also Chapter 5.7.1 for more details.
9.2.4
Wake configuration for Synchronization
The WK4 pin can be configured as SYNC input for driving the HSx.
Prerequisite to configure the WK4 as SYNC input is that the WK4 has to be OFF.
The configuration of the WK4/SYNC bit is done using the WK_EN bits. if the WK_EN=10B (SYNC selected), all
bits in WK4 bank are ignored and wake-up capability on WK4 is not available.
Note:
Datasheet
If WKx is the only wake source available and is configured with cyclic sense with
SYNC (WKx_FILT = 100), trying to go to Sleep Mode is not possible (restart mode is entered) because SYNC is driven by the microcontroller which is not supplied in Sleep Mode.
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BLDC Motor System IC
High-Voltage Wake Input
9.3
Electrical Characteristics
Table 17
Electrical Characteristics
VSINT = 5.5 V to 28 V; Tj = -40°C to +150°C; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit Note or
Test Condition
Number
WK4 Input Pin Characteristics
Wake-up/monitoring
threshold voltage
falling
VWKx_th,f
2.5
3
3.5
V
without external
serial resistor RS
P_10.3.1
Wake-up/monitoring
threshold voltage
rising
VWKx_th,r
3
3.5
4
V
without external
serial resistor RS
P_10.3.2
Threshold hysteresis
VWKx_th,hys 0.4
0.6
0.85
V
without external
serial resistor RS
P_10.3.3
WK pin Pull-up Current IPU_WKx
-20
-10
-3
µA
VWKx = 4 V
P_10.3.4
WK pin Pull-down
Current
IPD_WKx
3
10
20
µA
VWKx = 2.5 V
P_10.3.5
Input leakage current
ILK,lx
-2
2
µA
0 V < VWKx < 40 V;
Pull-up / Pull-down
disabled
P_10.3.6
WK4 as SYNC input pin
LOW input voltage
threshold
WK4SYNC_ 0.3 ×
VCC1
th,L
-
-
V
P_10.3.11
HIGH input voltage
threshold
WK4SYNC_ -
-
0.7 ×
VCC1
V
P_10.3.12
Pull-down resistance
on WK/SYNC
th,H
RSYNC
20
40
80
kΩ
VSYNC = 1 V
P_10.3.13
tFWK1
12
16
22
µs
1)
P_10.3.16
µs
1)
P_10.3.17
Timing
Wake-up filter time 1
Wake-up filter time 2
tFWK2
50
64
80
1) Not subject to production test, tolerance defined by internal oscillator tolerance.
Datasheet
62
Rev. 1.0
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TLE9564QX
BLDC Motor System IC
Interrupt Function
10
Interrupt Function
10.1
Block and Functional Description
Vcc1
Interrupt logic
Time
out
INTN
INTERRUPT BLOCK.VSD
Figure 32
Interrupt Block Diagram
The interrupt is used to signalize special events in real time to the microcontroller. The interrupt block is
designed as a push/pull output stage as shown in Figure 32. An interrupt is triggered and the INTN pin is pulled
low (active low) for tINTN in Normal Mode and Stop Mode and it is released again once tINTN is expired. The
minimum high-time of INTN between two consecutive interrupts is tINTND. An interrupt does not cause a device
mode change.
Two different interrupt generation methods are implemented:
•
Interrupt Mask: One dedicated register (INT_MASK) is intended to enable or disable set of interrupt
sources. The interrupt sources follow the SPI Status Information Field.
In details:
– SUPPLY_STAT: “OR” of all bits on SUP_STAT register except POR, VCC1_UV, VCC1_SC, VCC1_OV
– TEMP_STAT: “OR” of all bits on THERM_STAT register except TSD2
– BUS_STAT: “OR” of all bits on BUS_STAT register
– HS_STAT: “OR” of all bits on HS_OL_OC_OT_STAT register
– BD_STAT: “OR” of all bits on DSOV register
– SPI_CRC_FAIL: or between SPI_FAIL and CRC_FAIL bits on DEV_STAT register.
•
Wake-up events: all wake-up events stored in the wake status SPI register WK_STAT only in case the
corresponding input was configured as wake-up source.
The wake-up sources are:
– via LIN
– via WK pin
– via TIMERx (cyclic wake)
– via LSx_DSOV_BRK if any of the brake-feature is enabled
The methods are both available at the same time.
Note:
Datasheet
The errors which will cause Restart or Fail-Safe Mode (VCC1_UV, VCC1_SC, VCC1_OV, TSD2) are the
exceptions of an INTN generation. Also the bit POR will not generate interrupts. If the above
mentioned bits are not cleared after the device is back in Normal Mode or Stop Mode, the INTN is
periodically generated (Register based cyclic interrupt generation).
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BLDC Motor System IC
Interrupt Function
Note:
Periodical interrupts are only generated by CRC fail and SPI fail from DEV_STAT register.
Note:
During Restart Mode the SPI is blocked and the microcontroller is in reset. Therefore the INTN will not
be in Restart Mode, which is the same behavior in Fail-Safe Mode or Sleep Mode.
In addition to this behavior, INTN will be triggered when Stop Mode is entered and not all wake source bits
were cleared in the WK_STAT register and also the LSx_DSOV_BRK bits in the DSOV register..
The SPI status registers are updated at every falling edge of the INTN pulse. All interrupt events are stored in
the respective register until the register is cleared via SPI command. A second SPI read after reading out the
respective status register is optional but recommended to verify that the interrupt event is not present
anymore. The interrupt behavior is shown in Figure 33.
The INTN pin is also used during Init Mode to select the Software Development Mode entry. See Chapter 5.2
for further information.
In case of pending INTN event (SPI Status registers are not cleared after INTN event), additional periodical
INTN events are generated as shown in Figure 34.
The periodical INTN events generation can be disabled via SPI command using INTN_CYC_EN bit.
WKx
INTN
tINTD
tINTN
Scenario 1
SPI
Read & Clear
Scenario 2
Update of
WK_STAT register
SPI
Read & Clear
WK_STAT
contents
Update of
WK_STAT register
optional
WKx
no WK
no WK
No SPI Read & Clear
Command sent
WK_STAT
contents
WKx
no WK
Figure 33
Interrupt Signalization Behavior
Note:
For two or more interrupt events at the same time, when INTN pin is low the same time, it will not
start multiple toggling.
Datasheet
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TLE9564QX
BLDC Motor System IC
Interrupt Function
WKx
INTN
tINTN
tINTN_PULSE
tINTN
tINTN_PULSE
Update of
WK_STAT register
SPI
Read & Clear
No SPI Read & Clear
Command sent
No SPI Read & Clear
Command sent
WK_STAT
contents
WKx
WKx
Figure 34
Datasheet
Interrupt Signalization Behavior in case of pending INTN events
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BLDC Motor System IC
Interrupt Function
10.2
Electrical Characteristics
Table 18
Electrical Characteristics
VSINT = 5.5 V to 28 V; Tj = -40°C to +150°C; Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin; unless otherwise specified.
Parameter
Symbol
Values
Unit
Note or
Test Condition
Number
Min.
Typ.
Max.
INTN High Output Voltage VINTN,H
0.8 ×
VCC1
–
–
V
1)
IINTN = -2 mA;
INTN = off
P_11.2.1
INTN Low Output Voltage VINTN,L
–
–
0.2 ×
VCC1
V
1)
IINTN = 2mA;
INTN = on
P_11.2.2
INTN Pulse Width
80
100
120
µs
2)
P_11.2.3
Interrupt Output; Pin INTN
tINTN
INTN Pulse Minimum
Delay Time
tINTND
Pulse in case of pending
INTN
tINTN_PUL 4
80
100
120
µs
2)
between
consecutive pulses
P_11.2.4
5
6
ms
2)
between
consecutive pulses
P_11.2.5
60
100
kΩ
VINTN = 5 V
P_11.2.6
µs
2)
P_11.2.7
SE
SDM Select; Pin INTN
Config Pull-up Resistance RSDM
Config Select Filter Time
tSDM_F
30
50
64
80
1) Output Voltage Value also determines device configuration during Init Mode.
2) Not subject to production test, tolerance defined by internal oscillator tolerance.
Datasheet
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BLDC Motor System IC
Gate Drivers
11
Gate Drivers
The TLE9564QX integrates six floating gate drivers capable of controlling a wide range of N-channel MOSFETs.
They are configured as three high-sides and three low-sides, building three half-bridges.
VCP
VS
GHx
VDSMONTH
IPDDIAG
Current-Steering
DACs
ISINK_BRAKE
IPUDIAG
Highside
Gate-Driver
SHx
Logic
High-Speed
Comparators
VCP
GLx
Lowside
Gate-Driver
VDSMONTH
Current-Steering
DACs
Figure 35
SL
Half-bridge gate driver - Block diagram
This section describes the MOSFET control in static activation and during PWM operation.
Note:
PWMx mentioned in this chapter refer to the PWMx pins and signal used by the bridge driver to
control the external MOSFETs.
Note:
In this chapter PWMx do not refer to the internal PWM generators used to control the internal highside switches HSx.
11.1
MOSFET control
Depending on the configuration bits HBxMODE[1:0] (refer to HBMODE), CPEN, each high-side and low-side
MOSFETs can be:
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BLDC Motor System IC
Gate Drivers
•
Kept off with the passive discharge.
•
Kept off actively.
•
Activated (statically, no PWM, HBx_PWM_EN = 0).
•
Activated in PWM mode (HBx_PWM_EN = 1).
Refer to Table 19 for details.
Table 19
Half-bridge mode selection
CPEN
HBxMODE[1:0]1)
Configuration of HSx/LSx1)
CPEN = 0
Don’t care
All MOSFETs are kept off by the passive discharge
CPEN = 1
00B
HBx MOSFETs are kept off by the passive discharge
CPEN = 1
01B
LSx MOSFET is ON, HSx MOSFET is actively kept OFF
CPEN = 1
10B
HSx MOSFET is ON, LSx MOSFET is actively kept OFF
CPEN = 1
11B
LSx and HSx MOSFETs are actively kept OFF with IHOLD
1) x = 1 … 3
11.2
Static activation
In this section, we consider the static activation of the high-side and low-side MOSFET of the half-bridge x:
HBx_PWM_EN= 0 (in ST_ICHG) and CPEN = 1.
The low-side or high-side MOSFET of HBx is statically activated (no PWM) by setting HBxMODE[1:0] to
respectively (0,1) or (1,0).
The configured active cross-current protection and the Drain-Source overvoltage blank times for the HalfBridge x are noted tHBxCCP ACTIVE and tHBxBLANK ACTIVE.
The charge and discharge currents applied to the static controlled Half-Bridge x are noted ICHGSTx
(ST_ICHG).
IHARDOFF is the maximum current that the gate drivers can sink (150 mA typ.). This current is used to keep a
MOSFET off, when the opposite MOSFET of the same half-bridge is being turned on. This feature reduces the
risk of parasitic cross-current conduction.
ICHGSTx is the current sourced, respectively sunk, by the gate driver to turn-on the high-side x or low-side x.
ICHGSTx is configured in the control register ST_ICHG.
Table 20
Static charge currents
ICHGSTx[3:0]
Nom. charge current
[mA]
Nom. discharge current
[mA]
Max. deviation to typ. values
0000B
0.5 (ICHG0)
0.5 (IDCHG0)
+/- 60%
0001B
1.8 (ICHG4)
1.8 (IDCHG4)
+/- 60 %
0010B
4.7 (ICHG8)
4.7 (IDCHG8)
+/- 60 %
0011B
9.4 (ICHG12)
9.4 (IDCHG12)
+/- 60 %
0100B
15.3 (ICHG16)
15.1 (IDCHG16)
+/- 40 %
0101B
23 (ICHG20)
22.5 (IDCHG20)
+/- 40 %
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BLDC Motor System IC
Gate Drivers
Table 20
Static charge currents (cont’d)
ICHGSTx[3:0]
Nom. charge current
[mA]
Nom. discharge current
[mA]
Max. deviation to typ. values
0110B
31.6 (ICHG24)
30.9 (IDCHG24)
+/- 40 %
0111B
41.6 (ICHG28)
40.8 (IDCHG28)
+/- 40%
1000B
52.5 (ICHG32)
51.5 (IDCHG32)
+/- 30 %
1001B
63.6 (ICHG36)
62.4 (IDCHG36)
+/- 30 %
1010B
75.2 (ICHG40)
73.7 (IDCHG40)
+/- 30 %
1011B
87.1 (ICHG44)
85.5 (IDCHG44)
+/- 30 %
1100B
99.5 (ICHG48)
97.7 (IDCHG48)
+/- 30 %
1101B
112.2 (ICHG52)
110.8 (IDCHG52)
+/- 30 %
1110B
125.3 (ICHG56)
124.5 (IDCHG56)
+/- 30 %
1111B
139 (ICHG60)
138.7 (IDCHG60)
+/- 30 %
IHOLD is the hold current used to keep the gate of the external MOSFETs in the desired state. This parameter
is configurable with the IHOLD control bit in GENCTRL.
If the control bit IHOLD = 0:
•
A MOSFET is kept ON with the current ICHG15.
•
A MOSFET is kept OFF with the current IDCHG15.
If the control bit IHOLD = 1:
•
A MOSFET is kept ON with the current ICHG20.
•
A MOSFET is kept OFF with the current IDCHG20.
11.2.1
Static activation of a high-side MOSFET
Turn-on with cross-current protection
If LSx is ON (HBxMODE[1:0] = 01B), before the activation of HSx (HBxMODE[1:0] = 10B) then the high-side
MOSFET is turned on after a cross-current protection time (refer to Figure 36):
•
After the CSN rising edge and for the duration tHBxCCP ACTIVE :
– The high-side MOSFET is kept OFF with the current -ICHGSTx.
– The gate of the low-side MOSFET is discharged with the current -ICHGSTx.
•
At the end of tHBxCCP ACTIVE and for the duration tHBxBLANK ACTIVE + tFVDS:
– The gate of the high-side MOSFET is charged with the current ICHGSTx.
– Low-side MOSFET is kept OFF with the current -IHARDOFF (hard off phase).
•
At the end of tFVDS:
– The drive current of the high-side MOSFET is reduced to IHOLD.
– The drive current of the low-side MOSFET is set to -IHOLD.
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BLDC Motor System IC
Gate Drivers
CSN
Previous State
HSx OFF
LSx ON
SPI Frame accepted
Turn on HSx
New State
HSx ON
LSx OFF
t
VS
tHBxCCP
Active
IGHx
HSx
GHx
ICHGSTx
tHBxBLANK
Active
0
t
IGHx
HSx internal
drive signal
SHx
LSx
GLx
SL
tFVDS
IGLx
ICHGSTx
IHOLD
-IHOLD
t
-ICHGSTx
IGLx
t
-ICHGSTx
LSx internal
drive signal
IHOLD
-IHOLD
t
-ICHGSTx
Hard off
-IHARDOFF
Figure 36
Note:
Datasheet
Turn-on of a high-side MOSFET with cross-current protection
The CSN rising edge must be synchronized with the device logic. Therefore SPI commands are
executed with a delay of up to 3 µs after the CSN rising edge.
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BLDC Motor System IC
Gate Drivers
Turn-on without cross-current protection
If LSx is OFF (HBxMODE[1:0] = 11B), before the activation of HSx (HBxMODE[1:0] = 10B), then the high-side
MOSFET is turned on without cross-current protection (refer to Figure 37):
•
right after the CSN rising edge and for a duration tHBxBLANK ACTIVE + tFVDS:
– The gate of the high-side MOSFET is charged with the current ICHGSTx.
– The low-side MOSFET is kept OFF with the current -IHARDOFF.
•
At the end of tFVDS:
– The drive current of the high-side MOSFET is reduced to IHOLD.
– The drive current of the low-side MOSFET is set to -IHOLD.
SPI Frame accepted
Turn on HSx
Previous State
HSx OFF
LSx OFF
CSN
New State
HSx ON
LSx OFF
t
tHBxBLANK
Active
IGHx
tFVDS
ICHGSTx
0
t
HSx internal
drive signal
VS
HSx
ICHGSTx
IHOLD
-IHOLD
t
GHx
IGHx
IGLx
SHx
0
t
LSx
GLx
SL
IGLx
LSx internal
drive signal
IHOLD
-IHOLD
t
Hard off
-IHARDOFF
Figure 37
Note:
Datasheet
Turn-on of a high-side MOSFET without cross-current protection
The CSN rising edge must be synchronized with the device logic. Therefore SPI commands are
executed with a delay of up to 3 µs after the CSN rising edge.
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BLDC Motor System IC
Gate Drivers
11.2.2
Static activation of a low-side MOSFET
The description of the static activation of a low-side x differs from the description of Chapter 11.2.1 only by
exchanging high-side x and low-side x.
11.2.3
Turn-off of the high-side and low-side MOSFETs of a half-bridge
When the TLE9564QX receives a SPI command to turn-off both the high-side and low-side MOSFETs of the halfbridge x (HBxMODE[1:0] = (0,0) or (1,1)):
•
The gate of HSx and LSx are discharged with the current -ICHGSTx for the duration tHBxCCP ACTIVE (Figure 38).
•
At the end of tHBxCCP ACTIVE, the drive current of HSx and LSx are reduced to -IHOLD.
SPI Frame accepted
Turn off HSx and LSx
VS
CSN
HSx
t
GHx
IGHx
IGHx
SHx
LSx
GLx
SL
0
t
-ICHGSTx
IGLx
HSx internal
drive signal
IHOLD
-IHOLD
tHBxCCP
Active
t
-ICHGSTx
IGLx
t
LSx internal
drive signal
-IHOLD
t
-ICHGSTx
Figure 38
Note:
Datasheet
Turn-off of the high-side and low-side MOSFETs of a half-bridge
The CSN rising edge must be synchronized with the device logic. Therefore SPI commands are
executed with a delay of up to 3 µs after the CSN rising edge.
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BLDC Motor System IC
Gate Drivers
11.3
PWM operation
The half-bridge can be controlled in PWM using either three or six PWM inputs.
The TLE9564QX offers the possibility to detect the active and the freewheeling (FW) MOSFET in each halfbridge.
11.3.1
Determination of the active and freewheeling MOSFET
If EN_GEN_CHECK = 1, right before each MOSFET activation, the device detects which MOSFET of the halfbridge is the active MOSFET and which MOSFET is the free-wheeling (FW) MOSFET:
•
If VSHx > VS - VSHH: The high-side MOSFET is the FW MOSFET and the low-side MOSFET is the active
MOSFET.
•
If VSHx < VSHL: Then the low-side MOSFET is the FW MOSFET and the high-side MOSFET is the active
MOSFET.
•
If VSHL < VSHx < VSHH: No clear distinction between the active FW MOSFET and the active MOSFET. The
next MOSFET to be turned on is turned on as if it was the active MOSFET.
If EN_GEN_CHECK = 0, the detection of the active and FW MOSFET is disabled. The PWM MOSFET is considered
as the active MOSFET.
Figure 39 shows the detection of the active and of the FW MOSFET.
HS and LS off
Freewheeling through
high-side MOSFET body diode
VSHx > VSHH
HS = FW MOSFET
LS = Active MOSFET
HS and LS are off
Freewheeling through
low-side MOSFET body diode
VSHx < VSHL
LS = FW MOSFET
HS = Active MOSFET
VCP
VCP
VS
VS
GHx
Highside
Gate-Driver
GHx
Highside
Gate-Driver
SHx
SHx
VSHH
VSHH
High-Speed
Comparators
High-Speed
Comparators
VSHL
VSHL
VCP
VCP
Lowside
Gate-Driver
GLx
Lowside
Gate-Driver
SL
SL
Figure 39
11.3.2
GLx
Detection of the active and FW MOSFET - Principle
Configurations in PWM mode
The following sections describe the different control schemes in PWM mode.
Datasheet
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BLDC Motor System IC
Gate Drivers
Active gate control (AGC)
The active gate control is configured by the control bits AGC[1:0]. The control scheme during the pre-charge
and pre-discharge phases of:
•
The active MOSFET (EN_GEN_CHECK=1).
•
The PWM MOSFET (EN_GEN_CHECK=0).
can be selected.
The following settings are possible:
•
Adaptive gate control (AGC[1:0] = (1,0) or (1,1), see GENCTRL): In this mode a pre-charge current and a predischarge current are applied to the gate of the controlled MOSFET. These currents are used to regulate
effective the turn-on and turn-off delays to the respective target values.
•
No adaptive gate control (AGC[1;0] = (0,0)): in this mode, the pre-charge and pre-discharge phases are
deactivated.
•
No adaptive gate control (AGC[1;0] = (0,1)). In this mode:
– During the pre-charge phase, the MOSFET is discharged with the configured current IPCHGINIT
(HB_PCHG_INIT).
– During the pre-discharge phase, the MOSFET is discharged with the configured current IPDCHGINIT
(HB_PCHG_INIT).
Note:
It is recommended to configure tPCHGx < tHBxBLANK Active and tPDCHGx < tHBxCCP Active (Refer to
TPRECHG and CCP_BLK) independently from the AGC settings.
Active free-wheeling (AFW)
The active free-wheeling is activated for HBx if these conditions are fulfilled:
•
AFWx = 1 (HBMODE)
•
HBx_PWM_EN = 1 (HBMODE)
•
PWM_NB = 0
If AFWx = 1, a cross-current protection time is applied to HBx (set by CCP_BLK) during the PWM operation.
If AFWx = 0, no cross current protection is applied to HBx during the PWM operation.
The active free-wheeling reduces the power dissipation of the free-wheeling MOSFET. If an active MOSFET is
OFF, the opposite MOSFET of the same half-bridge is actively turned on. Refer to Figure 43 and Figure 44.
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BLDC Motor System IC
Gate Drivers
Post-charge
A post-charge is initiated if POCHGDIS is set to 0 (GENCTRL) to reach the minimum MOSFET Rdson:
•
POCHGDIS = 0: After the charge phase, the control signal for the charge current of LSx is increased by one
current step at every bridge driver clock cycle (BDFREQ) to ICHGMAXx. Refer to Figure 40
•
POCHGDIS = 1: The post-charge phase is disabled. The charge current is kept to the ICHGx
Turn-on of:
PWM MOSFET if EN_GEN_CHECK = 0
Active MOSFET if EN_GEN_CHECK =1
Precharge
IGS
Turn-off of:
PWM MOSFET if EN_GEN_CHECK = 0
Active MOSFET if EN_GEN_CHECK =1
Post-charge
tPCHGx
Predischarge
ICHGMAXx
IPRECHGx
tPDCHGx
ICHGx
t
0
- IDCHGx
tBLANK active
- IPREDCHGx
tHBxCPP active
PWM overview - AGC = 10B or 11B, POCHGDIS=0 (post-charge enabled)
Figure 40
Turn-on of:
PWM MOSFET if EN_GEN_CHECK = 0
Active MOSFET if EN_GEN_CHECK =1
IGS
Turn-off of:
PWM MOSFET if EN_GEN_CHECK = 0
Active MOSFET if EN_GEN_CHECK =1
Precharge
tPCHGx
Predischarge
tPDCHGx
IPRECHGx
ICHGx
t
0
- IDCHGx
tBLANK Active
- IPREDCHGx
tHBxCPP Active
Figure 41
PWM overview - AGC = 10B or 11B, POCHGDIS=1 (post-charge disabled)
Table 21
Abbreviations for adaptive turn-on and turn-off phases in PWM configuration
Abbreviation
Definition
Suffix x
Related to the half-bridge x.
VGS_HSx
Gate-Source voltage of high-side MOSFET x.
IGS_HSx
Gate current of high-side MOSFET x.
IGS_HSx is positive when the current flows out of GHx.
VGS_LSx
Gate-Source voltage of low-side MOSFET x.
IGS_LSx
Gate current of low-side MOSFET x.
IGS_LSx is positive when the current flows out of GLx.
tPWM_SYNCH
Synchronization delay between external and internal PWM signal.
tHBxCCP ACTIVE
Active cross-current protection time of HBx. See control register CCP_BLK.
tHBxBLANK ACTIVE
Active Drain-source overvoltage blank time of HBx. See control register and CCP_BLK.
tHBxCCP FW
Freewheeling cross-current protection time of HBx. See control register CCP_BLK.
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BLDC Motor System IC
Gate Drivers
Table 21
Abbreviations for adaptive turn-on and turn-off phases in PWM configuration (cont’d)
Abbreviation
Definition
tHBxBLANK FW
Freewheeling drain-source overvoltage blank time of HBx. See control register and
CCP_BLK.
PWMz
External PWM signal applied to the input pin PWMz.
ICHGMAXx
Maximum drive current of the half-bridge x during the pre-charge and pre-discharge
phases. See control register HB_ICHG_MAX.
IPRECHGx and IPREDCHGx are limited to ICHGMAXx.
IPRECHGx
Pre-charge current sourced by the gate driver to the active MOSFET of the half-bridge
x during tPCHGx (TPRECHG).
Internal and self-adaptive parameter (if AGC[1:0] = (1,0) or (1,1), GENCTRL).
IPRECHGx is clamped between ICHG0 (0.5 mA typ.) and ICHGMAXx.
IPCHGINITx
Initial value of IPRECHGx. Refer to HB_PCHG_INIT.
IPREDCHGx
Pre-discharge-current sunk by the gate driver mapped to the half-bridge x during
tPDCHGx.
Internal and self-adaptive parameter (if AGC[1:0] = (1,0) or (1,1), GENCTRL).
IPREDCHGx is clamped between IDCHG0 (0.5 mA typ.) and ICHGMAXx.
IPDCHGINITx
Initial value of IPREDCHGx. Refer to HB_PCHG_INIT.
ICHGx
Current sourced by the gate driver to the active MOSFET of the half-bridge x during the
charge phase. See control register HB_ICHG.
IDCHGx
Current sunk by the gate driver to turn-off the active MOSFET of the half-bridge x
during the discharge phase. See control register HB_ICHG.
ICHGFWx
Current sourced or sunk by the gate driver to turn on / turn off the freewheeling
MOSFET of the half-bridge x . See control register HB_ICHG.
tPCHGx
Duration of the pre-charge phase of half-bridge x.
tPCHGx is configurable by SPI. See control register TPRECHG.
tPDCHGx
Duration of the pre-discharge phase of half-bridge x.
tPDCHGx is configurable by SPI. See control register TPRECHG.
tDONx
Turn-on delay of the active MOSFET of HBx.
tDOFFx
Turn-off delay of the active MOSFET of HBx.
IHOLD
Hold current sourced or sunk by the gate driver to keep the MOSFET in the desired
state. See IHOLD control bit in GENCTRL.
IHARDOFF
IHARDOFF is the maximum current that the gate drivers can sink. It corresponds to the
discharge current when IDCHGx[5:0] = 63D (150 mA typ.).
TFVDS
Drain-Source overvoltage filter time. See LS_VDS.
11.3.3
PWM operation with 3 PWM inputs
Each half bridge are controlled by one input if PWM_NB = 0 (see CSA) and HBx_PWM_EN (see HBMODE):
•
PWM1/CRC controls HB1
•
PWM3 controls HB2
•
PWM5 controls HB3
Datasheet
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BLDC Motor System IC
Gate Drivers
CP
µC_PWM1
VS
PWM1
HS1
CP
PWM2
Control
LS1
µC_PWM3
SL
CP
VS
PWM3
HS2
CP
PWM4
LS2
SL
CP
VS
µC_PWM5 PWM5
HS3
CP
PWM6
LS3
SL
Figure 42
Half-bridge PWM control with three PWM inputs, PWM_NB = 0
Table 22
Half-bridge PWM settings with 3 PWM inputs
PWM_NB
HBxPWM_
EN1)
HBxMODE1)
AFW
Half-bridge x settings1)
0
Don’t care
00B
Don’t care
LSx and HSx MOSFETs are kept OFF by the passive
discharge
0
1
01B
0
PWM signal applied to LSx
PWM signal = 1: LSx, ON, HSx OFF
PWM signal = 0: LSx OFF, HS x OFF
0
1
10B
1
PWM signal applied to HSx
PWM signal= 1: HSx, ON, LSx OFF
PWM signal = 0: HSx OFF, LS x ON
0
Don’t care
11B
Don’t care
LSx and HSx MOSFETs are actively kept OFF
1) x = 1 to 3
11.3.3.1 Control signals with active free-wheeling (AFWx = 1)
This section describes the MOSFET control signals with active freewheeling and HS PWM:
•
The HS PWM MOSFET is the active MOSFET (Chapter 11.3.3.1.1).
•
The HS PWM MOSFET is the free-wheeling MOSFET (Chapter 11.3.3.1.2).
11.3.3.1.1
The PWM MOSFET is the active MOSFET
This section shows the control signals of the MOSFET when the PWM is the active MOSFET.
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BLDC Motor System IC
Gate Drivers
External
PWM signal
tPWM_SYNCH
t
Synchronized intern.
PWM signal
VSHx < VSHL right before activation of HSx
HSx detected as active MOSFET
tHBxCCP
FW
IGS_HSx
Charge
phase
t
Postcharge Phase
tPCHGx
ICHGMAXx
IPRECHGx
HS MOSFET
(Active MOSFET)
ICHGx
0
t
HSx internal
drive signal
tHBxBLANK Active
tFVDS
ICHGMAXx
IPRECHGx
IHOLD
ICHGx
IHOLD
ICHGx
t
0
- IHOLD
VGS_HSx
t
VSHx
tRISEx
VS
VSHH
tDONx
VSHL
VSHH
VSHL
t
IDS_HSDx
IPHASE
t
LS MOSFET
(FW MOSFET)
LSx internal
drive signal
tHBxCCP
FW
IHOLD
t
- IHOLD
- IHOLD
Hard off
- ICHGFWx
- IHARDOFF
Figure 43
Datasheet
Turn-on of an active MOSFET in PWM mode with active gate control, HS PWM, HS as active
MOSFET, LS as FW MOSFET. PWM_NB =0 (one PWM input per HB), HBxMODE = 10B (HS PWM),
AGC = 01B or 10B (Active Gate Control), EN_GEN_CHECK=1 (detection of active / FW MOSFET),
AFWx = 1 (active freewheeling for HBx is activated)
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External
PWM signal
t
Synchronized intern.
PWM signal
tPWM_SYNCH
t
tPDCHGx
VSHx < VSHL right before activation of LSx
LSx detected as FW MOSFET
HSx internal
drive signal
Discharge phase
HS MOSFET
(Active)
IHOLD
t
0
- IHOLD
- IDCHGx
- IHOLD
- IDCHGx
- IPREDCHGx
Hard off
tHBxCCP Active
- IHARDOFF
VGS_HSx
t
VSHx
VS
VSHH
VSHL
tFALLx
tDOFFx
VSHH
VSHL
t
IDS_HSDx
IPHASE
LS MOSFET
(FW)
t
tHBx_BLANK FW
LSx internal
drive signal
tFVDS
ICHGFWx
IHOLD
IHOLD
t
- IHOLD
Figure 44
Datasheet
Turn-off of an active MOSFET in PWM mode with active gate control, HS PWM, HS as active
MOSFET, LS as FW MOSFET. PWM_NB =0 (one PWM input per HB), HBxMODE = 10B (HS PWM),
AGC = 01B or 10B (Active Gate Control), EN_GEN_CHECK=1 (detection of active / FW MOSFET),
AFWx = 1 (active freewheeling for HBx is activated)
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Gate Drivers
11.3.3.1.2
The PWM MOSFET is the free-wheeling MOSFET
This section shows the control signals of the MOSFET when the PWM is the free-wheeling MOSFET.
External
PWMz
t
tPWM_SYNCH
Synchronized
intern. PWMz
t
IGS_LSx
Discharge phase
tPDCHGx
t
0
Low-side = Active MOSFET
- IDCHGx
- IPREDCHGx
tHBxCCP Active for cross current
protection
LSx internal
drive signal
IHOLD
t
0
- IHOLD
- IDCHGx
- IHOLD
- IDCHGx
- IPREDCHGx
Hard off
- IHARDOFF
tFVDS
VGS_LSx
t
VSHx
tDOFFx
tFALLx
VS
VSHH
VSHH
VSHL
VSHL
t
Detection of the active MOSFET
(EN_GEN_CHECK= 1). VSH > VSHH: LS
MOSFET is the active MOSFET
IDS_LSDx
IPHASE
t
IGS_HSx
High-side = FW MOSFET
and PWM MOSFET
ICHGFWx
t
tHBxBLANK FW
HSx internal
drive signal
tFVDS
ICHGFWx
IHOLD
IHOLD
t
- IHOLD
Figure 45
Datasheet
\G
Di
\fi
\BLDC
PWM rising edge - PWM mode with active gate control, HS PWM (HBxMODE = 10B) , LS as
active MOSFET, HS as FW MOSFET. PWM_NB =0 (one PWM input per HB), AGC = 01B or 10B
(Active Gate Control), EN_GEN_CHECK=1 (detection of active / FW MOSFET), AFWx = 1 (active
freewheeling for HBx is activated)
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BLDC Motor System IC
Gate Drivers
External
PWMz
Synchronized
intern. PWMz
t
tPWM_SYNCH
Charge
phase
IGS_LSx
t
Postcharge Phase
tPCHGx
ICHGMAXx
IPRECHGx
ICHGx
0
t
tHBxBLANK Active
Low-side = Active MOSFET
tHBxCCP FW
LSx internal
drive signal
tFVDS
ICHGMAXx
IPRECHGx
IHOLD
ICHGx
IHOLD
ICHGx
t
0
- IHOLD
VGS_LSx
t
tRISEx
VSHx
tDONx
VS
VSHH
VSHH
VSHL
IDS_LSDx
VSHL
t
Detection of the active MOSFET
(EN_GEN_CHECK= 1). VSH > VSHH: LS
MOSFET is the active MOSFET
IPHASE
t
IGS_HSx
High-side = FW MOSFET
and PWM MOSFET
t
- ICHGFWx
HSx internal
drive signal
tFVDS
IHOLD
t
- IHOLD
- IHOLD
- ICHGFWx
Hard off
- IHARDOFF
Figure 46
Datasheet
PWM falling edge - PWM mode with active gate control, HS PWM (HBxMODE = 10B) , LS as
active MOSFET, HS as FW MOSFET. PWM_NB =0 (one PWM input per HB), AGC = 01B or 10B
(Active Gate Control), EN_GEN_CHECK=1 (detection of active / FW MOSFET), AFWx = 1 (active
freewheeling for HBx is activated)
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BLDC Motor System IC
Gate Drivers
11.3.3.2 Control signals with passive free-wheeling (AFWx = 0)
This section describes the MOSFET control signals with active freewheeling and HS PWM:
•
The HS PWM MOSFET is the active MOSFET (Chapter 11.3.3.2.1).
