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FODM3022

FODM3022

  • 厂商:

    FAIRCHILD(仙童半导体)

  • 封装:

  • 描述:

    FODM3022 - 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers - Fairch...

  • 数据手册
  • 价格&库存
FODM3022 数据手册
FODM30XX 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers October 2005 FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers Features ■ Compact 4-pin surface mount package (2.4 mm maximum standoff height) ■ Peak blocking voltage 250V (FODM301X) 400V (FODM302X) ■ Available in tape and reel quantities of 500 and 2500. ■ Applicable to Infrared Ray reflow (230°C max, 30 seconds.) ■ BSI, CSA and VDE certifications pending ■ UL (File# E90700) certified Description The FODM301X and FODM302X series consists of a GaAs infrared emitting diode driving a silicon bilateral switch housed in a compact 4-pin mini-flat package. The lead pitch is 2.54 mm. They are designed for interfacing between electronic controls and power triacs to control resistive and inductive loads for 115V/240V operations. Applications ■ ■ ■ ■ ■ ■ ■ ■ ■ Industrial controls Traffic lights Vending machines Solid state relay Lamp ballasts Solenoid/valve controls Static AC power switch Incandescent lamp dimmers Motor control Package Dimensions PIN 1 0.026 (0.66) 0.100 (2.54) TYP 0.020 (0.51) 0.012 (0.30) 0.287 (7.29) 0.248 (6.30) 0.173 (4.40) TYP ANODE 1 MAIN 4 TERMINAL CATHODE 2 MAIN 3 TERMINAL 0.169 (4.29) 0.154 (3.91) 0.094 (2.39) 0.079 (2.01) 0.035 (0.89) 0.012 (0.30) 0.008 (0.20) 0.000 (0.0) 0.033 (0.85) 0.026 (0.65) NOTE All dimensions are in inches (millimeters) ©2005 Fairchild Semiconductor Corporation 1 FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0 www.fairchildsemi.com FODM30XX 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers Absolute Maximum Ratings (TA = 25°C unless otherwise specified) Parameter TOTAL PACKAGE Storage Temperature Junction Temperature Operating Temperature EMITTER Continuous Forward Current Peak Forward Current (1 µs pulse, 300 pps.) Reverse Input Voltage Power Dissipation (No derating required over operating temp. range) DETECTOR On-State RMS Current Off-State Output Terminal Voltage FODM3010/1/2 FODM3021/2/3 Power Dissipation (No derating required over operating temp. range) PD IT(RMS) VDRM 70 250 400 300 mW mA (RMS) V IF (avg) IF (pk) VR PD 60 1 3 100 mA A V mW TSTG TJ TOPR -40 to +125 125 -40 to +100 °C °C °C Symbol Value Units Electrical Characteristics (TA = 25°C) Individual Component Characteristics Parameter EMITTER Input Forward Voltage Reverse Leakage Current DETECTOR Peak Blocking Current Either Direction Peak On-State Voltage Either Direction Critical Rate of Rise of Off-State Voltage Rated VDRM, IF = 0 (note 1) ITM = 100mA peak IF = 0 (Figure 8, note 2) IDRM VTM dV/dt All All All 2 1.7 10 100 3 nA V V/µs IF = 10 mA VR = 3 V, TA = 25°C VF IR All All 1.20 0.01 1.5 100 V µA Test Conditions Symbol Device Min Typ* Max Unit Transfer Characteristics (TA = 25°C) DC Characteristics LED Trigger Current Test Conditions Symbol Main Terminal Voltage = 3V (note 3) IFT Device FODM3010 FODM3021 FODM3011 FODM3022 FODM3012 FODM3023 Min Typ* Max 15 Unit mA 10 5 Holding Current, Either Direction IH All 300 µA Isolation Characteristics Characteristic Steady State Isolation Voltage * All typicals at TA = 25°C Note 1. Test voltage must be applied within dv/dt rating. 2. This is static dv/dt. See Figure 1 for test circuit Commutating dv/dt is function of the load-driving thyristor(s) only. 3. All devices are guaranteed to trigger at an IF value less than or equal to max IFT. Therefore, recommended operating IF lies between max IFT (15 mA for FODM3010 and FODM3021, 10 mA for FODM3011 and FODM3022, 5 mA for FODM3012 and FODM3023) and absolute max IF (60 mA). 