FODM3011

4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM-PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS FODM3010 DESCRIPTION The FODM301X and FODM302X series consists of a GaAs infrared emitting diode driving a silicon bilateral switch housed in a compact 4-pin mini-flat package. The lead pitch is 2.54 mm. They are designed for interfacing between electronic controls and power triacs to control resistive and inductive loads for 115V/240V operations. FODM3011 FODM3012 FODM3021 FODM3022 FODM3023 FEATURES • Compact 4-pin surface mount package (2.4 mm maximum standoff height) • Peak blocking voltage 250V (FODM301X) 400V (FODM302X) • Available in tape and reel quantities of 500 and 2500. • Applicable to Infrared Ray reflow (230°C max, 30 seconds.) • BSI, CSA and VDE certifications pending • UL (File# E90700) certified PACKAGE DIMENSIONS PIN 1 0.026 (0.66) 0.100 (2.54) TYP ANODE 1 MAIN 4 TERMINAL CATHODE 2 MAIN 3 TERMINAL 0.020 (0.51) 0.012 (0.30) 0.287 (7.29) 0.248 (6.30) 0.173 (4.40) TYP 0.169 (4.29) 0.154 (3.91) 0.094 (2.39) 0.079 (2.01) APPLICATIONS • • • • • Industrial controls Traffic lights Vending machines Solid state relay Lamp ballasts • • • • Solenoid/valve controls Static AC power switch Incandescent lamp dimmers Motor control 0.008 (0.20) 0.000 (0.0) 0.035 (0.89) 0.012 (0.30) 0.033 (0.85) 0.026 (0.65) NOTE All dimensions are in inches (millimeters) ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified) Parameter TOTAL PACKAGE Storage Temperature Junction Temperature Operating Temperature EMITTER Continuous Forward Current Peak Forward Current (1 µs pulse, 300 pps.) Reverse Input Voltage Power Dissipation (No derating required over operating temp. range) DETECTOR On-State RMS Current Off-State Output Terminal Voltage FODM3010/1/2 FODM3021/2/3 IT(RMS) VDRM PD 70 250 400 300 mA (RMS) V mW IF (avg) IF (pk) VR PD 60 1 3 100 mA A V mW Symbol TSTG TJ TOPR Value -40 to +125 125 -40 to +85 Units °C °C °C Power Dissipation (No derating required over operating temp. range) © 2003 Fairchild Semiconductor Corporation Page 1 of 10 11/10/03 4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM-PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS FODM3010 FODM3011 FODM3012 FODM3021 FODM3022 FODM3023 ELECTRICAL CHARACTERISTICS (TA = 25°C) INDIVIDUAL COMPONENT CHARACTERISTICS Parameter EMITTER Input Forward Voltage Reverse Leakage Current DETECTOR Peak Blocking Current Either Direction Peak On-State Voltage Either Direction Critical Rate of Rise of Off-State Voltage Rated VDRM, IF = 0 (note 1) ITM = 100mA peak IF = 0 (Figure 8, note 2) IDRM VTM dV/dt Test Conditions Symbol IF = 10 mA VR = 3 V, TA = 25°C VF IR Device All All All All All Min Typ* 1.20 0.01 2 1.7 10 Max 1.5 100 100 3 Unit V µA nA V V/µs TRANSFER CHARACTERISTICS (TA = 25°C) DC Characteristics Test Conditions Symbol Device FODM3010 FODM3021 FODM3011 FODM3022 FODM3012 FODM3023 All 300 Min Typ* Max 15 10 5 µA mA Unit LED Trigger Current Main Terminal Voltage = 3V (note 3) IFT Holding Current, Either Direction IH ISOLATION CHARACTERISTICS Characteristic Steady State Isolation Voltage * All typicals at TA = 25°C Note 1. Test voltage must be applied within dv/dt rating. 