•
The HS PWM MOSFET is the free-wheeling MOSFET (Chapter 11.3.3.2.2).
11.3.3.2.1
The PWM MOSFET is the active MOSFET
This section shows the control signals of the MOSFET when the PWM is the active MOSFET.
Datasheet
82
Rev. 1.0
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TLE9564QX
BLDC Motor System IC
Gate Drivers
External
PWMz
Synchronized
intern. PWMz
t
tPWM_SYNCH
Charge
phase
IGS_HSx
t
Postcharge Phase
tPCHGx
ICHGMAXx
PWM MOSFET = Active MOSFET
IPRECHGx
ICHGx
0
t
tHBxBLANK
HSx internal
drive signal
tFVDS
ICHGMAXx
IPRECHGx
IHOLD
ICHGx
IHOLD
ICHGx
t
0
- IHOLD
VGS_HSx
t
VSHx
VS
VSHH
tRISEx
tDONx
VSHL
VSHH
VSHL
t
IDS_HSDx
IPHASE
t
FW MOSFET
PFW
IGS_LSx
t
LSx internal
drive signal
tFVDS
t
- IHOLD
- IHOLD
Hard off
- IHARDOFF
Figure 47
Datasheet
Adaptive turn-on with high-side PWM, AGC[1:0] = (1,0) or (1,1), AFWx=0, POCHGDIS=0, the
PWM MOSFET is the active MOSFET. PWM_NB=0.
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BLDC Motor System IC
Gate Drivers
External
PWMz
t
tPWM_SYNCH
Synchronized
intern. PWMz
t
IGS_HSx
PWM MOSFET = Active MOSFET
Discharge phase
tPDCHGx
t
0
- IDCHGx
- IPREDCHGx
tHBxCCP Active
HSx internal
drive signal
IHOLD
t
0
- IHOLD
- IDCHGx
- IDCHGx
- IPREDCHGx
- IHOLD
VGS_HSx
t
VSHx
tFALLx
tDOFFx
VS
VSHH
VSHH
VSHL
VSHL
t
IDS_HSDx
IPHASE
FW MOSFET
PFW
t
IGS_LSx
0
t
LSx internal
drive signal
t
- IHOLD
Figure 48
Adaptive turn-off with high-side PWM, AGC[1:0] = (1,0) or (1,1), AFWx=0, POCHGDIS=0, the
PWM MOSFET is the active MOSFET.PWM_NB=0.
11.3.3.2.2
The PWM MOSFET is the free-wheeling MOSFET
This section shows the control signals of the MOSFET when the PWM is the free-wheeling MOSFET.
Datasheet
84
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TLE9564QX
BLDC Motor System IC
Gate Drivers
External
PWMz
t
tPWM_SYNCH
Synchronized
intern. PWMz
t
IGS_LSx
Discharge phase
tPDCHGx
t
0
Low-side = Active MOSFET
- IDCHGx
- IPREDCHGx
tHBxCCP Active for cross current
protection
LSx internal
drive signal
IHOLD
t
0
- IHOLD
- IDCHGx
- IHOLD
- IDCHGx
- IPREDCHGx
VGS_LSx
t
VSHx
tDOFFx
tFALLx
VS
VSHH
VSHL
VSHH
VSHL
t
Detection of the active MOSFET
(EN_GEN_CHECK= 1). VSH > VSHH: LS
MOSFET is the active MOSFET
IDS_LSDx
IPHASE
High-side = FW MOSFET
(and PWM MOSFET)
t
Figure 49
Datasheet
IGS_HSx
t
HSx internal
drive signal
t
- IHOLD
\G t D i
\fi
\BLDC\
PWM rising edge with adaptive control, EN_GEN_CHECK = 1 with high-side PWM, AGC[1:0] =
(1,0) or (1,1), AFWx=0, POCHGDIS=0. The PWM MOSFET is the FW MOSFET. PWM_NB=0.
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BLDC Motor System IC
Gate Drivers
Detection of the active MOSFET
(EN_GEN_CHECK= 1). VSH > VSHH: LS
MOSFET is the active MOSFET
External
PWMz
Synchronized
intern. PWMz
t
tPWM_SYNCH
Charge
phase
IGS_LSx
t
Postcharge Phase
tPCHGx
ICHGMAXx
IPRECHGx
ICHGx
0
t
Low-side = Active MOSFET
tHBxBLANK Active
LSx internal
drive signal
tFVDS
ICHGMAXx
IPRECHGx
IHOLD
ICHGx
IHOLD
ICHGx
t
0
- IHOLD
VGS_LSx
t
VSHx
VS
VSHH
tRISEx
tDONx
VSHL
VSHH
VSHL
t
IDS_LSDx
IPHASE
t
IGS_HSx
High-side FW MOSFET
(and PWM MOSFET)
t
Figure 50
HSx internal
drive signal
tFVDS
t
- IHOLD
- IHOLD
Hard off
- IHARDOFF
PWM falling edge with adaptive control, EN_GEN_CHECK = 1 with high-side PWM, AGC[1:0]
= (1,0) or (1,1), AFWx=0, POCHGDIS=0. The PWM MOSFET is the FW MOSFET. PWM_NB=0.
11.3.3.3 Time modulation of pre-charge and pre-discharge times
If DEEP_ADAP =0:
Datasheet
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TLE9564QX
BLDC Motor System IC
Gate Drivers
•
one single precharge current is applied during tPCHGx to regulate TDON
•
one single precharge current is applied during tPDCHGx to regulate TDOFF
If DEEP_ADAP = 1 (“deep adaptation” or “time modulation”) it is possible to:
•
to divide the precharge phase in two parts, during which two different precharge currents can be applied
•
to divide the predischarge phase in two parts, during which two different precharge currents can be
applied
Figure 51 describes the principle of the time modulation applied to the precharge phase. The same principle
is also applied for the regulation of the pre-discharge phase.
Datasheet
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TLE9564QX
BLDC Motor System IC
Gate Drivers
TDON adaptation
with two current
steps (IPCHGADT =
1)
Current i+2
No
3 consecutive sign changes of (TDON
EFF- TDON TARGET) or No error for 3
consecutive PWM cycles
Current i
Yes
tPCHG
tPCHG
TDON adaptation
with one current step
i+1
i
3 consecutive sign changes
of (TDON EFF- TDON
TARGET)
No
tPCHG
tPCHG
Yes
Precharge phase splitted in 2
sub-phases
i+1
i
50% 50%
tPCHG
Exit from time modulation 2)
Yes
TDON EFF = TDON
TARGET
No
Precharge splitted:
75%-25% if TDON EFF > TDON TARGET
25%-75% if TDON EFF < TDON TARGET
i+1
i
or
25% 75%
Yes
tPCHG
TDON EFF = TDON
TARGET
i+1
i
75%
25%
tPCHG
No
Precharge splitted:
E.g 87.5%-12.5%
Etc... 1)
No 2)
1) Precharge further split either:
- until TDON EFF = TDON TARGET
- Or until no further split of tPCHG is possible. Refer to 2).
TDON EFF = TDON TARGET
2) Exit time modulation:
- tPCHG cannot be further divided due to the limitation of the resolution
- and the regulation of TDON is still not possible
One single current is applied during tPCHG
Figure 51
Datasheet
Principle of the time modulation of the precharge phase, DEEP_ADAP = 1, AGC = 10B or 11B
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BLDC Motor System IC
Gate Drivers
11.3.3.4 Operation at high and low duty cycles
In the particular cases where the on-time is shorter than tHBxCCP FW or the off-time of the PWM signal is
shorter than tHBxCCP Active:
•
No distinction between active MOSFET and FW MOSFET is possible. Therefore PWM MOSFET (selected by
HBxMODE[1:0]) is controlled as active MOSFET.
•
The MOSFET opposite to the PWM MOSFET stays off (passive FW)
11.3.3.5 Measurements of the switching times
The effective switching times in PWM operation:
•
of the PWM MOSFET if EN_GEN_CHECK = 0
•
of the active MOSFET if EN_GEN_CHECK = 1
are reported in the registers:
EFF_TDON_OFF1,EFF_TDON_OFF2,EFF_TDON_OFF3.
If the end of the rise time for a given MOSFET is not detected before tHBxBLANK Active elapses, then the
corresponding status register reports an effective rise time equal to zero.
If the end of the fall time for a given MOSFET is not detected before tHBxCCP Active active elapses, then the
corresponding status register reports an effective fall time equal to zero.
The device cannot measure the switching times tDON, tDOFF, tRISE and tFALL at very high and very low duty cycles:
tON < tHBxCCP FW and tOFF < tHBxCCP active. In this case, the corresponding registers report effective tDON, tDOFF, tRISE
and tFALL equal to zero.
Datasheet
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Rev. 1.0
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TLE9564QX
BLDC Motor System IC
Gate Drivers
11.3.4
PWM operation with 6 PWM inputs
Each high-side MOSFET and each low-side MOSFET is controlled by one PWM input. if PWM_NB is set to 1 (see
CSA) and HBx_PWM_EN are set to 1 (see HBMODE). Refer to Table 23.
CP
µC_PWM2
VS
PWM2
HS1
CP
µC_PWM1
PWM1
LS1
µC_PWM4
µC_PWM3
PWM4
Control
SL
CP
VS
HS2
CP
PWM3
LS2
SL
CP
µC_PWM6
VS
PWM6
HS3
CP
µC_PWM5
PWM5
LS3
SL
Figure 52
Half-bridge PWM control with six PWM inputs, PWM_NB = 1
Table 23
Half-bridge PWM settings with 6 PWM inputs (PWM_NB = 1)FW and Active MOSFET
PWM_NB
HBx_PWM HBxMODE1)
_EN1)
Half-bridge x settings1)
1
Don’t care
00B
LSx and HSx MOSFETs are kept OFF by the passive
discharge (default)
1
1
01B
HBx is controlled by its PWM inputs
1
1
1
Don’t care
10B
11B
•
If EN_GEN_CHECK = 0: LSx is always considered as the
active MOSFET
•
If EN_GEN_CHECK = 1: The active and the FW MOSFETs
are detected according to Chapter 11.3.1,
independently from HBxMODE
HBx is controlled by its PWM inputs
•
If EN_GEN_CHECK = 0: HSx is always considered as the
active MOSFET
•
If EN_GEN_CHECK = 1: The active and the FW MOSFETs
are detected according to Chapter 11.3.1
independently from HBxMODE
LSx and HSx MOSFETs are actively kept OFF
1) x = 1 to 3
Datasheet
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Rev. 1.0
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TLE9564QX
BLDC Motor System IC
Gate Drivers
Table 24
PWM Control of HS1 and LS1, PWM_NB = 1, HB1_PWM_EN = 1
HB1MODE[1:0]
PWM1/CRC
PWM2
HS1
LS1
01
Low
Low
OFF
OFF
01
Low
High
ON
OFF
01
High
Low
OFF
ON
01
High
High
OFF
OFF
10
Low
Low
OFF
OFF
10
Low
High
OFF
ON
10
High
Low
ON
OFF
10
High
High
OFF
OFF
Table 25
PWM Control of HS2 and LS2, PWM_NB = 1, HB2_PWM_EN = 1
HB2MODE[1:0]
PWM3
PWM4
HS2
LS2
01
Low
Low
OFF
OFF
01
Low
High
ON
OFF
01
High
Low
OFF
ON
01
High
High
OFF
OFF
10
Low
Low
OFF
OFF
10
Low
High
OFF
ON
10
High
Low
ON
OFF
10
High
High
OFF
OFF
Table 26
PWM Control of HS3 and LS3, PWM_NB = 1, HB3_PWM_EN = 1
HB3MODE[1:0]
PWM5
PWM6
HS3
LS3
01
Low
Low
OFF
OFF
01
Low
High
ON
OFF
01
High
Low
OFF
ON
01
High
High
OFF
OFF
10
Low
Low
OFF
OFF
10
Low
High
OFF
ON
10
High
Low
ON
OFF
10
High
High
OFF
OFF
Figure 53 shows the PWM control of HBx in PWM (HBx_PWM_EN = 1): Turn-off of the FW MOSFET (low-side
MOSFET in this case) followed by the activation of the active MOSFET (high-side MOSFET in this case)1) with
PWM_NB = 1, AGC[1:0]=01B or 10B, POCHGDIS = 0 (post-charge enabled).
This control scheme is applicable for the following cases:
1) If the synchronized HS PWM rising edge occurs after tHBxCCP FW and before the end of tOFF timeout FW, then the LS MOSFET is
discharged with IHARDOFF and the HS is turned on, when the HS PWM rising edge is detected
Datasheet
91
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TLE9564QX
BLDC Motor System IC
Gate Drivers
1. EN_GEN_CHECK = 0 (detection of FW/Active MOSFET disabled); HBxMODE[1:0] = 10B (HS MOSFET is
considered as active MOSFET by default).
2. EN_GEN_CHECK = 1 (detection of active / FW MOSFET enabled); HS MOSFET detected as active MOSFET;
HBxMODE[1:0] = 01B or10B.
Note:
Datasheet
If the synchronized HS PWM rising edge occurs before the end of tHBxCCP active, then the device
prevents an activation of the HS MOSFET until tHBxCCP FW elapses. In other words, the HS PWM
rising edge is ignored until the end of tHBxCCP FW.
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BLDC Motor System IC
Gate Drivers
External HSx PWM
signal
Synchronized HSx
PWM signal
tPWM_SYNCH
Charge
phase
IGS_HSx
t
Postcharge Phase
tPCHGx
ICHGMAXx
IPRECHGx
HS MOSFET
(Active MOSFET)
ICHGx
0
t
HSx internal
drive signal
tHBxBLANK Active
tFVDS
ICHGMAXx
IPRECHGx
IHOLD
ICHGx
IHOLD
ICHGx
t
0
- IHOLD
VGS_HSx
t
VSHx
VSHx < VSHL right before the activation of HSx
tRISEx
HSx detected as active MOSFET
VS
VSHH
VSHH
tDONx
VSHL
VSHL
t
IDS_HSDx
IPHASE
t
Synchronized LSx
PWM signal
LS MOSFET
(FW MOSFET)
LSx internal
drive signal
tHBxCCP FW
t
tOFF Timeout
FW
tFVDS
IHOLD
t
- IHOLD
- IHOLD
- ICHGFWx
Hard off
- IHARDOFF
Figure 53
Datasheet
Turn-on of an active MOSFET in PWM mode with active gate control, HS as active MOSFET,
LS as FW MOSFET. Two PWM inputs per half-bridge, active gate control enabled. PWM_EN =1
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BLDC Motor System IC
Gate Drivers
Figure 54 shows the PWM control of HBx in PWM (HBx_PWM_EN = 1): Turn-off of the active MOSFET (high-side
MOSFET in this case) followed by the activation of the FW MOSFET low-side MOSFET in this case) with PWM_NB
= 1, AGC[1:0] = 01B or 10B, POCHGDIS = 0 (post-charge enabled).
This control scheme is applicable for the following cases:
1. EN_GEN_CHECK = 0 (detection of FW/Active MOSFET disabled); HBxMODE[1:0] = 10B (HS MOSFET is
considered as active MOSFET by default).
2. EN_GEN_CHECK = 1 (detection of active / FW MOSFET enabled); HS MOSFET detected as active MOSFET;
HBxMODE[1:0] = 01B or 10B.
Note:
Datasheet
If the synchronized LS PWM rising edge occurs before the end of tHBxCCP active, then the device
prevents an activation of the LS MOSFET until tHBxCCP active elapses. In other words, the LS PWM
rising edge is ignored until the end of tHBxCCP active.
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BLDC Motor System IC
Gate Drivers
External HSx PWM
signal
t
tPWM_SYNCH
Synchronized HSx
PWM signal
t
tPDCHGx
Discharge phase
HSx internal
drive signal
tHBxCCP Active
HS MOSFET
(Active MOSFET)
IHOLD
t
0
- IHOLD
- IHOLD
- IDCHGx
- IHOLD
- IDCHGx
- IPREDCHGx
tOFF timeout
Active
Hard off
- IHARDOFF
VGS_HSx
t
VSHx
VS
VSHH
VSHL
tFALLx
VSHx < VSHL right before the activation of HSx
HSx detected as active MOSFET
tDOFFx
VSHH
VSHL
t
IDS_HSDx
IPHASE
t
LS MOSFET
(FW MOSFET)
Synchronized LSx
PWM signal
t
LSx internal
drive signal
tHBxBLANK FW
tFVDS
ICHGFWx
IHOLD
IHOLD
t
- IHOLD
Figure 54
Turn-off of an active MOSFET in PWM mode with active gate control, HS as active MOSFET,
LS as FW MOSFET. two PWM inputs per half-bridge, active gate control enabled. PWM_NB=1.
11.3.5
Status bits for regulation of turn-on and turn-off delay times
The control bits TDREGx (TDREG) indicate if tDONx and tDOFFx of the half-bridge x, using the adaptive control
scheme (AGC = 10B or 11B), are in regulation.
Datasheet
95
Rev. 1.0
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TLE9564QX
BLDC Motor System IC
Gate Drivers
The half-bridge x is considered in regulation if one of the following conditions is met:
•
Condition 1: The effective turn-on and turn-off delays are equal to the configured delays for at least eight
cumulative PWM cycle (HBx tDON counter ≥ 8 and HBx tDOFF counter ≥ 8). For each PWM cycle
– if tDONxEFF1) = TDONx2), x = 1.. 3, HBx tDON counter is incremented
– if tDONxEFF1) ≠ TDONx2), x = 1.. 3, HBx tDON counter is decremented
– if tDOFFxEFF1) = TDOFFx3), x = 1.. 3, HBx tDOFF counter is incremented
– if tDOFFxEFF 1) ≠ TDOFFx3), x = 1.. 3, HBx tDOFF counter is decremented
•
Condition 2: The error between the effective delays ((tDONxEFF-TDONx) and(tDOFFxEFF-TDOFFx ))
changes its sign three times consecutively
1) Refer to EFF_TDON_OFF1, EFF_TDON_OFF2, EFF_TDON_OFF3
2) Refer to TDON_HB_CTRL
3) Refer to TDOFF_HB_CTRL
Datasheet
96
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Gate Drivers
11.3.6
Gate driver current
Each gate driver is able to source and sink currents from 0.5 mA to 150 mA, with 64 steps.
150
Nominal PWM charge/ intial precharge current [mA]
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
0
Figure 55
Datasheet
5
10
15
20
25
30
ICHG[5:0]dec
35
40
45
50
55
60
Configurable discharge currents in PWM operation
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TLE9564QX
BLDC Motor System IC
Gate Drivers
Table 27
Charge currents and initial precharge currents
ICHGx[5:0],
PCHGINITx[5:0]
Parameter Nom. current
name
[mA]
Max. deviation to nominal
values [%]
000000B
ICHG0
0.5
+/- 60%
000001B
ICHG1
0.7
+/- 60 %
000010B
ICHG2
1.0
+/- 60 %
000011B
ICHG3
1.4
+/- 60 %
000100B
ICHG4
1.8
+/- 60 %
000101B
ICHG5
2.4
+/- 60 %
000110B
ICHG6
3.0
+/- 60 %
000111B
ICHG7
3.8
+/- 60 %
001000B
ICHG8
4.7
+/- 55%
001001B
ICHG9
5.8
+/- 55%
001010B
ICHG10
6.9
+/- 55%
001011B
ICHG11
8.1
+/- 55%
001100B
ICHG12
9.4
+/- 55%
001101B
ICHG13
10.8
+/- 55%
001110B
ICHG14
12.2
+/- 40%
001111B
ICHG15
13.7
+/- 40%
010000B
ICHG16
15.3
+/- 40 %
010001B
ICHG17
17.1
+/- 40 %
010010B
ICHG18
19
+/- 40%
010011B
ICHG19
21
+/- 40 %
010100B
ICHG20
23
+/- 40%
010101B
ICHG21
25
+/- 40 %
010110B
ICHG22
27.1
+/- 40 %
010111B
ICHG23
29.3
+/- 40 %
011000B
ICHG24
31.6
+/- 40 %
011001B
ICHG25
34
+/- 40 %
011010B
ICHG26
36.5
+/- 40 %
011011B
ICHG27
39
+/- 40 %
011100B
ICHG28
41.6
+/- 40 %
011101B
ICHG29
44.2
+/- 30 %
011110B
ICHG30
46.9
+/- 30 %
011111B
ICHG31
49.7
+/- 30 %
100000B
ICHG32
52.5
+/- 30 %
100001B
ICHG33
55.3
+/- 30 %
100010B
ICHG34
58.1
+/- 30 %
100011B
ICHG35
60.8
+/- 30 %
Datasheet
98
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Gate Drivers
Table 27
Charge currents and initial precharge currents (cont’d)
ICHGx[5:0],
PCHGINITx[5:0]
Parameter Nom. current
name
[mA]
Max. deviation to nominal
values [%]
100100B
ICHG36
63.6
+/- 30 %
100101B
ICHG37
66.5
+/- 30 %
100110B
ICHG38
69.4
+/- 30 %
100111B
ICHG39
72.3
+/- 30 %
101000B
ICHG40
75.2
+/- 30 %
101001B
ICHG41
78.1
+/- 30 %
101010B
ICHG42
81.1
+/- 30 %
101011B
ICHG43
84.1
+/- 30 %
101100B
ICHG44
87.1
+/- 30 %
101101B
ICHG45
90.2
+/- 30 %
101110B
ICHG46
93.3
+/- 30 %
101111B
ICHG47
96.4
+/- 30 %
110000B
ICHG48
99.5
+/- 30 %
110001B
ICHG49
102.7
+/- 30 %
110010B
ICHG50
105.8
+/- 30 %
110011B
ICHG51
109
+/- 30 %
110100B
ICHG52
112.2
+/- 30 %
110101B
ICHG53
115.4
+/- 30 %
110110B
ICHG54
118.7
+/- 30 %
110111B
ICHG55
122
+/- 30 %
111000B
ICHG56
125.3
+/- 30 %
111001B
ICHG57
128.7
+/- 30 %
111010B
ICHG58
132.1
+/- 30 %
111011B
ICHG59
135.5
+/- 30 %
111100B
ICHG60
139
+/- 30 %
111101B
ICHG61
142.5
+/- 30 %
111110B
ICHG62
146
+/- 30 %
111111B
ICHG63
150
+/- 30 %
Datasheet
99
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Gate Drivers
150
Nominal PWM Discharge/Initial precharge current [mA]
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
0
Figure 56
Datasheet
5
10
15
20
25
30
IDCHG[5:0]dec
35
40
45
50
55
60
Configurable discharge currents in PWM operation
100
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Gate Drivers
Table 28
Discharge currents and initial predischarge currents
IDCHG[5:0],
PDCHGINITx[5:0]
Parameter
name
Nom. current
[mA]
Max. deviation to nominal
values [%]
000000B
IDCHG0
0.5
+/- 60%
000001B
IDCHG1
0.7
+/- 60 %
000010B
IDCHG2
1.0
+/- 60 %
000011B
IDCHG3
1.4
+/- 60 %
000100B
IDCHG4
1.8
+/- 60 %
000101B
IDCHG5
2.4
+/- 60 %
000110B
IDCHG6
3.0
+/- 60 %
000111B
IDCHG7
3.8
+/- 60 %
001000B
IDCHG8
4.7
+/- 60 %
001001B
IDCHG9
5.8
+/- 60 %
001010B
IDCHG10
6.9
+/- 60 %
001011B
IDCHG11
8.1
+/- 60 %
001100B
IDCHG12
9.4
+/- 60 %
001101B
IDCHG13
10.7
+/- 60 %
001110B
IDCHG14
12.1
+/- 40%
001111B
IDCHG15
13.5
+/- 40%
010000B
IDCHG16
15.1
+/- 40 %
010001B
IDCHG17
16.8
+/- 40 %
010010B
IDCHG18
18.6
+/- 40%
010011B
IDCHG19
20.5
+/- 40 %
010100B
IDCHG20
22.5
+/- 40%
010101B
IDCHG21
24.5
+/- 40 %
010110B
IDCHG22
26.5
+/- 40 %
010111B
IDCHG23
28.7
+/- 40 %
011000B
IDCHG24
30.9
+/- 40 %
011001B
IDCHG25
33.2
+/- 40 %
011010B
IDCHG26
35.7
+/- 40 %
011011B
IDCHG27
38.2
+/- 40 %
011100B
IDCHG28
40.8
+/- 40 %
011101B
IDCHG29
43.4
+/- 30 %
011110B
IDCHG30
46.1
+/- 30 %
011111B
IDCHG31
48.8
+/- 30 %
100000B
IDCHG32
51.5
+/- 30 %
100001B
IDCHG33
54.2
+/- 30 %
100010B
IDCHG34
56.9
+/- 30 %
100011B
IDCHG35
59.6
+/- 30 %
Datasheet
101
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Gate Drivers
Table 28
Discharge currents and initial predischarge currents (cont’d)
IDCHG[5:0],
PDCHGINITx[5:0]
Parameter
name
Nom. current
[mA]
Max. deviation to nominal
values [%]
100100B
IDCHG36
62.4
+/- 30 %
100101B
IDCHG37
65.2
+/- 30 %
100110B
IDCHG38
68
+/- 30 %
100111B
IDCHG39
70.8
+/- 30 %
101000B
IDCHG40
73.7
+/- 30 %
101001B
IDCHG41
76.6
+/- 30 %
101010B
IDCHG42
79.5
+/- 30 %
101011B
IDCHG43
82.5
+/- 30 %
101100B
IDCHG44
85.5
+/- 30 %
101101B
IDCHG45
88.5
+/- 30 %
101110B
IDCHG46
91.5
+/- 30 %
101111B
IDCHG47
94.6
+/- 30 %
110000B
IDCHG48
97.7
+/- 30 %
110001B
IDCHG49
100.9
+/- 30 %
110010B
IDCHG50
104.2
+/- 30 %
110011B
IDCHG51
107.5
+/- 30 %
110100B
IDCHG52
110.8
+/- 30 %
110101B
IDCHG53
114.2
+/- 30 %
110110B
IDCHG54
117.6
+/- 30 %
110111B
IDCHG55
121
+/- 30 %
111000B
IDCHG56
124.5
+/- 30 %
111001B
IDCHG57
128
+/- 30 %
111010B
IDCHG58
131.5
+/- 30 %
111011B
IDCHG59
135.1
+/- 30 %
111100B
IDCHG60
138.7
+/- 30 %
111101B
IDCHG61
142.3
+/- 30 %
111110B
IDCHG62
145.8
+/- 30 %
111111B
IDCHG63
150
+/- 30 %
11.4
Passive discharge
Resistors (RGGND) between the gate of GHx and GND, and between GLx and GND, ensure that the external
MOSFETs are turned off in the following conditions:
•
VCC1 undervoltage
•
HBxMODE = 00B in Normal Mode
•
CPEN = 0 in Normal Mode
•
CSA Overcurrent detection with OCEN = 1 in normal mode
Datasheet
102
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Gate Drivers
•
VS overvoltage or VSINT overvoltage
•
Charge pump undervoltage and charge pump blank time (tCPUVBLANK)
•
Charge pump overtemperature (CP_OT)
•
VDS overvoltage after active discharge in Normal Mode
•
In Init Mode, Stop Mode, Fail Safe Mode, Restart Mode and Sleep Mode (exceptions for low-sides in parking
braking and VS / VSINT overvoltage braking , refer to Chapter 11.6 and Chapter 12.10.3)
11.5
Slam mode
The slam mode is applicable in Normal Mode.
If the SLAM bit is set in BRAKE register:
1. If HBxMODE = 01b or 10b , then the corresponding MOSFETs are actively turned off with their static
discharge current during their respective tHBxCCP Active.
2. Then charge pump is deactivated independently from CPEN
3. Then PWM1/CRC input pin is mapped to LS1, LS2, LS3, independently from PWM_NB, HBxMODE and
HBx_PWM_EN
a) If PWM1/CRC is High, then the low-side MOSFETs are turned on within tON_BRAKE.
b) If PWM1/CRC is Low, then the low-side MOSFETs are turned off within tOFF_BRAKE.
There is also the possibility to disable selectively the LSx in SLAM mode.
11.6
Parking braking mode
If PARK_BRK_EN bit is set, while the device goes in Sleep Mode or in Stop Mode:
1. If HBxMODE = 01b or 10b , then the corresponding MOSFETs are actively turned off with their static
discharge current during their respective tHBxCCP Active.
2. Then charge pump is deactivated independently from CPEN bit.
3. Then the passive discharge (RGGND) of the low-sides is deactivated, the passive discharge of the high-sides
are activated
4. If PWM1/CRC is High, then the low-side MOSFETs are turned on within tON_BRAKE.
Refer to Chapter 12.10.2 for the protection of the of low-side MOSFETs against short circuits when the parking
braking mode is activated.
Datasheet
103
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Gate Drivers
11.7
Charge pump
A dual-stage charge pump supplies the gate drivers for the high-side and low-side MOSFETs. It requires three
external capacitors connected between CPC1N and CPC1P, CPC2N and CPC2P, VS and CP.
The buffer capacitor between VS and CP must have a capacitance equal or higher than 470 nF.
CCP ≥ 470 nF
CCP1
CPC2P
CPC1P
CPC2N
CPC1N
VS
CCP2
CP
Single/dual stage
charge pump
Precharge
Logic
Figure 57
Charge pump - Block diagram
Logic or normal level MOSFETs
The regulation of the charge pump outputs voltage can be configured depending on the type of MOSFET.
FET_LVL = 0: Logic level MOSFETs are selected:
•
VCP - VS = VCP3 (11 V typ. at VS > 8 V).
•
The high-side gate-source voltage GHx - SHx is VGH4 (VS > 8 V).
•
The low-side gate-source voltage GLx - SL is VGH3 (VS > 8 V).
FET_LVL = 1: Normal level MOSFETs are selected:
•
VCP - VS = VCP1(15 V typ. at VS > 8 V).
•
The high-side and low-side gate-source voltage GHx - SHx or GLx - SL is VGH1 (VS > 8 V).
CPSTGA = 0 (default, see GENCTRL), the device operates with the dual-stage charge pump.
If CPSTGA = 1, the device switches to single-stage or dual-stage charge pump automatically:
•
If VS > VCPSO DS: the TLE9564QX switches from a dual-stage to a single-stage charge pump.
•
If VS < VCPSO SD: the TLE9564QX switches from single-stage to dual-stage charge pump.
The operation with the single-stage charge pump reduces the current consumption from the VS pin.
Datasheet
104
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Gate Drivers
11.8
Frequency modulation
A modulation of the charge pump frequency can be activated to reduce the peak emission.
The modulation frequency is set by the control bit FMODE in GENCTRL:
•
FMODE = 0: No modulation.
•
FMODE = 1: Modulation frequency = 15.6 kHz (default).
Datasheet
105
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Gate Drivers
11.9
Electrical characteristics gate driver
The electrical characteristics related to the gate driver are valid for VCP > VS + 8.5 V
Table 29
Electrical characteristics: gate drivers
VSINT = 5.5 V to 28 V, Tj = -40°C to +150°C,
VCP > VS + 8.5 V, VS = 6 to 19V, all voltages with respect to ground, positive current flowing into pin except for IGLx
and IGHx (unless otherwise specified).
Parameter
Symbol
Values
Min.
Typ.
Unit
Max.
Note or
Test Condition
Number
Comparators
SHx High Threshold
VSHH
VS - 2.6 –
VS - 1.9 V
SHx Low Threshold
VSHL
1.9
2.6
–
P_12.11.1
V
Referred to GND
P_12.11.2
P_12.11.3
–
12
30
ns
1)
High Level Output Voltage VGH1
GHx vs. SHx and GLx vs. SL
10
11.5
12.5
V
2)
VS ≥ 8 V ,
CLoad = 10 nF,
ICP = -12 mA,
FET_LVL = 1
P_12.11.4
High Level Output Voltage VGH2
GHx vs. SHx and GLx vs. SL
7
–
12.5
V
VS = 6 V,
CLoad = 10 nF,
ICP = -6 mA,
FET_LVL = 1
P_12.11.5
High Level Output Voltage VGH3
GLx vs. SL
10
–
12.5
V
3)
VS ≥ 6 V ,
CLoad = 10 nF,
FET_LVL = 0
P_12.11.6
High Level Output Voltage VGH4
GHx vs. SHx
8.5
10
12.5
V
2)
VS ≥ 8 V ,
CLoad = 10 nF,
ICP = -12 mA,
FET_LVL = 0
P_12.11.7
High Level Output Voltage VGH5
GHx vs. SHx
7
–
12.5
V
VS = 6 V,
CLOAD= 10 nF,
ICP = -6 mA,
FET_LVL =0
P_12.11.8
Charge current
ICHG0
-60%
0.5
+60%
mA
ICHG = 0D 1)
P_12.11.70
CLoad = 2.2 nF
VS ≥8V, VGS≤VGS(ON)4)
Charge current
ICHG8
-55%
4.7
+55%
mA
ICHG =8 D 1)
P_12.11.71
CLoad = 2.2 nF
VS ≥8V, VGS≤VGS(ON)4)
Charge current
ICHG16
-40%
15.3
+40%
mA
ICHG =16 D 1)
P_12.11.72
CLoad = 2.2 nF
VS ≥8V, VGS≤VGS(ON)4)
Charge current
ICHG32
-30%
52.5
+30%
mA
ICHG =32 D 1)
P_12.11.73
CLoad = 10 nF
VS ≥8V, VGS≤VGS(ON)4)
SHx comparator delay
tSHx
MOSFET Driver Output
Datasheet
106
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Gate Drivers
Table 29
Electrical characteristics: gate drivers (cont’d)
VSINT = 5.5 V to 28 V, Tj = -40°C to +150°C,
VCP > VS + 8.5 V, VS = 6 to 19V, all voltages with respect to ground, positive current flowing into pin except for IGLx
and IGHx (unless otherwise specified).
