AN1984

Freescale Semiconductor Application Note AN1984 Rev 3, 11/2006 Handling Freescale Pressure Sensors by: William McDonald INTRODUCTION Smaller package outlines and higher board densities require the need for automated placement of components. These components are supplied in embossed carrier tape on plastic reels to meet the increased demand and facilitate ease of handling. This application note is intended to provide general information and understanding for handling Freescale’s surface mount pressure sensors. Equipment details are not provided in this document and it is recommended that end users contact suppliers of equipment for specific applications. METHODS OF HANDLING Components can be picked from the carrier tape using either the vacuum assist or the mechanical type pick up heads. A vacuum assist nozzle type is most common due to its lower cost of maintenance and ease of operation. The recommended vacuum nozzle configuration should be designed to make contact with the device directly on the metal cover and avoid vacuum port location directly over the vent hole in the metal cover of the device. To provide a more secure hold on the device, contact with the plastic ridge around the perimeter of the metal cover should be avoided to prevent loss of vacuum pressure. Multiple vacuum ports within the nozzle may be required to effectively handle the device and prevent shifting during movement to placement position. Figure 1 shows two styles of multiple port vacuum nozzles for the MPXH series device as an example. Figure 2 represents the nozzle location on the device. Vacuum pressure required to adequately support the component should be approximately 25 in Hg (85kPa). This level is typical of in-house vacuum supply. Pick up nozzles are available in various sizes and configurations to suit a variety of component geometries. To select the nozzle best suited for the specific application, it is recommended that the customer consult their pick and place equipment supplier to determine the correct nozzle. In some cases it may be necessary to fabricate a special nozzle depending on the equipment and speed of operation. Figure 1. MPXH Series Multiple Port Vacuum Nozzles Figure 2. Nozzle Location Figure 3. SSOP Axial Style Port AVAILABLE PACKAGES Freescale offers several small outline surface mount device families. These are MPXA, MPXH, MPXM, and MPXY series of devices. These devices are also available in axial ported versions to allow pressure to be interfaced to a device via a hose connection. Pick up nozzles for these packages should be configured to apply vacuum only to the flat surface of a port base. An access clearance in the nozzle for a port shank is necessary to properly handle these device configurations. See Figure 3. © Freescale Semiconductor, Inc., 2006. All rights reserved. SOP SSOP MPAK SOIC16 Figure 2. Available Packages Table 1. Tape and Reel Information Case Carrier Tape Tape Width Pocket Width Length Depth Sprocket Hole Pitch Sprocket Hole Diagram Edge to Hole Hole to Edge Distance between Holes Pocket Pitch Pocket Position Tape Thickness Distance Pocket to Edge Pocket Hole Diagram Cover Tape Thickness Width Reel Width at Hub Width at outer flange Overall Width Hub Diagram Arbor Hole Diagram Slot of Arbor Hole Reel Diagram DEVICE QTY/REEL W1 W3 W2 N C B A MPQ 23.7 - 25.2 23.7 - 28.0 30.4 max. 100+/-2.50 13.0+ 0.5/-0.2 1.50/2.50 330+/-0.76 1000 23.7 - 25.2 23.7 - 28.0 30.4 max. 100+/-2.50 13.0+ 0.5/-0.2 1.50/2.50 330+/-0.76 1000 23.7 - 25.2 23.7 - 28.0 30.4 max. 100+/-2.50 13.0+ 0.5/-0.2 1.50/2.50 330+/-0.76 300 23.7 - 25.2 23.7 - 28.0 30.4 max. 100+/-2.50 13.0 +0.5/-0.2 1.50/2.50 330+/-0.76 1000 23.7 - 25.2 23.7 - 28.0 30.4 max. 100+/-2.50 13.0 +0.5/-0.2 1.50/2.50 330+/-0.76 400 23.7 - 25.2 23.7 - 28.0 30.4 max. 100+/-2.50 13.0 +0.5/-0.2 1.50/2.50 330+/-0.76 600 31.7 - 33.2 31.7 - 36.0 38.4 max. 178+/-2.50 13.0 +0.5/-0.2 1.50/2.50 330+/-0.76 100 31.7 - 33.2 31.7 - 36.0 38.4 max 178+/-2.50 13.0 +0.5/-0.2 1.50/2.50 