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74LCX08MX

74LCX08MX

  • 厂商:

    FAIRCHILD(仙童半导体)

  • 封装:

  • 描述:

    74LCX08MX - Low Voltage Quad 2-Input AND Gate with 5V Tolerant Inputs - Fairchild Semiconductor

  • 数据手册
  • 价格&库存
74LCX08MX 数据手册
74LCX08 Low Voltage Quad 2-Input AND Gate with 5V Tolerant Inputs March 1995 Revised February 2005 74LCX08 Low Voltage Quad 2-Input AND Gate with 5V Tolerant Inputs General Description The LCX08 contains four 2-input AND gates. The inputs tolerate voltages up to 7V allowing the interface of 5V systems to 3V systems. The 74LVX08 is fabricated with advanced CMOS technology to achieve high speed operation while maintaining CMOS low power dissipation. Features s 5V tolerant inputs s 2.3V–3.6V VCC specifications provided s 5.5 ns tPD max (VCC 3.3V), 10 PA ICC max 3.0V) s Power down high impedance inputs and outputs s r24 mA output drive (VCC s Implements patented noise/EMI reduction circuitry s Latch-up performance exceeds JEDEC 78 conditions s ESD performance: Human body model ! 2000V Machine model ! 150V s Leadless Pb-Free DQFN package Ordering Code: Order Number 74LCX08M 74LCX08MX_NL (Note 1) 74LCX08SJ 74LCX08BQX (Note 2) 74LCX08MTC 74LCX08MTCX_NL (Note 1) Package Number M14A M14A M14D MLP014A MTC14 MTC14 Package Description 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow Pb-Free 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Pb-Free 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Pb-Free package per JEDEC J-STD-020B. Note 1: “_NL” indicates Pb-Free product (per JEDEC J-STD-020B). Device is available in Tape and Reel only. Note 2: D QFN package available in Tape and Reel only. © 2005 Fairchild Semiconductor Corporation DS012411 www.fairchildsemi.com 74LCX08 Logic Symbol IEEE/IEC Connection Diagrams Pin Assignments for SOIC, SOP, and TSSOP Pad Assignments for DQFN Pin Descriptions Pin Names An, Bn On Description Inputs Outputs (Top View) www.fairchildsemi.com 2 74LCX08 Absolute Maximum Ratings(Note 3) Symbol VCC VI VO IIK IOK IO ICC IGND TSTG Parameter Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Source/Sink Current DC Supply Current per Supply Pin DC Ground Current per Ground Pin Storage Temperature Value Conditions Units V V Output in HIGH or LOW State (Note 4) VI  GND VO  GND VO ! VCC V mA mA mA mA mA 0.5 to 7.0 0.5 to 7.0 0.5 to VCC  0.5 50 50 50 r50 r100 r100 65 to 150 qC Recommended Operating Conditions (Note 5) Symbol VCC VI VO IOH/IOL Supply Voltage Input Voltage Output Voltage Output Current HIGH or LOW State VCC VCC VCC TA Free-Air Operating Temperature Input Edge Rate, VIN 0.8V–2.0V, VCC 3.0V 3.0V  3.6V 2.7V  3.0V 2.3V  2.7V Parameter Operating Data Retention Min 2.0 1.5 0 0 Max 3.6 3.6 5.5 VCC Units V V V mA r24 r12 r8 40 0 85 10 qC ns/V 't/'V Note 3: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Ratings. The “Recommended Operating Conditions” table will define the conditions for actual device operation. Note 4: IO Absolute Maximum Rating must be observed. Note 5: U nused inputs must be held HIGH or LOW. They may not float. DC Electrical Characteristics Symbol VIH VIL VOH Parameter HIGH Level Input Voltage LOW Level Input Voltage HIGH Level Output Voltage IOH IOH IOH IOH VOL LOW Level Output Voltage IOL IOL IOL IOL II IOFF ICC Input Leakage Current Power-Off Leakage Current Quiescent Supply Current Increase in ICC per Input Conditions VCC (V) 2.3  2.7 