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note or
Test Condition
Number
Charge current
ICHG48
-30%
99.5
+30%
mA
ICHG =48 D 1)
P_12.11.74
CLoad = 10 nF
VS ≥8V, VGS≤VGS(ON)4)
Charge current
ICHG63
-30%
150
+30%
mA
ICHG =63 D 1)
P_12.11.75
CLoad = 22 nF
VS ≥8V, VGS≤VGS(ON)4)
Discharge current
IDCH0
-60%
-0.5
+60%
mA
IDCHG =0 D 1)
P_12.11.76
CLoad = 2.2 nF
VS ≥8V,VGS≥VGS(OFF1)
Discharge current
IDCH8
-55%
-4.7
55%
mA
IDCHG =8 D 1)
P_12.11.77
CLoad = 2.2 nF
VS ≥8V,VGS≥VGS(OFF1)
Discharge current
IDCHG16
-40%
-15.1
+40%
mA
IDCHG =16 D 1)
P_12.11.78
CLoad = 2.2 nF
VS ≥8V,VGS≥VGS(OFF1)
Discharge current
IDCHG32
-30%
-51.5
+30%
mA
IDCHG =32 D 1)
P_12.11.79
CLoad = 10 nF
VS ≥8V,VGS≥VGS(OFF2)
Discharge current
IDCHG48
-30%
-97.7
+30%
mA
IDCHG = 48D 1)
P_12.11.80
CLoad = 10 nF
VS ≥8V,VGS≥VGS(OFF2)
Discharge current
IDCHG63
-30%
-150
+30%
mA
IDCHG = 63D 1)
P_12.11.81
CLoad = 22 nF
VS ≥8V,VGS≥VGS(OFF2)
Charge current
temperature drift
ICHG0,TDrift
-37%
-12%
15%
ICHG = 0D 1)5)
P_12.11.119
Charge current
temperature drift
ICHG8,TDrift
-17%
1%
20%
ICHG = 8D 1)5)
P_12.11.120
Charge current
temperature drift
ICHG16,TDrift
-12%
3%
18%
ICHG = 16D 1)5)
P_12.11.121
Charge current
temperature drift
ICHG32,TDrift
-11%
-1%
9%
ICHG = 32D 1)5)
P_12.11.122
Charge current
temperature drift
ICHG48,TDrift
-7.5%
0.5%
8%
ICHG = 48D 1)5)
P_12.11.123
Charge current
temperature drift
ICHG63,TDrift
-5.5%
1.5%
8.5%
IDCHG = 63D 1)5)
P_12.11.124
Discharge current
temperature drift
IDCHG0,TDrift
-29%
-4.5%
20%
IDCHG = 0D 1)5)
P_12.11.125
Datasheet
107
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Gate Drivers
Table 29
Electrical characteristics: gate drivers (cont’d)
VSINT = 5.5 V to 28 V, Tj = -40°C to +150°C,
VCP > VS + 8.5 V, VS = 6 to 19V, all voltages with respect to ground, positive current flowing into pin except for IGLx
and IGHx (unless otherwise specified).
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
Note or
Test Condition
Number
Discharge current
temperature drift
IDCHG8,TDrift
-8%
8.5%
26%
IDCHG = 8D 1)5)
P_12.11.126
Discharge current
temperature drift
IDCHG16,TDrift
-4%
9.5%
23%
IDCHG = 16D 1)5)
P_12.11.127
Discharge current
temperature drift
IDCHG32,TDrift
-4%
4.5%
13%
IDCHG = 32D 1)5)
P_12.11.128
Discharge current
temperature drift
IDCHG48,TDrift
-4%
3.5%
10%
IDCHG = 48D 1)5)
P_12.11.129
Discharge current
temperature drift
IDCHG63,TDrift
-3.5%
3.5%
9.5%
IDCHG = 63D 1)5)
P_12.11.130
Charge current VS drift
ICHG0,VsDrift
3%
4.5%
6%
ICHG = 0D 1)6)
P_12.11.131
1)6)
P_12.11.132
Charge current VS drift
ICHG8,VsDrift
4.5%
6%
7.5%
ICHG = 8D
Charge current VS drift
ICHG16,VsDrift
4%
5.8%
7.5%
ICHG = 16D 1)6)
P_12.11.133
5.8%
ICHG = 32D
1)6)
P_12.11.134
ICHG = 48D
1)6)
P_12.11.135
ICHG = 63D
1)6)
P_12.11.136
1)6)
P_12.11.137
P_12.11.138
Charge current VS drift
Charge current VS drift
Charge current VS drift
ICHG32,VsDrift
ICHG48,VsDrift
ICHG63,VsDrift
2%
-0.5%
-2.3%
3.8%
2%
0.3%
4.5%
2.8%
Discharge current VS drift
IDCHG0,VsDrift
-3%
-1.5%
0%
IDCHG = 0D
Discharge current VS drift
IDCHG8,VsDrift
-3%
-0.5%
2%
IDCHG = 8D 1)6)
Discharge current VS drift
IDCHG16,VsDrift -3.3%
-0.3%
2.3%
IDCHG = 16D
1)6)
P_12.11.139
1)6)
P_12.11.140
Discharge current VS drift
IDCHG32,VsDrift -2%
0%
2%
IDCHG = 32D
Discharge current VS drift
IDCHG48,VsDrift -1.5%
0%
1.5%
IDCHG = 48D 1)6)
P_12.11.141
1.5%
IDCHG = 63D
1)6)
P_12.11.142
P_12.11.22
Discharge current VS drift
IDCHG63,VsDrift -1.5%
0.2%
10
20
30
kΩ
1)
Resistor between SHx and RSHGND
GND
10
20
30
kΩ
1)7)
P_12.11.23
Low RDSON mode
–
22
35
Ω
1)
P_12.11.24
Passive discharge
resistance between
GHx/GLx and GND
RGGND
RONCCP
VS = 13.5 V
VCP = VS + 14 V
ICHG = IDCHG = 63D
Gate Drivers Dynamic Parameters
Datasheet
108
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Gate Drivers
Table 29
Electrical characteristics: gate drivers (cont’d)
VSINT = 5.5 V to 28 V, Tj = -40°C to +150°C,
VCP > VS + 8.5 V, VS = 6 to 19V, all voltages with respect to ground, positive current flowing into pin except for IGLx
and IGHx (unless otherwise specified).
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note or
Test Condition
8)
Number
Gate Driver turn-on delay
Time
tDGDRV_ON1
–
–
400
ns
P_12.11.25
From PWM9)
rising edge to 20%
of ICHGx ,
x = 0 to 63,
CLoad = 10 nF,
BDFREQ = 0
Gate Driver turn-on delay
Time
tDGDRV_ON2
–
–
300
ns
8)
From PWM9)
P_12.11.93
rising edge to 20%
of ICHGx ,
x = 0 to 63,
CLoad = 10 nF,
BDFREQ = 1
30
50
ns
8)
From 20% of ICHGx P_12.11.26
to ICHGx ,
x = 0 to 63,
CLoad = 10 nF
8)
Gate Driver current turn-on tGDRV_RISE(ON) –
rise time
Gate Driver turn-off delay
Time
tDGDRV_OFF1
–
–
400
ns
From PWM9)
P_12.11.27
rising edge to 20%
of IDCHGx ,
x = 0 to 63,
CLoad = 10 nF,
BDFREQ = 0
Gate Driver turn-off delay
Time
tDGDRV_OFF2
–
–
300
ns
8)
P_12.11.94
From PWM9)
rising edge to 20%
of IDCHGx ,
x = 0 to 63,
CLoad = 10 nF,
BDFREQ = 1
30
50
ns
8)
From 20% of
IDCHGx to IDCHGx ,
x = 0 to 63,
CLoad = 10 nF
P_12.11.28
Gate Driver current turn-off tGDRV_RISE(OFF –
rise time
)
External MOSFET gate-tosource voltage - ON
VGS(ON)1
7
–
–
V
1)
VS ≥ 8 V,
FET_LVL=1
P_12.11.29
External MOSFET gate-tosource voltage - ON
VGS(ON)1
7
–
–
V
1)
VS ≥ 8 V,
FET_LVL=1
P_12.11.102
External MOSFET gate-tosource voltage - ON
VGS(ON)2
5.5
–
–
V
1)
VS ≥ 8 V,
FET_LVL=0
P_12.11.103
External MOSFET gate-tosource voltage - OFF
VGS(OFF)1
–
–
1.5
V
1)
P_12.11.30
Datasheet
109
IDCHGx ≤ 24D(≤
41 mA typ.)
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Gate Drivers
Table 29
Electrical characteristics: gate drivers (cont’d)
VSINT = 5.5 V to 28 V, Tj = -40°C to +150°C,
VCP > VS + 8.5 V, VS = 6 to 19V, all voltages with respect to ground, positive current flowing into pin except for IGLx
and IGHx (unless otherwise specified).
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note or
Test Condition
Number
1)
External MOSFET gate-tosource voltage - OFF
VGS(OFF)2
–
–
5
V
IDCHGx > 28D(>
41 mA typ.)
P_12.11.101
PWM synchronization
delay
tPWM_SYNCH0
80
–
200
ns
1)
BDFREQ = 0
P_12.11.33
PWM synchronization
delay
tPWM_SYNCH1
40
–
100
ns
1)
BDFREQ= 1
P_12.11.82
Bridge driver frequency
tBDFREQ0
16.8
18.75
20.7
MHz
1)
BDFREQ= 0
P_12.11.83
Bridge driver frequency
tBDFREQ1
33.7
37.5
42.3
MHz
1)
BDFREQ= 1
P_12.11.84
Pre-charge time
tPCHG000
80
107
140
ns
1)
TPCHG = 000,
BDFREQ= 0 or 1
P_12.11.34
Pre-charge time
tPCHG001
130
160
190
ns
1)
TPCHG = 001,
BDFREQ= 0 or 1
P_12.11.35
Pre-charge time
tPCHG010
170
214
260
ns
1)
TPCHG = 010,
BDFREQ= 0 or 1
P_12.11.36
Pre-charge time
tPCHG011
210
267
330
ns
1)
TPCHG = 011,
BDFREQ= 0 or 1
P_12.11.37
Pre-charge time
tPCHG100
250
320
390
ns
1)
TPCHG = 100,
BDFREQ= 0 or 1
P_12.11.85
Pre-charge time
tPCHG101
420
533
630
ns
1)
TPCHG = 101,
BDFREQ= 0 or 1
P_12.11.86
Pre-charge time
tPCHG110
600
747
900
ns
1)
TPCHG = 110,
BDFREQ= 0 or 1
P_12.11.87
Pre-charge time
tPCHG111
840
1067
1260
ns
1)
TPCHG = 111,
BDFREQ= 0 or 1
P_12.11.88
Pre-discharge time
tPDCHG000
80
107
140
ns
1)
TPDCHG = 000,
BDFREQ= 0 or 1
P_12.11.38
Pre-discharge time
tPDCHG001
130
160
190
ns
1)
TPDCHG = 001,
BDFREQ= 0 or 1
P_12.11.39
Pre-discharge time
tPDCHG010
170
214
260
ns
1)
TPDCHG = 010,
BDFREQ= 0 or 1
P_12.11.40
Pre-discharge time
tPDCHG011
210
267
330
ns
1)
TPDCHG = 011,
BDFREQ= 0 or 1
P_12.11.41
Pre-discharge time
tPDCHG100
250
320
390
ns
1)
TPDCHG = 100,
BDFREQ= 0 or 1
P_12.11.89
Pre-discharge time
tPDCHG101
420
533
630
ns
1)
TPDCHG = 101,
BDFREQ= 0 or 1
P_12.11.90
Pre-discharge time
tPDCHG110
600
747
900
ns
1)
P_12.11.91
Datasheet
110
TPDCHG = 110,
BDFREQ= 0 or 1
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Gate Drivers
Table 29
Electrical characteristics: gate drivers (cont’d)
VSINT = 5.5 V to 28 V, Tj = -40°C to +150°C,
VCP > VS + 8.5 V, VS = 6 to 19V, all voltages with respect to ground, positive current flowing into pin except for IGLx
and IGHx (unless otherwise specified).
Parameter
Symbol
Values
Unit
Note or
Test Condition
Number
Min.
Typ.
Max.
840
1067
1260
ns
1)
TPDCHG = 111,
BDFREQ= 0 or 1
P_12.11.92
4
4.8
µs
1)
P_12.11.9
Pre-discharge time
tPDCHG111
Discharge timeout
tOFF_TIMEOUT 3.2
PWM_NB=1B
Low-side gate driver, CP off - Slam mode, parking braking and VS overvoltage braking
LS turn-on time, CP off
tON_BRAKE
–
4.5
9
µs
CLOAD = 10 nF
P_12.11.42
VGLx-VSL = 5 V,
VS > 8 V or VSINT > 8 V
LS turn-off time, CP off
tOFF_BRAKE
–
0.7
2
µs
CLOAD = 10 nF
P_12.11.43
VGLx-VSL = 1.5 V,
VS > 8 V or VSINT > 8 V
High output voltage
GLx - SL
VGLx_BRAKE
5
–
10
V
VS > 8 V or VSINT > 8 V P_12.11.48
Charge Pump Frequency
fCP
–
250
–
kHz
1)
Output Voltage VCP vs. VS
VCPmin1
8.5
–
–
V
VS = 6 V, ICP = - 6 mA, P_12.11.50
FET_LVL =1
Output Voltage VCP vs. VS
VCPmin2
7.5
–
–
V
VS = 6 V, ICP = - 6 mA, P_12.11.51
FET_LVL =0
Regulated CP output
voltage, VCP vs. VS
VCP1
12
15
17
V
8 V < VS < 23 V
ICP = - 12 mA11),
CPSTGA = 0,
FET_LVL =1
P_12.11.52
Regulated CP output
voltage, VCP vs. VS
VCP2
12
15
17
V
18 V < VS < 23 V
ICP = - 12 mA11),
CPSTGA = 1,
FET_LVL =1
P_12.11.53
Regulated CP output
voltage, VCP vs. VS
VCP3
7.5
11
13
V
8 V < VS < 23 V
ICP = - 12 mA11),
CPSTGA = 0,
FET_LVL =0
P_12.11.54
Regulated CP output
voltage, VCP vs. VS
VCP4
7.5
11
13
V
13 V < VS < 23 V
ICP = - 12 mA11),
CPSTGA = 0,
FET_LVL =0
P_12.11.55
Turn-on time
tON_VCP1
5
–
60
µs
1)10)11)
Charge pump
Datasheet
111
P_12.11.49
18 V VS + 8.5 V, VS = 6 to 19V, all voltages with respect to ground, positive current flowing into pin except for IGLx
and IGHx (unless otherwise specified).
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note or
Test Condition
1)10)11)
Number
Rise time
tRISE_VCP1
5
30
60
µs
18 V < VS < 23 P_12.11.57
V (25%-75%)
ICP = 0 , CPSTGA = 1,
FET_LVL =1
Turn-on time
tON_VCP2
20
60
120
µs
1)10)11)
13 V < VS VS + 8.5 V, VS = 6 to 19V, all voltages with respect to ground, positive current flowing into pin except for IGLx
and IGHx (unless otherwise specified).
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note or
Test Condition
Number
Digital PWMx Inputs
High Level Input Voltage
Threshold
VPWMH
–
–
0.7 ×
Vcc1
V
–
P_12.11.95
Low Level Input Voltage
Threshold
VPWML
0.3 ×
Vcc1
–
–
V
–
P_12.11.96
PWMx Input Hysteresis
VPWM,hys
–
0.12 ×
Vcc1
–
V
1)
P_12.11.97
PWMx Pull-down
Resistance
RPD_PWM
20
40
80
kΩ
–
P_12.11.98
kΩ
12)
P_12.11.99
µs
1)
P_12.11.105
CRC Select; Pin PWM1/CRC
Config Pull-up Resistance
Config Select Filter Time
100
RCFG
tCFG_F
5
10
14
1)
2)
3)
4)
5)
6)
7)
Not subject to production test, specified by design.
Independent from CPSTGA.
ICP = -12 mA for VS ≥ 8 V, ICP = 6 mA for VS = 6 V.
VGS(ON) = VGS(ON)1 if FET_LVL = 1, VGS(ON) = VGS(ON)2 if FET_LVL = 0.
Tj reference = 25°C
Valid for VS = 8 to 19 V, VS reference = 13.5 V
This resistance is the resistance between GHx and GND connected through a diode to SHx. As a consequence, the
voltage at SHx can rise up to 0.6 V typ. before it is discharged through the resistor.
8) Not subject to production test, specified by design.
9) External PWM signal.
10) Parameter dependent on the capacitance CCP.
11) CCPC1 = CCPC2 = 220 nF, CCP = 470 nF. Other CCP values higher than 470 nF can be used. Note that this capacitor
influences the charge pump rise and turn-on times, and the charge , VCP ripple voltage when charging the gate of a
MOSFET.
12) Config Pull-up will be only active during startup-phase for checking external pull-down. After checking, the typ. 40 kΩ
Pull-down resistance will be present.
Datasheet
113
Rev. 1.0
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TLE9564QX
BLDC Motor System IC
Supervision Functions
12
Supervision Functions
12.1
Reset Function
VCC1
RSTN
Reset logic
Incl. filter & delay
Figure 58
Reset Block Diagram
12.1.1
Reset Output Description
The reset output pin RSTN provides a reset information to the microcontroller, for example, in the event that
the output voltage has fallen below the undervoltage threshold VRTx. In case of a reset event, the reset output
RSTN is pulled to low after the filter time tRF and stays low as long as the reset event is present plus a reset
delay time tRD1 or tRD2 depending on the value in RSTN_DEL. When connecting the device to battery voltage,
the reset signal remains low initially. When the output voltage VCC1 has reached the reset default threshold
VRT1,r, the reset output RSTN is released to high after the reset delay time tRD1. A reset can also occur due to a
watchdog trigger failure. The reset threshold can be adjusted via SPI, the default reset threshold is VRT1,f. The
RSTN pin has an integrated pull-up resistor. In case reset is triggered, it will be pulled low for VCC1 ≥ 1V and
for VSINT ≥ VPOR,f (see also Chapter 12.3).
The timings for the RSTN triggering regarding VCC1 undervoltage and watchdog trigger is shown in Figure 59.
Datasheet
114
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Supervision Functions
VCC1
VRT1
t < tRF
The reset threshold can be
configured via SPI in
Normal Mode, default is VRT1
undervoltage
tRD1
tCW
tLW
tCW
SPI
SPI
Init
tOW
t
tLW
tOW
WD
Trigger
tCW
tRDx (config)
WD
Trigger
SPI
Init
t
tRF
RSTN
tLW= long open window
tCW= closed window
tOW= open window
t
Init
Normal
Restart
Normal
Reset_timing.vsd
Figure 59
Reset Timing Diagram
12.1.2
Soft Reset Description
In Normal Mode and Stop Mode, it is also possible to trigger a device internal reset via a SPI command in order
to bring the device into a defined state in case of failures. In this case the microcontroller must send a SPI
command and set the MODE bits to ‘11’ in the M_S_CTRL register. As soon as this command becomes valid,
the device is set back to Init Mode and all SPI registers are set to their default values (see SPI Chapter 13.5.1
and Chapter 13.6.1).
Two different soft reset configurations are possible via the SPI bit SOFT_RESET_RO:
•
SOFT_RESET_RO = ‘0’: The reset output (RSTN) is triggered when the soft reset is executed (default
setting) The configured reset delay time tRD1 or tRD2 is applied depending on the value in RSTN_DEL).
•
SOFT_RESET_RO = ‘1’: The reset output (RSTN) is not triggered when the soft reset is executed.
Note:
The device must be in Normal Mode or Stop Mode when sending this command.
Otherwise, the command will be ignored.
Note:
Allow CRC configuration after software-reset - or better check once again via SPI after software
reset.
Datasheet
115
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Supervision Functions
12.2
Watchdog Function
The watchdog is used to monitor the software execution of the microcontroller and to trigger a reset or move
the device to Fail Safe Mode, if the microcontroller stops serving the watchdog due to a lock up in the software.
Two different types of watchdog functions are implemented and can be selected via the bit WD_CFG:
•
Time-Out Watchdog (default value)
•
Window Watchdog
The respective watchdog functions can be selected and programmed in Normal Mode. The configuration stays
unchanged in Stop Mode.
Please refer to Table 30 to match the device modes with the respective watchdog modes.
Table 30
Watchdog Functionality by modes
Mode
Watchdog Mode
Remarks
Init Mode
Starts with Long Open
Window
Watchdog starts with Long Open Window after RSTN
is released.
Normal Mode
WD Programmable
Window Watchdog, Time-Out watchdog or switched
off for Stop Mode.
Stop Mode
Watchdog is fixed or off
Sleep Mode
Off
Device will start with Long Open Window when
entering Normal Mode.
Restart Mode
Off
Device will start with Long Open Window when
entering Normal Mode.
The watchdog timing is programmed via SPI command in the register WD_CTRL. As soon as the watchdog is
programmed, the timer starts with the new setting and the watchdog must be served. The watchdog is
triggered by sending a valid SPI-write command to the watchdog configuration register. The watchdog trigger
command is executed when the SPI command is interpreted.
When coming from Init Mode, Restart Mode or in certain cases from Stop Mode, the watchdog timer is always
started with a long open window. The long open window (tLW) allows the microcontroller to run its
initialization sequences and then to trigger the watchdog via SPI.
The watchdog timer period can be selected via SPI (WD_TIMER).The timer setting is valid for both watchdog
types.
The following watchdog timer periods are available:
•
WD Setting 1: 10 ms
•
WD Setting 2: 20 ms
•
WD Setting 3: 50 ms
•
WD Setting 4: 100 ms
•
WD Setting 5: 200 ms
•
WD Setting 6: 500 ms
•
WD Setting 7: 1 s
•
WD Setting 8: 10 s
In case of a reset, Restart Mode or Fail-Safe Mode is entered according to the configuration and the SPI bits
WD_FAIL are set. Once the RSTN goes high again the watchdog immediately starts with a long open window
the device enters automatically Normal Mode.
The Watchdog behaviour in Software Development Mode is described in Chapter 5.4.7.
Datasheet
116
Rev. 1.0
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TLE9564QX
BLDC Motor System IC
Supervision Functions
In case a watchdog-trigger was missed in Software Development Mode, the watchdog will start with the longopen-window once again.
The WD_FAIL bits will be set after a watchdog trigger failure.
The WD_FAIL bits are cleared automatically when following conditions apply:
•
After a successful watchdog trigger.
•
When the watchdog is off: in Stop Mode after successfully disabling it, in Sleep Mode, or in Fail-Safe Mode
(except for a watchdog failure).
12.2.1
Time-Out Watchdog
The time-out watchdog is an easier and less secure watchdog than a window watchdog as the watchdog
trigger can be done at any time within the configured watchdog timer period.
A correct watchdog service immediately results in starting a new watchdog timer period. Taking the
tolerances of the internal oscillator into account leads to the safe trigger area as defined in Figure 60.
If the time-out watchdog period elapses, a watchdog reset is created by setting the reset output RSTN low and
the device switches to Restart Mode or Fail-Safe Mode.
Typical timout watchdog trigger period
t WD x 1.50
open window
uncertainty
Watchdog Timer Period (WD_TIMER)
tWD x 1.20
t / [tWD_TIMER]
safe trigger area
Figure 60
Datasheet
t WD x 1.80
Time-out Watchdog Definitions
117
Rev. 1.0
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TLE9564QX
BLDC Motor System IC
Supervision Functions
12.2.2
Window Watchdog
Compared to the time-out watchdog the characteristic of the window watchdog is that the watchdog timer
period is divided between a closed and an open window. The watchdog must be triggered within the open
window.
A correct watchdog trigger results in starting the window watchdog period by a closed window followed by an
open window.
The watchdog timer period is at the same time the typical trigger time and defines the middle of the open
window. Taking the oscillator tolerances into account leads to a safe trigger area of:
tWD × 0.72 < safe trigger area < tWD × 1.20.
The typical closed window is defined to a width of 60% of the selected window watchdog timer period. Taking
the tolerances of the internal oscillator into account leads to the timings as defined in Figure 61.
A correct watchdog service immediately results in starting the next closed window.
If the trigger signal meet the closed window or if the watchdog timer period elapses, then a watchdog reset is
triggered (RSTN low) and the device switches to Restart Mode or Fail-Safe Mode.
tWD x 0.6
tWD x 0.9
Typ. closed window
Typ. open window
tWD x 0.48
closed window
tWD x 0.72
uncertainty
tWD x 1.0
open window
tWD x 1.20
tWD x 1.80
uncertainty
Watchdog Timer Period (WD_TIMER)
t / [tWD _TIMER ]
safe trigger area
Figure 61
Window Watchdog Definitions
12.2.3
Watchdog Setting Check Sum
A check sum bit is part of the SPI command to trigger the watchdog and to set the watchdog setting.
The sum of the 16 data bits in the register WD_CTRL needs to have even parity (see Equation (12.1)). This is
realized by either setting the bit CHECKSUM to 0 or 1. If the check sum is wrong, then the SPI command is
ignored, i.e. the watchdog is not triggered or the settings are not changed and the bit SPI_FAIL is set.
The written value of the reserved bits of the WD_CTRL register is considered (even if read as ‘0’ in the SPI
output) for checksum calculation, i.e. if a 1 is written on the reserved bit position, then a 1 will be used in the
checksum calculation.
(12.1)
Bit ( CHECKSUM ) = Bit22 ⊕ … ⊕ Bit8
Datasheet
118
Rev. 1.0
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TLE9564QX
BLDC Motor System IC
Supervision Functions
12.2.4
Watchdog during Stop Mode
The watchdog can be disabled for Stop Mode in Normal Mode. For safety reasons, there is a special sequence
to be followed in order to disable the watchdog as described in Figure 62. Two different SPI bits
(WD_STM_EN_0, WD_STM_EN_1) in the registers HW_CTRL and WD_CTRL need to be set.
Correct WD disabling
sequence
Sequence Errors
Missing to set bit
WD_STM_EN_0 with the
next watchdog trigger after
having set WD_STM_EN_1
Set bit
WD_STM_EN_1 = 1
with next WD Trigger
Staying in Normal Mode
instead of going to Stop
Mode with the next trigger
Set bit
WD_STM_EN_0 = 1
Before subsequent WD Trigger
Will enable the WD:
Change to
Stop Mode
Switching back to
Normal Mode
Triggering the watchdog
WD is switched off
Figure 62
Watchdog disabling sequence in Stop Mode
If a sequence error occurs, then the bit WD_STM_EN_1 will be cleared and the sequence has to be started
again.
The watchdog can be enabled by triggering the watchdog in Stop Mode or by switching back to Normal Mode
via SPI command. In both cases the watchdog will start with a long open window and the bits WD_STM_EN_1
and WD_STM_EN_0 are cleared. After the long open window the watchdog has to be served as configured in
the WD_CTRL register.
Note:
The bit WD_STM_EN_0 will be cleared automatically when the sequence is started and it was 1
before. WD_STM_EN_0 can also not be set if WD_STM_EN_1 isn't yet set.
12.2.5
Watchdog Start in Stop Mode due to Bus Wake
In Stop Mode the Watchdog can be disabled. In addition a feature is available which will start the watchdog
with any BUS wake (LIN) during Stop Mode. The feature is enabled by setting the bit WD_EN_ WK_BUS = 1
(default value after POR). The bit can only be changed in Normal Mode and needs to be programmed before
starting the watchdog disable sequence.
A wake on the Bus will generate an interrupt and the RXDLIN is pulled to low. By these signals the
microcontroller is informed that the watchdog is started with a long open window. After the long open
window the watchdog has to be served as configured in the WD_CTRL register.
To disable the watchdog again, the device needs to be switched to Normal Mode and the sequence needs to
be sent again.
Datasheet
119
Rev. 1.0
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BLDC Motor System IC
Supervision Functions
12.3
VSINT Power On Reset
At power up of the device, the Power on Reset is detected when VSINT > VPOR,r and the SPI bit POR is set to
indicate that all SPI registers are set to POR default settings. VCC1 is starting up and the reset output will be
kept low and will only be released once VCC1 has crossed VRT1,r and after tRD1 has elapsed.
In case VSINT < VPOR,f, an device internal reset will be generated and the device is switched off and will restart
in Init Mode at the next VSINT rising. This is shown in Figure 63.
VSINT
VPOR,r
VPOR,f
t
VCC1
VRT1,r
The reset threshold can be
configured via SPI in
Normal Mode, default is VRT1
VRTx,f
t
RSTN
Restart Mode is entered
whenever the Reset is
triggered
t
tRD1
Mode
OFF
INIT MODE
Any MODE
Restart
OFF
t
SPI
Command
Figure 63
Datasheet
Ramp up / down example of Supply Voltage
120
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Supervision Functions
12.4
VSINT Under- and Overvoltage
12.4.1
VSINT Undervoltage
The VSINT under-voltage monitoring is always active in Init Mode, Restart Mode, Normal Mode. If the supply
voltage VSINT drops below VSINT,UV for more than tVSUV_FILT, then the device does the following measures:
•
The VCC1 short circuit diagnosis becomes inactive (see Chapter 12.8). However, the thermal protection of
the device remains active. If the undervoltage threshold is exceeded (VSINT rising) then the function will
be automatically enabled again.
•
The status bit VSINT_UV is set and latched until a clear command of SUP_STAT is received.
Note:
VSINT under-voltage monitoring is not available in Stop Mode due to current consumption saving
requirements except if the VCC1 load current is above the active peak threshold (I_PEAK_TH) or if
VCC1 is below the VCC1 prewarning threshold.
12.4.2
VSINT Overvoltage
The VSINT over-voltage monitoring is always active in Init Mode, Restart Mode and Normal Mode. If VSINT rises
above VS,OVD1, VS,OVD2 for more than tVSOV_FILT then the device does the following measures:
1. If HBxMODE = 01b or 10b , then the corresponding MOSFETs are actively turned off with their static
discharge current during their respective tHBxCCP Active.
2. Then the charge pump is turned off and the passive discharge is activated.
3. The status bits VSINT_OV is set and latched until a clear command of SUP_STAT is received.
If VS or VSINT fall below VS,OVD1 or VS,OVD2:
•
If CPEN = 0 : the charge pumps stays and the bridge driver stay off.
•
If CPEN = 1 :
– If BDOV_REC = 0 : Then the charge pump is reactivated but the bridge driver stays off until VS_OV and
VSINT_OV are cleared. The current sense amplifier is reactivated (provided that CSA_OFF = 0)
– If BDOV_REC = 1 : Then the charge pump and the current sense amplifier are reactivated and the bridge
driver is enabled if VCP > VCPUVx, even if VS_OV or VSINT_OV is set. The state of the external MOSFETs is
according to the control registers.
Datasheet
121
Rev. 1.0
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TLE9564QX
BLDC Motor System IC
Supervision Functions
12.5
VS Under- and Overvoltage
12.5.1
VS Undervoltage
The VS under-voltage monitoring is always active in Init-, Restart Mode and Normal Mode. If VS drops below
VS,UV for more than tVSUV_FILT, then the device does the following measures:
1. If HBxMODE = 01b or 10b , then the corresponding MOSFETs are actively turned off with their static
discharge current during their respective tHBxCCP Active.
2. Then the charge pump is turned off and the passive discharge is activated and the current sense amplifier
is turned off.
3. The status bits VS_UV is set and latched until a clear command of SUP_STAT is received.
If VS rises above VS,UV, then the charge pump is reactivated (provided that CPEN is set) and the current sense
amplifier is reactivated (provided CSA_OFF = 0) but the bridge driver stays off until VS_UV is cleared. The
bridge driver will be reactivated once the VS_UV bit is cleared.
12.5.2
VS Overvoltage
The VS over-voltage monitoring is always active in Init-, Restart Mode and Normal Mode or when the charge
pump is enabled. If VS rises above VS,OVD1 or VS,OVD2 for more than tVSOV_FILT, then the device does the following
measures:
1. If HBxMODE = 01b or 10b , then the corresponding MOSFETs are actively turned off with their static
discharge current during their respective tHBxCCP Active.
2. Then the charge pump is turned off and the passive discharge is activated and current sense amplifier is
turned off .
3. The status bits VS_OV is set and latched until a clear command of SUP_STAT is received.
If VS and VSINT fall below VS,OVD1 or VS,OVD2:
•
If CPEN = 0 : the charge pumps and the bridge driver stay off.
•
If CPEN = 1 :
– If BDOV_REC = 0 : Then the charge pump is reactivated but the bridge driver stays off until VS_OV and
VSINT_OV are cleared. The current sense amplifier is reactivated provided that CSA_OFF = 0
– If BDOV_REC = 1 : Then the charge pump and the current sense amplifier are reactivated and the bridge
driver is enabled if VCP > VCPUVx, even if VS_OV or VSINT_OV is set. The state of the external MOSFETs is
according to the control registers.