2. This is static dv/dt. See Figure 1 for test circuit Commutating dv/dt is function of the load-driving thyristor(s) only. 3. All devices are guaranteed to trigger at an IF value less than or equal to max IFT. Therefore, recommended operating IF lies between max IFT (15 mA for FODM3010 and FODM3021, 10 mA for FODM3011 and FODM3022, 5 mA for FODM3012 and FODM3023) and absolute max IF (60 mA). Test Conditions (1 Minute) Symbol VISO Device All Min 3750 Typ* Max Unit VRMS © 2003 Fairchild Semiconductor Corporation Page 2 of 10 11/10/03 4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM-PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS FODM3010 FODM3011 FODM3012 FODM3021 FODM3022 FODM3023 TYPICAL PERFORMANCE CURVES Fig. 1 LED Forward Voltage vs. Forward Current 1.7 1000 Fig. 2 Leakage Current vs. Ambient Temperature 1.6 IDRM - LEAKAGE CURRENT (nA) 100 VDRM = 400V VF - FORWARD VOLTAGE (V) 1.5 1.4 1.3 TA = -40°C 1.2 TA = 25°C 1.1 TA = 85°C 1.0 10 1 0.9 1 10 IF - FORWARD CURRENT (mA) 100 0.1 -40 -20 0 20 40 60 80 100 T A - AMBIENT TEMPERATURE (°C) Fig. 3 Holding Current vs. Ambient Temperature 5 I H - HOLDING CURRENT (NORMALIZED) NORMALIZED TO TA = 25°C I FT - TRIGGER CURRENT (NORMALIZED) 1.3 1.4 Fig. 4 Trigger Current vs. Ambient Temperature VTM = 3V NORMALIZED TO TA = 25°C 2 1.2 1.0 1.1 0.5 1.0 0.9 0.2 0.8 0.1 -40 -20 0 20 40 60 80 100 TA - AMBIENT TEMPERATURE (°C) 0.7 -40 -20 0 20 40 60 80 100 T A - AMBIENT TEMPERATURE (°C) © 2003 Fairchild Semiconductor Corporation Page 3 of 10 11/10/03 4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM-PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS FODM3010 FODM3011 FODM3012 FODM3021 FODM3022 FODM3023 TYPICAL PERFORMANCE CURVES Fig. 5 LED Current Required to Trigger vs. LED Pulse Width 12 V DRM - OFF-STATE OUTPUT TERMINAL VOLTAGE T = 25°C A NORMALIZED TO PW IN >> 100µs 10 Fig. 6 Off-state Output Terminal Voltage vs. Ambient Temperature 1.4 NORMALIED TO TA = 25°C 1.3 1.2 (NORMALIZED) 1.1 1.0 0.9 0.8 0.7 0.6 -40 IFT - LED TRIGGER CURRENT (NORMALIZED) 8 6 4 2 0 1 10 PW IN - LED TRIGGER PULSE WIDTH (µs) 100 -20 0 20 40 60 80 100 T A - AMBIENT TEMPERATURE (°C) Fig. 7 On-State Characteristics 800 TA = 25°C 600 ITM - ON-STATE CURRENT (mA) 400 200 0 -200 -400 -600 -800 -4 -3 -2 -1 0 1 2 3 4 VTM - ON-STATE VOLTAGE (V) © 2003 Fairchild Semiconductor Corporation Page 4 of 10 11/10/03 4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM-PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS FODM3010 FODM3011 FODM3012 FODM3021 FODM3022 FODM3023 TYPICAL PERFORMANCE CURVES 400V (FODM302X) 250V (FODM301X) Vdc RTEST R = 10 kΩ CTEST PULSE INPUT MERCURY WETTED RELAY D.U.T. X100 SCOPE PROBE 1. The mercury wetted relay provides a high speed repeated pulse to the D.U.T. 2. 100x scope probes are used, to allow high speeds and voltages. 3. The worst-case condition for static dv/dt is established by triggering the D.U.T. with a normal LED input current, then removing the current. The variable RTEST allows the dv/dt to be gradually increased until the D.U.T. continues to trigger in response to the applied voltage pulse, even after the LED current has been removed. The dv/dt is then decreased until the D.U.T. stops triggering. τRC is measured at this point and recorded. Vmax = 400 V (FODM302X) = 250 V (FODM301X) APPLIED VOLTAGE WAVEFORM 252 V (FODM302X) 158 V (FODM301X) dv/dt = τRC 0.63 Vmax τRC 0 VOLTS 252 =τ (FODM302X) RC 158 =τ (FODM301X) RC Figure 8. Static dv/dt Test Circuit NOTE: This optoisolator should not be used to drive a load directly. It is intended to be a trigger device only. RL Rin VCC FODM3010 FODM3011 FODM3012 2 3 1 4 180 120 V 60 Hz Figure 9. Resistive Load ZL Rin VCC MOC3010 MOC3011 MOC3012 2 3 0.1 µF C1 1 4 180 2.4k 120 V 60 Hz Figure 10. Inductive Load with Sensitive Gate Triac (IGT ≤ 15 mA) © 2003 Fairchild Semiconductor Corporation Page 