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NDF0610

NDF0610

  • 厂商:

    FAIRCHILD(仙童半导体)

  • 封装:

  • 描述:

    NDF0610 - P-Channel Enhancement Mode Field Effect Transistor - Fairchild Semiconductor

  • 数据手册
  • 价格&库存
NDF0610 数据手册
April 1995 NDF0610 / NDS0610 P-Channel Enhancement Mode Field Effect Transistor General Description These P-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process has been designed to minimize on-state resistance, provide rugged and reliable performance and fast switching. They can be used, with a minimum of effort, in most applications requiring up to 180mA DC and can deliver pulsed currents up to 1A. This product is particularly suited to low voltage applications requiring a low current high side switch. Features -0.18 and -0.12A, -60V. RDS(ON) = 10Ω Voltage controlled p-channel small signal switch High density cell design for low RDS(ON) TO-92 and SOT-23 packages for both through hole and surface mount applications High saturation current ____________________________________________________________________________________________ S D G S D G S SOT-23 NDS0610 G TO-92 NDF0610 D Absolute Maximum Ratings Symbol Parameter TA = 25°C unless otherwise noted NDF0610 NDS0610 Units VDSS VDGR VGSS ID PD Drain-Source Voltage Drain-Gate Voltage (RGS < 1 MΩ) Gate-Source Voltage - Continuous - Nonrepetitive (tP < 50 µs) Drain Current - Continuous - Pulsed Maximum Power Dissipation TA = 25°C Derate above 25°C 0.8 5 -0.18 -60 -60 ±20 ±30 -0.12 -1 0.36 2.9 -55 to 150 300 V V V V A W mW/oC °C °C TJ,TSTG TL Operating and Storage Temperature Range Maximum lead temperature for soldering purposes, 1/16" from case for 10 seconds THERMAL CHARACTERISTICS RθJA Thermal Resistance, Junction-to-Ambient 200 350 °C/W © 1998 Fairchild Semiconductor Corporation NDS0610.SAM ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol Parameter Conditions Min Typ Max Units OFF CHARACTERISTICS BVDSS IDSS IGSSF IGSSR VGS(th) RDS(ON) Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current VGS = 0 V, ID = -10 µA VDS = -48 V, VGS = 0 V TJ = 125°C VGS = 20 V, VDS = 0 V VGS = -20 V, VDS= 0 V VDS = VGS, ID = -1 mA TJ = 125°C VGS = -10 V, ID = -0.5 A TJ = 125°C VGS = -4.5 V, ID = -0.25 A TJ = 125°C -60 -1 -200 10 -10 V µA µA nA nA Gate - Body Leakage, Forward Gate - Body Leakage, Reverse ON CHARACTERISTICS (Note 1) Gate Threshold Voltage -1 -0.6 -2.4 -2.1 3.6 5.9 5.2 7.9 -3.5 -3.2 10 16 20 30 V Static Drain-Source On-Resistance Ω ID(on) gFS On-State Drain Current Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance VGS = -10 V, VDS = -10 V VGS = -4.5 V, VDS = -10 V VDS = -10 V, ID = -0.1 A VDS = -25 V, VGS = 0 V, f = 1.0 MHz -0.6 70 -1.6 -0.35 170 40 11 3.2 60 25 5 A mS pF pF pF DYNAMIC CHARACTERISTICS Ciss Coss Crss tD(on) tr tD(off) tf Qg Qgs Qgd IS ISM VSD SWITCHING CHARACTERISTICS (Note 1) Turn - On Delay Time Turn - On Rise Time Turn - Off Delay Time Turn - Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Maximum Continuous Source Current Maximum Pulse Source Current (Note 1) Drain-Source Diode Forward Voltage Reverse Recovery Time Reverse Recovery Current VDD = -25 V, ID = -0.18 A, VGS = -10 V, RGEN = 25 Ω 7 5 13 10 10 15 15 20 nS nS nS nS nC nC nC VDS = -48 V, ID = -0.5 A, VGS = -10 V 1.43 0.6 0.25 -0.18 -1 DRAIN-SOURCE DIODE CHARACTERISTICS A A V ns A VGS = 0 V, IS = -0.5 A (Note 1) -1.2 TJ = 125°C -0.98 40 2.8 -1.5 -1.3 trr Irr VGS = 0 V, IS = -0.5 A, dIF/dt = 100 A/µs Note: 1. Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0%. NDS0610.SAM Typical Electrical Characteristics -1.4 I D , DRA IN-SOURCE CURRENT (A) VGS = -10V -1.2 -1 -0.8 -0.6 -9 DRA IN-SOURCE ON -RESISTANCE 2.2 -8 -7 R DS(on) , NORMALIZED V GS = -4V 2 -5 1.8 1.6 1.4 1.2 1 0.8 -6 -7 -8 -9 - 10 -6 -5 -0.4 -0.2 0 0 -2 -4 -6 -8 V DS , DRAIN-SOURCE VOLTAGE (V) -10 -4 0 -0.2 -0.4 -0.6 -0.8 -1 I D , DRA IN CURRENT (A) -1.2 -1.4 Figure 1. On-Region Characteristics Figure 2. On-Resistance Variation with Gate Voltage and Drain Current 1.8 3 DRAIN-SOURCE ON -RESISTANCE DRAIN-SOURCE ON-RESISTANCE I 1.6 D= -0.5A R DS(on) , NORMALIZED TJ = 125°C 2 .5 VGS - 4.5V -10V 25 R DS(ON) , NORM A LIZED V GS = -10V 1.4 2 - 55 125 1.2 1 .5 1 25 1 0.8 - 55 0 .5 0 -0.2 -0.4 -0.6 -0.8 -1 I D , DRAIN CURRENT (A) -1.2 -1.4 0.6 -5 0 -25 0 25 50 75 100 T J , JUNCTION TEMPERATURE (°C) 125 150 Figure 3. On-Resistance Variation with Temperature Figure 4. On-Resistance Variation with Drain Current and Temperature -1.2 1 .1 V DS = -10V -1 I D , DRA IN CURRENT (A) TJ = -55°C 25 125 Vth , NORMALIZED GATE-SOURCE THRESHOLD VOLTAGE VDS = VGS I D = -1m A 1 .05 -0.8 1 -0.6 0 .95 -0.4 0 .9 -0.2 0 .85 0 0 -2 -4 -6 -8 V GS , GATE TO SOURCE VOLTAGE (V) -10 0 .8 -50 -25 0 25 50 75 100 TJ , JUNCTION TEM PERATURE (°C) 125 150 Figure 5. Transfer Characteristics Figure 6. Gate Threshold Variation with Temperature NDS0610.SAM Typical Electrical Characteristics (continued) DRAIN-SOURCE BREAKDOWN VOLTAGE (V) 1 .15 1 .5 -I S , REVERSE DRAIN CURRENT (A) I D = -10µA 1 .1 VGS = 0 V 1 , NORMALIZED 1 .05 0 .5 TJ = 125°C 25 S BV D 1 0 .3 -5 5 0 .2 S 0 .95 0 .9 -50 -25 0 T J 25 50 75 100 , JUNCTION TEMPERATURE (°C) 125 150 0 .1 0 .6 0 .8 1 1 .2 1 .4 1 .6 -VSD , BODY DIODE FORW A RD VOLTAGE (V) 1 .8 Figure 7. Breakdown Voltage Variation with Temperature Figure 8. Body Diode Forward Voltage Variation with Current and Temperature 70 -10 C i ss VGS , GATE-SOURCE VOLTAGE (V) 50 30 -8 V DS = - 12V CAPACITANCE (pF) -24 -4 8 20 -6 10 C o ss -4 5 f = 1 MHz 3 2 0 .1 C r ss -2 V GS = 0V 0 .2 0 .5 1 2 5 10 20 -V DS , DRA IN TO SOURCE VOLTAGE (V) 30 60 I D = -0.5A 0 0 0 .2 0 .4 0 .6 0 .8 1 Q g , GATE CHARGE (nC) 1 .2 1 .4 1 .6 Figure 9. Capacitance Characteristics Figure 10. Gate Charge Characteristics 0 .4 , TRANSCONDUCTANCE (SIEM ENS) T J = -55°C 0 .3 25 125 0 .2 0 .1 g FS V D S = - 10V 0 0 -0.2 -0.4 -0.6 -0.8 -1 I D , DRAIN CURRENT (A) -1.2 -1.4 Figure 11. Transconductance Variation with Drain Current and Temperature NDS0610.SAM Typical Electrical Characteristics (continued) 3 2 3 2 -I D , DRA IN CURRENT (A) -I D , DRAIN CURRENT (A) 1 0.5 R ( DS ) ON Lim it 10 1m 10 10 m s 0m s 1s 10 s DC s 0u s 1 0 .5 RD S(O Lim N) it 10 1m 10 ms 10 0m s 1s 