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12.6
VS Under- Overvoltage for high-side
12.6.1
VS Undervoltage for high-side
If the supply voltage VS passes below the undervoltage threshold (VSHS,UVD) the device does the following
measures:
•
HS1...3 are acting accordingly to the SPI setting (refer also to Chapter 7.2.1).
•
LIN: Transmitter and Receiver are disabled during the VS undervoltage condition.
•
SPI bit HS_UV is set. No other error bits are set. The bit can be cleared once the condition is not present
anymore.
12.6.2
VS Overvoltage for high-side
If the supply voltage VSHS reaches the overvoltage threshold (VSHS,OVD) the device triggers the following
measures:
•
HS1...3 are acting accordingly to the SPI setting (refer also to Chapter 7.2.2).
•
The status bit HS_OV is set. No other error bits are set. The bit can be cleared once the condition is not
present anymore.
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12.7
VCC1 Over-/ Undervoltage and Undervoltage Prewarning
12.7.1
VCC1 Undervoltage and Undervoltage Prewarning
This function is always active when the VCC1 voltage regulator is enabled.
A first-level voltage detection threshold is implemented as a prewarning for the microcontroller. The
prewarning event is signaled with the bit VCC1_WARN. No other actions are taken.
As described in Chapter 12.1 and Figure 64, a reset will be triggered (RSTN pulled low) when the VCC1 output
voltage falls below the selected undervoltage threshold (VRTx). The device will enter Restart Mode and the bit
VCC1_UV is set when RSTN is released again.
The hysteresis of the VCC1 undervoltage threshold can be increased by setting the bit RSTN_HYS. In this case
always the highest rising threshold (VRT1,R) is used for the release of the undervoltage reset. The falling reset
threshold remains as configured.
An additional safety mechanism is implemented to avoid repetitive VCC1 undervoltage resets due to high
dynamic loads on VCC1:
•
A counter is increased for every consecutive VCC1 undervoltage event (regardless on the selected reset
threshold).
•
The counter is active in Init Mode, Normal Mode and Stop Mode.
•
For VS < VSINT,UV the counter will be stopped in Normal Mode (i.e. the VS UV comparator is always enabled
in Normal Mode).
•
A 4th consecutive VCC1 undervoltage event will lead to Fail-Safe Mode entry and to setting the bit
VCC1_UV_FS.
•
This counter is cleared:
– When Fail-Safe Mode is entered.
– When the bit VCC1_UV is cleared.
– When a Soft-Reset is triggered.
Note:
After 4 consecutive VCC1_UV events, the device will enter Fail-Safe Mode and the VCC1_UV_FS bit is
set.
Note:
The VCC1_WARN or VCC1_UV bits are not set in Sleep Mode as VCC1 = 0 V in this case.
VCC1
VRTx
tRF
t
tRDx (config)
RSTN
t
Normal Mode
Figure 64
Datasheet
Restart Mode
Normal Mode
VCC1 Undervoltage Timing Diagram
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Note:
It is recommended to clear the VCC1_WARN and VCC1_UV bit once it is detected by the
microcontroller software to verify if the undervoltage still exists or not.
12.7.2
VCC1 Overvoltage
For fail-safe reasons a configurable VCC1 over voltage detection feature is implemented. It is active when the
VCC1 voltage regulator is enabled.
In case the VCC1,OV,r threshold is crossed, the device triggers following measures depending on the
configuration:
•
The bit VCC1_OV is always set.
•
Based on the configuration of VCC1_OV_MOD, different kind of event are generated from device.
•
If the VCC1_OV_MOD=11B, in case of the device enters in Fail Safe Mode.
VCC1
VCC1,OV
t
tOV_filt
RSTN
tRDx (config)
t
Normal Mode
Restart Mode
Figure 65
VCC1 Over Voltage Timing Diagram
12.8
VCC1 Short Circuit Diagnostics
Normal Mode
The short circuit protection feature for VCC1 is implemented as follows:
•
The short circuit detection is only enabled if VS > VSINT,UV.
•
If VCC1 is not above the VRTx within tVCC1,SC after device power up or after waking from Sleep Mode or FailSafe Mode (i.e. after VCC1 is enabled) then the SPI bit VCC1_SC bit is set, VCC1 is turned off, the FO pin is
enabled, FAILURE is set and Fail-Safe Mode is entered. The device can be activated again via a wake-up
sources.
•
The same behavior applies, if VCC1 falls below VRTx for longer than tVCC1,SC.
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12.9
Thermal Protection
Three independent and different thermal protection features are implemented in the device according to the
system impact:
•
Individual thermal shutdown of specific blocks
•
Temperature prewarning of VCC1 voltage regulator
•
Device thermal shutdown due to VCC1 overtemperature
12.9.1
Individual Thermal Shutdown
As a first-level protection measure, LIN, HSx and the charge pump are independently switched off if the
respective block reaches the temperature threshold TjTSD1. Then the TSD1 bit is set. This bit can only be
cleared via SPI once the overtemperature is not present anymore. Independent of the device mode the
thermal shutdown protection is only active if the respective block is ON.
The respective modules behave as follows:
•
LIN: The transmitter is disabled and stays in LIN Normal Mode acting like LIN Receive Only Mode. The status
bits LIN_FAIL are set to ‘01’. Once the over temperature condition is not present anymore, then the LIN
transmitter is automatically switched on.
•
HSx: If one or more HSx switches reach the TSD1 threshold, then the HSx switches are turned OFF
(depending on configuration either individually or all at once) and the control bits for HSx are cleared
based on HS_OT_SD_DIS setting. The status bits HSx_OT are set (see register HS_OL_OC_OT_STAT).
Once the over temperature condition is not present anymore, then HSx has to be configured again by SPI.
•
Charge pump: If the charge pump reaches TjTSD1, then CP_OT is set, CPEN is cleared and the activated
MOSFETs are actively discharged with their respective static currents during their respective active cross
current protection times (tHBxCCP active). When all tHBxCCP active elapsed, then the charge pump and
the MOSFETs active discharge are disabled and the current sense amplifier is deactivated. Once the over
temperature condition is not present anymore, then CPEN has to be configured again by SPI.
Note:
The diagnosis bits are not cleared automatically and have to be cleared via SPI once the
overtemperature condition is not present anymore.
12.9.2
Temperature Prewarning
As a next level of thermal protection a temperature prewarning is implemented if the main supply VCC1
reaches the thermal prewarning temperature threshold TjPW. Then the status bit TPW is set. This bit can only
be cleared via SPI once the overtemperature is not present anymore.
12.9.3
Thermal Shutdown
As a highest level of thermal protection a temperature shutdown of the device is implemented if the main
supply VCC1 reaches the thermal shutdown temperature threshold TjTSD2. Once a TSD2 event is detected FailSafe Mode is entered. Only when device temperature falls below the TSD2 threshold then the device remains
in Fail-Safe Mode for tTSD2 to allow the device to cool down. After this time has expired, the device will
automatically change via Restart Mode to Normal Mode (see also Chapter 5.4.6).
When a TSD2 event is detected, then the status bit TSD2 is set. This bit can only be cleared via SPI in Normal
Mode once the overtemperature is not present anymore.
For increased robustness requirements it is possible to extend the TSD2 waiting time by 64x of tTSD2 after 16
consecutive TSD2 events by setting the SPI bit TSD2_DEL. The counter is incremented with each TSD2 event
even if the bit TSD2 is not cleared. Once the counter has reached the value 16, then the bit TSD2_SAFE is set
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and the extended TSD2 waiting time is active. The extended waiting time will be kept until TSD2_SAFE is
cleared. The TSD counter is cleared when TSD2 or TSD2_DEL is cleared.
Note:
In case a TSD2 overtemperature occurs while entering Sleep Mode then Fail-Safe Mode is still
entered.
Note:
In case of a TSD2 event, the FAILURE bit is set to ‘1’ and the DEV_STAT field is set to ‘01’ inside the
DEV_STAT register.
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12.10
Bridge driver
This section describes the supervision functions related to the bridge driver.
12.10.1
Bridge driver supervision with activated charge pump
This section describes the supervision functions when the charge pump is activated.
12.10.1.1 Drain-source voltage monitoring
Voltage comparators monitor the activated MOSFETs to protect high-side MOSFETs and low-side MOSFETs
against a short circuit respectively to ground and to the battery during ON-state.
A drain-source overvoltage is detected on a low-side MOSFET if the voltage difference between VSHx and SL
exceeds the threshold voltage configured by LS_VDS (see Table 31). Consequently, the corresponding halfbridge is latched off with the static discharge current.
A drain-source overvoltage is detected on a high-side MOSFET if the voltage difference between VS and VSHx
exceeds the threshold voltage configured by HS_VDS (see Table 32). Consequently, the corresponding halfbridge is latched off with the static discharge current.
Table 31
Low-side drain-source overvoltage threshold
LSxVDSTH[2:0]
Drain-Source overvoltage threshold for LSx (typical)
000B
160 mV
001B
200 mV (default)
010B
300 mV
011B
400 mV
100B
500 mV
101B
600 mV
110B
800 mV
111B
2V
Table 32
High-side drain-source overvoltage threshold
HSxVDSTH[2:0]
Drain-Source overvoltage threshold for HSx (typical)
000B
160 mV
001B
200 mV (default)
010B
300 mV
011B
400 mV
100B
500 mV
101B
600 mV
110B
800 mV
111B
2V
Attention: 2 V threshold is dedicated for the diagnostic in off-state. It is highly recommended to select
another drain-source overvoltage threshold once the routine of the diagnostic in off-state has
been performed to avoid additional current consumption from VS and from the charge pump.
The device reports a Drain-Source overvoltage error if both conditions are met:
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•
After expiration of the blank time .
•
If the Drain-Source voltage monitoring exceeds the configured threshold for a duration longer than the
configured filter time (refer to Table 33 and LS_VDS TFVDS bits).
Table 33
Drain-Source overvoltage filter time
TFVDS[2:0]
Drain-Source overvoltage filter time (typical)
00B
0.5 µs (default)
01B
1 µs
10B
2 µs
11B
6 µs
If a short circuit is detected by the Drain-Source voltage monitoring:
•
The impacted half-bridge is latched off with the static discharge current for the configured cross-current
protection time.
•
The corresponding bit in the status register DSOV is set.
•
The DSOV bit in Global Status Register GEN_STAT is set.
If a Drain-Source overvoltage is detected for one of the MOSFETs, then the status register DSOV must be
cleared in order to re-enable the faulty half-bridge.
12.10.1.2 Cross-current protection and drain-source overvoltage blank time
All gate drivers feature a cross-current protection time and a Drain-Source overvoltage blank time.
The cross-current protection avoids the simultaneous activation of the high-side and the low-side MOSFETs
of the same half-bridge.
During the blank time, the drain-source overvoltage detection is disabled, to avoid a wrong fault detection
during the activation phase of a MOSFET.
Note:
The setting of the cross-current protection and of the blank times may be changed by the
microcontroller only if all HBx_PWM_EN bits are reset.
Note:
Changing the Drain-Source overvoltage of a half-bridge x (HBx) in on-state (HBxMODE[1:0]=(0,1) or
(1,0)) may result in a wrong VDS overvoltage detection on HBx. Therefore it is highly recommended
to change this threshold when HBxMODE[1:0]=(0,0) or (1,1)
12.10.1.2.1 Cross-current protection
The active and freewheeling cross-current protection times of each half-bridge is configured individually with
the control register CCP_BLK.
The typical cross-current protection time applied to the freewheeling MOSFET of the half-bridge x is 587 ns +
266 ns x TCCP[3:0]D, where TCCP[3:0]D is the decimal value of the control bits TCCP.
12.10.1.2.2 Drain-source overvoltage blank time
A configurable blank time for the Drain-Source monitoring is applied at the turn-on of the MOSFETs. During
the blank time, a Drain-Source overvoltage error is masked.
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For Half-Bridges in PWM mode with AFWx = 1:
•
the blank time of the PWM MOSFET starts at the expiration of the cross-current protection time of the PWM
MOSFET. Refer to Figure 66.
•
the blank time of the free-wheeling MOSFET starts after expiration of the cross-current protection time at
turn-off of the PWM MOSFET. Refer to Figure 66.
PWM
t
IGS_PWM
MOSFET
tPCHGz
Post-charge
ICHGMAXz
IPRECHGz
tPDCHGz
ICHGz
t
0
- IDCHGz
- IPREDCHGz
tHBxCPP
tBLANK for
PWM MOSFET
tHBxCPP for
symmetrisation
tHBxCPP
IGS Freewheeling
MOSFET
ICHGMAXz
t
tBLANK for
freewheeling MOSFET
- ICHGMAXz
Figure 66
Blank time for half-bridges in PWM operation with AFW = 1
For statically activated half-bridges, the blank time starts:
•
Case1: at expiration of the cross-current protection (Figure 36), if the opposite MOSFET was previously
activated.
•
Case 2: right after the decoding of the SPI command to turn on a MOSFET, if the half-bridge was in high
impedance (Figure 37).
The blank times of the active and FW MOSFETs can be configured with the control register CCP_BLK.
The typical blank is 587 ns + 266 ns x TBLK[3:0]D).
Note:
The blank time is implemented at every new activation of a MOSFET, including a recovery from VS
undervoltage, VS overvoltage, VSINT overvoltage, CP UV, CP OT.
12.10.1.3 OFF-state diagnostic
In order to support the off-state diagnostic (HBxMODE= 11 and CPEN = 1), the gate driver of each MOSFET
provides pull-up (IPUDiag) and a pull-down currents (IPDDiag) at the SHx pins. This function requires an activated
charge pump.
The pull-up current source of a given half-bridge is on when the half-bridge is active: HBxMODE= 01, 10 or 11
and CPEN = 1.
The pull-down current of each low-side gate driver is activated by the control bits HBx (HB_ICHG_MAX
register).
During the off-state diagnostic routine performed by the microcontroller, the drain-source overvoltage
threshold of the relevant half-bridges must be set to 2V nominal. Refer to Table 31. Once the routine is
finished, it is highly recommended to decrease the drain-source overvoltage threshold to a lower value,
avoiding additional current consumption from the VS input.
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The following failures can be detected:
•
MOSFET short circuit to GND
•
MOSFET short circuit the battery
•
Open load (disconnected motor)
The status of the output voltages VOUTx, can be read back with status bit HBxVOUT (register GEN_STAT) when
the corresponding half-bridge is in off-state (HBxMODE[1:0] = 11).
Note:
HBxVOUT = 0 if the half-bridge x is not actively off (HBxMODE[1:0] = (0,0), (0,1) or (1,0) and CPEN=1)
or when the charge pump is deactivated (CPEN=0).
12.10.1.4 Charge pump undervoltage
The voltage of the charge pump output (VCP) is monitored in order to ensure a correct control of the external
MOSFETs.
The charge pump undervoltage threshold is configurable by the control bits FET_LVL and CPUVTH.
Table 34
Charge pump undervoltage thresholds
FET_LVL = 0
FET_LVL = 1
CPUVTH = 0
VCPUV1 (6 V typ. referred to VS)
VCPUV3 (7.5 V typ. referred to VS)
CPUVTH = 1
VCPUV2 (6.5 V typ. referred to VS)
VCPUV4 (8 V typ. referred to VS)
If VCP falls below the configured charge pump undervoltage threshold while CPEN = 1:
•
If one of the MOSFET is on, then all MOSFETs are actively turned off with their configured static discharge
current during their respective tHBxCCP active.
•
Then the gate drivers are turned off and CSA is turned off .
•
CP_UV is set and latched.
The CP_UV is reset and the normal operation is resumed once SUP_STAT is cleared and VCP > VCPUV.
The charge pump undervoltage detection is blanked (tCPUVBLANK) during each new activation of the charge
pump1).
12.10.1.5 Switching parameters of MOSFETs in PWM mode
The effective switching parameters of the active MOSFETs (EN_GEN_CHECK=1), respectively PWM MOSFET
(EN_GEN_CHECK=0)can be read out with dedicated status registers:
•
The turn-on and turn off delays, noted tDON and tDOFF are reported by the status register
EFF_TDON_OFF1, EFF_TDON_OFF2, EFF_TDON_OFF3.
•
The rise and fall times, noted tRISE and tFALL, are reported by the status register TRISE_FALL1,
TRISE_FALL2, TRISE_FALL3.
12.10.2
Low-side drain-source voltage monitoring during braking
The low-side MOSFETs are turned-on while the charge pump is deactivated in the following conditions:
•
The slam mode is activated and PWM1/CRC is High.
1) Including CPEN set to 1, recovery from VS under/overvoltage, VSINT overvoltage and CP_ OT
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•
The parking braking mode is activated and the device is in Sleep Mode or Stop Mode.
•
VS overvoltage brake is activated and (VS > VS Overvoltage braking or VSINT > VSINT Overvoltage braking)
in all device modes if OV_BRK_EN is set.
Under these conditions, the drain-source voltage of the low-sides are monitored and the applied drain-source
overvoltage thresholds are according to VDSTH_BRK.
The applied blank time, which starts at the beginning of the brake activation, is:
•
tBLK_BRAKE1 if TBLK_BRK = 0
•
tBLK_BRAKE2 if TBLK_BRK = 1
During the blank time, a drain-source overvoltage of the low-sides is masked.
The applied filter time is tFVDS_BRAKE.
If a drain-source overvoltage is detected during braking , then all low-side MOSFETs are turned off (latched)
within tOFF_BRAKE. SLAM_LSx_DIS (BRAKE, SLAM, PARK_BRK_EN, OV_BRK_EN are unchanged. The
corresponding status bit LSxDSOV_BRK is set in DSOV.
The low-sides can be reactivated only if all LSxDSOV_BRK bits (DSOV) are cleared (even in slam mode with the
respective LSx disabled by the SLAM_LSx_DIS bit).
If any of the status bits LSxDSOV_BRK is set, then the charge pump stays off (CPEN=1 command is accepted
but the charge pump stays disabled until all LSxDSOV_BRK are cleared).
12.10.3
VS or VSINT Overvoltage braking
The VS and VSINT overvoltage braking is activated if the OV_BRK_EN bit in BRAKE register is set regardless of
the device mode.
If VS, respectively VSINT, exceeds VOVBR,cfgx,r (x = 0 to 7), then all low-sides MOSFETs are turned-on within
tON_BRAKE. The status bits VSOVBRAKE_ST, respectively VSINTOVBRAKE_ST, is set and latched (see DSOV
register).
If VS and VSINT decrease below VOVBR,cfgx,r - VHYS,cfgx (x = 0 to 7), then all low-sides MOSFETs are turned-off within
tOFF_BRAKE after the filter time tOV_BR_FILT.
If (VSHx - VSL) exceeds the configured threshold, then all low-sides MOSFETs are turned-off within tOFF_BRAKE
after the filter time tFVDS_BRAKE. The threshold is:
•
VVDSMONTH0_BRAKE if VDSTH_BRK = 0
•
VVDSMONTH1_BRAKE if VDSTH_BRK = 1
12.11
Current sense amplifier
The current sense amplifier (CSA) allows current measurements with external shunt resistor in low-side
configuration. The CSA is supplied by the charge pump (CP). Therefore, if the CP is off, then the CSA is
deactivated.
12.11.1
Unidirectional and bidirectional operation
The current sense amplifier (CSA) can work either as unidirectional or bi-directional operation. Refer to CSA
register.
Unidirectional operation CSD = 0
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In unidirectional operation, the CSA is optimized to measure the current flowing through the external shunt
resistor when VCSAP ≥ VCSAN.
VCSO = VREF Unidir + (VCSAP - VCSAN + VOS) × GDIFF provided that VCSO is in the linear range1) 2).
Bidirectional operation CSD = 1
In bidirectional operation, the CSA measures the current flowing through the external shunt resistor in both
directions: VCSAP ≥ VCSAN or VCSAP ≤ VCSAN.
The output CSO works at half-scale range: VCSO = VREF Bidir+ (VCSAP - VCSAN + VOS) × GDIFF, provided that VCSO
is in the linear range 2).
12.11.2
Gain configuration
The gain of the current sense amplifier is configurable by the configuration bits CSAG bits. Refer to Table 35.
Table 35
Configuration of the current sense amplifier gain
CSAG[1:0]
Current sense amplifier gain GDIFF
00B
GDIFF10
01B
GDIFF20
10B
GDIFF40
11B
GDIFF60
12.11.3
Overcurrent Detection
A comparator at CSO detects overcurrent conditions. The overcurrent threshold is configurable with the OCTH
bits. Refer to Table 36 for unidirectional operation and Table 37 for bidirectional operation.
Table 36
Overcurrent detection thresholds in unidirectional operation (CSD = 0)
OCTH[1:0]
Typical Overcurrent Detection Threshold
00B
VCSO > VCC1/2
01B
VCSO > VCC1 /2+ VCC1/10
10B
VCSO > VCC1 /2+ 2 × VCC1/10
11B
VCSO > VCC1/2 /2+ 3 × VCC1/10
1) Valid if 0.5 V ≤ VCSO ≤ VCC1 - 0.5 V.
2) VCSO is clamped between VCC1 and GND.
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VCSO
CSO unidirectional overcurrent detection threshold
VCC1
OCTH[1:0]
VCC1 / 2 + 3 x VCC1 / 10
VOCTH4 Unidir
(1,1)
VCC1 / 2 + 2 x VCC1 / 10
VOCTH3 Unidir
(1,0)
VCC1 / 2 + VCC1 / 10
VOCTH2 Unidir
(0,1)
VCC1 / 2
VOCTH1 Unidir
(0,0)
VREF Unidir
Typ. VCC1/5
0V
Figure 67
Datasheet
Overcurrent detection thresholds in unidirectional operation (CSD = 0)
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Table 37
Overcurrent detection thresholds in bidirectional operation (CSD = 1)
OCTHx[1:0]
Typical Overcurrent Detection Threshold
00B
VCSO > VCC1/2 + 2 × VCC1/20 or VCSO< VCC1/2 -2 × VCC1/20
01B
VCSO > VCC1/2 + 4 × VCC1/20 or VCSO< VCC1/2 - 4 × VCC1/20
10B
VCSO > VCC1/2+ 5 × VCC1/20 or VCSO< VCC1/2 - 5 × VCC1/20
11B
VCSO > VCC1/2+ 6 × VCC1/20 or VCSO< VCC1/2 - 6 × VCC1/20
VCSO
CSO bidirectional overcurrent detection threshold
VCC1
OCTH[1:0]
VCC1 / 2 + 6 x VCC1 / 20
VCC1 / 2 + 5 x VCC1 / 20
VCC1 / 2 + 4 x VCC1 / 20
VOCTH4 BidirH
VOCTH3 BidirH
VOCTH2 BidirH
(1,1)
(1,0)
(0,1)
VCC1 / 2 + 2 x VCC1 / 20
VOCTH1 BidirH
(0,0)
VCC1 / 2 - 2 x VCC1 / 20
VOCTH1 BidirL
(0,0)
VCC1 / 2 - 4 x VCC1 / 20
VCC1 / 2 - 5 x VCC1 / 20
VCC1 / 2 - 6 x VCC1 / 20
VOCTH2 BidirL
(0,1)
VOCTH3 BidirL
(1,0)
(1,1)
VREF Bidir
Typ. VCC1 /2
VOCTH4 BidirL
0V
Figure 68
Overcurrent detection thresholds in bidirectional operation (CSD = 1)
It is possible to program the device behavior when an overcurrent condition is detected:
•
OCEN bit = 0 (see CSA): the device only reports the overcurrent event ( bit is set), without any change of the
gate driver states.
•
OCEN bit = 1 (see CSA): the device reports the overcurrent event ( bit is set) and actively turns off all
MOSFETs with static discharge curent:
– The MOSFETs can be reactivated by clearing OC_CSA or by resetting the OCEN bit.
The overcurrent filter time is configurable (refer to tFOC) by the OCFILT control bits.
tFOC refers to the output of the current sense amplifier. The CSO settling time (2 µs max, tSET) and the analog
propagation delay (< 1 µs) are not taken into account by the overcurrent filter time.
12.11.4
CSO output capacitor
The capacitor connected to CSO (CCSO) must be between 10 pF and 2.2 nF. The control bit CSO_CAP
optimizes the current consumption for CCSO < 400 pF or 400 pF < CCSO < 2.2 nF1).
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12.12
Electrical Characteristics
Table 38
Electrical Characteristics
VSINT = 5.5 V to 28 V; Tj = -40°C to +150°C; Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin; unless otherwise specified.
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note or
Test Condition
Number
VCC1 Monitoring; VCC1 = 5.0V Version
Undervoltage Prewarning
Threshold Voltage PW,f
VPW,f
4.53
4.70
4.84
V
VCC1 falling,
SPI bit is set
P_13.12.1
Undervoltage Prewarning
Threshold Voltage PW,r
VPW,r
4.60
4.75
4.90
V
VCC1 rising
P_13.12.2
Undervoltage Prewarning
Threshold Voltage
hysteresis
VPW,hys
30
50
90
mV
6)
P_13.12.3
VCC1 UV Prewarning
Detection Filter Time
tVCC1,PW_F
5
10
14
us
2)
rising and falling P_13.12.4
Reset Threshold
Voltage RT1,f
VRT1,f
4.45
4.6
4.75
V
default setting;
VCC1 falling
P_13.12.5
Reset Threshold
Voltage RT1,r
VRT1,r
4.58
4.74
4.90
V
default setting;
VCC1 rising
P_13.12.6
Reset Threshold
Voltage RT2,f
VRT2,f
3.70
3.85
4.00
V
VCC1 falling
P_13.12.7
Reset Threshold
Voltage RT2,r
VRT2,r
3.85
4.0
4.15
V
VCC1 rising
P_13.12.8
Reset Threshold
Voltage RT3,f
VRT3,f
3.24
3.40
3.55
V
VS ≥ 4 V;
VCC1 falling
P_13.12.9
Reset Threshold
Voltage RT3,r
VRT3,r
3.39
3.54
3.70
V
VS ≥ 4 V;
VCC1 rising
P_13.12.10
Reset Threshold
Voltage RT4,f
VRT4,f
2.49
2.65
2.8
V
VS ≥ 4 V;
VCC1 falling
P_13.12.11
Reset Threshold
Voltage RT4,r
VRT4,r
2.65
2.76
2.95
V
VS ≥ 4 V;
VCC1 rising
P_13.12.12
Reset Threshold Hysteresis VRT,hys
70
140
220
mV
6)
P_13.12.13
VCC1 Over Voltage
Detection Threshold
Voltage
VCC1,OV,r
5.5
5.65
5.8
V
1)6)
VCC1 Over Voltage
Detection Threshold
Voltage
VCC1,OV,f
5.4
5.55
5.7
V
6)
VCC1 OV Detection Filter
Time
tVCC1,OV_F
51
64
80
us
2)
rising VCC1
P_13.12.26
falling VCC1
P_13.12.27
P_13.12.31
1) for 400 pF < CCSO < 2.2 nF, a seial resistor of min. 45 Ohm between the CSO pin and the CCSO capacitor is required,
Datasheet
136
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Supervision Functions
Table 38
Electrical Characteristics (cont’d)
VSINT = 5.5 V to 28 V; Tj = -40°C to +150°C; Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin; unless otherwise specified.
Parameter
Symbol
Values
Unit
Note or
Test Condition
Number
Min.
Typ.
Max.
tVCC1,SC
3.2
4
4.8
ms
2)
blanking time
during power-up,
short circuit
detection for
VS ≥ VS,UV
P_13.12.32
VRSTN,L
–
0.2
0.4
V
IRSTN = 1 mA for
VCC1 ≥ 1 V &
VS ≥ VPOR,f
P_13.12.33
Reset High Output Voltage VRSTN,H
0.8 x
VCC1
–
VCC1 +
0.3 V
V
IRSTN = -20 µA
P_13.12.34
Reset Pull-up Resistor
RRSTN
10
20
40
kΩ
P_13.12.35
Reset Filter Time
tRF
4
10
26
µs
VRSTN = 0 V
2)
VCC1 < VRT1x
tRD1
8
VCC1 Short to GND Filter
Time
Reset Generator; Pin RSTN
Reset Low Output Voltage
Reset Delay Time 1
Reset Delay Time 2
tRD2
P_13.12.36
to RSTN = L see
also Chapter 12.3
1.6
10
12
ms
2)
RSTN_DEL = 0
P_13.12.37
RSTN_DEL = 1
P_13.12.64
2
2.4
ms
2)
Watchdog Generator / Internal Oscillator
Long Open Window
tLW
160
200
240
ms
2)
P_13.12.42
Internal Clock Generator
Frequency
fCLKSBC,1
0.8
1.0
1.2
MHz
–
P_13.12.43
100
120
ms
2)3)
P_13.12.45
Minimum Waiting time during Fail-Safe Mode
Min. waiting time Fail-Safe tFS,min
80
Power-on Reset, Over / Undervoltage Protection
VSINT Power on reset rising VPOR,r
–
–
4.5
V
VSINT increasing
P_13.12.46
VSINT Power on reset
falling
VPOR,f
–
–
3
V
VSINT decreasing
P_13.12.47
VSINT Undervoltage
Detection Threshold
VSINT,UV
5.3
–
6.0
V
P_13.12.48
Supply UV
threshold for VCC1
SC detection;
hysteresis
included; includes
rising and falling
threshold
Datasheet
137
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Supervision Functions
Table 38
Electrical Characteristics (cont’d)
VSINT = 5.5 V to 28 V; Tj = -40°C to +150°C; Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin; unless otherwise specified.
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note or
Test Condition
Number
VSHS Overvoltage
Detection Threshold
VSHS,OVD
20
–
22
V
Supply OV
supervision for
HSx, LIN;
hysteresis
included
P_13.12.55
VSHS Overvoltage
Detection hysteresis
VSHS,OVD,hys
100
500
–
mV
6)
P_13.12.56
VSHS Undervoltage
Detection Threshold
VSHS,UVD
4.8
–
5.5
V
Supply UV
supervision for
HSx, LIN;
hysteresis
included
P_13.12.57
VSHS Undervoltage
Detection hysteresis
VSHS,UVD,hys
50
200
350
mV
6)
P_13.12.58
VSHS Undervoltage
Detection Filter Time
tVSHS,UV
5
10
14
us
2)
rising and falling P_13.12.300
VSHS Overvoltage
Detection Filter Time
tVSHS,OV
5
10
14
us
2)
rising and falling P_13.12.301
Charge Pump Undervoltage
Charge Pump
Undervoltage Referred to
VS
VCPUV1
5.4
5.9
6.4
V
FET_LVL = 0
CPUVTH = 0
falling threshold,
VS ≥6 V
P_13.12.59
Charge Pump
Undervoltage Referred to
VS
VCPUV2
5.85
6.35
6.85
V
FET_LVL = 0
CPUVTH = 1
falling threshold,
VS ≥ 6 V
P_13.12.60
Charge Pump
Undervoltage Referred to
VS
VCPUV3
6.85
7.35
7.85
V
FET_LVL = 1
CPUVTH = 0
falling threshold,
VS ≥ 6 V
P_13.12.61
Charge Pump
Undervoltage Referred to
VS
VCPUV4
7.5
8
8.5
V
FET_LVL = 1
CPUVTH = 1
falling threshold,
VS ≥ 6 V
P_13.12.62
Charge Pump
Undervoltage Filter Time
tCPUV
51
64
80
µs
6)
VS ≥ 6 V
P_13.12.63
Charge Pump
Undervoltage Blank Time
tCPUVBLANK
400
500
600
µs
6)
VS ≥ 6 V
P_13.12.175
VS monitoring
Datasheet
138
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Supervision Functions
Table 38
Electrical Characteristics (cont’d)
VSINT = 5.5 V to 28 V; Tj = -40°C to +150°C; Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin; unless otherwise specified.
Parameter
Symbol
Values
Unit
Note or
Test Condition
Number
Min.
Typ.
Max.
VS undervoltage threshold VS,UV
4.7
–
5.4
V
hysteresis
included
P_13.12.66
VS overvoltage threshold
detection 1
VS,OVD1
19
–
22.5
V
hysteresis
included,
VS_OV_SEL = 0
P_13.12.68
VS overvoltage threshold
detection 2
VS,OVD2
27.75
–
31.25
V
hysteresis
included,
VS_OV_SEL = 1
P_13.12.65
5
10
14
µs
2)
rising and falling P_13.12.71
rising and falling P_13.12.72
VS undervoltage filter time tVSUV_FILT
VS overvoltage filter time
tVSOV_FILT
5
10
14
µs
2)
Off-state open load diagnosis
Pull-up diagnosis current
IPUDiag
-600
-400
-270
µA
VS ≥ 6 V
P_13.12.73
Pull-down diagnosis
current
IPDDiag
1600
2200
2800
µA
VS ≥ 6 V
P_13.12.74
Diagnosis current ratio
IDiag_ratio
4.25
5.25
6.25
Ratio
IPDDiag / IPUDiag
P_13.12.302
Drain-source monitoring CP activated
Blank time
tBLANK
typ20%
587
typ+20 ns
+266
%
xTBLK
6)
Cross-current protection
time
tCCP
typ20%
587
typ+20 ns
+266
%
xTCCP
6)
HS/LS Drain-source
overvoltage 0
VVDSMONTH0_ 0.115
0.16
0.195
V
VDSTH[2:0] = 000B, P_13.12.77
VS≥6 V, TFVDS=00B
0.2
0.25
V
VDSTH[2:0] = 001B, P_13.12.78
VS≥6 V, TFVDS=00B
0.3
0.36
V
VDSTH[2:0] = 010B, P_13.12.79
VS≥6 V, TFVDS=00B
0.4
0.48
V
VDSTH[2:0] = 011B, P_13.12.80
VS≥6 V, TFVDS=00B
0.5
0.6
V
VDSTH[2:0] = 100B, P_13.12.81
VS≥6 V, TFVDS=00B
0.6
0.72
V
VDSTH[2:0] = 101B, P_13.12.82
VS≥6 V, TFVDS=00B
0.8
0.96
V
VDSTH[2:0] = 110B, P_13.12.83
VS≥6 V, TFVDS=00B
CPON
HS/LS Drain-source
overvoltage 1
VVDSMONTH1_ 0.16
HS/LS Drain-source
overvoltage 2
VVDSMONTH2_ 0.24
HS/LS Drain-source
overvoltage 3
VVDSMONTH3_ 0.32
HS/LS Drain-source
overvoltage 4
VVDSMONTH4_ 0.4
HS/LS Drain-source
overvoltage 5
VVDSMONTH5_ 0.48
HS/LS Drain-source
overvoltage 6
VVDSMONTH6_ 0.64
Datasheet
CPON
CPON
CPON
CPON
CPON
CPON
139
TBLK: decimal
P_13.12.75
value of TBLK[3:0],
VS ≥ 6 V
TCCP: decimal
value of
TCCPx[3:0],
VS ≥ 6 V
P_13.12.76
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Supervision Functions
Table 38
Electrical Characteristics (cont’d)
VSINT = 5.5 V to 28 V; Tj = -40°C to +150°C; Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin; unless otherwise specified.