2 FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0 www.fairchildsemi.com Test Conditions Symbol (1 Minute) VISO Device All Min 3750 Typ* Max Unit VRMS FODM30XX 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers Typical Performance Curves Fig. 1 LED Forward Voltage vs. Forward Current 1.8 1.7 IDRM - LEAKAGE CURRENT (nA) 1.6 VF - FORWARD VOLTAGE (V) 1.5 1.4 1.3 1.2 1.1 1.0 0.9 1 10 IF - FORWARD CURRENT (mA) 100 TA = 25°C TA = 100°C 0.1 -40 1000 VDRM = 600V Fig. 2 Leakage Current vs. Ambient Temperature 100 TA = -40°C 10 1 -20 0 20 40 60 80 100 T A - AMBIENT TEMPERATURE (°C) Fig. 3 Holding Current vs. Ambient Temperature 10 I H - HOLDING CURRENT (NORMALIZED) NORMALIZED TO TA = 25°C I FT - TRIGGER CURRENT (NORMALIZED) 1.4 1.6 Fig. 4 Trigger Current vs. Ambient Temperature VTM = 3V NORMALIZED TO TA = 25°C 1.2 1.0 1.0 0.8 0.6 0.1 -40 -20 0 20 40 60 80 100 T A - AMBIENT TEMPERATURE (°C) 0.8 -40 -20 0 20 40 60 80 100 T A - AMBIENT TEMPERATURE (°C) 3 FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0 www.fairchildsemi.com FODM30XX 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers Typical Performance Curves Fig. 5 LED Current Required to Trigger vs. LED Pulse Width 12 IFT - LED TRIGGER CURRENT (NORMALIZED) TA =T °C 25 A NORMALIZED TO PW IN >> 100µs 10 V DRM- OFF-STATE OUTPUT TERMINAL VOLTAGE Fig. 6 Off-State Output Terminal Voltage vs. Ambient Temperature 1.4 NORMALIZED TO T = 25°C A 1.3 1.2 (NORMALIZED) 1.1 1.0 0.9 0.8 0.7 0.6 -40 8 6 4 2 0 1 10 PW IN - LED TRIGGER PULSE WIDTH (°C) 100 -20 0 20 40 60 80 100 T A - AMBIENT TEMPERATURE (°C) Fig. 7 On-State Characteristics 800 TA = 25°C 600 ITM - ON-STATE CURRENT (mA) 400 200 0 -200 -400 -600 -800 -4 -3 -2 -1 0 1 2 3 4 VTM - ON-STATE VOLTAGE (V) 4 FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0 www.fairchildsemi.com FODM30XX 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers Typical Performance Curves 400V (FODM302X) 250V (FODM301X) Vdc RTEST R = 10 kΩ CTEST PULSE INPUT MERCURY WETTED RELAY D.U.T. X100 SCOPE PROBE 1. The mercury wetted relay provides a high speed repeated pulse to the D.U.T. 2. 100x scope probes are used, to allow high speeds and voltages. 3. The worst-case condition for static dv/dt is established by triggering the D.U.T. with a normal LED input current, then removing the current. The variable RTEST allows the dv/dt to be gradually increased until the D.U.T. continues to trigger in response to the applied voltage pulse, even after the LED current has been removed. The dv/dt is then decreased until the D.U.T. stops triggering. τRC is measured at this point and recorded. Vmax = 400 V (FODM302X) = 250 V (FODM301X) APPLIED VOLTAGE WAVEFORM 252 V (FODM302X) 158 V (FODM301X) dv/dt = τRC 0.63 Vmax τRC 0 VOLTS 252 =τ (FODM302X) RC 158 =τ (FODM301X) RC Figure 8. Static dv/dt Test Circuit NOTE: This optoisolator should not be used to drive a load directly. It is intended to be a trigger device only. RL Rin VCC FODM3010 FODM3011 FODM3012 2 3 1 4 180 120 V 60 Hz Figure 9. Resistive Load ZL Rin VCC MOC3010 MOC3011 MOC3012 2 3 0.1 µF C1 1 4 180 2.4k 120 V 60 Hz Figure 10. Inductive Load with Sensitive Gate Triac (IGT ≤ 15 mA) 5 FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0 www.fairchildsemi.com FODM30XX 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers ZL VCC Rin 1 FODM3010 FODM3011 FODM3012 2 3 4 180 1.2 k 120 V 60 Hz 0.2 µF C1 Figure 11. Inductive Load with Sensitive Gate Triac (IGT ≤ 15 mA) Rin VCC 1 FODM3021 FODM3022 FODM3023 2 4 