74273

MM74HC273 Octal D-Type Flip-Flops with Clear September 1983 Revised February 1999 MM74HC273 Octal D-Type Flip-Flops with Clear General Description The MM74HC273 edge triggered flip-flops utilize advanced silicon-gate CMOS technology to implement D-type flipflops. They possess high noise immunity, low power, and speeds comparable to low power Schottky TTL circuits. This device contains 8 master-slave flip-flops with a common clock and common clear. Data on the D input having the specified setup and hold times is transferred to the Q output on the LOW-to-HIGH transition of the CLOCK input. The CLEAR input when LOW, sets all outputs to a low state. Each output can drive 10 low power Schottky TTL equivalent loads. The MM74HC273 is functionally as well as pin compatible to the 74LS273. All inputs are protected from damage due to static discharge by diodes to VCC and ground. Features s Typical propagation delay: 18 ns s Wide operating voltage range s Low input current: 1 µA maximum s Low quiescent current: 80 µA (74 Series) s Output drive: 10 LS-TTL loads Ordering Code: Order Number MM74HC273M MM74HC273SJ MM74HC273MTC MM74HC273N Package Number M20B M20D MTC20 N20A Package Description 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-153, 0.300” Wide 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 20-Lead thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Connection Diagram Pin Assignments for DIP, SOIC, SOP and TSSOP Top View © 1999 Fairchild Semiconductor Corporation DS005331.prf www.fairchildsemi.com MM74HC273 Truth Table (Each Flip-Flop) Inputs Clear L H H H Clock X ↑ ↑ L D X H L X Outputs Q L H L Q0 Logic Diagram H = HIGH Level (Steady State) L = LOW Level (Steady State) X = Don’t Care ↑ = Transition from LOW-to-HIGH level Q0 = The level of Q before the indicated steady state input conditions were established www.fairchildsemi.com 2 MM74HC273 Absolute Maximum Ratings(Note 1) (Note 2) Supply Voltage (VCC) DC Input Voltage (VIN) DC Output Voltage (VOUT) Clamp Diode Current (IIK, IOK) DC Output Current, per pin (IOUT) DC VCC or GND Current, per pin (ICC) Storage Temperature Range (TSTG) Power Dissipation (PD) (Note 3) S.O. Package only Lead Temperature (TL) (Soldering 10 seconds) 260°C 600 mW 500 mW −0.5 to +7.0V −1.5 to VCC +1.5V −0.5 to VCC +0.5V ±20 mA ±25 mA ±50 mA −65°C to +150°C Recommended Operating Conditions Min Supply Voltage (VCC) DC Input or Output Voltage (VIN, VOUT) Operating Temperature Range (TA) Input Rise or Fall Times (tr, tf) VCC = 2.0V VCC = 4.5V VCC = 6.0V 1000 500 400 ns ns ns 0 −40 VCC +85 V °C 2 Max 6 Units V Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur. Note 2: Unless otherwise specified all voltages are referenced to ground. Note 3: Power Dissipation temperature derating — plastic “N” package: − 12 mW/°C from 65°C to 85°C. DC Electrical Characteristics Symbol VIH Parameter Minimum HIGH Level Input Voltage VIL Maximum LOW Level Input Voltage VOH Minimum HIGH Level Output Voltage VIN = VIH or VIL |IOUT| ≤ 20 µA Conditions (Note 4) VCC 2.0V 4.5V 6.0V 2.0V 4.5V 6.0V 2.0V 4.5V 6.0V 2.0 4.5 6.0 4.2 5.7 0 0 0 0.2 0.2 TA = 25°C Typ 1.5 3.15 4.2 0.5 1.35 1.8 1.9 4.4 5.9 3.98 5.48 0.1 0.1 0.1 0.26 0.26 ±0.1 8 TA = −40 to 85°C TA = −55 to 125°C Guaranteed Limits 1.5 3.15 4.2 0.5 1.35 1.8 1.9 4.4 5.9 3.84 5.34 0.1 0.1 0.1 0.33 0.33 ±1.0 80 1.5 3.15 4.2 0.5 1.35 1.8 1.9 4.4 5.9 3.7 5.2 0.1 0.1 0.1 0.4 0.4 ±1.0 160 Units V V V V V V V V V V V V V V V V µA µA VIN = VIH or VIL |IOUT| ≤ 4.0 mA |IOUT| ≤ 5.2 mA VOL