Parameter
Symbol
Values
Min.
HS/LS Drain-source
overvoltage 7
VVDSMONTH7_ 1.75
Typ.
Max.
2.0
2.25
Unit
Note or
Test Condition
V
VDSTH[2:0] = 111B, P_13.12.84
VS≥6 V, TFVDS=00B
CPON
Number
Drain-Source monitoring - Slam mode, parking braking and VS overvoltage braking, VS or VSINT ≥ 8V
Blank time
tBLK_BRAKE1
4.5
7
9.5
µs
TBLK_BRK = 0,
VS or VSINT ≥ 8 V
P_13.12.85
Blank time
tBLK_BRAKE2
9
11
13
µs
TBLK_BRK = 1,
VS or VSINT ≥ 8 V
P_13.12.86
VDS Filter time
tFVDS_BRAKE
0.5
1
2.5
µs
VS or VSINT ≥ 8 V
P_13.12.87
LS Drain-source
monitoring thresholds
VVDSMONTH0_ 0.56
0.8
1.05
V
VS or VSINT ≥ 8 V
VDSTH_BRK = 0
P_13.12.89
LS Drain-source
monitoring thresholds
VVDSMONTH1_ 0.15
0.22
0.29
V
VS or VSINT ≥ 8 V
VDSTH_BRK = 1
P_13.12.90
BRAKE
BRAKE
VS Overvoltage Braking Mode
VS Overvoltage braking
config 0 rising
VOVBR,cfg0,r
25.65
27
28.35
V
OV_BRK_TH=000B P_13.12.97
VS Overvoltage braking
config 1 rising
VOVBR,cfg1,r
26.60
28
29.40
V
OV_BRK_TH=001B P_13.12.98
VS Overvoltage braking
config 2 rising
VOVBR,cfg2,r
27.55
29
30.45
V
OV_BRK_TH=010B P_13.12.99
VS Overvoltage braking
config 3 rising
VOVBR,cfg3,r
28.50
30
31.50
V
OV_BRK_TH=011B P_13.12.100
VS Overvoltage braking
config 4 rising
VOVBR,cfg4,r
29.45
31
32.55
V
OV_BRK_TH=100B P_13.12.101
VS Overvoltage braking
config 5 rising
VOVBR,cfg5,r
30.40
32
33.60
V
OV_BRK_TH=101B P_13.12.102
VS Overvoltage braking
config 6 rising
VOVBR,cfg6,r
31.35
33
34.65
V
OV_BRK_TH=110B P_13.12.103
VS Overvoltage braking
config 7 rising
VOVBR,cfg7,r
32.30
34
35.70
V
OV_BRK_TH=111B P_13.12.104
VS Overvoltage braking
config 0
VHYS,cfg0
0.64
0.75
0.85
V
OV_BRK_TH=000B P_13.12.105
VS Overvoltage braking
config 1
VHYS,cfg1
0.74
0.82
0.9
V
OV_BRK_TH=001B P_13.12.109
VS Overvoltage braking
config 2
VHYS,cfg2
0.80
0.89
0.98
V
OV_BRK_TH=010B P_13.12.113
VS Overvoltage braking
config 3
VHYS,cfg3
0.85
0.95
1.05
V
OV_BRK_TH=011B P_13.12.117
VS Overvoltage braking
config 4
VHYS,cfg4
0.93
1.03
1.13
V
OV_BRK_TH=100B P_13.12.121
Datasheet
140
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Supervision Functions
Table 38
Electrical Characteristics (cont’d)
VSINT = 5.5 V to 28 V; Tj = -40°C to +150°C; Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin; unless otherwise specified.
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note or
Test Condition
Number
VS Overvoltage braking
config 5
VHYS,cfg5
0.97
1.08
1.19
V
OV_BRK_TH=101B P_13.12.125
VS Overvoltage braking
config 6
VHYS,cfg6
1.03
1.15
1.27
V
OV_BRK_TH=110B P_13.12.129
VS Overvoltage braking
config 7
VHYS,cfg7
1.1
1.23
1.36
V
OV_BRK_TH=111B P_13.12.133
VS and VSINT overvoltage
braking filter time
tOV_BR_FILT
10
15
20
µs
6)
Operating common mode
input voltage range
referred to GND (CSAP GND) or (CSAN- GND)
VCM
-2.0
–
2.0
V
Common Mode Rejection
Ratio
CMRR
63
69
75
77
–
–
–
–
–
–
–
–
dB
6)
CSAG = (0,0)
CSAG = (0,1)
CSAG = (1,0)
CSAG = (1,1)
DC to 50 kHz
VCM = -2 … 2 V
VCSAP = VCSAN
P_13.12.139
Settling time to 98%
tSET
–
1500
2000
ns
6)
P_13.12.140
Settling time to 98% after
gain change
tSET_GAIN
–
–
5000
ns
6)
P_13.12.141
Input Offset voltage
VOS
-1
0
1
mV
Current Sense Amplifier DC GDIFF10
Gain (uncalibrated)
9.91
10.04
10.17
V/V
CSAG = (0,0)
P_13.12.143
Current Sense Amplifier DC GDIFF20
Gain (uncalibrated)
19.79
20.05
20.31
V/V
CSAG = (0,1)
P_13.12.144
Current Sense Amplifier DC GDIFF40
Gain (uncalibrated)
39.53
40.05
40.57
V/V
CSAG = (1,0)
P_13.12.145
Current Sense Amplifier DC GDIFF60
Gain (uncalibrated)
59.34
60.12
60.91
V/V
CSAG = (1,1)
P_13.12.146
Gain drift
GDRIFT
-0.5
–
0.5
%
6)
Gain drift after
calibration
P_13.12.151
CSO single ended output
voltage range (linear
range)
VCSO
0.5
–
VCC1 0.5
V
6)
P_13.12.152
Reference voltage for
unidirectional CSAx
VREF Unidir
-1.25% VCC1/5
CSD = 0
VCSAP = VCSAN
P_13.12.153
P_13.12.200
Current sense amplifier4)
Datasheet
141
+1.25% V
P_13.12.138
After gain
change from CSN
rising edge
P_13.12.142
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Supervision Functions
Table 38
Electrical Characteristics (cont’d)
VSINT = 5.5 V to 28 V; Tj = -40°C to +150°C; Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin; unless otherwise specified.
Parameter
Symbol
Values
Unit
Note or
Test Condition
Number
Min.
Typ.
Max.
VREF Bidir
-1%
VCC1/2
+1%
V
CSD = 1
VCSAP = VCSAN
P_13.12.154
Overcurrent filter time
tFOC
4
7
40
80
6
10
50
100
8
13
60
120
µs
5)6)
OCFILT = 00B
OCFILT = 01B
OCFILT = 10B
OCFILT = 11B
P_13.12.155
OC threshold,
unidirectional
VOCTH1 Unidir
-4%
VCC1/2 +4%
V
CSD = 0,
OCTH[1:0]= 00B
P_13.12.156
OC threshold,
unidirectional
VOCTH2 Unidir
-4%
VCC1/2 +4%
+
VCC1/10
V
CSD = 0,
OCTH[1:0]= 01B
P_13.12.157
OC threshold,
unidirectional
VOCTH3 Unidir
-4%
VCC1/2 +4%
+ 2x
VCC1/1
0
V
CSD = 0,
OCTH[1:0]= 10B
P_13.12.158
OC threshold,
unidirectional
VOCTH4 Unidir
-4%
VCC1/2 +4%
+ 3x
VCC1/10
V
CSD = 0,
OCTH[1:0]= 11B
P_13.12.159
High OC threshold,
bidirectional
VOCTH1 BidirH
-4%
VCC1/2 +4%
+ 2x
VCC1/20
V
CSD = 1,
OCTH[1:0]= 00B
P_13.12.160
High OC threshold,
bidirectional
VOCTH2 BidirH
-4%
VCC1/2 +4%
+ 4x
VCC1/20
V
CSD = 1,
OCTH[1:0]= 01B
P_13.12.161
High OC threshold,
bidirectional
VOCTH3 BidirH
-4%
VCC1/2 +4%
+ 5x
VCC1/20
V
CSD = 1,
OCTH[1:0]= 10B
P_13.12.162
High OC threshold,
bidirectional
VOCTH4 BidirH
-4%
VCC1/2 +4%
+ 6x
VCC1/20
V
CSD = 1,
OCTH[1:0]= 11B
P_13.12.163
Low OC threshold,
bidirectional
VOCTH1 BidirL
-4%
VCC1/2 - +4%
2x
VCC1/20
V
CSD = 1,
OCTH[1:0]= 00B
P_13.12.164
Low OC threshold,
bidirectional
VOCTH2 BidirL
-4%
VCC1/2 - +4%
4x
VCC1/20
V
CSD = 1,
OCTH[1:0]= 01B
P_13.12.165
Low OC threshold,
bidirectional
VOCTH3 BidirL
-4%
VCC1/2 - +4%
5x
VCC1/20
V
CSD = 1,
OCTH[1:0]= 10B
P_13.12.166
Reference voltage for
bidirectional CSAx
Overcurrent detection
Datasheet
142
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Supervision Functions
Table 38
Electrical Characteristics (cont’d)
VSINT = 5.5 V to 28 V; Tj = -40°C to +150°C; Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin; unless otherwise specified.
Parameter
Low OC threshold,
bidirectional
Symbol
VOCTH4 BidirL
Values
Unit
Note or
Test Condition
Number
Min.
Typ.
Max.
-4%
VCC1/2 - +4%
6x
VCC1/20
V
CSD = 1,
OCTH[1:0]= 11B
P_13.12.167
60
–
–
dB
6)
VCP modulated
with sinewave
(100 kHz, 1 Vpp
P_13.12.168
Current Sense Amplifier Dynamic Parameters
Power Supply Rejection
Ratio
PSRR
Overtemperature Shutdown6)
Thermal Prewarning
Temperature
TjPW
125
145
165
°C
Tj rising
P_13.12.169
Thermal Shutdown TSD1
TjTSD1
170
185
200
°C
Tj rising
P_13.12.170
Thermal Shutdown TSD2
TjTSD2
170
185
200
°C
P_13.12.171
Thermal Shutdown
hysteresis
TjTSD,hys
–
25
–
°C
Tj rising
6)
TSD/TPW Filter Time
tTSD_TPW_F
5
10
15
us
rising and falling, P_13.12.173
applies to all
thermal sensors
(TPW, TSD1, TSD2)
Deactivation time after
thermal shutdown TSD2
tTSD2
0.8
1
1.2
s
2)
P_13.12.172
P_13.12.174
1) It is ensured that the threshold VCC1,OV,r is always higher than the highest regulated VCC1 output voltage VCC1,out4.
.
2) Not subject to production test, tolerance defined by internal oscillator tolerance.
3) This time applies for all failure entries except a device thermal shutdown (TSD2 has a typ. 1 s waiting time tTSD2).
4) 6 V ≤ VS ≤ 23 V
5) tFOC refers to the output of the current sense amplifier. The CSO settling time (2 µs max, tSET) and the analog
propagation delay (< 1 µs)are not taken into account by the overcurrent filter time.
6) Not subject to production test, specified by design.
Datasheet
143
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
13
Serial Peripheral Interface
The Serial Peripheral Interface is the communication link between the device and the microcontroller.
The TLE9564QX is supporting multi-slave operation in full-duplex mode with 32-bit data access.
The SPI behavior for the different device modes is as follows:
•
The SPI is enabled in Init Mode, Normal Mode and Stop Mode.
•
The SPI is OFF in Sleep Mode, Restart Mode and Fail-Safe Mode.
13.1
SPI Block Description
The Control Input Word is read via the data input SDI, which is synchronized with the clock input CLK provided
by the microcontroller. The output word appears synchronously at the data output SDO (see Figure 69 with a
32-bit data access example).
The transmission cycle begins when the chip is selected by the input CSN (Chip Select Not), LOW active. After
the CSN input returns from LOW to HIGH, the word that has been read is interpreted according to the content.
The SDO output switches to tristate status (high impedance) at this point, thereby releasing the SDO bus for
other use.The state of SDI is shifted into the input register with every falling edge on CLK. The state of SDO is
shifted out of the output register after every rising edge on CLK. The SPI of the device is not daisy chain
capable.
CSN high to low: SDO is enabled. Status information transferred to output shift register
CSN
time
CSN low to high: data from shift register is transferred to output functions
CLK
time
Actual data
LSB
SDI
0 1 2 3 4 5 6
MSB
27 28 29 30 31
New data
0 1
+ +
time
SDI: will accept data on the falling edge of CLK signal
LSB
SDO
Actual status
ERR 0 1 2 3 4 5 6
-
MSB
27 28 29 30 31
New status
ERR 0
+
1
+
time
SDO: will change state on the rising edge of CLK signal
Figure 69
Datasheet
SPI Data Transfer Timing (note the reversed order of LSB and MSB shown in this figure
compared to the register description)
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Serial Peripheral Interface
13.2
Failure Signalization in the SPI Data Output
When the microcontroller sends a wrong SPI command to the device, the device ignores the information.
Wrong SPI commands are either invalid device mode commands or commands which are prohibited by the
state machine to avoid undesired device or system states (see below). In this case the diagnosis bit SPI_FAIL
is set and the SPI Write command is ignored (no partial interpretation). This bit can be only reset by actively
clearing it via a SPI command.
Invalid SPI Commands leading to SPI_FAIL are listed below (in this case the SPI command is ignored):
•
Illegal state transitions:
- Going from Stop Mode to Sleep Mode. In this case the device enters Restart Mode.
- Trying to go to Stop Mode or Sleep Mode from Init Mode1). In this case Normal Mode is entered.
•
Uneven parity in the data bit of the WD_CTRL register. In this case the watchdog trigger is ignored and/or
the new watchdog settings are ignored respectively.
•
In Stop Mode: attempting to change any SPI settings, e.g. changing the watchdog configuration, PWM
settings and HSx configuration settings during Stop Mode, etc.;
the SPI command is ignored in this case;
only WD trigger, returning to Normal Mode, triggering a device soft reset, and read & clear status registers
commands are valid SPI commands in Stop Mode; Note: No failure handling is done for the attempt to go
to Stop Mode when all bits in the registers BUS_CTRL and WK_CTRL are cleared because the
microcontroller can leave this mode via SPI.
•
When entering Stop Mode and WK_STAT is not cleared; SPI_FAIL will not be set but the INTN pin will be
triggered.
•
Changing from Stop Mode to Normal Mode and changing the other bits of the M_S_CTRL register. The
other modifications will be ignored.
•
Sleep Mode: attempt to go to Sleep Mode without any wake source set, i.e. when all bits in the BUS_CTRL
and WK_CTRL registers are cleared. In this case the SPI_FAIL bit is set and the device enters Restart Mode.
Even though the Sleep Mode command is not entered in this case, the rest of the command is executed but
restart values apply during Restart Mode; Note: At least one wake source must be activated in order to
avoid a deadlock situation in Sleep Mode.
If the only wake source is a timer and the timer is OFF, then the device will wake immediately from Sleep
Mode and enter Restart Mode.
•
Setting a longer or equal on-time than the timer period of the respective timer.
•
SDI stuck at HIGH or LOW, e.g. SDI received all ‘0’ or all ‘1’.
•
Configured the HSx controlled by SYNC when the WK4/SYNC is not configured as SYNC-input.
Note:
There is no SPI fail information for unused addresses.
Note:
In case that the register or banking are accessed but they are not valid as address or banks, the
SPI_FAIL is not triggered and the cmd is ignored.
Signalization of the ERR Flag (high active) in the SPI Data Output (see Figure 69):
The ERR flag presents an additional diagnosis possibility for the SPI communication. The ERR flag is being set
for following conditions:
1) If the device is externally configured to use SPI with CRC (by PWM1/CRC pin), the attempt to go to Stop or Sleep from Init , will
generate SPI_FAIL even if it is a SPI command with correct CRC. Still, the first SPI command will put the device from Init to Normal
Mode even if CRC is not correct (CRC_FAIL status bit will be set).
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BLDC Motor System IC
Serial Peripheral Interface
•
in case the number of received SPI clocks is not 0 or 32.
•
in case RSTN is LOW and SPI frames are being sent at the same time.
Note:
In order to read the SPI ERR flag properly, CLK must be low when CSN is triggered, i.e. the ERR bit is
not valid if the CLK is high on a falling edge of CSN.
The number of received SPI clocks is not 0 or 32:
The number of received input clocks is supervised to be 0 or 32 clock cycles and the input word is discarded in
case of a mismatch (0 clock cycle to enable ERR signalization). The error logic also recognizes if CLK was high
during CSN edges. Both errors ( 0 or 32 bit CLK mismatch or CLK high during CSN edges ) are flagged in the
following SPI output by a “HIGH” at the data output (SDO pin, bit ERR) before the first rising edge of the clock
is received. The complete SPI command is ignored in this case.
RSTN is LOW and SPI frames are being sent at the same time:
The ERR flag will be set when the RSTN pin is triggered (during device restart) and SPI frames are being sent to
the device at the same time. The behavior of the ERR flag will be signalized at the next SPI command for below
conditions:
•
If the command begins when RSTN is HIGH and it ends when RSTN is LOW.
•
If a SPI command will be sent while RSTN is LOW.
•
If a SPI command begins when RSTN is LOW and it ends when RSTN is HIGH.
And the SDO output will behave as follows:
•
Always when RSTN is LOW then SDO will be HIGH.
•
When a SPI command begins when RSTN is LOW and ends when RSTN is HIGH, then the SDO should be
ignored because wrong data will be sent.
Note:
It is possible to quickly check for the ERR flag without sending any data bits. i.e. only the CSN is pulled
low and SDO is observed - no SPI Clocks are sent in this case.
Note:
The ERR flag could also be set after the device has entered Fail-Safe Mode because the SPI
communication is stopped immediately.
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BLDC Motor System IC
Serial Peripheral Interface
13.3
SPI Programming
For the TLE9564QX, 7 bits are used for the address selection (BIT 6...0). Bit 7 is used to decide between Read
Only and Read & Clear for the status bits, and between Write and Read Only for configuration bits. For the
actual configuration and status information, 16 data bits (BIT 23...8) are used.
Writing, clearing and reading is done word wise. The SPI status bits are not cleared automatically and must be
cleared by the microcontroller. Some of the configuration bits will automatically be cleared by the device
(refer to the respective register descriptions for detailed information). In Restart Mode, the device ignores all
SPI communication, i.e. it does not interpret it.
There are two types of SPI registers:
•
Control registers: These registers are used to configure the device, e.g. mode, watchdog trigger, etc.
•
Status registers: These registers indicate the status of the device, e.g. wake events, warnings, failures, etc.
For the status registers, the requested information is given in the same SPI command in the data out (SDO).
For the control registers, the status of each byte is shown in the same SPI command as well. However,
configuration changes of the same register are only shown in the next SPI command (configuration changes
inside the device become valid only after CSN changes from low to high). See Figure 70.
Writing of control registers is possible in Init and Normal Mode. During Stop Mode only the change to Normal
Mode and triggering the watchdog is allowed as well as reading and clearing the status registers.
No status information can be lost, even if a bit changes right after the first 7 SPI clock cycles before the SPI
frame ends. In this case the status information field will be updated with the next SPI command. However, the
flag is already set in the relevant status register.The device status information from the SPI status registers is
transmitted in a compressed format with each SPI response on SDO in the so-called Status Information Field
register (see also Table 39). The purpose of this register is to quickly signal changes in dedicated SPI status
registers to the microcontroller.
Table 39
Status Information Field
Bit in Status
Information Field
Corresponding
Address Bit
Status Register Description
0
SUPPLY_STAT = OR of all bits on SUP_STAT register
1
TEMP_STAT = OR of all bits on THERM_STAT register
2
BUS_STAT= OR of all bits on BUS_STAT register
3
WAKE_UP = OR of all bits on WK_STAT register
4
HS_STAT = OR of all bits on HS_OL_OC_OT_STAT
register
5
DEV_STAT = OR of all bits on DEV_STAT except
CRC_STAT and SW_DEV
6
BD_STAT = OR of all bits on DSOV register
7
SPI_CRC_FAIL = (SPI_FAIL) OR (CRC_FAIL)
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BLDC Motor System IC
Serial Peripheral Interface
MSB
LSB
DI
0
1
2
3
4
5
6
Address Bits
7
8
9
x
x
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31
Data Bits
R/W
x
x
x
x
x
x
x
CRC or Static Pattern
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
Register content of
selected address
DO
0
1
2
3
4
5
6
7
8
9
x
x
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31
Status Information Field
Data Bits
x
x
x
x
x
x
x
CRC or Static Pattern
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
time
LSB is sent first in SPI message
Figure 70
SPI Operation Mode
13.3.1
CRC
The SPI interface includes also 8 Bits (bits 24 to 31) used for Cyclic Redundancy Check (CRC) to ensure data
integrity on sent or received SPI command.
The implemented CRC is based on Autosar specification of CRC Routines revision 4.3.0 and in particular the
function CRC8-2FH.
The specification are based on the follow table:
Table 40
CRC8x2FH definition
CRC result width:
8 bits
Polynomial
2FH
Initial Value
FFH
Input data reflected
No
Result data reflected
No
XOR value
FFH
Check
DFH
Magic check
42H
Some examples of CRC calculation are shown in the follow table:
Table 41
CRC8x2FH calculation example
Data Bytes (hexadecimal)
CRC
00
00
00
F2
01
83
0F
AA
00
55
C6
00
FF
55
11
77
33
22
55
AA
92
6B
55
FF
FF
FF
Datasheet
00
12
C2
BB
CC
DD
EE
FF
11
33
FF
6C
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BLDC Motor System IC
Serial Peripheral Interface
Polynominal
The polynomial is:
x8 + x5 + x3 + x2 + x1 + x0
(13.1)
Calculation in SDI and SDO
The calculation of the CRC is done considering the first 24 bits (BIT 0..23) either of SDI or SDO.
The content of SDO Payload (BIT 8..23) is referring the previous data written at the addressed register via SDI.
SDI
Add.
r
w
Payload - Configuration
CRC
∑
PASS/FAIL
SDO
Status Info. Field
From previous SPI cmd
CRC
∑
Figure 71
CRC calculation
CRC Activation and status information
For CRC activation, refer to Chapter 5.2.
The CRC status (CRC_STAT)and failure (CRC_FAIL) are readable on DEV_STAT.
Read out of the register which contains the CRC_STAT and CRC_FAIL is done ignoring the CRC field and no
failure flag are set.
The DEV_STAT register shall be cleared considering the CRC setting (ON or OFF).
The CRC_STAT bit is read only.
The CRC_FAIL is set in the follow conditions:
•
If the CRC is enabled and the µC sends wrong CRC field.
•
If the CRC is disabled and the µC sends wrong static pattern (no A5H).
CRC field in case of CRC disabled
In case that the CRC is not activated, the bits needed for CRC field have to be filled with static pattern.
In case of SDI, the CRC field has to be filled with A5H (bits 24:31).
In case of SDO, the device will always answer with 5AH (bits 24:31).
The status of the CRC is updated accordingly in CRC_STAT bit.
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BLDC Motor System IC
Serial Peripheral Interface
13.4
SPI Bit Mapping
The following figures show the mapping of the registers and the SPI bits of the respective registers.
The Control Registers are Read/Write Register with the following structure:
•
Device Control Registers from 000 0001B to 000 1011B.
•
Bridge Driver Control Registers from 001 0000B to 001 1101B.
Depending on bit 7 the bits are only read (setting bit 7 to ‘0’) or also written (setting bit 7 to ‘1’). The new setting
of the bit after a write can be seen with a new read / write command.
The Status Registers are Read/Clear with the following structure:
•
Device Status Registers from 100 0000B to 100 0110B.
•
Bridge Driver Status Registers from 101 0000B to 101 1011B.
•
Product Family is 111 0000B.
The registers can be read or can be cleared (if clearing is possible) depending on bit 7. To clear the payload of
one of the Status Registers bit 7 must be set to 1.
The registers WK_LVL_STAT, and FAM_PROD_STAT are an exception as they show the actual voltage level at
the respective WKx pin (LOW/HIGH), or a fixed family/ product ID respectively and can thus not be cleared.
It is recommended for proper diagnosis to clear respective status bits for wake events or failure.
When changing to a different device mode, certain configurations bits will be cleared automatically or
modified:
•
The device mode bits are updated to the actual status, e.g. when returning to Normal Mode.
•
When changing to a low-power mode (Stop Mode or Sleep Mode), the diagnosis bits of the integrated
module are not cleared.
•
When changing to Stop Mode, the LIN control bits will not be modified.
•
When changing to Sleep Mode, the LIN control bits will be modified if they were not OFF or wake capable
before.
Note:
Datasheet
The detailed behavior of the respective SPI bits and control functions is described in Chapter 13.5,
Chapter 13.6.and in the respective module chapter. The bit type be marked as ‘rwh’ in case the
device will modify respective control bits.
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Serial Peripheral Interface
16 Data Bits [bits 23...8]
Figure 72
Reg.
Type
7 Address Bits [bits 6...0]
for Register Selection
Addresses:
000 0001
.
.
.
000 1011
Addresses:
001 0000
.
.
.
001 1101
Addresses:
100 0000
.
.
.
111 0000
The most important status registers are represented in the
Status Information Field
Status Information
Field Bit
Status Registers
Bridge Driver
Device
Control Registers Control Registers
for Configuration & Status Information
SPI Register Mapping Structure
The detailed register mappings for control registers and status registers are shown in Table 42 and Table 68
respectively.
13.4.1
Register Banking
In order to minimize the number of configuration registers, seven registers follow a bank structure.
The banked registers are:
•
WK_CTRL
•
PWM_CTRL
•
CCP_BLK
•
TPRECHG
•
HB_ICHG
•
HB_PCHG_INIT
•
TDON_HB_CTRL
•
TDOFF_HB_CTRL
In these register, the first 3 bits of the payload (bit 8 to 10) select the bank that has to be configured. The rest
of the payload is used to configure the selected bank (for more details refer to the specific banked register).
In case that CRC is used, the CRC calculation is done considering the first 24 bits (from bit 0 to 23).
The banked registers can be read like the other configuration registers but in the SDO one ‘0’ is automatically
added after the status information field. Figure 73 shows the structure of SDO in banked register.
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BLDC Motor System IC
Serial Peripheral Interface
SDI
Add.
r
w
B
K
0
B
K
1
B
K
2
R
e
s
Configuration of selected Bank
B
K
0
B
K
1
B
K
2
Selected Bank Content
0
CRC
SDO
Status Info. Filed
Figure 73
Datasheet
CRC
Register read Out of banked register (3 bit banking)
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Serial Peripheral Interface
13.5
SPI control registers
READ/WRITE Operation (see also Chapter 13.3):
•
The ‘POR / Soft Reset Value’ defines the register content after POR or device reset.
•
The ‘Restart Value’ defines the register content after device restart, where ‘x’ means the bit is unchanged.
•
There are different bit types:
– ‘r’ = READ: read only bits (or reserved bits).
– ‘rw’ = READ/WRITE: readable and writable bits.
– ‘rwh’ = READ/WRITE/Hardware: readable/writable bits, which can also be modified by the device
hardware.
•
Reserved bits are marked as “Reserved” and always read as “0”. The respective bits shall also be
programmed as “0”.
•
Reading a register is done word wise by setting the SPI bit 7 to “0” (= Read Only).
•
SPI control bits are in general not cleared or changed automatically. This must be done by the
microcontroller via SPI programming. Exceptions to this behavior are stated at the respective register
description and the respective bit type is marked with a ‘h’ meaning that the device is able to change the
register content.
The registers are addressed wordwise.
Table 42
Register Overview
Register Short Name
Register Long Name
Offset Address
Page
Number
SPI control registers, Device Control Registers
M_S_CTRL
Mode and Supply Control
0000001B
155
HW_CTRL
Hardware Control
0000010B
157
WD_CTRL
Watchdog Control
0000011B
159
BUS_CTRL
and LIN Control
0000100B
161
WK_CTRL
Wake-up Control
0000101B
162
TIMER_CTRL
Timer 1 and Timer 2 Control and Selection
0000110B
164
SW_SD_CTRL
High-Side Switch Shutdown Control
0000111B
166
HS_CTRL
High-Side Switch Control
0001000B
168
INT_MASK
Interrupt Mask Control
0001001B
170
PWM_CTRL
PWM Configuration Control
0001010B
172
SYS_STAT_CTRL
System Status Control
0001011B
173
SPI control registers, Control registers bridge driver
GENCTRL
General Bridge Control
0010000B
174
CSA
Current sense amplifier
0010001B
176
LS_VDS
Drain-Source monitoring threshold
0010010B
178
HS_VDS
Drain-Source monitoring threshold
0010011B
180
CCP_BLK
CCP and times selection
0010100B
182
HBMODE
Half-Bridge MODE
0010101B
183
TPRECHG
PWM pre-charge and pre-discharge time
0010110B
185
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BLDC Motor System IC
Serial Peripheral Interface
Table 42
Register Overview (cont’d)
Register Short Name
Register Long Name
Offset Address
Page
Number
ST_ICHG
Static charge/discharge current
0010111B
186
HB_ICHG
PWM charge/discharge current
0011000B
187
HB_ICHG_MAX
PWM max. pre-charge/pre-discharge current
and diagnostic pull-down
0011001B
188
HB_PCHG_INIT
PWM pre-charge/pre-discharge initialization
0011010B
190
TDON_HB_CTRL
PWM inputs TON configuration
0011011B
191
TDOFF_HB_CTRL
PWM inputs TOFF configuration
0011100B
192
BRAKE
Brake control
0011101B
193
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BLDC Motor System IC
Serial Peripheral Interface
13.5.1
Device Control Registers
Mode and Supply Control
M_S_CTRL
Mode and Supply Control
15
14
13
12
MODE
RES
rwh
r
(000 0001B)
11
10
9
8
7
Reset Value: see Table 43
6
5
4
VCC1_OV_MO
RSTN_
I_PEA
RES
RES
D
HYS
K_TH
rwh
r
rw
r
rw
3
2
1
0
RES
VCC1_RT
r
rw
Field
Bits
Type
Description
MODE
15:14
rwh
Device Mode Control
00B NORMAL, Normal Mode
01B SLEEP, Sleep Mode
10B STOP, Stop Mode
11B RESET, Device reset: Soft reset is executed
(configuration of RSTN triggering in bit
SOFT_RESET_RO)
RES
13:11
r
Reserved, always reads as 0
VCC1_OV_MOD
10:9
rwh
Reaction in case of VCC1 Over Voltage
00B NO, no reaction
01B INTN, INTN event is generated
10B RSTN, RSTN event is generated
11B FAILSAFE, Fail-Safe Mode is entered
RES
8
r
Reserved, always reads as 0
RSTN_HYS
7
rw
VCC1 Undervoltage Reset Hysteresis Selection (see
also Chapter 12.7.1 for more information)
0B DEFAULT, default hysteresis applies as specified
in the electrical characteristics table
1B HIGHEST, the highest rising threshold (VRT1,R) is
always used for the release of the undervoltage
reset
RES
6
r
Reserved, always reads as 0
I_PEAK_TH
5
rw
VCC1 Active Peak Threshold Selection
0B LOW, low VCC1 active peak threshold selected
1B HIGH, high VCC1 active peak threshold selected
RES
4:2
r
Reserved, always reads as 0
VCC1_RT
1:0
rw
VCC1 Reset Threshold Control
00B VRT1, Vrt1 selected (highest threshold)
01B VRT2, Vrt2 selected
10B VRT3, Vrt3 selected
11B VRT4, Vrt4 selected
Datasheet
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BLDC Motor System IC
Serial Peripheral Interface
Table 43
Reset of M_S_CTRL
Register Reset Type Reset Values
POR/Soft reset
0000 0000 0000 0000B
Restart
0000 0000 x0x0 00xxB
Reset Short Name Reset Mode
Note
Notes
1. It is not possible to change from Stop Mode to Sleep Mode via SPI Command. See also the State Machine
Chapter.
2. After entering Restart Mode, the MODE bits will be automatically set to Normal Mode.
3. The SPI output will always show the previously written state with a Write Command (what has been
programmed before) .
