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FODM3052

FODM3052

  • 厂商:

    FAIRCHILD(仙童半导体)

  • 封装:

  • 描述:

    FODM3052 - 4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS - Fairch...

  • 数据手册
  • 价格&库存
FODM3052 数据手册
4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS FODM3051 DESCRIPTION The FODM305X series consists of a galium arsenide diode driving a silicon bilateral switch housed in a compact 4-pin mini-flat package. The lead pitch is 2.54 mm. The FODM305X series isolates low voltage logic from 115 and 240 Vac lines to provide random phase control of high current triacs or thyristors. It also features greatly enhanced static dv/dt capability to ensure stable switching performance of inductive loads. FODM3052 FODM3053 FEATURES • Compact 4-pin surface mount package (2.4 mm maximum standoff height) • Peak blocking voltage – 600V • Guaranteed static dv/dt of 1000 V/µs • Available in tape and reel quantities of 500 and 2500. • Applicable to Infrared Ray reflow (230°C max, 30 seconds.) • BSI, CSA and VDE certifications pending • UL (File# E90700) certified PACKAGE DIMENSIONS PIN 1 0.026 (0.66) 0.100 (2.54) TYP 0.020 (0.51) 0.012 (0.30) 0.287 (7.29) 0.248 (6.30) 0.173 (4.40) TYP APPLICATIONS • Solenoid/valve controls • Interfacing microprocessors to 115 and 240 Vac peripherals • Temperature controls • Solid state relays • Lamp ballast • Static AC power switch • Motor control • Incandescent lamp dimmers 0.169 (4.29) 0.154 (3.91) 0.094 (2.39) 0.079 (2.01) ANODE 1 MAIN 4 TERMINAL 0.035 (0.89) 0.012 (0.30) 0.008 (0.20) 0.000 (0.0) 0.033 (0.85) 0.026 (0.65) CATHODE 2 MAIN 3 TERMINAL NOTE All dimensions are in inches (millimeters) ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified) Parameter TOTAL PACKAGE Storage Temperature Junction Temperature Operating Temperature EMITTER Continuous Forward Current Peak Forward Current (1 µs pulse, 300 pps.) Reverse Input Voltage Power Dissipation (No derating required over operating temp. range) DETECTOR On-State RMS Current Off-State Output Terminal Voltage Power Dissipation (No derating required over operating temp. range) IF (avg) IF (pk) VR PD IT(RMS) VDRM PD 60 1 3 100 70 600 250 mA A V mW mA (RMS) V mW Symbol TSTG TJ TOPR Value -40 to +125 125 -40 to +85 Units °C °C °C © 2003 Fairchild Semiconductor Corporation Page 1 of 8 11/10/03 4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS FODM3051 FODM3052 FODM3053 ELECTRICAL CHARACTERISTICS (TA = 25°C Unless otherwise specified) INDIVIDUAL COMPONENT CHARACTERISTICS Parameter EMITTER Input Forward Voltage Reverse Leakage Current DETECTOR Peak Blocking Current Either Direction Peak On-State Voltage Either Direction Critical Rate of Rise of Off-State Voltage VDRM = 600V, IF = 0 (note 1) ITM = 100mA peak IF = 0 (Figure 8, note 2) IDRM VTM dV/dt Test Conditions IF = 10 mA VR = 3 V Symbol VF IR Device All All All All All Min Typ* 1.20 0.01 3 2.0 Max 1.5 100 100 2.5 Unit V µA nA V V/µs 1000 TRANSFER CHARACTERISTICS (TA = 25°C Unless otherwise specified) DC Characteristics LED Trigger Current Holding Current, Either Direction Test Conditions Main Terminal Voltage = 3V (note 3) Symbol IFT IH Device FODM3051 FODM3052 FODM3053 All 300 Min Typ* Max 15 10 5 Unit mA µA ISOLATION CHARACTERISTICS (TA = 25°C Unless otherwise specified) Characteristic Steady State Isolation Voltage * All typicals at TA = 25°C Note 1. Test voltage must be applied within dv/dt rating. 2. This is static dv/dt. See Figure 1 for test circuit. Commutating dv/dt is function of the load-driving thyristor(s) only. 3. All devices are guaranteed to trigger at an IF value less than or equal to max IFT. Therefore, recommended operating IF lies between max IFT (15 mA for FODM3051, 10 mA for FODM3052, 5 mA for FODM3053) and absolute max IF (60 mA). Test Conditions t = 1 Minute Symbol VISO Device All Min 3750 Typ* Max Unit V(RMS) © 2003 Fairchild Semiconductor Corporation Page 2 of 8 11/10/03 4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS FODM3051 TYPICAL PERFORMANCE CURVES Fig. 1 LED Forward Voltage vs. Forward Current 1.7 1000 VDRM = 600V 1.6 IDRM - LEAKAGE CURRENT (nA) 100 FODM3052 FODM3053 Fig. 2 Leakage Current vs. Ambient Temperature VF - FORWARD VOLTAGE (V) 1.5 1.4 1.3 TA = -40°C 1.2 TA = 25°C 1.1 TA = 85°C 1.0 10 1 0.9 1 10 IF - FORWARD CURRENT (mA) 100 0.1 -40 -20 0 20 40 60 80 100 T A - AMBIENT TEMPERATURE (°C) Fig. 3 