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MPX2100A

MPX2100A

  • 厂商:

    FREESCALE(飞思卡尔)

  • 封装:

  • 描述:

    MPX2100A - 100kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors - Freescale ...

  • 数据手册
  • 价格&库存
MPX2100A 数据手册
MOTOROLA Freescale Semiconductor, Inc. ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 SEMICONDUCTOR TECHNICAL DATA Order this document by MPX2100/D 100 kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors The MPX2100 series device is a silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output — directly proportional to the applied pressure. The sensor is a single, monolithic silicon diaphragm with the strain gauge and a thin–film resistor network integrated on–chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. Features • Temperature Compensated Over 0°C to +85°C • Easy–to–Use Chip Carrier Package Options • Available in Absolute, Differential and Gauge Configurations • Ratiometric to Supply Voltage • ±0.25% Linearity (MPX2100D) Application Examples • Pump/Motor Controllers • Robotics • Level Indicators • Medical Diagnostics • Pressure Switching • Barometers • Altimeters Figure 1 illustrates a block diagram of the internal circuitry on the stand–alone pressure sensor chip. VS 3 THIN FILM TEMPERATURE COMPENSATION AND CALIBRATION CIRCUITRY 1 GND MPX2100 SERIES 0 to 100 kPa (0 to 14.5 psi) 40 mV FULL SCALE SPAN (TYPICAL) UNIBODY PACKAGE Freescale Semiconductor, Inc... ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 MPX2100A/D CASE 344 MPX2100AP/GP CASE 344B 2 4 SENSING ELEMENT Vout+ Vout- MPX2100DP CASE 344C Figure 1. Temperature Compensated Pressure Sensor Schematic VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the sensor is directly proportional to the differential pressure applied. The absolute sensor has a built–in reference vacuum. The output voltage will decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure (P1) side relative to the vacuum (P2) side. Similarly, output voltage increases as increasing vacuum is applied to the vacuum (P2) side relative to the pressure (P1) side. 1 2 MPX2100ASX/GSX CASE 344F PIN NUMBER Gnd +Vout 3 4 VS –Vout NOTE: Pin 1 is noted by the notch in the lead. REV 9 Motorola Sensor Device Data © Motorola, Inc. 2002 For More Information On This Product, Go to: www.freescale.com 1 MPX2100 SERIES MAXIMUM RATINGS(NOTE) Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 Symbol Pmax Tstg TA Value 400 –40 to +125 –40 to +125 Unit kPa °C °C Freescale Semiconductor, Inc. Rating NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Pressure Range(1) Supply Voltage(2) Symbol POP VS Io MPX2100A, MPX2100D MPX2100D MPX2100A Series VFSS Voff ∆V/∆P MPX2100D Series MPX2100A Series (–40°C to +125°C) Span(5) — — — — TCVFSS TCVoff Zin Zout (10% to 90%) tR — — Min 0 — — 38.5 –1.0 –2.0 — –0.25 –1.0 — — –1.0 –1.0 1000 1400 — — — Typ — 10 6.0 40 — — 0.4 — — ±0.1 ±0.5 — — — — 1.0 20 ±0.5 Max 100 16 — 41.5 1.0 2.0 — 0.25 1.0 — — 1.0 1.0 2500 3000 — — — Unit kPa Vdc mAdc mV mV mV/kPa %VFSS %VFSS %VFSS %VFSS mV Ω Ω ms ms %VFSS Supply Current Full Scale Span(3) Offset(4) Freescale Semiconductor, Inc... Sensitivity ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 Linearity(5) Pressure Hysteresis(5) (0 to 100 kPa) Temperature Hysteresis(5) Temperature Effect on Full Scale Temperature Effect on Offset(5) Input Impedance Output Impedance Response Warm–Up Offset Stability(7) Time(6) NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self–heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. 