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BLDC Motor System IC
Serial Peripheral Interface
Hardware Control
HW_CTRL
Hardware Control
15
14
13
(000 0010B)
12
11
10
9
8
TSD2_ VS_OV SH_DI RSTN_
DEL _SEL SABLE DEL
RES
r
rw
rw
rw
rw
7
RES
r
Reset Value: see Table 44
6
5
SOFT_
RESET RES
_RO
rw
4
3
2
1
0
RES
WD_S
TM_E
N_1
RES
r
rwh
r
r
Field
Bits
Type
Description
RES
15:13
r
Reserved, always reads as 0
TSD2_DEL
12
rw
TSD2 minimum Waiting Time Selection
0B 1s, Minimum waiting time until TSD2 is released
again is always 1 s
1B 64s, Minimum waiting time until TSD2 is released
again is 1 s, after >16 TSD2 consecutive events, it
will extended x 64
VS_OV_SEL
11
rw
VS OV comparator threshold change
0B 20V, Default threshold setting (VS,OVD1)
1B 30V, increased threshold setting (VS,OVD2)
SH_DISABLE
10
rw
Sample and hold circuitry disable
0B ENABLED, Gate driver S&H circuitry enabled
1B DISABLED, Gate driver S&H circuitry disabled
RSTN_DEL
9
rw
Reset delay time
0B 10ms, Reset delay time 10 ms (tRD1)
1B 2ms, Reset delay time to 2 ms (tRD2)
RES
8:7
r
Reserved, always reads as 0
SOFT_RESET_RO
6
rw
Soft Reset Configuration
0B RSTN, RSTN will be triggered (pulled low) during
a Soft Reset
1B NO_RSTN, no RSTN trigger during a Soft Reset
RES
5
r
Reserved, always reads as 0
RES
4:3
r
Reserved, always reads as 0
WD_STM_EN_1
2
rwh
Watchdog Deactivation during Stop Mode, bit1
0B ACTIVE, Watchdog is active in Stop Mode
1B INACTIVE, Watchdog is deactivated in Stop Mode
RES
1:0
r
Reserved, always reads as 0
Table 44
Reset of HW_CTRL
Register Reset Type Reset Values
POR
0000 0000 0000 0000B
Soft reset
0000 00x0 0000 0000B
Restart
000x 00x0 0x00 0000B
Datasheet
Reset Short Name Reset Mode
157
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BLDC Motor System IC
Serial Peripheral Interface
Notes
1. WD_STM_EN_1 will also be cleared when changing from Stop Mode to Normal Mode .
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BLDC Motor System IC
Serial Peripheral Interface
Watchdog Control
WD_CTRL
Watchdog Control
15
14
13
(000 0011B)
12
11
10
CHEC
KSUM
RES
rw
r
9
8
7
Reset Value: see Table 45
6
5
4
3
WD_S
WD_E
WD_C
TM_E
N_WK RES
FG
N_0
_BUS
rwh
rw
rwh
2
1
0
WD_TIMER
r
rwh
Field
Bits
Type
Description
CHECKSUM
15
rw
Watchdog Setting Check Sum Bit
0B 0, Counts as 0 for checksum calculation
1B 1, Counts as 1 for checksum calculation
RES
14:7
r
Reserved, always reads as 0
WD_STM_EN_0
6
rwh
Watchdog Deactivation during Stop Mode, bit0
0B ACTIVE, Watchdog is active in Stop Mode
1B INACTIVE, Watchdog is deactivated in Stop Mode
WD_CFG
5
rw
Watchdog Configuration
0B TIMEOUT, Watchdog works as a Time-Out
watchdog
1B WINDOW, Watchdog works as a Window
watchdog
WD_EN_ WK_BUS
4
rwh
Watchdog Enable after Bus Wake in Stop Mode
0B DISABLED, Watchdog will not start after a or LIN
wake-up event
1B ENABLED, Watchdog starts with a long open
window after or LIN Wake-up event
RES
3
r
Reserved, always reads as 0
WD_TIMER
2:0
rwh
Watchdog Timer Period
000B 10ms, 10ms
001B 20ms, 20ms
010B 50ms, 50ms
011B 100ms, 100ms
100B 200ms, 200ms
101B 500ms, 500ms
110B 1s, 1s
111B 10s, 10s
Table 45
Reset of WD_CTRL
Register Reset Type Reset Values
POR/Soft reset
0000 0000 0001 0100B
Restart
0000 0000 000x 0100B
Datasheet
Reset Short Name Reset Mode
159
Note
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Notes
1. See also Chapter 12.2.4 for more information on disabling the watchdog in Stop Mode.
2. See chapter Chapter 12.2.5 for more information on the effect of the bit WD_EN_WK_BUS.
3. See chapter Chapter 12.2.3 for calculation of checksum.
Datasheet
160
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
and LIN Control
BUS_CTRL
and LIN Control
15
14
13
(000 0100B)
12
11
10
9
8
7
Reset Value: see Table 46
6
5
LIN_T
LIN_F LIN_L
XD_T
LASH SM
O
RES
r
rw
rw
rw
4
3
2
1
0
LIN
RES
rwh
r
Field
Bits
Type
Description
RES
15:8
r
Reserved, always reads as 0
LIN_FLASH
7
rw
LIN Flash
0B ACTIVE, Slope control mechanism active
1B INACTIVE, Deactivation of slope control for
baudrates up to 115 kBaud
LIN_LSM
6
rw
LIN LSM
0B NORMAL, LIN Normal Mode is activated
1B LOW_SLOPE, LIN Low-Slope Mode (10.4 kBaud)
activated
LIN_TXD_TO
5
rw
LIN TXD TO
0B DISABLED, TXD Time-out feature disabled
1B ENABLED, TXD Time-out feature enabled
LIN
4:3
rwh
LIN Module Modes
00B OFF, LIN OFF
01B WAKE, LIN wake capable
10B RECEIVE, LIN Receive Only Mode
11B NORMAL, LIN Normal Mode
RES
2:0
r
Reserved, always reads as 0
Table 46
Reset of BUS_CTRL
Register Reset Type Reset Values
POR/Soft reset
0000 0000 0000 0000B
Restart
0000 0000 xx0y 0000B
Reset Short Name Reset Mode
Note
Notes
1. The reset values for LIN transceivers are marked with ‘y’ because they will vary depending on the cause of
change.
2. See , Figure 25 for detailed state changes of LIN transceivers for different device modes.
3. Failure Handling Mechanism: When the device enters Fail-Safe Mode due to a failure, then BUS_CTRL is
modified by the device to 0000 0000 xxx0 1001B to ensure that the device can be woken again. See also the
description in Chapter 8.1 and Chapter 9.2.1 for WK_CTRL for other wake sources when entering Fail-Safe
Mode.
4. When in Software Development Mode the POR/Soft Reset value are: LIN=11B.
Datasheet
161
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Wake-up Control
WK_CTRL
Wake-up Control
13
(000 0101B)
12
11
10
9
8
7
Reset Value: see Table 47
15
14
6
5
4
3
2
1
0
RES
RES
WK_FILT
WK_PUPD
RES
WK_EN
RES
WK_BNK
r
r
rw
rw
r
rw
r
rw
Field
Bits
Type
Description
RES
15
r
Reserved, always reads as 0
RES
14
r
Reserved, always reads as 0
WK_FILT
13:11
rw
Wake-up Filter Time Configuration
000B 16us, Filter with 16 µs filter time (static sensing)
001B 64us, Filter with 64 µs filter time (static sensing)
010B TIMER1, Filtering at the end of the on-time; filter
time of 16 µs (cyclic sensing) is selected, Timer1
011B TIMER2, Filtering at the end of the on-time; filter
time of 16 µs (cyclic sensing) is selected, Timer2
100B SYNC, Filter at the end of settle time (80 µs), filter
time of 16 µs (cyclic sensing) is selected, SYNC1)2)
101B , reserved
110B , reserved
111B , reserved
WK_PUPD
10:9
rw
WKx Pull-Up/Pull-Down Configuration
00B NO, No pull-up/pull-down selected
01B PULL_DOWN, Pull-down resistor selected
10B PULL_UP, Pull-up resistor selected
11B AUTO, Automatic switching to pull-up or pulldown
RES
8:7
r
Reserved, always reads as 0
WK_EN
6:5
rw
WKx Enable
00B WK_OFF, WKx module OFF
01B WK_ON, WKx module ON
10B SYNC, OFF or (in case of WK4), it is configured as
SYNC input
11B OFF, OFF
RES
4:3
r
Reserved, always reads as 0
WK_BNK
2:0
rw
WKs input Banking
011B WK4, WK4 Module (Bank 4)
101B , reserved
110B , reserved
111B , reserved
1) This setting is available only in case of WK4 configured as WK_EN=10B.
2) The min TON time for cyclic sense with SYNC is 100 µs.
Datasheet
162
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Table 47
Reset of WK_CTRL
Register Reset Type Reset Values
POR/Soft reset
0000 0000 0010 0000B
Restart
00xx xxx0 0xx0 0000B
Reset Short Name Reset Mode
Note
Notes
1. The SYNC functionality is accessable only if the Bank 4 is selected.
2. When selecting a filter time configuration, the user must make sure to also assign the respective timer/SYNC
to at least one HS switch during cyclic sense operation.
3. At Fail-Safe Mode entry WK_EN will be automatically changed (by the device) in “01”. WK4 if configured as
SYNC previously
4. During Fail-Safe Mode the WK_FILT bits are ignored and static-sense with 16 µs filter time is used by default.
Datasheet
163
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Timer 1 and Timer2 Control and Selection
TIMER_CTRL
Timer 1 and Timer2 Control and Selection
15
14
13
12
11
10
(000 0110B)
9
8
7
Reset Value: see Table 48
6
5
4
3
2
1
0
TIMER2_ON
RES
TIMER2_PER
CYCWK
TIMER1_ON
RES
TIMER1_PER
rwh
r
rwh
rwh
rwh
r
rwh
Field
Bits
Type
Description
TIMER2_ON
15:13
rwh
Timer2 On-Time Configuration
000B OFF_LOW, OFF / Low (timer not running, HSx
output is low)
001B 100us, 0.1ms on-time
010B 300us, 0.3ms on-time
011B 1ms, 1.0ms on-time
100B 10ms, 10ms on-time
101B 20ms, 20ms on-time
110B OFF_HIGH, OFF / HIGH (timer not running, HSx
output is high)
111B , reserved, same behaviour as 110B
RES
12
r
Reserved, always reads as 0
TIMER2_PER
11:9
rwh
Timer2 Period Configuration
000B 10ms, 10ms
001B 20ms, 20ms
010B 50ms, 50ms
011B 100ms, 100ms
100B 200ms, 200ms
101B 500ms, 500ms
110B 1s, 1s
111B 2s, 2s
CYCWK
8:7
rwh
Cyclic Wake Configuration
00B DISABLED, Timer1 and Timer2 disabled as wakeup sources
01B TIMER1, Timer1 is enabled as wake-up source
(Cyclic Wake)
10B TIMER2, Timer2 is enabled as wake-up source
(Cyclic Wake)
11B , reserved
Datasheet
164
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Field
Bits
Type
Description
TIMER1_ON
6:4
rwh
Timer1 On-Time Configuration
000B OFF_LOW, OFF / Low (timer not running, HSx
output is low)
001B 100us, 0.1ms on-time
010B 300us, 0.3ms on-time
011B 1ms, 1.0ms on-time
100B 10ms, 10ms on-time
101B 20ms, 20ms on-time
110B OFF_HIGH, OFF / HIGH (timer not running, HSx
output is high)
111B , reserved, same behaviour as 110B
RES
3
r
Reserved, always reads as 0
TIMER1_PER
2:0
rwh
Timer1 Period Configuration
000B 10ms, 10ms
001B 20ms, 20ms
010B 50ms, 50ms
011B 100ms, 100ms
100B 200ms, 200ms
101B 500ms, 500ms
110B 1s, 1s
111B 2s, 2s
Table 48
Reset of TIMER_CTRL
Register Reset Type Reset Values
POR/Soft reset
0000 0000 0000 0000B
Restart
0000 0000 0000 0000B
Reset Short Name Reset Mode
Note
Notes
1. The timer must be first assigned and is then automatically activated as soon as the on-time is configured.
2. If cyclic sense is selected and the HSx switch is cleared during Restart Mode then also the timer settings
(period and on-time) are cleared to avoid incorrect switch detection. However, the timer settings are not
cleared in case of failure not leading to Restart Mode.
3. In case the timer is set as wake sources and cyclic sense is running, then both cyclic sense and cyclic wake will
be active at the same time.
4. Timer accuracy is linked to the oscillator accuracy (see Parameter P_13.12.43).
Datasheet
165
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
High-Side Switch Shutdown Control
SW_SD_CTRL
High-Side Switch Shutdown Control
15
14
13
12
11
10
(000 0111B)
9
8
7
Reset Value: see Table 49
6
5
4
3
HS3_ HS2_ HS1_ HS_O HS_U
HS3_ HS2_ HS1_ HS_O
HS_U
RES OV_RE OV_RE OV_RE T_SD_ RES OV_S OV_S OV_S V_SDS V_SD_ RES
V_REC
DN_DI DN_DI DN_DI _DIS DIS
C
C
C
DIS
S
S
S
r
rw
rw
rw
rw
r
rw
rw
rw
rw
rw
r
rw
2
1
0
RES
r
Field
Bits
Type
Description
RES
15
r
Reserved, always reads as 0
HS3_OV_REC
14
rw
Switch recovery after removal of VS Overvoltage for
HS3
0B DISABLED, Switch recovery is disabled
1B PREVIOUS, Previous state before VS Overvoltage
is enabled after Overvoltage considtion is
removed
HS2_OV_REC
13
rw
Switch recovery after removal of VS Overvoltage for
HS2
0B DISABLED, Switch recovery is disabled
1B PREVIOUS, Previous state before VS Overvoltage
is enabled after Overvoltage considtion is
removed
HS1_OV_REC
12
rw
Switch recovery after removal of VS Overvoltage for
HS1
0B DISABLED, Switch recovery is disabled
1B PREVIOUS, Previous state before VS Overvoltage
is enabled after Overvoltage considtion is
removed
HS_OT_SD_DIS
11
rw
Shutdown Disabling of all HS in case of
Overtemperature event
0B ALL, shudown for all HSx in case of
Overtemperature
1B INDIVIDUAL, individual shudown in case of
Overtemperature
RES
10
r
Reserved, always reads as 0
HS3_OV_SDN_DIS
9
rw
Shutdown Disabling of HS3 in case of input supply
overvoltage in Normal Mode
0B ENABLED, shudown enabled in case of VS
Overvoltage
1B DISABLED, shudown disabled in case of VS
Overvoltage
Datasheet
166
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Field
Bits
Type
Description
HS2_OV_SDN_DIS
8
rw
Shutdown Disabling of HS2 in case of input supply
overvoltage in Normal Mode
0B ENABLED, shudown enabled in case of VS
Overvoltage
1B DIASBLED, shudown disabled in case of VS
Overvoltage
HS1_OV_SDN_DIS
7
rw
Shutdown Disabling of HS1 in case of input supply
overvoltage in Normal Mode
0B ENABLED, shudown enabled in case of VS
Overvoltage
1B DISABLED, shudown disabled in case of VS
Overvoltage
HS_OV_SDS_DIS
6
rw
Shutdown Disabling of HSx in case of input supply
overvoltage in Stop Mode or Sleep Mode
0B ENABLED, shudown enabled in case of VS
Overvoltage
1B DISABLED, shudown disabled in case of VS
Overvoltage
HS_UV_SD_DIS
5
rw
Shutdown Disabling of HSx in case of input supply
undervoltage
0B ENABLED, shudown enabled in case of VS
Undervoltage
1B DISABLED, shudown disabled in case of VS
Undervoltage
RES
4
r
Reserved, always reads as 0
HS_UV_REC
3
rw
Switch recovery after removal of Undervoltage for
HSx
0B DISABLED, Switch recovery is disabled
1B PREVIOUS, Previous state before VS
Undervoltage is enabled after Undervoltage
considtion is removed
RES
2:0
r
Reserved, always reads as 0
Table 49
Reset of SW_SD_CTRL
Register Reset Type Reset Values
POR/Soft reset
0000 0000 0000 0000B
Restart
0xxx x0xx xxx0 x000B
Datasheet
Reset Short Name Reset Mode
167
Note
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
High-Side Switch Control
HS_CTRL
High-Side Switch Control
15
14
13
12
(000 1000B)
11
10
9
8
7
Reset Value: see Table 50
6
5
4
3
2
1
RES
HS3
HS2
HS1
r
rwh
rwh
rwh
0
Field
Bits
Type
Description
RES
15:12
r
Reserved, always reads as 0
HS3
11:8
rwh
HS3 Configuration
0000BOFF, OFF
0001BON, ON
0010BTIMER1, Controlled by Timer1
0011BTIMER2, Controlled by Timer2
0100BPWM1, Controlled by PWM1
0101BPWM2, Controlled by PWM2
0110BPWM3, Controlled by PWM3
0111BPWM4, Controlled by PWM4
1000BWK4_SYNC, Synchronized with WK4/SYNC
1001B, reserved
1010B, reserved
1011B, reserved
1100B, reserved
1101B, reserved
1110B, reserved
1111B, reserved
HS2
7:4
rwh
HS2 Configuration
0000BOFF, OFF
0001BON, ON
0010BTIMER1, Controlled by Timer1
0011BTIMER2, Controlled byTimer2
0100BPWM1, Controlled by PWM1
0101BPWM2, Controlled by PWM2
0110BPWM3, Controlled by PWM3
0111BPWM4, Controlled by PWM4
1000BWK4_SYNC, Synchronized with WK4/SYNC
1001B, reserved
1010B, reserved
1011B, reserved
1100B, reserved
1101B, reserved
1110B, reserved
1111B, reserved
Datasheet
168
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Field
Bits
Type
Description
HS1
3:0
rwh
HS1 Configuration
0000BOFF, OFF
0001BON, ON
0010BTIMER1, Controlled by Timer1
0011BTIMER2, Controlled by Timer2
0100BPWM1, Controlled by PWM1
0101BPWM2, Controlled by PWM2
0110BPWM3, Controlled by PWM3
0111BPWM4, Controlled by PWM4
1000BWK4_SYNC, Synchronized with WK4/SYNC
1001B, reserved
1010B, reserved
1011B, reserved
1100B, reserved
1101B, reserved
1110B, reserved
1111B, reserved
Table 50
Reset of HS_CTRL
Register Reset Type Reset Values
POR/Soft reset
0000 0000 0000 0000B
Restart
0000 0000 0000 0000B
Reset Short Name Reset Mode
Note
PWMx in this register designates the internal PWM generators for the integrated high-side switches.
Datasheet
169
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Interrupt Mask Control1)
INT_MASK
Interrupt Mask Control
15
14
13
12
(000 1001B)
11
10
9
8
7
Reset Value: see Table 51
6
5
4
3
2
1
0
INTN_ WD_S
SPI_C
SUPP
WD_S
BD_ST HS_ST BUS_S TEMP
CYC_E DM_DI
RC_FA
LY_ST
DM
AT
AT
TAT _STAT
N SABLE
IL
AT
RES
r
rw
rw
rw
rw
rw
rw
rw
rw
rw
Field
Bits
Type
Description
RES
15:9
r
Reserved, always reads as 0
INTN_CYC_EN
8
rw
Periodical INTN generation
0B DISABLED, no periodical INTN event generated in
case of pending interrupts
1B ENABLED, periodical INTN event generated in
case of pending interrupts
WD_SDM_DISABLE
7
rw
Disable Watchdog in Software Development Mode
0B ENABLED, WD is enabled in Software
Development Mode
1B DISABLED, WD is disabled in Software
Development Mode
WD_SDM
6
rw
Watchdog failure in Software Development Mode
0B DISABLED, no INTN event generated in case of
WD trigger failure in Software Development Mode
1B ENABLED, one INTN event is generated in case of
WD trigger failure in Software Development Mode
SPI_CRC_FAIL
5
rw
SPI and CRC interrupt generation
0B DISABLED, no INTN event generated in case of
SPI_FAIL or CRC_FAIL
1B ENABLED, one INTN event is generated n case of
SPI_FAIL or CRC_FAIL
BD_STAT
4
rw
Bridge Driver Interrupt generation
0B DISABLED, no INTN event generated in case
BD_STAT (on Status Information Field) is set
1B ENABLED, one INTN event generated in case
BD_STAT (on Status Information Field) is set
HS_STAT
3
rw
High Side Interrupt generation
0B DISABLED, no INTN event generated in case
HS_STAT (on Status Information Field) is set
1B ENABLED, one INTN event generated in case
HS_STAT (on Status Information Field) is set
1) Every event will generate a signal on the INTN pin (when masked accordingly).
Even if the status-bit was already set in the corresponding status-register it can still trigger a signal on the INTN pin.
Datasheet
170
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Field
Bits
Type
Description
BUS_STAT
2
rw
BUS Interrupt generation
0B DISABLED, no INTN event generated in case
BUS_STAT (on Status Information Field) is set
1B ENABLED, one INTN event generated in case
BUS_STAT (on Status Information Field) is set
TEMP_STAT
1
rw
Temperature Interrupt generation
0B DISABLED, no INTN event generated in case
TEMP_STAT (on Status Information Field) is set
1B ENABLED, one INTN event generated in case
TEMP_STAT (on Status Information Field) is set
SUPPLY_STAT
0
rw
SUPPLY Status Interrupt generation
0B DISABLED, no INTN event generated in case
SUPPLY_STAT (on Status Information Field) is set
1B ENABLED, one INTN event generated in case
SUPPLY_STAT (on Status Information Field) is set
Table 51
Reset of INT_MASK
Register Reset Type Reset Values
POR/Soft reset
0000 0001 0100 0000B
Restart
0000 000x xxxx xxxxB
Datasheet
Reset Short Name Reset Mode
171
Note
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
PWM Configuration Control
PWM_CTRL
PWM Configuration Control
13
12
(000 1010B)
11
10
9
8
7
Reset Value: see Table 52
15
14
6
5
4
3
2
1
0
RES
PWM_
FREQ
PWM_DC
RES
PWM_BNK
r
rw
rw
r
rw
Field
Bits
Type
Description
RES
15
r
Reserved, always reads as 0
PWM_FREQ
14
rw
PWM generator Frequency Setting
0B 100Hz, 100Hz is selected
1B 200Hz, 200Hz is selected
PWM_DC
13:4
rw
PWM Duty Cycle Setting (bit4 = LSB; bit13 = MSB)
00 0000 0000B, 100% OFF, i.e. HS = OFF
xx xxxx xxxxB, ON with duty cycle fraction of 1024
11 1111 1111B, 100% ON, i.e. HS = ON
RES
3
r
Reserved, always reads as 0
PWM_BNK
2:0
rw
Internal PWM generator selection
000B PWM1, PWM1 Module
001B PWM2, PWM2 Module
010B PWM3, PWM3 Module
011B PWM4, PWM4 Module
1xxB , Don’t care
Table 52
Reset of PWM_CTRL
Register Reset Type Reset Values
POR/Soft reset
0000 0000 0000 0000B
Restart
0xxx xxxx xxxx 0000B
Reset Short Name Reset Mode
Note
PWMx in this register designates the internal PWM generators for the integrated high-side switches.
Notes
1.
2.
3.
4.
0% and 100% duty cycle settings are used to have the switch turned ON or OFF respectively.
The desired duty cycle should be set first before the HSx is enabled as PWM.
The PWM signal is correct only after at least one PWM pulse.
PWM generator accuracy is linked to the oscillator accuracy (see parameter P_13.12.43).
Datasheet
172
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
System Status Control
SYS_STAT_CTRL
System Status Control
15
14
13
12
(000 1011B)
11
10
9
8
7
Reset Value: see Table 53
6
5
4
3
2
1
0
SYS_STAT
rw
Field
Bits
Type
Description
SYS_STAT
15:0
rw
System Status Control (bit0=LSB; bit15=MSB)
Dedicated bytes for system configuration, access only
by microcontroller. Cleared after power up and soft
reset.
Table 53
Reset of SYS_STAT_CTRL
Register Reset Type Reset Values
POR / Soft reset
0000 0000 0000 0000B
Restart
xxxx xxxx xxxx xxxxB
Note:
Datasheet
Reset Short Name Reset Mode
Note
This register is intended for storing system configuration of the ECU by the microcontroller and is
only accessible in Normal Mode. The register is not accessible by the TLE9564QX and is also not
cleared after Fail-Safe or Restart Mode. It allows the microcontroller to quickly store system
configuration without loosing data.
173
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
13.5.2
Control registers bridge driver
General Bridge Control
GENCTRL
General Bridge Control
15
14
13
BDFR
EQ
RES
RES
rw
r
r
12
(001 0000B)
11
10
9
8
7
CPUV FET_L CPST BDOV IPCHG
TH
VL
GA _REC ADT
rw
rw
rw
rw
rw
Reset Value: see Table 54
6
5
AGC
CPEN
rw
rw
4
3
2
1
0
EN_GE
FMOD
POCH AGCFI
N_CH IHOLD
GDIS
LT
E
ECK
rw
rw
rw
rw
rw
Field
Bits
Type
Description
BDFREQ
15
rw
Bridge driver synchronization frequency
0B 18MHz, typ. 18.75 MHz (default)
1B 37MHz, typ. 37.5 MHz
RES
14
r
Reserved, always reads as 0
RES
13
r
Reserved, always reads as 0
CPUVTH
12
rw
Charge pump under voltage (referred to VS)
0B TH1, (default) CPUV threshold 1 for FET_LVL = 0,
CPUV threshold 1 for FET_LVL = 1
1B TH2, CPUV threshold 2 for FET_LVL = 0, CPUV
threshold 2 for FET_LVL = 1
FET_LVL
11
rw
External MOSFET normal / logic level selection
0B LOGIC, Logic level MOSFET selected
1B NORMAL, Normal level MOSFET selected(default)
CPSTGA
10
rw
Automatic switchover between dual and single
charge pump stage
0B INACTIVE, Automatic switch over deactivated
(default)
1B ACTIVE, Automatic switch over activated
BDOV_REC
9
rw
Bridge driver recover from VS and VSINT
Overvoltage
0B INACTIVE, Recover deactivated (default)
1B ACTIVE, Recover activated
IPCHGADT
8
rw
Adaptation of the pre-charge and pre-discharge
current
0B 1STEP, 1 current step (default)
1B 2STEPS, 2 current steps
Datasheet
174
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Field
Bits
Type
Description
AGC
7:6
rw
Adaptive gate control
00B INACTIVE1, (default) Adaptive gate control
disabled, pre-charge and pre-discharge disabled
01B INACTIVE2, Adaptive gate control disabled,
precharge is enabled with IPRECHG = IPCHGINIT,
predischarge is enabled with IPREDCHG =
IPDCHGINIT
10B ACTIVE, Adaptive gate control enabled, IPRECHG
and IPREDCHG are self adapted
11B , reserved. Adaptive gate control enabled,
IPRECHG and IPREDCHG are self adapted
CPEN
5
rw
CPEN
0B DISABLED, Charge pump disabled (default)
1B ENABLED, Charge pump enabled
POCHGDIS
4
rw
Postcharge disable bit
0B ENABLED, The postcharge phase is enabled
during PWM (default)
1B DISABLED, The postcharge phase is disabled
during PWM
AGCFILT
3
rw
Filter for adaptive gate control
0B NO_FILT, No filter applied (default)
1B FILT_APPL, Filter applied
EN_GEN_CHECK
2
rw
Detection of active / FW MOSFET
0B DISABLED, Detection disabled (default)
1B ENABLED, Detection enabled
IHOLD
1
rw
Gate driver hold current IHOLD
0B TH1, (default) Charge: ICHG15, discharge IDCHG15.
1B TH2, Charge: ICHG20, discharge: IDCHG20
FMODE
0
rw
Frequency modulation of the charge pump
0B NO, No modulation
1B 15KHz, Modulation frequency 15.6 kHz (default)
Table 54
Reset of GENCTRL
Register Reset Type Reset Values
POR/Soft reset
0000 1000 0000 0001B
Restart
x00x xxxx xxxx xxxxB
Datasheet
Reset Short Name Reset Mode
175
Note
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Current sense amplifier
CSA
Current sense amplifier
15
14
13
12
(001 0001B)
11
10
9
PWM_ CSO_
NB
CAP
RES
r
rw
8
7
Reset Value: see Table 55
6
5
4
3
2
1
0
CSD
OCFILT
CSA_O
FF
OCTH
CSAG
OCEN
rw
rw
rw
rw
rw
rw
rw
Field
Bits
Type
Description
RES
15:11
r
Reserved, always reads as 0
PWM_NB
10
rw
Selection of 3 or 6 PWM inputs
0B 3PWM, 3 PWM inputs (default)
1B 6PWM, 6 PWM inputs
CSO_CAP
9
rw
Capacitance connected to the current sense
amplifier output (CCSO), see also Chapter 12.11.4
0B 400pF, CCSO < 400 pF (default)
1B 2nF, 400 pF < CCSO < 2.2 nF
CSD
8
rw
Direction of the current sense amplifier
0B UNI, Unidirectional
1B BI, Bidirectional (default)
OCFILT
7:6
rw
Overcurrent filter time of CSO
00B 6us, 6 µs (default)
01B 10us, 10 µs
10B 50us, 50 µs
11B 100us, 100 µs
CSA_OFF
5
rw
CSA OFF
0B CSA_ON, CSA enabled
1B CSA_OFF, CSA disabled (default)
OCTH
4:3
rw
Overcurrent detection threshold of CSO
00B TH1, VCSO > VCC1/2+2 x VCC1/20 or VCSOx< VCC1/2- 2x
VCC1/20 (default)
01B TH2, VCSO > VCC1/2+ 4x VCC1/20 or VCSOx< VCC1/2- 4x
VCC1/20
10B TH3, VCSO > VCC1/2+ 5 x VCC1/20 or VCSOx< VCC1/2- 5
xVCC1/20
11B TH4, VCSO > VCC1/2+ 6x VCC1/20 or VCSOx< VCC1/2- 6x
VCC1/20
CSAG
2:1
rw
Gain of the current sense amplifier
00B 10VV, GDIFF10 (default)
01B 20VV, GDIFF20
10B 40VV, GDIFF40
11B 60VV, GDIFF60
OCEN
0
rw
Overcurrent shutdown Enable
0B DISABLED, Disabled
1B ENABLED, Enabled (default)
Datasheet
176
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Table 55
Reset of CSA
Register Reset Type Reset Values
POR/Soft reset
0000 0001 0010 0001B
Restart
0000 0xxx xxxx xxx1B
Datasheet
Reset Short Name Reset Mode
177
Note
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Drain-Source monitoring threshold LS1-3
LS_VDS
VDS monitoring threshold LS1-3
15
14
13
12
(001 0010B)
11
10
9
8
7
Reset Value: see Table 56
6
5
4
3
2
1
0
RES
TFVDS
RES
LS3VDSTH
LS2VDSTH
LS1VDSTH
r
rw
r
rw
rw
rw
Field
Bits
Type
Description
RES
15:14
r
Reserved. Always read as 0
TFVDS
13:12
rw
Filter time of drain-source voltage monitoring
00B 500ns, 0.5 µs (default)
01B 1us, 1 µs
10B 2us, 2 µs
11B 6us, 6 µs
RES
11:9
r
Reserved, always reads as 0
LS3VDSTH
8:6
rw
LS3 drain-source overvoltage threshold
000B 160mV, 0.16 V
001B 200mV, 0.20 V (default)
010B 300mV, 0.30 V
011B 400mV, 0.40 V
100B 500mV, 0.50 V
101B 600mV, 0.60 V
110B 800mV, 0.80 V
111B 2V, 2.0 V
LS2VDSTH
5:3
rw
LS2 drain-source overvoltage threshold
000B 160mV, 0.16V
001B 200mV, 0.20 V (default)
010B 300mV, 0.30 V
011B 400mV, 0.40 V
100B 500mV, 0.50 V
101B 600mV, 0.60 V
110B 800mV, 0.80 V
111B 2V, 2.0 V
LS1VDSTH
2:0
rw
LS1 drain-source overvoltage threshold
000B 160mV, 0.16 V
001B 200mV, 0.20 V (default)
010B 300mV, 0.30 V
011B 400mV, 0.40 V
100B 500mV, 0.50 V
101B 600mV, 0.60 V
110B 800mV, 0.80 V
111B 2V, 2.0 V
Datasheet
178
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Table 56
Reset of LS_VDS
Register Reset Type Reset Values
Reset Short Name
POR/Soft reset
0000 0000 0100 1001B
0000 0000 0000 0000
Restart
0000 000x xxxx xxxxB
Datasheet
179
Reset Mode
Note
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Drain-Source monitoring Threshold HS1-3
HS_VDS
VDS monitoring threshold HS1-3
15
14
(001 0011B)
11
10
9
8
7
Reset Value: see Table 57
13
12
6
5
4
3
2
1
0
RES
RES
DEEP_
ADAP
RES
HS3VDSTH
HS2VDSTH
HS1VDSTH
r
rw
rw
r
rw
rw
rw
Field
Bits
Type
Description
RES
15:14
r
Reserved. Always read as 0
RES
13
rw
Reserved. This bit must be programmed to ‘0‘
DEEP_ADAP
12
rw
Deep adaptation enable
0B NO_DEEP_ADAP, Deep adaptation disabled
(default)
1B DEEP_ADAP, Deep adaptation enabled
RES
11:9
r
Reserved, always reads as 0
HS3VDSTH
8:6
rw
HS3 drain-source overvoltage threshold
000B 160mV, 0.16 V
001B 200mV, 0.20 V (default)
010B 300mV, 0.30 V
011B 400mV, 0.40 V
100B 500mV, 0.50 V
101B 600mV, 0.60 V
110B 800mV, 0.80 V
111B 2V, 2.0 V
HS2VDSTH
5:3
rw
HS2 drain-source overvoltage threshold
000B 160mV, 0.16 V
001B 200mV, 0.20 V (default)
010B 300mV, 0.30 V
011B 400mV, 0.40 V
100B 500mV, 0.50 V
101B 600mV, 0.60 V
110B 800mV, 0.80 V
111B 2V, 2.0 V
HS1VDSTH
2:0
rw
HS1 drain-source overvoltage threshold
000B 160mV, 0.16 V
001B 200mV, 0.20 V (default)
010B 300mV, 0.30 V
011B 400mV, 0.40 V
100B 500mV, 0.50 V
101B 600mV, 0.60 V
110B 800mV, 0.80 V
111B 2V, 2.0 V
Datasheet
180
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Table 57
Reset of HS_VDS
Register Reset Type Reset Values
POR/Soft reset
0000 0000 0100 1001B
Restart
00xx 000x xxxx xxxxB
Datasheet
Reset Short Name Reset Mode
181
Note
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
CCP and times selection
CCP_BLK
CCP and times selection
15
14
13
12
(001 0100B)
11
10
9
8
7
Reset Value: see Table 58
6
5
4
3
2
1
0
TBLANK
TCCP
RES
CCP_BNK
rw
rw
r
rw
Field
Bits
Type
Description
TBLANK
15:12
rw
Blank time
nom. tHBxBLANK = 587 ns + 266 x T[3:0]D
The CCP_BNK bits select the blank time for the FW or
active MOSFET and the half-bridge HBx
Reset of active and FW tHBxBLANK: 2450 ns typ.
