MPXC2011DT1_10

Pressure Freescale Semiconductor High Volume Sensor for Low Pressure Applications Freescale Semiconductor has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub-module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer. This new chip carrier package uses Freescale Semiconductor's unique sensor die with its piezoresistive technology, along with the added feature of on-chip, thin-film temperature compensation and calibration. NOTE: Freescale Semiconductor is also offering the Chip Pak package in application-specific configurations, which will have an “SPX” prefix, followed by a four-digit number, unique to the specific customer MPXC2011DT1 Rev 8, 04/2010 MPXC2011DT1 MPXC2012DT1 Pressure Sensors 0 to 75 mmHg (0 to 10 kPa) Application Examples • • • • Respiratory Diagnostics Air Movement Control Controllers Pressure Switching Features • • • • • Low Cost Integrated Temperature Compensation and Calibration Ratiometric to Supply Voltage Polysulfone Case Material (ISO 10993) Provided in Easy-to-Use Tape and Reel ORDERING INFORMATION Device Name MPXC2011DTI MPXC2012DTI Package Options Tape and Reel Tape and Reel Case No. 423A 423A Gauge Pressure Type Differential • • Absolute Device Marking Date Code, Lot ID Date Code, Lot ID CHIP PAK PACKAGE MPXC2011DT1/MPXC2012DT1 CASE 423A-03 NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device). Front side die and wire protection must be provided in the customer's housing. Use caution when handling the devices during all processes. © Freescale Semiconductor, Inc., 2006, 2008-2010. All rights reserved. Pressure Freescale Semiconductor's MPXC2011DT1/ MPXC2012DT1 Pressure Sensor has been designed for medical usage by combining the performance of Freescale Semiconductor's shear stress pressure sensor design and the use of biomedically approved materials. Materials with a proven history in medical situations have been chosen to provide a sensor that can be used with confidence in applications, such as invasive blood pressure monitoring. It can be sterilized using ethylene oxide. The portions of the pressure sensor that are required to be biomedically approved are the rigid housing and the gel coating. The rigid housing is molded from a white, medical grade polysulfone that has passed extensive biological testing including: 10993-5:1999, 10993-10:2002, and 1099311:1993. The MPXC2011DT1 contains a silicone dielectric gel which covers the silicon piezoresistive sensing element. The gel is a nontoxic, nonallergenic elastomer system which meets all USP XX Biological Testing Class V requirements. The properties of the gel allow it to transmit pressure uniformly to the diaphragm surface, while isolating the internal electrical connections from the corrosive effects of fluids, such as saline solution. The gel provides electrical isolation sufficient to withstand defibrillation testing, as specified in the proposed Association for the Advancement of Medical Instrumentation (AAMI) Standard for blood pressure transducers. A biomedically approved opaque filler in the gel prevents bright operating room lights from affecting the performance of the sensor. The MPXC2012DT1 is a no-gel option. MPXC2011DT1 2 Sensors Freescale Semiconductor Pressure MAXIMUM RATINGS Table 1. Maximum Ratings(1) Rating Maximum Pressure (Backside) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 75 -25 to +85 +15 to +40 Unit kPa °C °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS Table 2. Operating Characteristics (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Pressure Range(1) Supply Voltage(2) Supply Current Full Scale Span(3) Offset(4) Sensitivity Linearity(5) Pressure Hysteresis(5) (0 to 10 kPa) Temperature Hysteresis(5) (+15°C to +40°C) Temperature Effect on Full Scale Span(5) Temperature Effect on Offset(5) Input Impedance Output Impedance Response Time(6) (10% to 90%) Warm-Up Offset Stability(7) Symbol POP VS Io VFSS Voff ΔV/ΔP — — — TCVFSS TCVoff Zin Zout tR — — Min 0 — — 24 -1.0 — -1.0 — — -1.0 -1.0 1300 1400 — — — Typ — 3 6.0 25 — 2.5 — ± 0.1 ± 0.1 — — — — 1.0 20 ± 0.5 Max 10 10 — 26 1.0 — 1.0 — — 1.0 1.0 2550 3000 — v — Unit kPa Vdc mAdc mV mV mV/kPa %VFSS %VFSS %VFSS %VFSS mV Ω Ω ms ms %VFSS 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPXC2011DT1 Sensors Freescale Semiconductor 3 Pressure PACKAGE DIMENSIONS A M C L N F B 1 23 4 V K DETAIL A D1 G H FRONT VIEW E –T– J END VIEW AC F AA AB DIM A B C D1 D2 E F G H J K L M N V AA AB AC AD INCHES MIN MAX 0.240 0.260 0.350 0.370 0.140 0.150 0.012 0.020 0.014 0.022 0.088 0.102 0.123 0.128 0.045 0.055 0.037 0.047 0.007 0.011 0.120 0.140 0.095 0.105 0.165 0.175 0.223 0.239 0.105 0.115 0.095 0.107 0.015 0.035 0.120 0.175 0.100 0.115 MILLIMETERS MIN MAX 6.10 6.60 8.89 9.40 3.56 3.81 0.30 0.51 0.36 0.56 2.24 2.59 3.12 3.25 1.14 1.40 0.94 1.19 0.18 0.28 3.05 3.56 2.41 2.67 4.19 4.45 5.66 6.07 2.67 2.92 2.41 2.72 0.38 0.89 3.05 4.45 2.54 2.92 NOTES: 1. 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. 4. CONTROLLING DIMENSION: INCH. AD D2 DETAIL A BACK VIEW STYLE 2: 1: STYLE PIN 1. 1. VCC PIN GND 2. 2. +OUT S+ 3. 3. –OUT Vs 4. 4. GROUND S- CASE 423A-03 ISSUE C CHIP PAK PACKAGE MPXC2011DT1 4 Sensors Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor China Ltd. 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Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2010. All rights reserved. MPXC2011DT1 Rev. 8 04/2010