2 For More Information On This Product, Go to: www.freescale.com Motorola Sensor Device Data LINEARITY Linearity refers to how well a transducer’s output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 2) or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 LEAST SQUARES FIT RELATIVE VOLTAGE OUTPUT EXAGGERATED PERFORMANCE CURVE Freescale Semiconductor, Inc. MPX2100 SERIES LEAST SQUARE DEVIATION STRAIGHT LINE DEVIATION END POINT STRAIGHT LINE FIT OFFSET 0 50 PRESSURE (% FULLSCALE) 100 Freescale Semiconductor, Inc... Figure 2. Linearity Specification Comparison ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 ON–CHIP TEMPERATURE COMPENSATION and CALIBRATION Figure 3 shows the output characteristics of the MPX2100 series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. The effects of temperature on Full Scale Span and Offset are very small and are shown under Operating Characteristics. 40 35 OUTPUT (mVdc) 30 25 20 15 10 5 kPa PSI 0 -5 0 VS = 10 Vdc TA = 25°C P1 > P2 MAX TYP SPAN RANGE (TYP) MIN 25 3.62 50 7.25 75 10.87 100 14.5 OFFSET (TYP) Figure 3. Output versus Pressure Differential SILICONE GEL DIE COAT WIRE BOND LEAD FRAME DIFFERENTIAL/GAUGE ELEMENT P2 DIE BOND LEAD FRAME Figure 4. Cross–Sectional Diagrams (Not to Scale) Figure 4 illustrates the absolute sensing configuration (right) and the differential or gauge configuration in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2100 series pressure sensor operating charac- teristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. Motorola Sensor Device Data For More Information On This Product, Go to: www.freescale.com ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ABSOLUTE ELEMENT P2 DIFFERENTIAL/GAUGE STAINLESS STEEL DIE METAL COVER P1 EPOXY CASE SILICONE GEL ABSOLUTE DIE COAT DIE P1 WIRE BOND STAINLESS STEEL METAL COVER EPOXY CASE ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ DIE BOND 3 MPX2100 SERIES PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the silicone gel which isolates the die. The differential or gauge sensor is designed to operate with positive differential pressure Part Number MPX2100A MPX2100DP MPX2100AP MPX2100ASX MPX2100GP MPX2100GSX MPX2100D ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 applied, P1 > P2. The absolute sensor is designed for vacuum applied to P1 side. The Pressure (P1) side may be identified by using the table below: Freescale Semiconductor, Inc. Case Type 344 344C 344B 344F Pressure (P1) Side Identifier Stainless Steel Cap Side with Part Marking Side with Port Attached Side with Port Attached Freescale Semiconductor, Inc... ORDERING INFORMATION ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 MPX2100 series pressure sensors are available in absolute, differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. MPX Series Device Type Options Absolute, Differential Differential, Dual Port Absolute, Gauge Absolute, Gauge Axial Case Type 344 344C 344B 344F Order Number MPX2100A MPX2100D MPX2100DP MPX2100AP MPX2100GP MPX2100ASX MPX2100GSX Device Marking MPX2100A MPX2100D MPX2100DP MPX2100AP MPX2100GP MPX2100A MPX2100D Basic Element Ported Elements 4 For More Information On This Product, Go to: www.freescale.com Motorola Sensor Device Data ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 PACKAGE DIMENSIONS Freescale Semiconductor, Inc. MPX2100 SERIES C R M 1 B –A– N PIN 1 1 2 3 4 2 3 4 Z NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). INCHES MIN MAX 0.595 0.630 0.514 0.534 0.200 0.220 0.016 0.020 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 30 _ NOM 0.475 0.495 0.430 0.450 0.048 0.052 0.106 0.118 MILLIMETERS MIN MAX 15.11 16.00 13.06 13.56 5.08 5.59 0.41 0.51 1.22 1.63 2.54 BSC 0.36 0.40 17.65 18.42 30 _ NOM 12.07 12.57 10.92 11.43 1.22 1.32 2.68 3.00 L –T– J SEATING PLANE G F 4 PL F Y D 0.136 (0.005) M TA M DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. “F” 8 PL DIM A B C D F G J L M N R Y Z Freescale Semiconductor, Inc... ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT STYLE 2: PIN 1. 2. 3. 4. VCC - SUPPLY + SUPPLY GROUND STYLE 3: PIN 1. 2. 3. 4. GND -VOUT VS +VOUT CASE 344–15 ISSUE Z SEATING PLANE –T– R H N PORT #1 POSITIVE PRESSURE (P1) –A– U L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U INCHES MIN MAX 1.145 1.175 0.685 0.715 0.305 0.325 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.230 0.250 0.220 0.240 0.910 BSC MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 7.75 8.26 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.10 23.11 BSC –Q– B PIN 1 12 34 K S F G D 4 PL 0.13 (0.005) –P– 0.25 (0.010) J C M TQ S M TS S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344B–01 ISSUE B Motorola Sensor Device Data For More Information On This Product, Go to: www.freescale.com 5 MPX2100 SERIES ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 PACKAGE DIMENSIONS — CONTINUED Freescale Semiconductor, Inc. V R PORT #2 PORT #1 –A– U W H PORT #2 VACUUM (P2) L PORT #1 POSITIVE PRESSURE (P1) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U V W INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.248 0.278 0.310 0.330 MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 6.30 7.06 7.87 8.38 N –Q– SEATING PLANE B SEATING PLANE PIN 1 1234 –P– –T– J –T– C 0.25 (0.010) M K S TQ S G D 4 PL F Freescale Semiconductor, Inc... ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 0.13 (0.005) M TS S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344C–01 ISSUE B –T– C E A U –Q– NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MIN MAX 1.080 1.120 0.740 0.760 0.630 0.650 0.016 0.020 0.160 0.180 0.048 0.064 0.100 BSC 0.014 0.016 0.220 0.240 0.070 0.080 0.150 0.160 0.150 0.160 0.440 0.460 0.695 0.725 0.840 0.860 0.182 0.194 MILLIMETERS MIN MAX 27.43 28.45 18.80 19.30 16.00 16.51 0.41 0.51 4.06 4.57 1.22 1.63 2.54 BSC 0.36 0.41 5.59 6.10 1.78 2.03 3.81 4.06 3.81 4.06 11.18 11.68 17.65 18.42 21.34 21.84 4.62 4.92 V N R PORT #1 POSITIVE PRESSURE (P1) B –P– 0.25 (0.010) M PIN 1 TQ M 4 3 2 1 S K J F D 4 PL 0.13 (0.005) G TP Q STYLE 1: PIN 1. 2. 3. 4. GROUND V (+) OUT V SUPPLY V (-) OUT M S S CASE 344F–01 ISSUE B 6 For More Information On This Product, Go to: www.freescale.com Motorola Sensor Device Data ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 Freescale Semiconductor, Inc. MPX2100 SERIES NOTES Freescale Semiconductor, Inc... ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 Motorola Sensor Device Data For More Information On This Product, Go to: www.freescale.com 7 MPX2100 SERIES ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 Freescale Semiconductor, Inc. Freescale Semiconductor, Inc... ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and the Stylized M Logo are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. MOTOROLA and the Stylized M Logo are registered in the US Patent & Trademark Office. All other product or service names are the property of their respective owners. E Motorola, Inc. 2002. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1–303–675–2140 or 1–800–441–2447 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3–20–1, Minami–Azabu. Minato–ku, Tokyo 106–8573 Japan. 81–3–3440–3569 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong. 852–26668334 Technical Information Center: 1–800–521–6274 HOME PAGE: http://www.motorola.com/semiconductors/ 8 F ◊ or More Information On This Product, Go to: www.freescale.com Motorola Sensor Device Data MPX2100/D
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