10 s DC s 0u s 0.1 0.05 0 .1 0 .0 5 V GS = -10V SINGLE PULSE 0.01 0.005 1 2 V GS = -10V SINGLE PULSE 0 .0 1 0 .0 0 5 1 T A = 25°C T A = 25°C 5 10 20 30 - V DS , DRAIN -SOURCE VOLTAGE (V) 60 80 2 5 10 20 30 - V DS , DRA IN-SOURCE VOLTAGE (V) 60 80 Figure 12. NDF0610 (TO-92) Maximum Safe Operating Area Figure 13. NDS0610 (SOT-23) Maximum Safe Operating Area 1 TRANSIENT THERMAL RESISTANCE r(t), NORMALIZED EFFECTIVE 0.5 D = 0 .5 R θJA (t) = r(t) * R θJA 0.2 0.1 0.05 0 .2 0 .1 P(pk) 0 .0 5 R θJA = 200 C/ W Datasheet) o t1 0 .0 2 0 .0 1 t2 0.02 0.01 0.0001 S ingle Pulse TJ - T A = P * RθJA (t) Duty Cycle, D = t1 /t2 0.001 0.01 0.1 t 1, TIME (sec) 1 10 100 300 Figure 14. NDF0610 (TO-92) Transient Thermal Response Curve. 1 TRANSIENT THERMAL RESISTANCE 0.5 0.2 0.1 0.05 D = 0 .5 0 .2 0 .1 0 .0 5 0 .0 2 0 .0 1 P(pk) r(t), NORMALIZED EFFECTIVE R θJA (t) = r(t) * R θJA R θJA = 350 C/W o 0.01 S ingle Pulse t1 t2 0.002 0.001 0.0001 0.001 0.01 0.1 t1 , TIME (sec) 1 10 TJ - T A = P * RθJA (t) D uty Cycle, D = t1 /t2 100 300 Figure 15. NDS0610 (SOT-23) Transient Thermal Response Curve. NDS0610.SAM TO-92 Tape and Reel Data and Package Dimensions TO-92 Packaging Configuration: Figure 1.0 TAPE and REEL OPTION FSCINT Label sample FAIRCHILD SEMICONDUCTOR CORPORATION LOT: CBVK741B019 QTY: HTB:B 10000 See Fig 2.0 for various Reeling Styles NSID: PN2222N SPEC: D/C1: D9842 SPEC REV: QA REV: B2 FSCINT Label (FSCINT) 5 Reels per Intermediate Box F63TNR Label Customized Label 375mm x 267mm x 375mm Intermediate Box F63TNR Label sample LOT: CBVK741B019 FSID: PN222N D/C1: D9842 D/C2: QTY1: QTY2: QTY: 2000 SPEC: SPEC REV: CPN: N/F: F Customized Label (F63TNR)3 TO-92 TNR/AMMO PACKING INFROMATION Packing Reel Style A E Ammo M P Quantity 2,000 2,000 2,000 2,000 EOL code D26Z D27Z D74Z D75Z AMMO PACK OPTION See Fig 3.0 for 2 Ammo Pack Options Unit weight = 0.22 gm Reel weight with components = 1.04 kg Ammo weight with components = 1.02 kg Max quantity per intermediate box = 10,000 units FSCINT Label 327mm x 158mm x 135mm Immediate Box Customized Label 5 Ammo boxes per Intermediate Box F63TNR Label 333mm x 231mm x 183mm Intermediate Box Customized Label (TO-92) BULK PACKING INFORMATION EOL CODE J18Z J05Z NO EOL CODE DESCRIPTION TO-18 OPTION STD TO-5 OPTION STD TO-92 STANDARD STRAIGHT LEADCLIP DIMENSION NO LEAD CLIP NO LEAD CLIP NO LEADCLIP QUANTITY 2.0 K / BOX 1.5 K / BOX 2.0 K / BOX BULK OPTION See Bulk Packing Information table Anti-static Bubble Sheets FSCINT Label 2000 units per EO70 box for std option 114mm x 102mm x 51mm Immediate Box 5 EO70 boxes per intermediate Box 530mm x 130mm x 83mm Intermediate box Customized Label FSCINT Label 10,000 units maximum per intermediate box for std option September 1999, Rev. B TO-92 Tape and Reel Data and Package Dimensions, continued TO-92 Reeling Style Configuration: Figure 2.0 Machine Option “A” (H) Machine Option “E” (J) Style “A”, D26Z, D70Z (s/h) Style “E”, D27Z, D71Z (s/h) TO-92 Radial Ammo Packaging Configuration: Figure 3.0 FIRST WIRE OFF IS COLLECTOR ADHESIVE TAPE IS ON THE TOP SIDE FLAT OF TRANSISTOR IS ON TOP FIRST