360 470 HOT 0.05 µF 3 39 240 VAC 0.01 µF LOAD GROUND In this circuit the “hot” side of the line is switched and the load connected to the cold or ground side. The 39 ohm resistor and 0.01 µF capacitor are for snubbing of the triac, and the 470 ohm resistor and 0.05 mF capacitor are for snubbing the coupler. These components may or may not be necessary depending upon the particular and load used. Figure 12. Typical Application Circuit 6 FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0 www.fairchildsemi.com FODM30XX 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers Ordering Information Option V R1 R2 R3 R4 R1V R2V R3V R4V Description VDE Approved Tape and Reel (500 units) Tape and Reel (2500 units) Tape and Reel (500 units; unit 180° rotated) Tape and Reel (2500 units; unit 180° rotated) Tape and Reel (500 units) and VDE Approved Tape and Reel (2500 units) and VDE Approved Tape and Reel (500 units; unit 180° rotated) and VDE Approved Tape and Reel (2500 units; unit 180° rotated) and VDE Approved Marking Information 1 3011 V X YY M 3 4 5 2 6 Definitions 1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option – See order entry table) One digit year code Two digit work week ranging from ‘01’ to ‘53’ Assembly package code 7 FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0 www.fairchildsemi.com FODM30XX 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers K0 t P0 P 2 D0 E A0 W1 B0 F W d P 2.54 Pitch Description Tape Width Tape Thickness Sprocket Hole Pitch Sprocket Hole Dia. Sprocket Hole Location Pocket Location Symbol W t P 0 D0 E F P 2 Pocket Pitch Pocket Dimension P A0 B0 K0 Pocket Hole Dia. Cover Tape Width Cover Tape Thickness Max. Component Rotation or Tilt D1 W 1 d D1 Dimensions (mm) 12.00±0.4 0.30±0.20 4.00±0.20 1.55±0.20 1.75±0.20 5.50±0.20 2.00±0.20 8.00±0.20 4.40±0.20 7.30±0.20 2.30±0.20 1.55±0.20 9.20 0.065±0.02 20˚ max Devices Per Reel R1 R2 500 2500 178 mm (7") 330 mm (13") Reel Diameter R1 R2 8 FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0 www.fairchildsemi.com FODM30XX 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers Footprint Drawing for PCB Layout 0.024 (0.61) 0.060 (1.52) 0.310 (7.87) 0.190 (4.83) 0.100 (2.54) Recommended Infrared Reflow Soldering Profile (heating) to 30 s Package Surface Temperature T (°C) 230°C (peak temperature) 210°C 180°C to 60 s 150 s Time (s) 90 s 60 s • Peak reflow temperature: 230°C (package surface temperature) for 30 seconds • Time of temperature higher than 210°C: 60 seconds or less • One time soldering reflow is recommended 9 FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0 www.fairchildsemi.com FODM30XX 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ FAST ActiveArray™ FASTr™ Bottomless™ FPS™ Build it Now™ FRFET™ CoolFET™ GlobalOptoisolator™ CROSSVOLT™ GTO™ DOME™ HiSeC™ EcoSPARK™ I2C™ E2CMOS™ i-Lo™ EnSigna™ ImpliedDisconnect™ FACT™ IntelliMAX™ FACT Quiet Series™ Across the board. Around the world.™ The Power Franchise Programmable Active Droop™ DISCLAIMER ISOPLANAR™ LittleFET™ MICROCOUPLER™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ OCX™ OCXPro™ OPTOLOGIC OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerEdge™ PowerSaver™ PowerTrench QFET QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ µSerDes™ SILENT SWITCHER SMART START™ SPM™ Stealth™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic TINYOPTO™ TruTranslation™ UHC™ UltraFET UniFET™ VCX™ Wire™ FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I16 10 FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0 www.fairchildsemi.com
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