Holding Current vs. Ambient Temperature 5 I H - HOLDING CURRENT (NORMALIZED) NORMALIZED TO TA = 25°C I FT - TRIGGER CURRENT (NORMALIZED) 1.3 1.4 Fig. 4 Trigger Current vs. Ambient Temperature VTM = 3V NORMALIZED TO TA = 25°C 2 1.2 1.0 1.1 0.5 1.0 0.9 0.2 0.8 0.1 -40 -20 0 20 40 60 80 100 T A - AMBIENT TEMPERATURE (°C) 0.7 -40 -20 T A - AMBIENT TEMPERATURE (°C) 100 Fig. 5 LED Current Required to Trigger vs. LED Pulse Width 12 TA =T °C 25 A NORMALIZED TO PW IN >> 100µs 10 V DRM- OFF-STATE OUTPUT TERMINAL VOLTAGE Fig. 6 Off-state Output Terminal Voltage vs. Ambient Temperature 1.4 NORMALIZED TO T = 25°C A 1.3 1.2 (NORMALIZED) 1.1 1.0 0.9 0.8 0.7 0.6 -40 IFT - LED TRIGGER CURRENT (NORMALIZED) 8 6 4 2 0 1 10 PW IN - LED TRIGGER PULSE WIDTH (µs) 100 -20 0 20 40 60 80 100 T A - AMBIENT TEMPERATURE (°C) © 2003 Fairchild Semiconductor Corporation Page 3 of 8 11/10/03 4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS FODM3051 FODM3052 Fig. 7 On-State Characteristics 800 TA = 25°C 600 FODM3053 ITM - ON-STATE CURRENT (mA) 400 200 0 -200 -400 -600 -800 -6 -4 -2 0 2 4 6 VTM - ON-STATE VOLTAGE (V) 400V Vdc RTEST R = 10 kΩ CTEST PULSE INPUT MERCURY WETTED RELAY D.U.T. X100 SCOPE PROBE 1. The mercury wetted relay provides a high speed repeated pulse to the D.U.T. 2. 100x scope probes are used, to allow high speeds and voltages. 3. The worst-case condition for static dv/dt is established by triggering the D.U.T. with a normal LED input current, then removing the current. The variable RTEST allows the dv/dt to be gradually increased until the D.U.T. continues to trigger in response to the applied voltage pulse, even after the LED current has been removed. The dv/dt is then decreased until the D.U.T. stops triggering. τRC is measured at this point and recorded. Vmax = 400 V APPLIED VOLTAGE WAVEFORM 252 V 0.63 Vmax τRC 0 VOLTS τRC dv/dt = 252 =τ RC Figure 8. Static dv/dt Test Circuit © 2003 Fairchild Semiconductor Corporation Page 4 of 8 11/10/03 4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS FODM3051 ORDERING INFORMATION Option V R1 R2 R3 R4 R1V R2V R3V R4V Description VDE Approved Tape and Reel (500 units) Tape and Reel (2500 units) Tape and Reel (500 units; unit 180° rotated) Tape and Reel (2500 units; unit 180° rotated) Tape and Reel (500 units) and VDE Approved Tape and Reel (2500 units) and VDE Approved Tape and Reel (500 units; unit 180° rotated) and VDE Approved Tape and Reel (2500 units; unit 180° rotated) and VDE Approved FODM3052 FODM3053 MARKING INFORMATION 1 3051 V X YY M 3 4 5 2 6 Definitions 1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option – See order entry table) One digit year code Two digit work week ranging from ‘01’ to ‘53’ Assembly package code © 2003 Fairchild Semiconductor Corporation Page 5 of 8 11/10/03 4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS FODM3051 FODM3052 FODM3053 K0 t P0 P 2 D0 E A0 W1 B0 F W d P 2.54 Pitch Description Tape Width Tape Thickness Sprocket Hole Pitch Sprocket Hole Dia. Sprocket Hole Location Pocket Location Symbol W t P 0 D0 E F P 2 Pocket Pitch Pocket Dimension P A0 B0 K0 Pocket Hole Dia. Cover Tape Width Cover Tape Thickness Max. Component Rotation or Tilt D1 W 1 d D1 Dimensions (mm) 12.00±0.4 0.30±0.20 4.00±0.20 1.55±0.20 1.75±0.20 5.50±0.20 2.00±0.20 8.00±0.20 4.40±0.20 7.30±0.20 2.30±0.20 1.55±0.20 9.20 0.065±0.02 20˚ max Devices Per Reel R1 R2 500 2500 178 mm (7") 330 mm (13") Reel Diameter R1 R2 © 2003 Fairchild Semiconductor Corporation Page 6 of 8 11/10/03 4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS FODM3051 FODM3052 Footprint Drawing for PCB Layout 0.024 (0.61) FODM3053 0.060 (1.52) 0.310 (7.87) 0.190 (4.83) 0.100 (2.54) Recommended Infrared Reflow Soldering Profile (heating) to 30 s Package Surface Temperature T (°C) 230°C (peak temperature) 210°C 180°C to 60 s 150 s Time (s) 90 s 60 s • Peak reflow temperature: 230°C (package surface temperature) for 30 seconds • Time of temperature higher than 210°C: 60 seconds or less • One time soldering reflow is recommended © 2003 Fairchild Semiconductor Corporation Page 7 of 8 11/10/03 4-PIN FULL PITCH MINI-FLAT PACKAGE RANDOM PHASE TRIAC DRIVER OUTPUT OPTOCOUPLERS FODM3051 FODM3052 FODM3053 DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. © 2003 Fairchild Semiconductor Corporation Page 8 of 8 11/10/03
FODM3052 价格&库存

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