TCCP
11:8
rw
Cross-current protection time
nom. tHBxCCP = 587 ns + 266 x TCCP[3:0]D
The CCP_BNK bits select the cross-current protection
time for the FW or active MOSFET and the half-bridge
HBx
Reset of all active and FW tHBxCCP: 2450 ns typ.
RES
7:3
r
Reserved, always reads as 0
CCP_BNK
2:0
rw
Cross-current and time banking
000B ACT_HB1, Active blank and cross-current prot.
times for HB1 (default)
001B ACT_HB2, Active blank and cross-current prot.
times for HB2
010B ACT_HB3, Active blank and cross-current prot.
times for HB3
011B RES, reserved
100B FW_HB1, FW blank and cross-current prot. times
for HB1
101B FW_HB2, FW blank and cross-current prot. times
for HB2
110B FW_HB3, FW blank and cross-current prot. for
times for HB3
111B RES, reserved
Table 58
Reset of CCP_BLK
Register Reset Type Reset Values
POR/Soft reset
0111 0111 0000 0000B
Restart
xxxx xxxx 0000 0000B
Datasheet
Reset Short Name Reset Mode
182
Note
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Half-Bridge MODE
HBMODE
Half-Bridge MODE
15
14
13
(001 0101B)
12
11
10
RES
HB3MODE
r
rw
9
8
7
HB3_
AFW3 PWM_
EN
rw
rw
Reset Value: see Table 59
6
HB2MODE
rw
5
4
HB2_
AFW2 PWM_
EN
rw
rw
3
2
HB1MODE
rw
1
0
HB1_
AFW1 PWM_
EN
rw
rw
Field
Bits
Type
Description
RES
15:12
r
Reserved, always reads as 0
HB3MODE
11:10
rw
Half-bridge 3 MODE selection
00B PASSIVE_OFF, LS3 and HS3 are off by passive
discharge (default)
01B LS3_ON, LS3 is ON
10B HS3_ON, HS3 is ON
11B ACTIVE_OFF, LS3 and HS3 kept off by the active
discharge
AFW3
9
rw
Active freewheeling for half-bridge 3 during PWM
0B DISABLED, active freewheeling disabled
1B ENABLED, active freewheeling enabled (default)
HB3_PWM_EN
8
rw
PWM mode for half-bridge 3
0B INACTIVE, PWM deactivated for HB2(default)
1B ACTIVE, PWM activated for HB2
HB2MODE
7:6
rw
Half-bridge 2 MODE selection
00B PASSIVE_OFF, LS2 and HS2 are off by passive
discharge (default)
01B LS2_ON, LS2 is ON
10B HS2_ON, HS2 is ON
11B ACTIVE_OFF, LS2 and HS2 kept off by the active
discharge
AFW2
5
rw
Active freewheeling for half-bridge 2 during PWM
0B DISABLED, active freewheeling disabled
1B ENABLED, active freewheeling enabled (default)
HB2_PWM_EN
4
rw
PWM mode for half-bridge 2
0B INACTIVE, PWM deactivated for HB2(default)
1B ACTIVE, PWM activated for HB2
HB1MODE
3:2
rw
Half-bridge 1 MODE selection
00B PASSIVE_OFF, LS1 and HS1 are off by passive
discharge (default)
01B LS1_ON, LS1 is ON
10B HS1_ON, HS1 is ON
11B ACTIVE_OFF, LS1 and HS1 kept off by the active
discharge
Datasheet
183
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Field
Bits
Type
Description
AFW1
1
rw
Active freewheeling for half-bridge 1 during PWM
0B DISABLED, active freewheeling disabled
1B ENABLED, active freewheeling enabled (default)
HB1_PWM_EN
0
rw
PWM mode for half-bridge 1
0B INACTIVE, PWM deactivated for HB1 (default)
1B ACTIVE, PWM activated for HB1
Table 59
Reset of HBMODE
Register Reset Type Reset Values
POR/Soft reset
0000 0010 0010 0010B
Restart
0000 0010 0010 0010B
Datasheet
Reset Short Name Reset Mode
184
Note
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
HB pre-charge and pre-discharge time
TPRECHG
HB pre-charge and pre-discharge time
15
14
13
12
11
10
(001 0110B)
9
8
7
Reset Value: see Table 60
6
5
4
3
2
1
0
RES
TPCHG3
TPCHG2
TPCHG1
RES
TPCHG_BNK
r
rw
rw
rw
r
rw
Field
Bits
Type
Description
RES
15:13
r
Reserved, always reads as 0
TPCHG3
12:10
rw
If TPCHG_BNK=0: precharge time of HB 3, If
TPCHG_BNK=1: predischarge time of HB 3
TPCHG2
9:7
rw
If TPCHG_BNK=0: precharge time of HB 2, If
TPCHG_BNK=1: predischarge time of HB 2
TPCHG1
6:4
rw
If TPCHG_BNK=0: precharge time of HB 1, If
TPCHG_BNK=1: predischarge time of HB 1
RES
3
r
Reserved, always read as 0
TPCHG_BNK
2:0
rw
Precharge/predischarge time selection
000B PRECHARGE, Precharge time selected (default)
001B PREDISCHARGE, Predischarge time selected
x1xB , wrong setting of TPCHG_BNK
1xxB , wrong setting of TPCHG_BNK
Table 60
Reset of TPRECHG
Register Reset Type Reset Values
POR/Soft reset
0000 0000 0000 0000B
Restart
000x xxxx xxxx 0000B
Datasheet
Reset Short Name Reset Mode
185
Note
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Static charge/discharge current
ST_ICHG
Static charge/discharge current
15
14
13
12
11
(001 0111B)
10
9
8
7
Reset Value: see Table 61
6
5
4
3
2
1
RES
ICHGST3
ICHGST2
ICHGST1
r
rw
rw
rw
0
Field
Bits
Type
Description
RES
15:12
r
Reserved, always read as 0
ICHGST3
11:8
rw
Static charge and discharge currents of HB3
Refer to Table 20
Default: 0100B - charge: ICHG16,15.3 mA typ., discharge:
IDCHG16, 15.1 mA typ.
ICHGST2
7:4
rw
Static charge and discharge currents of HB2
Refer to
Default: 0100B - charge: ICHG16,15.3 mA typ., discharge:
IDCHG16, 15.1 mA typ.
ICHGST1
3:0
rw
Static charge and discharge currents of HB1
Refer to Table 20
Default: 0100B - charge: ICHG16,15.3 mA typ., discharge:
IDCHG16, 15.1 mA typ.
Table 61
Reset of ST_ICHG
Register Reset Type Reset Values
POR/Soft reset
0000 0100 0100 0100B
Restart
0000 xxxx xxxx xxxxB
Datasheet
Reset Short Name Reset Mode
186
Note
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
HB charge/discharge currents for PWM operation
HB_ICHG
HB charge/discharge currents for PWM operation
(001 1000B)
15
14
13
12
11
10
9
8
7
Reset Value: see Table 62
6
5
4
3
2
1
0
IDCHG
ICHG
RES
ICHG_BNK
rw
rw
r
rw
Field
Bits
Type
Description
IDCHG
15:10
rw
If ICHG_BNK =0xxB: Discharge current of HBx active
MOSFET
If ICHG_BNK=1xxB: Reserved. Always read as ‘0’
Default value for all active MOSFETs discharge
currents: 001111B, IDCHG15
Refer to Table 28 for the configuration of the discharge
current
ICHG
9:4
rw
If ICHG_BNK=0xxB: Charge current of HBx active
MOSFET
If ICHG_BNK=1xxB: Charge and discharge current of
HBx FW MOSFETs
Default value for all active MOSFETs charge currents
and all FW MOSFETs charge/discharge currents:
001101B, ICHG13
Refer to Table 27 for the configuration of the charge
current of the active and FW MOSFET
Refer to Table 28 for the configuration of the discharge
current of the FW MOSFET
RES
3
r
Reserved, always read as 0
ICHG_BNK
2:0
rw
Banking bits for charge and discharge currents of
active MOSFETs
000B ACT_HB1, Active MOSFET of HB1 is selected
(default)
001B ACT_HB2, Active MOSFET of HB2 is selected
010B ACT_HB3, Active MOSFET of HB3 is selected
011B RES, reserved
100B FW_HB1, FW MOSFET of HB1 is selected
101B FW_HB2, FW MOSFET of HB2 is selected
110B FW_HB3, FW MOSFET of HB3 is selected
111B RES, reserved
Table 62
Reset of HB_ICHG
Register Reset Type Reset Values
POR/Soft reset
0011 1100 1101 0000B
Restart
xxxx xxxx xxxx 0000B
Datasheet
Reset Short Name Reset Mode
Note
POR value valid for
ICHG_BNK = 0
187
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
HB max. pre-charge/pre-discharge in PWM operation current and diagnostic pull-down
HB_ICHG_MAX
HB max. pre-charge/pre-discharge in PWM operation current and diagnostic pull-down
Reset Value: see Table 63
(001 1001B)
15
RES
14
13
12
11
HB3ID HB2ID HB1ID
IAG
IAG
IAG
r
rrw
rw
rw
10
9
8
7
6
5
4
3
2
1
0
RES
RES
ICHGMAX3
ICHGMAX2
ICHGMAX1
r
r
rw
rw
rw
Field
Bits
Type
Description
RES
15
r
Reserved, always read as 0
HB3IDIAG
14
rrw
Control of HB3 off-state current source and current
sink
0B INACTIVE, Pull-down deactivated (default)
1B ACTIVE, Pull-down activated
HB2IDIAG
13
rw
Control of HB2 pull-down for off-state diagnostic
0B INACTIVE, Pull-down deactivated (default)
1B ACTIVE, Pull-down activated
HB1IDIAG
12
rw
Control of HB1 pull-down for off-state diagnostic
0B INACTIVE, Pull-down deactivated (default)
1B ACTIVE, Pull-down activated
RES
11:8
r
Reserved, always read as 0
RES
7:6
r
Reserved, always reads as 0
ICHGMAX3
5:4
rw
Maximum drive current of HB3 during the precharge and pre-discharge phases1)
00B 31mA, charge ICHG24: typ. 31.6 mA, discharge
IDCHG24: typ. 30.9 mA (default)
01B 52mA, charge ICHG32: typ. 52.5 mA, discharge
IDCHG32: typ. 51.5 mA
10B 112mA, charge ICHG52: typ. 112.2mA, discharge
IDCHG52: typ. 110.8 mA
11B 150mA, charge ICHG63: typ. 150 mA, discharge
IDCHG63: typ. 150 mA
ICHGMAX2
3:2
rw
Maximum drive current of HB2 during the precharge phase and pre-discharge phases1)
00B 31mA, charge ICHG24: typ. 31.6 mA, discharge
IDCHG24: typ. 30.9 mA (default)
01B 52mA, charge ICHG32: typ. 52.5 mA, discharge
IDCHG32: typ. 51.5 mA
10B 112mA, charge ICHG52: typ. 112.2mA, discharge
IDCHG52: typ. 110.8 mA
11B 150mA, charge ICHG63: typ. 150 mA, discharge
IDCHG63: typ. 150 mA
Datasheet
188
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Field
Bits
Type
Description
ICHGMAX1
1:0
rw
Maximum drive current of HB1 during the precharge and pre-discharge phases1)
00B 31mA, charge ICHG24: typ. 31.6 mA, discharge
IDCHG24: typ. 30.9 mA (default)
01B 52mA, charge ICHG32: typ. 52.5 mA, discharge
IDCHG32: typ. 51.5 mA
10B 112mA, charge ICHG52: typ. 112.2mA, discharge
IDCHG52: typ. 110.8 mA
11B 150mA, charge ICHG63: typ. 150 mA, discharge
IDCHG63: typ. 150 mA
1) ICHGMAX is also the current applied during the post-charge of the PWM MOSFET.
Table 63
Reset of HB_ICHG_MAX
Register Reset Type Reset Values
POR/Soft reset
0000 0000 0000 0000B
Restart
0xxx 0000 00xx xxxxB
Datasheet
Reset Short Name Reset Mode
189
Note
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
HBx pre-charge/pre-dischage initialization configuration in PWM operation
HB_PCHG_INIT
HBx pre-charge/pre-discharge initialization configuration in PWM operation
Reset Value: see Table 64
(001 1010B)
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
PDCHGINIT
PCHGINIT
RES
INIT_BNK
rw
rw
r
rw
Field
Bits
Type
Description
PDCHGINIT
15:10
rw
Initial predischarge current of HBx, IPDCHGINITx
The INIT_BNK bits select the addressed half-bridge
Default: 001111B
Refer to Table 27
PCHGINIT
9:4
rw
Initial precharge current of HBx, IPCHGINITx
The INIT_BNK bits select the addressed half-bridge
Default: 001101B
Refer to Table 27
RES
3
r
Reserved, always reads as 0
INIT_BNK
2:0
rw
Banking bits for Precharge an Predischarge Initial
Current
000B HB1, precharge/discharge init. for HB1 selected
(default)
001B HB2, precharge/discharge init. for HB2 selected
010B HB3, precharge/discharge init. for HB3 selected
010B RES, reserved
011B RES, reserved
1xxB , wrong setting of INIT_BANK
Table 64
Reset of HB_PCHG_INIT
Register Reset Type Reset Values
POR/Soft reset
0011 1100 1101 0000B
Restart
xxxx xxxx xxxx 0000B
Datasheet
Reset Short Name Reset Mode
190
Note
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
HBx inputs TDON configuration
TDON_HB_CTRL
HBx inputs TDON configuration
15
14
13
12
11
(001 1011B)
10
9
8
7
Reset Value: see Table 65
6
5
4
3
2
1
0
RES
TDON
RES
HB_TDON_BNK
r
rw
r
rw
Field
Bits
Type
Description
RES
15:14
r
Reserved, always read as 0
TDON
13:8
rw
Turn-on delay time of active MOSFET of HBx
The HB_TDON_BNK bits selects the turn-on delay time
of the active MOSFET of the half-bridge HBx
Nominal tDON = 53.3 ns x TDON[5:0]D
Default: 00 1100B : 640 ns typ.
RES
7:3
r
Reserved, always read as 0
HB_TDON_BNK
2:0
rw
Banking bits for turn-on delay time
000B HB1, tDON of HB1 selected (default)
001B HB2, tDON of HB2 selected
010B HB3, tDON of HB3 selected
011B RES, reserved
1xxB , wrong setting of PWM_TDON_BNK
Table 65
Reset of TDON_HB_CTRL
Register Reset Type Reset Values
POR/Soft reset
0000 1100 0000 0000B
Restart
00xx xxxx 0000 0000B
Datasheet
Reset Short Name Reset Mode
191
Note
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
HBx TDOFF configuration
TDOFF_HB_CTRL
HBx TDOFF configuration
15
14
13
12
(001 1100B)
11
10
9
8
7
Reset Value: see Table 66
6
5
4
3
2
1
0
RES
TDOFF
RES
HB_TDOFF_BNK
r
rw
r
rw
Field
Bits
Type
Description
RES
15:14
r
Reserved, always read as 0
TDOFF
13:8
rw
Turn-off delay time of active MOSFET of HBx
The HB_TDOFF_BNK bits selects the turn-off delay
time of the active MOSFET of the half-bridge HBx
Nominal tDOFF = 53.3 ns x TDOFF[5:0]D
Default: 0000 1100B : 640 ns
RES
7:3
r
Reserved, always read as 0
HB_TDOFF_BNK
2:0
rw
Banking bits for turn-off delay time
000B HB1, tDOFF of HB1 selected (default)
001B HB2, tDOFF of HB2 selected
010B HB3, tDOFF of HB3 selected
1xxB , wrong setting of PWM_TDOFF_BNK
Table 66
Reset of TDOFF_HB_CTRL
Register Reset Type Reset Values
POR/Soft reset
0000 1100 0000 0000B
Restart
00xx xxxx 0000 0000B
Datasheet
Reset Short Name Reset Mode
192
Note
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Brake control
BRAKE
Brake control
15
(001 1101B)
14
RES
13
12
11
10
9
8
7
Reset Value: see Table 67
6
5
4
SLAM SLAM SLAM
VDST
PARK_ OV_B
TBLK_
BRK_E RK_E
RES _LS3_ _LS2_ _LS1_ SLAM H_BR
BRK
DIS
DIS
DIS
K
N
N
r
r
rw
rw
rw
rw
rw
rw
rw
rw
3
2
1
0
RES
OV_BRK_TH
rw
rw
Field
Bits
Type
Description
RES
15:14
r
Reserved, always read as 0
RES
13
r
Reserved, always read as 0
SLAM_LS3_DIS
12
rw
LS3 output disable during SLAM mode
0B ACTIVE, LS3 control active in Slam mode
(default)
1B DISABLED, LS3 control disabled in Slam mode
SLAM_LS2_DIS
11
rw
LS2 output disable during SLAM mode
0B ACTIVE, LS2 control active in Slam mode
(default)
1B DISABLED, LS2 control disabled in Slam mode
SLAM_LS1_DIS
10
rw
LS1 output disable during SLAM mode
0B ACTIVE, LS1 control active in Slam mode
(default)
1B DISABLED, LS1 control disabled in Slam mode
SLAM
9
rw
Slam mode
0B INACTIVE, Slam mode deactivated (default)
1B AVTIVE, Slam mode activated
VDSTH_BRK
8
rw
VDS Overvoltage for LS1-3 during braking
0B 800mV, VVDSMONTH0_BRAKE, 0.8 V, typ. (default)
1B 220mV, VVDSMONTH1_BRAKE, 0.22 V typ.
TBLK_BRK
7
rw
Blank time of VDS overvoltage during braking
0B 7uS, tBLK_BRAKE1,7 µs typ.
1B 11uS, tBLK_BRAKE2, 11 µs typ. (default)
PARK_BRK_EN
6
rw
Parking brake enable
0B DISABLED, Parking brake disabled (default)
1B ENABLED, Parking brake enabled
OV_BRK_EN
5
rw
Overvoltage brake enable
0B DISABLED, Overvoltage brake disabled
1B ENABLED, Overvoltage brake enabled (default)
RES
4:3
rw
Reserved, to be set to 0
Datasheet
193
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Field
Bits
Type
Description
OV_BRK_TH
2:0
rw
Overvoltage brake threshold
000B 27V, typ. 27V (default)
001B 28V, typ. 28V
010B 29V, typ. 29V
011B 30V, typ. 30V
100B 31V, typ. 31V
101B 32V, typ. 32V
110B 33V, typ. 33V
111B 34V, typ. 34V
Table 67
Reset of BRAKE
Register Reset Type Reset Values
POR/Soft reset
0000 0000 1010 0000B
Restart
000x xxxx xxx0 0xxxB
Note:
Datasheet
Reset Short Name Reset Mode
Note
For min and max values of OV_BRK_TH, refer to Chapter 12.12.
194
Rev. 1.0
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TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
13.6
SPI status information registers
READ/CLEAR Operation (see also Chapter 13.3):
•
One 32-bit SPI command consist of four bytes:
- The 7-bit address and one additional bit for the register access mode and
- following the two data bytes and the CRC.
The numbering of following bit definitions refers to the data byte and correspond to the bits D0...D7 and to
the SPI bits 8...23 (see also figure).
•
There are two different bit types:
- ‘r’ = READ: read only bits (or reserved bits).
- ‘rc’ = READ/CLEAR: readable and clearable bits.
•
Reading a register is done word wise by setting the SPI bit 7 to “0” (= Read Only).
•
Clearing a register is done word wise by setting the SPI bit 7 to “1”. No single bits can be cleared. Therefore
the content of a SPI message (bit 8..23) doesn’t matter.
•
SPI status registers are in general not cleared or changed automatically (an exception are the x bits). This
must be done by the microcontroller via SPI command.
The registers are addressed wordwise.
Table 68
Register Overview
Register Short Name
Register Long Name
Offset Address
Page
Number
SPI status information registers, Device Status Registers
SUP_STAT
Supply Voltage Fail Status
1000000B
196
THERM_STAT
Thermal Protection Status
1000001B
198
DEV_STAT
Device Information Status
1000010B
199
BUS_STAT
Bus Communication Status
1000011B
201
WK_STAT
Wake-up Source and Information Status
1000100B
202
WK_LVL_STAT
WK Input Level
1000101B
203
HS_OL_OC_OT_STAT
High-Side Switch Status
1000110B
204
SPI status information registers, Status registers bridge driver
GEN_STAT
GEN Status register
1010000B
206
TDREG
Turn-on/off delay regulation register
1010001B
208
DSOV
Drain-source overvoltage HBVOUT
1010010B
210
EFF_TDON_OFF1
Effective MOSFET turn-on/off delay - PWM halfbridge 1
1010011B
212
EFF_TDON_OFF2
Effective MOSFET turn-on/off delay - PWM halfbridge 2
1010100B
213
EFF_TDON_OFF3
Effective MOSFET turn-on/off delay - PWM halfbridge 3
1010101B
214
TRISE_FALL1
MOSFET rise/fall time - PWM half-bridge 1
1010111B
215
TRISE_FALL2
MOSFET rise/fall time - PWM half-bridge 2
1011000B
216
TRISE_FALL3
MOSFET rise/fall time - PWM half-bridge 3
1011001B
217
1110000B
218
SPI status information registers, Family and product information register
FAM_PROD_STAT
Datasheet
Family and Product Identification Register
195
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TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
13.6.1
Device Status Registers
Supply Voltage Fail Status
SUP_STAT
Supply Voltage Fail Status
15
14
13
POR
RES
rc
r
12
(100 0000B)
11
10
9
8
7
Reset Value: see Table 69
6
5
4
3
2
1
0
CP_O VCC1_ HS_U HS_O VSINT VSINT
VCC1_ VCC1_ VCC1_ VCC1_
VS_UV VS_OV CP_UV
T UV_FS V
V
_UV _OV
SC
UV
OV WARN
rc
rc
rc
rc
rc
rc
rc
rc
rc
rc
rc
rc
rc
Field
Bits
Type
Description
POR
15
rc
Power-On reset detection
0B NO_POR, No POR
1B POR, POR occurred
RES
14:13
r
Reserved, always reads as 0
CP_OT
12
rc
Charge pump overtemperature
0B NO_CP_OT, No charge pump OT detected
1B CP_OT, Charge pump OT detected
VCC1_UV_FS
11
rc
4th consecutive VCC1 UV-Detection
0B NO_FAILSAFE, No Fail-Safe Mode entry due to
4th consecutive VCC1_UV
1B FAILSAFE, Fail-Safe Mode entry due to 4th
consecutive VCC1_UV
HS_UV
10
rc
HS Supply UV-Detection
0B NO_UV, No Undervoltage
1B UV_EVENT, HS Supply Undervoltage detected
HS_OV
9
rc
HS Supply OV-Detection
0B NO_OV, No Overvoltage
1B OV_EVENT, HS Supply Overvoltage detected
VSINT_UV
8
rc
VSINT UV-Detection
0B NO_UV, No Undervoltage
1B UV_EVENT, VSINT Undervoltage detected
VSINT_OV
7
rc
VSINT OV-Detection
0B NO_OV, No Overvoltage
1B OV_EVENT, VSINT Overvoltage detected
VS_UV
6
rc
VS Undervoltage Detection (VS,UV)
0B NO_VS, No VS undervoltage detected
1B VS_EVENT, VS undervoltage detected (detection
is only active when VCC1 is enabled)
VS_OV
5
rc
VS Overvoltage Detection (VS,OV)
0B NO_OV, No VS overvoltage detected
1B OV_EVENT, VS overvoltage detected (detection is
only active when VCC1 is enabled)
Datasheet
196
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Field
Bits
Type
Description
CP_UV
4
rc
CP_UV
0B NO_UV, No CP undervoltage detected
1B UV_EVENT, CP undervoltage detected
VCC1_SC
3
rc
VCC1 SC
0B NO_SC, No VCC1 short to GND detected
1B SC_EVENT, VCC1 short to GND
VCC1_UV
2
rc
VCC1 UV-Detection (due to Vrtx reset)
0B NO_UV, No VCC1_UV detection
1B UV_EVENT, VCC1 undervoltage detected
VCC1_OV
1
rc
VCC1 Overvoltage Detection
0B NO_OV, No VCC1 overvoltage warning
1B OV_EVENT, VCC1 overvoltage detected
VCC1_WARN
0
rc
VCC1 Undervoltage Prewarning
0B NO_UV, No VCC1 undervoltage prewarning
1B UV_PREWARN, VCC1 undervoltage prewarning
detected
Table 69
Reset of SUP_STAT
Register Reset Type Reset Values
POR/Soft reset
y000 0000 0000 0000B
Restart
x00x xxxx xxxx xxxxB
Reset Short Name Reset Mode
Note
Notes
1. The VCC1 undervoltage prewarning threshold VPW,f / VPW,r is a fixed threshold and independent of the VCC1
undervoltage reset thresholds.
2. VSINT undervoltage monitoring is not available in Stop Mode due to current consumption saving
requirements. Exception: VSINT undervoltage detection is also available in Stop Mode if the VCC1 load current
is above the active peak threshold (I_PEAK_TH) or if VCC1 is below the VCC1 prewarning threshold
(VCC1_WARN is set).
3. The MSB of the POR/Soft Reset value is marked as ‘y’: the default value of the POR bit is set after Power-on
reset (POR value = 1000 0000). However it will be cleared after a device Soft Reset command (Soft Reset value
= 0000 0000).
4. During Sleep Mode, the bits VCC1_SC, VCC1_OV and VCC1_UV will not be set when VCC1 is off.
5. The VCC1_UV bit is never updated in Restart Mode, in Init Mode it is only updated after RSTN was released, it
is always updated in Normal Mode and Stop Mode, and it is always updated in any device modes in a VCC1_SC
condition (after VCC1_UV = 1 for > 2 ms).
Datasheet
197
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TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Thermal Protection Status
THERM_STAT
Thermal Protection Status
15
14
13
12
(100 0001B)
11
10
9
8
7
Reset Value: see Table 70
6
5
4
3
2
1
0
TSD2_
TSD2 TSD1 TPW
SAFE
RES
r
rc
rc
rc
rc
Field
Bits
Type
Description
RES
15:4
r
Reserved, always reads as 0
TSD2_SAFE
3
rc
TSD2 Thermal Shut-Down Safe State Detection
0B NO_TSD2_SF, No TSD2 safe state detected
1B TSD2_SF, TSD2 safe state detected: >16
consecutive TSD2 events occurred, next TSD2
waiting time will be 64s
TSD2
2
rc
TSD2 Thermal Shut-Down Detection
0B NO_TSD2, No TSD2 event
1B TSD2_EVENT, TSD2 OT detected - leading to FailSafe Mode
TSD1
1
rc
TSD1 Thermal Shut-Down Detection
0B NO_TSD1, No TSD1 fail
1B TSD1_EVENT, TSD1 OT detected (affected
module is disabled)
TPW
0
rc
Thermal Pre Warning
0B NO_TPW, No Thermal Pre warning
1B TPW, Thermal Pre warning detected
Table 70
Reset of THERM_STAT
Register Reset Type Reset Values
POR/Soft reset
0000 0000 0000 0000B
Restart
0000 0000 0000 xxxxB
Note:
Datasheet
Reset Short Name Reset Mode
Note
Temperature warning and shutdown bits are not reset automatically, even if the temperature pre
warning or the TSD condition is not present anymore.
198
Rev. 1.0
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TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Device Information Status
DEV_STAT
Device Information Status
15
14
13
12
(100 0010B)
11
10
9
8
7
CRC_S CRC_F
TAT
AIL
RES
r
r
rc
Reset Value: see Table 71
6
5
4
3
2
DEV_STAT
RES
SW_D
EV
WD_FAIL
rc
r
rh
rh
1
0
SPI_F FAILU
AIL
RE
rc
rc
Field
Bits
Type
Description
RES
15:10
r
Reserved, always read as 0
CRC_STAT
9
r
CRC STAT Information
0B DISABLED, CRC disabled
1B ENABLED, CRC enabled
CRC_FAIL
8
rc
CRC Fail Information1)
0B NO_FAIL, No CRC Failure
1B FAIL, CRC Failure detected
DEV_STAT
7:6
rc
Device Status before Restart Mode
00B CLEARED, Cleared (Register must be actively
cleared)
01B RESTART, Restart due to failure (WD fail, TSD2,
VCC1_UV, trial to access Sleep Mode without any
wake source activated); also after a wake from
Fail-Safe Mode
10B SLEEP, Sleep Mode
11B , reserved
RES
5
r
Reserved, always reads 0
SW_DEV
4
rh
Status of Operating Mode
0B NORMAL, Normal operation
1B SW_DEV, Software Development Mode is
enabled
WD_FAIL
3:2
rh
Number of WD-Failure Events
00B NO_FAIL, No WD Fail
01B 1x, 1x WD Fail,
10B 2x, 2x WD Fail
11B 3x, more than 3xWD Fail
SPI_FAIL
1
rc
SPI Fail Information
0B NO_FAIL, No SPI fail
1B INVALID, Invalid SPI command detected
FAILURE
0
rc
Failure detection
0B NO_FAIL, No Failure
1B FAIL, Failure occured
1) The CRC_FAIL bit will not be set in case the static CRC enabling / disabling sequence is sent (see Chapter 5.2).
Datasheet
199
Rev. 1.0
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TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Table 71
Reset of DEV_STAT
Register Reset Type Reset Values
POR/Soft reset
0000 0000 0000 0000B
Restart
0000 00xx xx0x xxxxB
Reset Short Name Reset Mode
Note
Notes
1. The bits DEV_STAT show the status of the device before exiting Restart Mode. Either the device came from
regular Sleep Mode or a failure (Restart Mode or Fail-Safe Mode) occurred. Coming from Sleep Mode will also
be shown if there was a trial to enter Sleep Mode without having cleared all wake flags before.
2. The WD_FAIL bits are implemented as a counter and are the only status bits, which are cleared automatically
by the device.
3. The SPI_FAIL bit can only be cleared via SPI command.
4. The bit CRC_STAT and CRC_FAIL can be read regardless the CRC setting. The SPI read command on
DEV_STAT ignores the CRC field.
Datasheet
200
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Bus Communication Status
BUS_STAT
Bus Communication Status
15
14
13
12
(100 0011B)
11
10
9
8
7
Reset Value: see Table 72
6
5
4
3
2
1
0
RES
LIN_FAIL
RES
RES
r
rc
r
r
Field
Bits
Type
Description
RES
15:7
r
Reserved, always reads as 0
LIN_FAIL
6:5
rc
LIN failure status
00B NO_FAIL, No failures
01B LIN_TSD, LIN Thermal shutdown
10B LIN_TXD_DOM_TO, LIN_TXD_DOM: detected a
TXDLIN dominant timeout
11B LIN_BUS_DOM_TO, LIN_BUS_DOM: detected a
LIN dominant timeout
RES
4:3
r
Reserved, always reads as 0
RES
2:0
r
Reserved, always reads as 0
Table 72
Reset of BUS_STAT
Register Reset Type Reset Values
POR/Soft reset
0000 0000 0000 0000B
Restart
0000 0000 0xxx xxxxB
Reset Short Name Reset Mode
Note
Notes
1. The VCAN_UV comparator is enabled if CAN Normal or CAN Receive Only Mode.
Datasheet
201
Rev. 1.0
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TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Wake-up Source and Information Status
WK_STAT
Wake-up Source and Information Status
15
14
13
12
11
10
(100 0100B)
9
8
7
Reset Value: see Table 73
6
LIN_W
TIMER TIMER
RES
U
2_WU 1_WU
RES
r
rc
r
rc
rc
5
4
3
2
1
0
RES
RES
WK4_
WU
RES
RES
RES
r
r
rc
r
r
r
Field
Bits
Type
Description
RES
15:11
r
Reserved, always reads as 0
LIN_WU
10
rc
LIN wake up
0B NO_WU, No Wake up
1B WU, Wake up detected
RES
9
r
Reserved, always reads as 0
TIMER2_WU
8
rc
Wake up via Timer2
0B NO_WU, No Wake up
1B WU, Wake up detected
TIMER1_WU
7
rc
Wake up via Timer1
0B NO_WU, No Wake up
1B WU, Wake up detected
RES
6:5
r
Reserved, always reads as 0
RES
4
r
Reserved, always reads as 0
WK4_WU
3
rc
Wake up via WK4
0B NO_WU, No Wake up
1B WU, Wake up detected
RES
2
r
Reserved, always reads as 0
RES
1
r
Reserved, always reads as 0
RES
0
r
Reserved, always reads as 0
Table 73
Reset of WK_STAT
Register Reset Type Reset Values
POR/Soft reset
0000 0000 0000 0000B
Restart
0000 0xxx x000 00x0B
Note:
Datasheet
Reset Short Name Reset Mode
Note
At Fail-Safe Mode entry, the WK_STAT register is automatically cleared by the device.