Maximum LOW Level Output Voltage VIN = VIH or VIL |IOUT| ≤ 20 µA 2.0V 4.5V 6.0V VIN = VIH or VIL |IOUT| ≤ 4 mA |IOUT| ≤ 5.2 mA IIN ICC Maximum Input Current Maximum Quiescent Supply Current VIN = VCC or GND IOUT = 0 µA 6.0V VIN = VCC or GND 4.5V 6.0V 6.0V 4.5V 6.0V Note 4: For a power supply of 5V ±10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when designing with this supply. Worst case VIH and VIL occur at VCC = 5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V.) The worst case leakage current (IIN, ICC, and IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used. 3 www.fairchildsemi.com MM74HC273 AC Electrical Characteristics VCC = 5V, TA = 25°C, CL = 15 pF, tr = tf = 6 ns Symbol fMAX tPHL, tPLH tPHL tREM ts tH tW Parameter Maximum Operating Frequency Maximum Propagation Delay, Clock to Output Maximum Propagation Delay, Clear to Output Minimum Removal Time, Clear to Clock Minimum Setup Time Data to Clock Minimum Hold Time Clock to Data Minimum Pulse Width Clock or Clear 10 16 ns −2 0 ns 10 20 ns 10 20 ns 18 27 ns 18 27 ns Conditions Typ 50 Guaranteed Limit 30 Units MHz AC Electrical Characteristics CL = 50 pF, tr = tf = 6 ns (unless otherwise specified) Symbol fMAX Parameter Maximum Operating Frequency tPHL, tPLH Maximum Propagation Delay, Clock to Output tPHL Maximum Propagation Delay, Clear to Output tREM Minimum Removal Time Clear to Clock ts Minimum Setup Time Data to Clock tH Minimum Hold Time Clock to Data tW Minimum Pulse Width Clock or Clear tr, tf Maximum Input Rise and Fall Time, Clock tTHL, tTLH Maximum Output Rise and Fall Time CPD CIN Power Dissipation Capacitance (Note 5) Maximum Input Capacitance Note 5: CPD determines the no load dynamic power consumption, PD = CPD VCC2f + ICC VCC, and the no load dynamic current consumption, IS = CPD VCC f + ICC. Conditions VCC 2.0V 4.5V 6.0V 2.0V 4.5V 6.0V 2.0V 4.5V 6.0V 2.0V 4.5V 6.0V 2.0V 4.5V 6.0V 2.0V 4.5V 6.0V 2.0V 4.5V 6.0V 2.0V 4.5V 6.0V 2.0V 4.5V 6.0V TA = 25°C Typ 16 74 78 38 14 12 42 19 18 0 0 0 26 7 5 −15 −6 −4 34 11 10 5 27 31 135 27 23 135 27 23 25 5 4 100 20 17 0 0 0 80 16 14 1000 500 400 28 11 9 45 7 10 75 15 13 TA = −40 to 85°C TA = −55 to 125°C Guaranteed Limits 4 21 24 170 34 29 170 34 29 32 6 5 125 25 21 0 0 0 100 20 18 1000 500 400 95 19 16 3 18 20 205 41 35 205 41 35 37 7 6 150 30 25 0 0 0 120 24 20 1000 500 400 110 22 19 Units MHz MHz MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns pF (per flip-flop) 10 10 pF www.fairchildsemi.com 4 MM74HC273 Physical Dimensions inches (millimeters) unless otherwise noted 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide Package Number M20B 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package Number M20D 5 www.fairchildsemi.com MM74HC273 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC20 www.fairchildsemi.com 6 MM74HC273 Octal D-Type Flip-Flops with Clear Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide Package Number N20A LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component in any component of a life support 1. Life support devices or systems are devices or systems device or system whose failure to perform can be reawhich, (a) are intended for surgical implant into the sonably expected to cause the failure of the life support body, or (b) support or sustain life, and (c) whose failure device or system, or to affect its safety or effectiveness. to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the www.fairchildsemi.com user. Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.