WIRE OFF IS EMITTER ADHESIVE TAPE IS ON THE TOP SIDE FLAT OF TRANSISTOR IS ON BOTTOM ORDER STYLE D74Z (M) ORDER STYLE D75Z (P) FIRST WIRE OFF IS EMITTER (ON PKG. 92) ADHESIVE TAPE IS ON BOTTOM SIDE FLAT OF TRANSISTOR IS ON BOTTOM FIRST WIRE OFF IS COLLECTOR (ON PKG. 92) ADHESIVE TAPE IS ON BOTTOM SIDE FLAT OF TRANSISTOR IS ON TOP September 1999, Rev. B TO-92 Tape and Reel Data and Package Dimensions, continued TO-92 Tape and Reel Taping Dimension Configuration: Figure 4.0 Hd P Pd b Ha H1 HO d L L1 W1 S WO W2 W t t1 P1 F1 P2 DO ITEM DESCRIPTION PO Base of Package to Lead Bend Component Height Lead Clinch Height Component Base Height Component Alignment ( side/side ) Component Alignment ( front/back ) Component Pitch Feed Hole Pitch Hole Center to First Lead Hole Center to Component Center Lead Spread Lead Thickness Cut Lead Length Taped Lead Length Taped Lead Thickness Carrier Tape Thickness SYMBOL b Ha HO H1 Pd Hd P PO P1 P2 F1/F2 d L L1 t t1 W WO W1 W2 DO S DIMENSION 0.098 (max) 0.928 (+/- 0.025) 0.630 (+/- 0.020) 0.748 (+/- 0.020) 0.040 (max) 0.031 (max) 0.500 (+/- 0.020) 0.500 (+/- 0.008) 0.150 (+0.009, -0.010) 0.247 (+/- 0.007) 0.104 (+/- 0 .010) 0.018 (+0.002, -0.003) 0.429 (max) 0.209 (+0.051, -0.052) 0.032 (+/- 0.006) 0.021 (+/- 0.006) 0.708 (+0.020, -0.019) 0.236 (+/- 0.012) 0.035 (max) 0.360 (+/- 0.025) 0.157 (+0.008, -0.007) 0.004 (max) User Direction of Feed TO-92 Reel Configuration: Figure 5.0 Carrier Tape Width Hold - down Tape Width Hold - down Tape position Feed Hole Position Sprocket Hole Diameter Lead Spring Out Note : All dimensions are in inches. ELECT ROSTATIC SEN SITIVE D EVICES D4 D1 ITEM DESCRIPTION SYSMBOL MINIMUM MAXIMUM F63TNR Label Customized Label D2 Reel Diameter Arbor Hole Diameter (Standard) (Small Hole) Core Diameter Hub Recess Inner Diameter Hub Recess Depth Flange to Flange Inner Width W1 Hub to Hub Center Width W3 Note: All dimensions are inches D1 D2 D2 D3 D4 W1 W2 W3 13.975 1.160 0.650 3.100 2.700 0.370 1.630 14.025 1.200 0.700 3.300 3.100 0.570 1.690 2.090 W2 D3 July 1999, Rev. A TO-92 Tape and Reel Data and Package Dimensions TO-92 (FS PKG Code 92, 94, 96) 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 0.1977 January 2000, Rev. B SOT-23 Tape and Reel Data and Package Dimensions SOT-23 Packaging Configuration: Figure 1. 0 Customized La bel Packaging Description: SOT-23 parts are shipped in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a m ultilayer film (Heat Activated Adhesive in na ture) primarily composed of polyester film, adhesive layer, sealant, and anti-static sprayed agent. These reeled pa in standard option are shipped with rts 3,000 units per 7" or 177cm diameter reel. The reels are dark blue in color an is made of polystyrene plastic (antid static coated). Other option comes in 10,000 units per 13" or 330cm diameter reel. This and s ome other options are described in the P ackaging Information table. These full reels are individually labeled and placed inside as tanda intermediate made of recyclable corrugated rd brown pap with a Fairchil d logo printing. One pizza