202
Rev. 1.0
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TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
WK Input Level
WK_LVL_STAT
WK Input Level
15
14
(100 0101B)
13
12
11
10
9
8
7
Reset Value: see Table 74
6
5
4
3
2
1
0
RES
RES
WK4_
LVL
RES
RES
RES
r
r
r
r
r
r
Field
Bits
Type
Description
RES
15:5
r
Reserved, always reads as 0
RES
4
r
Reserved, always reads as 0
WK4_LVL
3
r
Status of WK4
0B LOW, Low Level (=0)
1B HIGH, High Level (=1)
RES
2
r
Reserved, always reads as 0
RES
1
r
Reserved, always reads as 0
RES
0
r
Reserved, always reads as 0
Table 74
Reset of WK_LVL_STAT
Register Reset Type Reset Values
POR/Soft reset
0000 0000 0000 00x0B
Restart
0000 0000 0000 00x0B
Note:
Datasheet
Reset Short Name Reset Mode
Note
WK_LVL_STAT is updated in Normal Mode and Stop Mode and also in Init and Restart Mode. In cyclic
sense or wake mode, the registers contain the sampled level, i.e. the registers are updated after
every sampling.
203
Rev. 1.0
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TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
High-Side Switch Status
HS_OL_OC_OT_STAT
High-Side Switch Status
15
14
13
RES
RES
r
r
12
(100 0110B)
11
10
HS3_ HS2_ HS1_
OT
OT
OT
rc
rc
rc
9
8
RES
RES
r
r
7
Reset Value: see Table 75
6
5
HS3_ HS2_ HS1_
OL
OL
OL
rc
rc
rc
4
3
RES
RES
r
r
2
rc
Bits
Type
Description
RES
15:14
r
Reserved, always reads as 0
RES
13
r
Reserved, always reads as 0
HS3_OT
12
rc
Overtemperature Detection on HS3
0B NO_OT, No OT
1B OT, OT detected
HS2_OT
11
rc
Overtemperature Detection on HS2
0B NO_OT, No OT
1B OT, OT detected
HS1_OT
10
rc
Overtemperature Detection on HS1
0B NO_OT, No OT
1B OT, OT detected
RES
9
r
Reserved, always reads as 0
RES
8
r
Reserved, always reads as 0
HS3_OL
7
rc
Open-Load Detection on HS3
0B NO_OL, No OL
1B OL, OL detected
HS2_OL
6
rc
Open-Load Detection on HS2
0B NO_OL, No OL
1B OL, OL detected
HS1_OL
5
rc
Open-Load Detection on HS1
0B NO_OL, No OL
1B OL, OL detected
RES
4
r
Reserved, always reads as 0
RES
3
r
Reserved, always reads as 0
HS3_OC
2
rc
Overcurrent Detection on HS3
0B NO_OC, No OC
1B OC, OC detected
HS2_OC
1
rc
Overcurrent Detection on HS2
0B NO_OC, No OC
1B OC, OC detected
HS1_OC
0
rc
Overcurrent Detection on HS1
0B NO_OC, No OC
1B OC, OC detected
204
0
HS3_ HS2_ HS1_
OC
OC
OC
Field
Datasheet
1
rc
rc
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Table 75
Reset of HS_OL_OC_OT_STAT
Register Reset Type Reset Values
POR/Soft reset
0000 0000 0000 0000B
Restart
00xx xxxx xxxx xxxxB
Datasheet
Reset Short Name Reset Mode
205
Note
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
13.6.2
Status registers bridge driver
General Status register
GEN_STAT
General Status register
15
14
13
12
(101 0000B)
11
10
9
RES
RES
r
r
8
7
Reset Value: see Table 76
6
5
4
3
2
1
0
HB3V HB2V HB1V PWM6 PWM5 PWM4 PWM3 PWM2 PWM1
OUT OUT OUT STAT STAT STAT STAT STAT STAT
r
r
r
r
r
r
r
r
r
Field
Bits
Type
Description
RES
15:10
r
Reserved, always reads as 0
RES
9
r
Reserved, always reads as 0
HB3VOUT
8
r
Voltage level at VSH3 when HB3MODE[1:0] = 11 and
CPEN=11)
0B LOW, VSH3 = Low : VS - VSH3 > VHS3VDSTHx
1B HIGH, VSH3 = High: VS - VSH3 ≤ VHS3VDSTHx
HB2VOUT
7
r
Voltage level at VSH2 when HB2MODE[1:0] = 11 and
CPEN=11)
0B LOW, VSH2 = Low : VS - VSH2 > VHS2VDSTHx
1B HIGH, VSH2 = High: VS - VSH2 ≤ VHS2VDSTHx
HB1VOUT
6
r
Voltage level at VSH1 when HB1MODE[1:0] = 11 and
CPEN=11)
0B LOW, VSH1 = Low : VS - VSH1 > VHS1VDSTHx
1B HIGH, VSH1 = High: VS - VSH1 ≤ VHS1VDSTHx
PWM6STAT
5
r
PWM6 status
0B LOW, PWM6 is Low
1B HIGH, PWM6 is High
PWM5STAT
4
r
PWM5 status
0B LOW, PWM5 is Low
1B HIGH, PWM5 is High
PWM4STAT
3
r
PWM4 Status
0B LOW, PWM4 is Low
1B HIGH, PWM4 is High
PWM3STAT
2
r
PWM3 status
0B LOW, PWM3 is Low
1B HIGH, PWM3 is High
PWM2STAT
1
r
PWM2 Status
0B LOW, PWM2 is Low
1B HIGH, PWM2 is High
PWM1STAT
0
r
PWM1/CRC status
0B LOW, PWM1/CRC is Low
1B HIGH, PWM1/CRC is High
1) HBxVOUT = 0 if (CPEN=1 and HBxMODE ≠ 11) or CPEN=0.
Datasheet
206
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Table 76
Reset of GEN_STAT
Register Reset Type Reset Values
POR/Soft reset
0000 0000 0000 0000B
Restart
0000 0000 xx00 000xB
Datasheet
Reset Short Name Reset Mode
207
Note
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Turn-on/off delay regulation register
TDREG
Turn-on/off delay regulation register
15
14
13
12
11
RES
RES
r
r
10
(101 0001B)
9
8
7
Reset Value: see Table 77
6
5
4
3
IPDCH IPDCH IPDCH
IPCHG IPCHG IPCHG
RES
RES
G3_ST G2_ST G1_ST
3_ST 2_ST 1_ST
r
r
r
r
r
r
r
r
2
1
0
TDRE TDRE TDRE
G3
G2
G1
r
r
r
Field
Bits
Type
Description
RES
15:12
r
Reserved, always reads as 0
RES
11
r
Reserved, always reads as 0
IPDCHG3_ST
10
r
HB3 predischarge status
0B CLAMP, the predischarge current is equal to
0.5 mA typ. or ICHGMAX3 if AGC[1:0] = 10B or 11B,
and HB3_PWM_EN = 11)
1B NO_CLAMP, 0.5 mA < predischarge current <
ICHGMAX31)
IPDCHG2_ST
9
r
HB2 predischarge status
0B CLAMP, the predischarge current is equal to
0.5 mA typ. or ICHGMAX2 if AGC[1:0] = 10B or 11B,
and HB2_PWM_EN = 11)
1B NO_CLAMP, 0.5 mA < predischarge current <
ICHGMAX21)
IPDCHG1_ST
8
r
HB1 predischarge status
0B CLAMP, the predischarge current is equal to the
0.5 mA typ. or ICHGMAX1 if AGC[1:0] = 10B or 11B,
and HBx_PWM_EN = 11)
1B NO_CLAMP, 0.5 mA < predischarge current <
ICHGMAX11)
RES
7
r
Reserved, always reads as 0
IPCHG3_ST
6
r
HB3 precharge status
0B CLAMP, the precharge current is equal to 0.5 mA
typ. or ICHGMAX3 if AGC[1:0] = 10B or 11B, and
HB3_PWM_EN = 11)
1B NO_CLAMP, 0.5 mA < precharge current <
ICHGMAX31)
IPCHG2_ST
5
r
HB2 precharge status
0B CLAMP, the precharge current is equal to 0.5 mA
typ. or ICHGMAX2 if AGC[1:0] = 10B or 11B, and
HB2_PWM_EN = 11)
1B NO_CLAMP, 0.5 mA < precharge current <
ICHGMAX21)
Datasheet
208
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Field
Bits
Type
Description
IPCHG1_ST
4
r
HB1 precharge status
0B CLAMP, the precharge current is equal to the
0.5 mA typ. or ICHGMAX1 if AGC[1:0] = 10B or 11B,
and HB1_PWM_EN = 11)
1B NO_CLAMP, 0.5 mA < precharge current <
ICHGMAX11)
RES
3
r
Reserved, always reads as 0
TDREG3
2
r
HB3 Regulation of turn-on/off delay
0B NO_REG, tDON3 and tDOFF3 are not in regulation
1B REG, tDON3 and/or tDOFF3 are in regulation
TDREG2
1
r
HB2 Regulation of turn-on/off delay
0B NO_REG, tDON2 and tDOFF2 are not in regulation
1B REG, tDON2 and/or tDOFF2 are in regulation
TDREG1
0
r
HB1 Regulation of turn-on/off delay
0B NO_REG, tDON and tDOFF are not in regulation
1B REG, tDON and/or tDOFF are in regulation
1) IPCHGx_ST = 1 otherwise (PWM disabled, HB in high impedance or AGC[1:0] = 00B or 01B ).
Table 77
Reset of TDREG
Register Reset Type Reset Values
POR/Soft reset
0000 0000 0000 0000B
Restart
0000 0000 xx00 000xB
Datasheet
Reset Short Name Reset Mode
209
Note
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Drain-source overvoltage status
DSOV
Drain-source overvoltage
15
RES
r
14
13
12
VSINT VSOV
OC_C OVBR
BRAK
SA AKE_S
E_ST
T
rc
rc
rc
(101 0010B)
11
RES
10
9
8
7
LS3DS LS2DS LS1DS
OV_B OV_B OV_B RES
RK
RK
RK
r
rc
rc
rc
r
Reset Value: see Table 78
6
RES
r
5
4
3
2
1
0
LS3DS HS3D LS2DS HS2D LS1DS HS1D
OV
SOV
OV
SOV
OV
SOV
rc
rc
rc
rc
rc
rc
Field
Bits
Type
Description
RES
15
r
Reserved, always reads as 0
OC_CSA
14
rc
CSA Overcurrent detection
0B NO_OC, No overcurrent detected
1B OC, Overcurrent detected
VSINTOVBRAKE_ST
13
rc
VSINT Brake status
0B NOT_DETECT, VSINT overvoltage brake
condition is not detected
1B DETECT, VSINT overvoltage brake conditions is
detected
VSOVBRAKE_ST
12
rc
VS Brake status
0B NOT_DETECT, VS overvoltage brake conditions is
not detected
1B DETECT, VS overvoltage brake conditions is
detected
RES
11
r
Reserved, always reads as 0
LS3DSOV_BRK
10
rc
Drain-source overvoltage on low-side 3 during
braking
0B NO_OV, No drain-source overvoltage on LS3
1B OV, Drain-source overvoltage on LS3
LS2DSOV_BRK
9
rc
Drain-source overvoltage on low-side 2 during
braking
0B NO_OV, No drain-source overvoltage on LS2
1B OV, Drain-source overvoltage on LS2
LS1DSOV_BRK
8
rc
Drain-source overvoltage on low-side 1 during
braking
0B NO_OV, No drain-source overvoltage on LS1
1B OV, Drain-source overvoltage on LS1
RES
7
r
Reserved, always reads as 0
RES
6
r
Reserved, always reads as 0
LS3DSOV
5
rc
Drain-source overvoltage on low-side 3
0B NO_OV, No drain-source overvoltage on LS3
1B OV, Drain-source overvoltage on LS3
Datasheet
210
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Field
Bits
Type
Description
HS3DSOV
4
rc
Drain-source overvoltage on high-side 3
0B NO_OV, No drain-source overvoltage on HS3
1B OV, Drain-source overvoltage on HS3
LS2DSOV
3
rc
Drain-source overvoltage on low-side 2
0B NO_OV, No drain-source overvoltage on LS2
1B OV, Drain-source overvoltage on LS2
HS2DSOV
2
rc
Drain-source overvoltage on high-side 2
0B NO_OV, No drain-source overvoltage on HS2
1B OV, Drain-source overvoltage on HS2
LS1DSOV
1
rc
Drain-source overvoltage on low-side 1
0B NO_OV, No drain-source overvoltage on LS1
1B OV, Drain-source overvoltage on LS1
HS1DSOV
0
rc
Drain-source overvoltage on high-side 1
0B NO_OV, No drain-source overvoltage on HS1
1B OV, Drain-source overvoltage on HS1
Table 78
Reset of DSOV
Register Reset Type Reset Values
POR/Soft reset
0000 0000 0000 0000B
Restart
0xxx 0xxx 00xx xxxxB
Datasheet
Reset Short Name Reset Mode
211
Note
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Effective MOSFET turn.on/off delay - PWM half-bridge 1
EFF_TDON_OFF1
Effective MOSFET turn.on/off delay - HB1
15
14
13
12
11
10
(101 0011B)
9
8
Reset Value: see Table 79
7
6
5
4
3
2
RES
TDOFF1EFF
RES
TDON1EFF
r
r
r
r
1
0
Field
Bits
Type
Description
RES
15:14
r
Reserved, always reads as 0
TDOFF1EFF
13:8
r
Effective active MOSFET turn-off delay HB1
Nominal effective tDOFF1 = 53.3 ns x TDOFF1EFF[13:8]D
RES
7:6
r
Reserved, always reads as 0
TDON1EFF
5:0
r
Effective active MOSFET turn-on delay HB1
Nominal effective tDON1 = 53.3 ns x TDON1EFF[5:0]D
Table 79
Reset of EFF_TDON_OFF1
Register Reset Type Reset Values
POR/Soft reset
0000 0000 0000 0000B
Restart
00xx xxxx 00xx xxxxB
Datasheet
Reset Short Name Reset Mode
212
Note
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Effective MOSFET turn.on/off delay - PWM half-bridge 2
EFF_TDON_OFF2
Effective MOSFET turn.on/off delay - HB 2
15
14
13
12
11
10
(101 0100B)
9
8
Reset Value: see Table 80
7
6
5
4
3
2
RES
TDOFF2EFF
RES
TDON2EFF
r
r
r
r
1
0
Field
Bits
Type
Description
RES
15:14
r
Reserved, always reads as 0
TDOFF2EFF
13:8
r
Effective active MOSFET turn-off delay HB2
Nominal effective tDOFF2 = 53.3 ns x TDOFF2EFF[13:8]D
RES
7:6
r
Reserved, always reads as 0
TDON2EFF
5:0
r
Effective active MOSFET turn-on delay HB2
Nominal effective tDON2 = 53.3 ns x TDON2EFF[5:0]D
Table 80
Reset of EFF_TDON_OFF2
Register Reset Type Reset Values
POR/Soft reset
0000 0000 0000 0000B
Restart
00xx xxxx 00xx xxxxB
Datasheet
Reset Short Name Reset Mode
213
Note
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Effective MOSFET turn.on/off delay - PWM half-bridge 3
EFF_TDON_OFF3
Effective MOSFET turn.on/off delay - HB3
15
14
13
12
11
10
(101 0101B)
9
8
Reset Value: see Table 81
7
6
5
4
3
2
RES
TDOFF3EFF
RES
TDON3EFF
r
r
r
r
1
0
Field
Bits
Type
Description
RES
15:14
r
Reserved, always reads as 0
TDOFF3EFF
13:8
r
Effective active MOSFET turn-off delay HB3
Nominal effective tDOFF3 = 53.3 ns x TDO3EFF[13:8]D
RES
7:6
r
Reserved, always reads as 0
TDON3EFF
5:0
r
Effective active MOSFET turn-on delay HB3
Nominal effective tDON3 = 53.3 ns x TDON3EFF[5:0]D
Table 81
Reset of EFF_TDON_OFF3
Register Reset Type Reset Values
POR/Soft reset
0000 0000 0000 0000B
Restart
00xx xxxx 00xx xxxxB
Datasheet
Reset Short Name Reset Mode
214
Note
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
MOSFET rise/fall time - PWM half-bridge 1
TRISE_FALL1
MOSFET rise/fall time - HB1
15
14
13
12
(101 0111B)
11
10
9
8
Reset Value: see Table 82
7
6
5
4
3
2
RES
TFALL1
RES
TRISE1
r
r
r
r
Field
Bits
Type
Description
RES
15:14
r
Reserved, always reads as 0
TFALL1
13:8
r
Active MOSFET fall time HB1
Nominal tFALL1 = 53.3 ns x TFALL1[5:0]D
RES
7:6
r
Reserved, always reads as 0
TRISE1
5:0
r
Active MOSFET rise time HB1
Nominal tRISE1 = 53.3 ns x TRISE1[5:0]D
Table 82
0
Reset of TRISE_FALL1
Register Reset Type Reset Values
POR/Soft reset
0000 0000 0000 0000B
Restart
00xx xxxx 00xx xxxxB
Datasheet
1
Reset Short Name Reset Mode
215
Note
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
MOSFET rise/fall time - PWM half-bridge 2
TRISE_FALL2
MOSFET rise/fall time - HB2
15
14
13
12
(101 1000B)
11
10
9
8
Reset Value: see Table 83
7
6
5
4
3
2
RES
TFALL2
RES
TRISE2
r
r
r
r
Field
Bits
Type
Description
RES
15:14
r
Reserved, always reads as 0
TFALL2
13:8
r
Active MOSFET fall time HB2
Nominal tFALL2 = 53.3 ns x TFALL2[5:0]D
RES
7:6
r
Reserved, always reads as 0
TRISE2
5:0
r
Active MOSFET rise time HB2
Nominal tRISE2 = 53.3 ns x TRISE2[5:0]D
Table 83
0
Reset of TRISE_FALL2
Register Reset Type Reset Values
POR/Soft reset
0000 0000 0000 0000B
Restart
00xx xxxx 00xx xxxxB
Datasheet
1
Reset Short Name Reset Mode
216
Note
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
MOSFET rise/fall time - PWM half-bridge 3
TRISE_FALL3
MOSFET rise/fall time - HB3
15
14
13
12
(101 1001B)
11
10
9
8
Reset Value: see Table 84
7
6
5
4
3
2
RES
TFALL3
RES
TRISE3
r
r
r
r
Field
Bits
Type
Description
RES
15:14
r
Reserved, always reads as 0
TFALL3
13:8
r
Active MOSFET fall time HB3
Nominal tFALL3 = 53.3 ns x TFALL3[5:0]D
RES
7:6
r
Reserved, always reads as 0
TRISE3
5:0
r
Active MOSFET rise time HB3
Nominal tRISE3 = 53.3 ns x TRISE3[5:0]D
Table 84
0
Reset of TRISE_FALL3
Register Reset Type Reset Values
POR/Soft reset
0000 0000 0000 0000B
Restart
00xx xxxx 00xx xxxxB
Datasheet
1
Reset Short Name Reset Mode
217
Note
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
13.6.3
Family and product information register
Family and Product Identification Register
FAM_PROD_STAT
Family and Product Identification Register
15
14
13
12
11
10
(111 0000B)
9
8
7
Reset Value: see Table 85
6
5
4
3
RES
FAM
PROD
r
r
r
2
1
0
Field
Bits
Type
Description
RES
15:11
r
Reserved, always reads as 0
FAM
10:7
r
Device Family Identifier
1000B, BLDC Motor System IC
PROD
6:0
r
Device Product Identifier
000 0000BTLE9562-3QX/QX, TLE9562-3QX/-3QXJ/QX
000 0001BTLE9561-3QX/QX, TLE9561-3QX/-3QXJ/QX
000 0010BTLE9563-3QX, TLE9563-3QX/-3QXJ
000 0011BTLE9564QX, TLE9564QX,TLE9185QX
001 0000BTLE9562-3QX V33, TLE9562-3QX V33
001 0010BTLE9563-3QX V33, TLE9563-3QX V33
001 0011BTLE9564QX V33,
TLE9564QX V33,TLE9185QX V33
001 1000BTLE9560QX, TLE9560-3QX/-3QXJ
Table 85
Reset of FAM_PROD_STAT
Register Reset Type Reset Values
POR/Soft reset
0000 0100 0000 0011B
Restart
0000 0100 0000 0011B
Datasheet
Reset Short Name Reset Mode
218
Note
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
13.7
Electrical Characteristics
Table 86
Electrical Characteristics: Power Stage
VSINT = 5.5 V to 28 V, Tj = -40°C to +150°C, all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter
Symbol
Values
Unit
Note or
Test Condition
Number
P_14.7.1
Min.
Typ.
Max.
–
–
6.0
MHz
1)
SPI frequency
Maximum SPI frequency
fSPI,max
VCC1 > 3 V
SPI Interface; Logic Inputs SDI, CLK and CSN
H-input Voltage Threshold
VIH
–
–
0.7 ×
VCC1
V
–
P_14.7.2
L-input Voltage Threshold
VIL
0.3 ×
VCC1
–
–
V
–
P_14.7.3
Hysteresis of input Voltage
VIHY
–
0.12 ×
VCC1
–
V
1)
P_14.7.4
Pull-up Resistance at pin
CSN
RICSN
20
40
80
kΩ
–
P_14.7.5
Pull-down Resistance at pin RICLK/SDI
SDI and CLK
20
40
80
kΩ
VSDI/CLK = 0.2 × VCC1
P_14.7.6
Input Capacitance at pin
CSN, SDI or CLK
CI
–
10
–
pF
1)
VCSN, VSDI, VCLK =
VCC1
P_14.7.7
H-output Voltage Level
VSDOH
0.8 ×
VCC1
–
–
V
IDOH = -2 mA
P_14.7.8
L-output Voltage Level
VSDOL
–
–
0.2 ×
VCC1
V
IDOL = 2 mA
P_14.7.9
‘Tri-state Input Capacitance CSDO
–
10
15
pF
1)
VCSN, VSDI, VCLK =
VCC1
P_14.7.11
Tri-state Leakage Current
ISDOLK
–10
–
10
µA
1)
VCSN= VCC1,
0V < VSDO< VCC1
P_14.7.38
Clock Period
tpCLK
160
–
–
ns
–
P_14.7.12
Clock HIGH Time
tCLKH
70
–
–
ns
–
P_14.7.13
Clock LOW Time
tCLKL
70
–
–
ns
–
P_14.7.14
Clock LOW before CSN LOW tbef
70
–
–
ns
–
P_14.7.15
CSN Setup Time
tlead
160
–
–
ns
–
P_14.7.16
CLK Setup Time
tlag
160
–
–
ns
–
P_14.7.17
Clock LOW after CSN HIGH
tbeh
70
–
–
ns
–
P_14.7.18
SDI Setup Time
tDISU
60
–
–
ns
–
P_14.7.19
SDI Hold Time
tDIHO
40
–
–
ns
–
P_14.7.20
Logic Output SDO
Data Input Timing1)
Datasheet
219
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Serial Peripheral Interface
Table 86
Electrical Characteristics: Power Stage (cont’d)
VSINT = 5.5 V to 28 V, Tj = -40°C to +150°C, all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter
Symbol
Values
Unit
Note or
Test Condition
Number
Min.
Typ.
Max.
Input Signal Rise Time at pin trIN
SDI, CLK and CSN
–
–
20
ns
–
P_14.7.21
Input Signal Fall Time at pin tfIN
SDI, CLK and CSN
–
–
20
ns
–
P_14.7.22
tDel,Mode
–
–
5
µs
3)
P_14.7.23
tCSN(high)
3
–
–
µs
–
P_14.7.24
SDO Rise Time
trSDO
–
30
40
ns
CL = 50 pF, 0.2 × VCC1 P_14.7.25
to 0.8 × VCC1
SDO Fall Time
tfSDO
–
30
40
ns
CL = 50 pF, 0.8 × VCC1 P_14.7.26
to 0.2 × VCC1
SDO Enable Time
tENSDO
–
–
40
ns
LOW impedance
P_14.7.27
SDO Disable Time
tDISSDO
–
–
40
ns
HIGH impedance
P_14.7.28
SDO Valid Time
tVASDO
–
–
40
ns
CL = 50 pF
P_14.7.29
Delay Time for Mode
Changes2)
CSN HIGH Time
Data Output Timing
1)
1) Not subject to production test; specified by design.
2) Applies to all mode changes triggered via SPI commands.
3) Guaranteed by design.
24
CSN
15
16
13
17
14
18
CLK
19
SDI
27
SDO
20
LSB
not defined
MSB
28
29
Flag
LSB
MSB
Figure 74
SPI Timing Diagram
Note:
Numbers in drawing correlate with the last 2 digits of the Number field in the Electrical
Characteristics table.
Datasheet
220
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Application Information
14
Application Information
Note:
The following information is given as a hint for the implementation of the device only and shall not
be regarded as a description or warranty of a certain functionality, condition or quality of the device.
14.1
Application Diagrams
VCC1
Drev1
Trev1
CVCC1
Cin3
Cin2
L1
VSINT
SDI
Cin4
Rrev1
Cin1
Drev2
VS
VBAT
Cin5
SDO
CCP
CLK
CP
Rrev2
CPC1N
CCP1
CPC1P
CSN
Trev2
Rrev3
Drev3
RSTN
CPC2N
INTN
CPC2P
CCP2
RLED
HS1
Cin2b
CHS1
CHS2
RLED
HS2
GHx
CHS1
CHS2
CHS1
CHS2
Bridge x3
Q1
RLED
HS3
CHB1x
CHB2x
SHx
TLE9564
Microcontroller
GLx
Q2
VBAT
to other bridges
CSAP
CSAN
CWK1
RFILT1
PWM1
RFILT2
CFILT3
PWM2
CFILT2
RCSO
RWK2
RWK1
WK4
CFILT1
RSENSE
SL
PWM3
CSO
PWM4
ADC IN
CCSO
PWM5
VSHS
PWM6
DLIN
RLIN
LIN
TxD_LIN
RxD_LIN
CLIN
GND
Figure 75
TLE9564QX Application Diagram
Note:
This is a very simplified example of an application circuit. The function must be always verified in the
real application.
Datasheet
221
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Application Information
Table 87
Bill of Material
Ref.
Typical Value
Purpose / Comment
Cin1
100 nF ±20%
ceramic
Input filter battery capacitor for optimum EMC behavior
Cin2
100 µF ±20%, 50 V
Electrolytic
Buffering capacitor to cut off battery spikes, depending on the
application
Cin2b
470 µF ±20%, 50 V
Electrolytic
Buffering capacitor for bridges. Cut off battery spikes,
depending on the application
Cin3
100 nF ±20%, 50 V
Ceramic
Input capacitor
Cin4
100 nF ±20%, 50 V
Ceramic
Input capacitor
Cin5
470 µF ±20%, 50 V
Electrolytic
Buffering capacitor for bridges. Cut off battery spikes,
depending on the application
CCP
470 nF ±20%, 50 V
Ceramic
Charge-Pump buffering capacitor
CCP1/ CCP2
220 nF ±20%, 50 V
Ceramic
Charge-Pump flying capacitor to be placed as closed as possible
to the device pins, in order to minimize the length of the PCB
tracks
CFILT1
1.5 nF ±20%, 16 V
Ceramic
Current-sense filtering
CFILT2 / CFILT3
22 nF ±20%, 16 V
Ceramic
Current-sense filtering
CCSO
16 V
Ceramic
CSO buffering cap for a stable ADC voltage. Max 400 pF in case no
resistor is used. With 50 Ω resistor up to 2.2 nF. (See CSA
configuration register)
CLIN
1 nF / OEM dependent
LIN master termination
CVCC1
2.2 uF ±20%, 16 V
Blocking capacitor. Low ESR. Minimum 1 uF effective
capacitance
CHB1x
10 nF ±20%, 50 V
Ceramic
Half-Bridge EME (electromagnetic emission) and ESD
suppression filter to be placed close to the connector. Other
capacitance values might be needed depending on application
CHB2x
560 pF ±20%, 50 V
Ceramic
Optional filter for EMI immunity to be placed close to the SHx pin
(PCB footprints highly recommended). Other capacitance values
might be needed depending on application
CHS1
47 pF / OEM dependent
Only required om case of off-board connection to optimize
EMC behavior, place close to pin
CHS2
33 nF / OEM dependent
As required by application, mandatory protection for off-board
connection
CWK1 / CWK2
47 nF / OEM dependent
Spike filtering, as required by application, mandatory protection
for off-board connections
Capacitances
Datasheet
222
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Application Information
Table 87
Bill of Material (cont’d)
Ref.
Typical Value
Purpose / Comment
4 uH ... 6 uH
Input filter for power stage - consider high current rating
(application dependent)
RREV1
100 kΩ ±5%
Other values needed depending on application
RREV2
10 kΩ ±5%
Device protection against reverse battery
RREV3
10 kΩ ±5%
RSENSE
5 mΩ ±1%
Current-sense resistor
RFILT1 / RFILT2
4.7 Ω ±5%
Current-sense filtering
RCSO
50 Ω ±5%
Compensation for internal opamp.Depending on SPI
configuration
RLIN
1 k ±5%
LIN master termination
RLED
1k
Limit LED-current
RWK1 / RWK2 /
RWK3 / RWK4
10 kΩ ±5%
Inductances
L1
Resistances
Active Components
DREV1
RR268MM600
Reverse polarity protection
DREV2
BZX84C16
Gate protection. Limit VGS
DREV3
BAS21
TREV1
IPZ40N04S5L-2R8
TREV2
BC846
Q1 / Q2
IPZ40N04S5-3R1
Main power switches
DLIN
BAS70
Requested by LIN standard; reverse polarity protection of
network
Datasheet
Reverse battery protection, N-MOS
223
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Application Information
14.2
ESD Tests
14.2.1
ESD according to IEC61000-4-2
Tests for ESD robustness according to IEC61000-4-2 “GUN test” (150 pF, 330 Ω) have been performed.
The results and test condition are available in a test report. The values for the test are listed below.
Table 88
ESD “GUN test”1)2)
Performed Test
Result
Unit
Remarks
ESD at pin LIN, HSx, VS,VSINT,VS,
WKx
versus GND
>6
kV
positive pulse
ESD at pin LIN, HSx, VS,VSINT,VS,
WKx
versus GND
< -6
kV
negative pulse
1) ESD susceptibility “ESD GUN” according to EMC 1.3 Test specification, Section 4.3 (IEC 61000-4-2). Tested by external
test house (IBEE Zwickau, EMC Test report Nr. 20.12.20).
2) ESD Test “Gun Test” is specified with external components for pins VS, VSINT, VS, WKx, HSx. See the application
diagram in Chapter 14.1 for more information.
14.2.2
ESD according to SAE J2962
Tests for ESD robustness according to SAE J2962 have been performed.
Table 89
ESD according to SAE J2962
Performed Test
Result
Unit
Remarks
ESD at pin
±4
kV
Unpowered, contact discharge
ESD at pin
±8
kV
1)
ESD at pin
± 25
kV
1)
Powered, contact discharge
Powered, air discharge
1) For ESD pulses ≤ - 6 kV, VCC1 undervoltage may be detected.
Datasheet
224
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Application Information
14.3
Thermal Behavior of Package
Top view
Figure 76
Bottom view
cooling area
Detail solder
pads and vias
Board Setup
Board setup is defined according JESD 51-2, -5, -7.
Board: 76.2 × 114.3 × 1.5 mm3 with 2 inner copper layers (35 µm thick), with thermal via array under the
exposed pad contacting the first inner copper layer and 300 mm2 cooling area on the bottom layer (70 µm).
14.4
Further Application Information
•
The VS pin supplies the bridge driver and the charge pump, and is the sense pin for the high-side MOSFETs
drain voltage. It is therefore highly recommended to connect a 100 nF / 50V ceramic by-pass capacitor as
close as possible to the VS pin with a short PCB trace to GND.
•
Please contact us for information regarding the FMEA pin
•
For further information you may contact http://www.infineon.com/
Datasheet
225
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Package Outlines
Package Outlines
0.1±0.03
.0
±0
1)
1
13
12
0.05 MAX.
5)
(0.2)
1) Vertical burr 0.03 max., all sides
2) These four metal areas have exposed diepad potential
Figure 77
(6)
48
13
.3
C
2)
37
(0
Index Marking
0.15 ±0.05
0.1 ±0.05
24
SEATING PLANE
7 ±0.1
6.8
48x
0.08
0.4 x 45°
36
25
0.
+0.03
26
B
0.5
0.
6.8
11 x 0.5 = 5.5
0.5 ±0.07
A
(5.2)
7 ±0.1
0.9 MAX.
(0.65)
5
15
0.23 ±0.05
(5.2)
Index Marking
48x
0.1 M A B C
(6)
PG-VQFN-48-29, -31-PO V05
PG-VQFN-481)
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant
with government regulations the device is available as a green product. Green products are RoHS-Compliant
(i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
Further information on packages
https://www.infineon.com/packages
1) Dimensions in mm
Datasheet
226
Rev. 1.0
2021-01-21
TLE9564QX
BLDC Motor System IC
Revision History
16
Revision History
Revision Date
Changes
1.0
First release
Datasheet
2021-01-21
227
Rev. 1.0
2021-01-21
Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
Edition 2021-01-21
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2021 Infineon Technologies AG.
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