5 of 10 11/10/03 4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM-PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS FODM3010 FODM3011 FODM3012 FODM3021 FODM3022 FODM3023 ZL VCC Rin 1 FODM3010 FODM3011 FODM3012 2 3 4 180 1.2 k 120 V 60 Hz C1 0.2 µF Figure 11. Inductive Load with Sensitive Gate Triac (IGT ≤ 15 mA) Rin VCC 1 FODM3021 FODM3022 FODM3023 2 4 360 470 HOT 0.05 µF 3 39 240 VAC 0.01 µF LOAD GROUND In this circuit the “hot” side of the line is switched and the load connected to the cold or ground side. The 39 ohm resistor and 0.01 µF capacitor are for snubbing of the triac, and the 470 ohm resistor and 0.05 mF capacitor are for snubbing the coupler. These components may or may not be necessary depending upon the particular and load used. Figure 12. Typical Application Circuit © 2003 Fairchild Semiconductor Corporation Page 6 of 10 11/10/03 4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM-PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS FODM3010 FODM3011 FODM3012 FODM3021 FODM3022 FODM3023 ORDERING INFORMATION Option V R1 R2 R3 R4 R1V R2V R3V R4V Description VDE Approved Tape and Reel (500 units) Tape and Reel (2500 units) Tape and Reel (500 units; unit 180° rotated) Tape and Reel (2500 units; unit 180° rotated) Tape and Reel (500 units) and VDE Approved Tape and Reel (2500 units) and VDE Approved Tape and Reel (500 units; unit 180° rotated) and VDE Approved Tape and Reel (2500 units; unit 180° rotated) and VDE Approved MARKING INFORMATION 1 3011 V X YY M 3 4 5 2 6 Definitions 1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option – See order entry table) One digit year code Two digit work week ranging from ‘01’ to ‘53’ Assembly package code © 2003 Fairchild Semiconductor Corporation Page 7 of 10 11/10/03 4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM-PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS FODM3010 FODM3011 FODM3012 FODM3021 FODM3022 FODM3023 K0 t P0 P 2 D0 E A0 W1 B0 F W d P 2.54 Pitch Description Tape Width Tape Thickness Sprocket Hole Pitch Sprocket Hole Dia. Sprocket Hole Location Pocket Location Symbol W t P 0 D0 E F P 2 Pocket Pitch Pocket Dimension P A0 B0 K0 Pocket Hole Dia. Cover Tape Width Cover Tape Thickness Max. Component Rotation or Tilt D1 W 1 d D1 Dimensions (mm) 12.00±0.4 0.30±0.20 4.00±0.20 1.55±0.20 1.75±0.20 5.50±0.20 2.00±0.20 8.00±0.20 4.40±0.20 7.30±0.20 2.30±0.20 1.55±0.20 9.20 0.065±0.02 20˚ max Devices Per Reel R1 R2 500 2500 178 mm (7") 330 mm (13") Reel Diameter R1 R2 © 2003 Fairchild Semiconductor Corporation Page 8 of 10 11/10/03 4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM-PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS FODM3010 FODM3011 FODM3012 FODM3021 FODM3022 FODM3023 Footprint Drawing for PCB Layout 0.024 (0.61) 0.060 (1.52) 0.310 (7.87) 0.190 (4.83) 0.100 (2.54) Recommended Infrared Reflow Soldering Profile (heating) to 30 s Package Surface Temperature T (°C) 230°C (peak temperature) 210°C 180°C to 60 s 150 s Time (s) 90 s 60 s • Peak reflow temperature: 230°C (package surface temperature) for 30 seconds • Time of temperature higher than 210°C: 60 seconds or less • One time soldering reflow is recommended © 2003 Fairchild Semiconductor Corporation Page 9 of 10 11/10/03 4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM-PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS FODM3010 FODM3011 FODM3012 FODM3021 FODM3022 FODM3023 DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. © 2003 Fairchild Semiconductor Corporation Page 10 of 10 11/10/03