box er contains eight reels maximum. And thes intermediate e boxes are placed inside a labeled shipping box which comes in different sizes depending on t e nu h mber of parts shippe d. Antistatic Cover Tape Human Readable Label Embossed Carrier Tape 3P SOT-23 Packaging Information Packaging Option Packaging type Qty per Reel/Tube/Bag Reel Size Box Dimension (mm) Max qty per Box Weight per unit (gm) Weight per Reel (kg) Note/Comments Standard (no flow code ) TNR 3,000 7" Dia 187x107x183 24,000 0.0082 0.1175 D87Z TNR 10,000 13" 343x343x64 30,000 0.0082 0.4006 3P 3P 3P SOT-23 Unit Orientation 343mm x 342mm x 64mm Intermediate box for L87Z Option Human Readable Label Human Readable Label sample H uman readable Label SOT-23 Tape Leader and Trailer Configuration: Figure 2. 0 187mm x 107mm x 183mm Intermediate Box for Stand Option ard Carrier Tape Cover Tape Components Trailer Tape 300mm minimum or 75 empty poc kets Leader Tape 500mm minimum or 125 empty pockets September 1999, Rev. C SOT-23 Tape and Reel Data and Package Dimensions, continued SOT-23 Embossed Carrier Tape Configuration: Figure 3.0 P0 T E1 P2 D0 D1 F E2 B0 Wc W Tc K0 P1 A0 User Direction of Feed Dimensions are in millimeter Pkg type SOT-23 (8mm) A0 3.15 +/-0.10 B0 2.77 +/-0.10 W 8.0 +/-0.3 D0 1.55 +/-0.05 D1 1.125 +/-0.125 E1 1.75 +/-0.10 E2 6.25 min F 3.50 +/-0.05 P1 4.0 +/-0.1 P0 4.0 +/-0.1 K0 1.30 +/-0.10 T 0.228 +/-0.013 Wc 5.2 +/-0.3 Tc 0.06 +/-0.02 Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481 rotational and lateral movement requirements (see sketches A, B, and C). 20 deg maximum Typical component cavity center line 0.5mm maximum B0 20 deg maximum component rotation 0.5mm maximum Sketch A (Side or Front Sectional View) Component Rotation A0 Sketch B (Top View) Typical component center line Sketch C (Top View) Component lateral movement SOT-23 Reel Configuration: Figure 4.0 Component Rotation W1 Measured at Hub Dim A Max Dim A max Dim N See detail AA 7" Diameter Option B Min Dim C See detail AA W3 Dim D min 13" Diameter Option W2 max Measured at Hub DETAIL AA Dimensions are in inches and millimeters Tape Size 8mm Reel Option 7" Dia Dim A 7.00 177.8 13.00 330 Dim B 0.059 1.5 0.059 1.5 Dim C 512 +0.020/-0.008 13 +0.5/-0.2 512 +0.020/-0.008 13 +0.5/-0.2 Dim D 0.795 20.2 0.795 20.2 Dim N 2.165 55 4.00 100 Dim W1 0.331 +0.059/-0.000 8.4 +1.5/0 0.331 +0.059/-0.000 8.4 +1.5/0 Dim W2 0.567 14.4 0.567 14.4 Dim W3 (LSL-USL) 0.311 – 0.429 7.9 – 10.9 0.311 – 0.429 7.9 – 10.9 8mm 13" Dia September 1999, Rev. C SOT-23 Tape and Reel Data and Package Dimensions, continued SOT-23 (FS PKG Code 49) 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 0.0082 September 1998, Rev. A1 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ CoolFET™ CROSSVOLT™ E2CMOSTM FACT™ FACT Quiet Series™ FAST® FASTr™ GTO™ HiSeC™ DISCLAIMER ISOPLANAR™ MICROWIRE™ POP™ PowerTrench  QFET™ QS™ Quiet Series™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic™ UHC™ VCX™ FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. D
NDF0610 价格&库存

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