MMSZ4702

MMSZ4702 MMSZ4702 General Description Half watt, General purpose, Medium Current Surface Mount Zener in the SOD-123 package. The SOD-123 package has the same footprint as the glass mini-melf (LL34) package & provides a convenient alternative to the leadless package. Features • Compact surface mount with same footprint as mini-melf • 500mW rating on FR-4 or FR-5 board. • Class 3 ESD rating (>16kV) per Human Body Model Ordering • 7 inch reel (178mm); 8mm Tape; 3,000 units per reel. Absolute Maximum Ratings (note 1) TA=25°C unless otherwise noted Symbol TSTG TJ PD RQJA RQJL ∆VZ Parameter Storage Temperature Maximum Junction Temperature Total Power Dissipation at 25°C Derate above 25°C Thermal Resistance Junction to Ambient Thermal Resistance Junction to Lead Maximum Voltage Change (Note 2) Value -55 ~ 150 -55 ~ 150 500 6.7 340 150 150 260 15.0 Units °C °C mW mW/°C °C/W °C/W mV °C V Lead Solder Temperature (Max 10 second duration) Nominal Zener Voltage (VZ) at 50µA Note 1: These ratings are limiting values above which the serviceability of any semiconductor device may be impaired. Note 2: Voltage change is equal to the difference between VZ at 100µA and VZ at 10µA. Top Mark: DM 1: Cathode 2: Anode 1 2 Electrical Characteristics TA=25°C unless otherwise noted Symbol VZ IR VF ∆VZ Characteristics Zener Voltage Reverse Leakage Forward Voltage Delta Zener Voltage (Note 2) Test Conditions IZT = 50µA D.C VR = 11.4V IF = 10mA IZT = 100µA to 10µA Min. 14.25 Max. 15.75 50 900 150 Units V nA mV mV ©2003 Fairchild Semiconductor Corporation MMSZ4692, Rev. A MMSZ4702 SOD-123 PACKAGE PACKAGE CODE = (D6) Fairchild Semiconductor's Criteria Corrected March 11, 1998 Actual Size DIM 2 1 A MIN (mils) 55 100 34.6 141.7 ---21.5 0.5 12.7 3.7 MAX (mils) 71 112 46 153.5 ---27.5 4 ---7.7 A MIN (mm) 1.400 2.550 0.880 3.600 ------0.546 0.322 0.095 MAX (mm) 1.800 2.850 1.180 3.900 ------0.70 ------0.195 A B C D B E F G 0.0135 0.1015 D H I I C H F G 1.2 2 mm 48 mils 0.91 mm 36 mils 2.36 mm 93 mils 4.19 mm 165 mils 0.91 mm 36 mils SOD-123 LAND PADS ©2003 Fairchild Semiconductor Corporation MMSZ4692, Rev. 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PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I5