2.7  3.6 2.3  2.7 2.3  3.6 TA 40qC to 85qC Max Units Min 1.7 2.0 V 0.7 0.8 V 100 PA 12 mA 18 mA 24 mA 100 PA 12 mA 16 mA 24 mA 5.5V 2.3  3.6 2.3 2.7 3.0 3.0 2.3  3.6 2.3 2.7 3.0 3.0 2.3  3.6 0 2.3  3.6 2.3  3.6 2.3  3.6 VCC  0.2 1.8 2.2 2.4 2.2 0.2 0.6 0.4 0.4 0.55 V V IOH = -8 mA IOL = 8mA 0 d VI d 5.5V VI or VO VI VIH VCC or GND VCC 0.6V r5.0 10 10 PA PA PA PA 3.6V d VI d 5.5V r10 500 'ICC 3 www.fairchildsemi.com 74LCX08 AC Electrical Characteristics TA Symbol Parameter VCC CL Min tPHL tPLH tOSHL tOSLH Output to Output Skew (Note 6) Propagation Delay 1.5 1.5 3.3V r 0.3V 50 pF Max 5.5 5.5 1.0 1.0 40qC to 85qC, RL VCC CL Min 1.5 1.5 2.7V 50 pF Max 6.2 6.2 500: VCC CL Min 1.5 1.5 2.5V r 0.2V 30 pF Max 6.6 6.6 ns ns Units Note 6: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH). Dynamic Switching Characteristics Symbol VOLP VOLV Parameter Quiet Output Dynamic Peak VOL Quiet Output Dynamic Valley VOL CL CL CL CL 50 pF, VIH 30 pF, VIH 50 pF, VIH 30 pF, VIH Conditions 3.3V, VIL 2.5V, VIL 3.3V, VIL 2.5V, VIL 0V 0V 0V 0V VCC (V) 3.3 2.5 3.3 2.5 TA 25qC 0.8 0.6 Typical Units V V 0.8 0.6 Capacitance Symbol CIN COUT CPD Input Capacitance Output Capacitance Power Dissipation Capacitance Parameter VCC VCC VCC Open, VI 3.3V, VI 3.3V, VI Conditions 0V or VCC 0V or VCC 0V or VCC, f 10 MHz Typical 7 8 25 Units pF pF pF www.fairchildsemi.com 4 74LCX08 AC Loading and Waveforms Generic for LCX Family FIGURE 1. AC Test Circuit (CL includes probe and jig capacitance) Test tPLH, tPHL tPZL, tPLZ tPZH,tPHZ Switch Open 6V at VCC 3.3 r 0.3V VCC x 2 at VCC 2.5 r 0.2V GND Waveform for Inverting and Non-Inverting Functions 3-STATE Output Low Enable and Disable Times for Logic Propagation Delay, Pulse Width and trec Waveforms Setup Time, Hold TIme and Recovery TIme for Logic 3-STATE Output High Enable and Disable TImes for Logic trise and tfall FIGURE 2. Waveforms (Input Pulse Characteristics; f = 1MHz, tr = tf = 3ns) Symbol Vmi Vmo Vx Vy VCC 3.3V r 0.3V 1.5V 1.5V VOL  0.3V VOH  0.3V 2.7V 1.5V 1.5V VOL  0.3V VOH  0.3V 2.5V r 0.2V VCC/2 VCC/2 VOL  0.15V VOH  0.15V 5 www.fairchildsemi.com 74LCX08 Schematic Diagram Generic for LCX Family www.fairchildsemi.com 6 74LCX08 Tape and Reel Specification Tape Format for DQFN Package Designator BQX Tape Section Leader (Start End) Carrier Trailer (Hub End) TAPE DIMENSIONS inches (millimeters) Number Cavities 125 (typ) 3000 75 (typ) Cavity Status Empty Filled Empty Cover Tape Status Sealed Sealed Sealed REEL DIMENSIONS inches (millimeters) Tape Size 12 mm A 13.0 (330.0) B 0.059 (1.50) C 0.512 (13.00) D 0.795 (20.20) N 2.165 (55.00) W1 0.488 (12.4) W2 0.724 (18.4) 7 www.fairchildsemi.com 74LCX08 Physical Dimensions inches (millimeters) unless otherwise noted 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow Package Number M14A www.fairchildsemi.com 8 74LCX08 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package Number M14D 9 www.fairchildsemi.com 74LCX08 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) Pb-Free 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm Package Number MLP014A www.fairchildsemi.com 10 74LCX08 Low Voltage Quad 2-Input AND Gate with 5V Tolerant Inputs Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC14 Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 11 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com www.fairchildsemi.com
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