330+/-0.76 200 T1 W4 0.052 +/-0.01 21.1+/-0.1 0.052 +/-0.01 21.1+/-0.1 0.052 +/-0.01 21.1+/-0.1 0.052 +/-0.01 21.1+/-0.1 0.052 +/-0.01 21.1+/-0.1 0.052 +/-0.01 21.1+/-0.1 0.052 +/-0.01 25.5+/-0.1 0.052 +/-0.01 25.5+/-0.1 W Ao Bo Ko Po Do E1 E2 So P1 P2 F T S1 423A Chip Pak 24.0+/-0.3 8.5+/-0.2 14.2+/-0.2 4.7+/-0.1 4.0 +/-0.1 1.55+/-0.05 1.75+/-0.1 22.2 min N/A 12.0+/-0.1 2.0+/-0.1 11.5+/-0.1 0.40+/-0.05 0.6 min. 1317 SSOP 24.0+/-0.3 7.7+/-0.1 10.7+/-0.1 5.0+/-0.1 4.0+/-0.1 1.55+/-0.05 1.75+/-0.1 22.2 min N/A 12.0+/-0.1 2.0+/-0.1 11.5+/-0.1 0.40+/-0.05 0.6 min 1317A SSOP Ported 24.0+/-0.3 8.8+/-0.1 11.8+/-0.1 10.8+/-0.1 4.0+/-0.1 1.55+/-0.05 1.75+/-0.1 22.2 min N/A 16.0+/-0.1 2.0+/-0.1 11.5+/-0.1 0.40+/-0.05 0.6 min 1320 M-Pak 24.0+/-0.3 6.8+/-0.1 12.6+/-0.1 4.6+/-0.1 4.0+/-0.1 1.55+/-0.05 1.75+/-0.1 22.2 min N/A 12.0+/-0.1 2.0+/-0.1 11.5+/-0.1 0.40+/-0.05 0.6 min 1320A M-Pak Ported 24.0+/-0.3 7.2+/-0.1 13.2+/-0.1 10.5+/-0.1 4.0+/-0.1 1.55+/-0.05 1.75+/-0.1 22.2 min N/A 16.0+/-0.1 2.0+/-0.1 11.5+/-0.1 0.40+/-0.05 0.6 min 482 SOP 32+/-0.3 11.3+/-0.1 18.9+/-0.1 6.4+/-0.1 4.0+/-0.1 1.5+/-0.05 1.75+/-0.1 N/A 28.4+/-0.1 16.0+/-0.1 2.0+/-0.1 14.2+/-0.1 0.30+/-0.05 N/A 482A SOP Ported 32+/-0.3 12.0+/-0.2 18.8+/-0.2 13.8+/-0.1 4.0+/-0.1 1.5+/-0.1 1.75+/-0.1 N/A 28.4+/-0.1 20.0+/-0.1 2.0+/-0.1 14.2+/-0.1 0.35+/-0.05 N/A 1369 SOP Side Port 32+/-0.3 12.6+/-0.2 18.8+/-0.2 9.2+/-0.2 4.0+/-0.1 1.5+/-0.1 1.75+/-0.1 N/A 28.4+/-0.1 24.0+/-.01 2.0+/-0.1 14.2+/-0.1 0.40+/-0.05 N/A D1 N/A 1.5+/-0.1 1.5+/-0.1 1.5+/-0.1 1.5+/-0.1 2.0+/-0.1 2.0+/-0.1 2.0+/-0.1 AN1984 2 Sensors Freescale Semiconductor Cover Tape T Carrier Tape D0 P2 P0 D1 B E1 F W W4 B0 S1 B K0 B0 K1 E2 A0 T1 A0 m 0.2 0+/Hole Location P1 View A-A View B-B Figure 3. Carrier Tape Plastic Reel W3 W2 A D* C B* W1 Front View Side View N Reel Sealing Tape Pocket Carrier Tape Bar Code Label Figure 4. Reel AN1984 Sensors Freescale Semiconductor 3 Pin 1 Pin 1 Corner Chamfer User Direction of Feed Figure 5. Orientation of Small Outline Package Sensor Device AN1984 4 Sensors Freescale Semiconductor PACKAGE DIMENSIONS -A4 5 D 8 PL 0.25 (0.010) M TB S A S -BG 8 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 10.29 10.54 18.01 18.41 S N C H -TPIN 1 IDENTIFIER SEATING PLANE J K M DIM A B C D G H J K M N S SOP PACKAGE CASE 482-01 CASE 482-01 ISSUE O O ISSUE DATE 01/27/98 -A4 5 D 8 PL 0.25 (0.010) M TB S A S N -BG 8 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 S W V C H J K M PIN 1 IDENTIFIER -TSEATING PLANE DIM A B C D G H J K M N S V W SOP PACKAGE CASE 482A-01 CASE 482A-01 ISSUE A ISSUE A DATE 05/13/98 AN1984 Sensors Freescale Semiconductor 5 PACKAGE DIMENSIONS PAGE 1 OF 2 MPAK PACKAGE CASE 1320-02 ISSUE B AN1984 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 2 OF 2 MPAK PACKAGE CASE 1320-02 ISSUE B AN1984 Sensors Freescale Semiconductor 7 PACKAGE DIMENSIONS PAGE 1 OF 2 MPAK PACKAGE CASE 1320A-02 ISSUE A AN1984 8 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 2 OF 2 MPAK PACKAGE CASE 1320A-02 ISSUE A AN1984 Sensors Freescale Semiconductor 9 PACKAGE DIMENSIONS PAGE 1 OF 2 SSOP PACKAGE CASE 1317A-03 ISSUE C AN1984 10 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 2 OF 2 SSOP PACKAGE CASE 1317A-03 ISSUE C AN1984 Sensors Freescale Semiconductor 11 PACKAGE DIMENSIONS PAGE 1 OF 3 SSOP PACKAGE CASE 1317-04 ISSUE F AN1984 12 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 2 OF 3 SSOP PACKAGE CASE 1317-04 ISSUE F AN1984 Sensors Freescale Semiconductor 13 PACKAGE DIMENSIONS PAGE 3 OF 3 SSOP PACKAGE CASE 1317-04 ISSUE F AN1984 14 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 1 OF 3 SSOP PACKAGE CASE 1352-03 ISSUE C AN1984 Sensors Freescale Semiconductor 15 PACKAGE DIMENSIONS PAGE 2 OF 3 SSOP PACKAGE CASE 1352-03 ISSUE C AN1984 16 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 3 OF 3 SSOP PACKAGE CASE 1352-03 ISSUE C AN1984 Sensors Freescale Semiconductor 17 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2006. All rights reserved. AN1984 Rev. 3 11/2006