VA800A-SPI

Datasheet USB 2.0 HI-SPEED TO SPI MPSSE MODULE Version 1.0 Document Reference No.: FT_000882 Clearance No.: FTDI #354 FTDI Chip VA800A-SPI USB 2.0 Hi-Speed to MPSSE SPI Module 1. Introduction 1.1 Features  The USB2.0 Hi-Speed to MPSSE SPI Module, VA800A-SPI, is a small electronic circuit board, utilising the FTDI FT232H. The 10 pin connector on the module fits directly to the FTDI VM800B and VM800C graphic display modules. This allows direct control of the EVE FT800 devices with an SPI interface from a USB host.  USB 2.0 Hi-Speed (480Mbits/Second) and Full Speed (12Mbits/Second) compatible  Entire USB protocol handled on the chip – No USB-specific firmware programming required  USB Type B micro connector  USB bus powered All USB signalling and protocols are handled on the module.  Synchronous Serial (MPSSE) data rates of up to 30Mbps on SPI For full details of the FT232H IC, consult the FT232H datasheet, DS_FT232H.  1kByte receive and transmit buffers for high data throughput  3.3V Level IO  Power indicator LED  SPI SS# active indicator LED  Adjustable receive buffer timeout  Support for USB suspend and resume  Low operating and USB suspend current  Low USB bandwidth consumption  UHCI / OHCI / EHCI host controller compatible  -40°C to +85°C operating temperature range  FTDI’sFTDI Chip’s royalty-free D2XX drivers eliminate the requirement for USB driver development in most cases Use of FTDI devices in life support and/or safety applications is entirely at the user’s risk, and the user agrees to defend, indemnify and hold harmless FTDI from any and all damages, claims, suits or expense resulting from such use. Datasheet USB 2.0 HI-SPEED TO SPI MPSSE MODULE Version 1.0 Document Reference No.: FT_000882 Clearance No.: FTDI #354 2 Description The USB2.0 Hi-Speed to MPSSE SPI Module is a small electronic circuit board, utilising the FT232H. This device handles all the USB signalling and protocols. The module provides a fast, simple way to connect devices with 3.3 Volt digital interface to USB. For full details of the IC, consult the FT232H datasheet, DS_FT232H. The integrated FT232H device incorporates a command processor called the Multi-Protocol Synchronous Serial Engine (MPSSE). The purpose of the MPSSE command processor is to communicate with devices which use synchronous protocols (such as JTAG, SPI or I2C) in an efficient manner. Full details are available in the MPSSE application note - AN_108. The module is terminated by ten female pin headers which can be interfaced to a male header. Pin signals are compliant with CMOS logic at 3.3 volts. The FT232H is a single channel USB 2.0 Hi-Speed (480Mb/s) to UART/FIFO IC. It can be configured in a variety of industry standard serial or parallel interfaces at up to 30Mbps, such as MPSSE - JTAG, SPI, I2C. The VA800A-SPI MPSSE module is configured for SPI only. The 10 pin connector fits to the VM800B and VM800C graphic display modules directly. The module is powered from a USB host port and is USB2.0 Hi-Speed compatible. The VA800A-SPI MPSSE module requires USB device drivers, available free from http://www.ftdichip.com. The D2XX driver is used with application software to directly access the FT232H in the module though a DLL. This is illustrated in the Figure 2-1 The VA800A-SPI MPSSE module uses the FTDI’s FT232H USB to serial IC device. VA800A-SPI Connector D2XX DLL API USB Micro USB 10 Female pin headers Software application access to USB via D2XX Figure 2-1 Using the VA800A-SPI MPSSE module Copyright © 2013 Future Technology Devices International Limited 1 Datasheet USB 2.0 HI-SPEED TO SPI MPSSE MODULE Version 1.0 Document Reference No.: FT_000882 Clearance No.: FTDI #354 2.1 Ordering Information The following Table 2-1 gives details of the available VA800A-SPI MPSSE modules. Part Number Description VA800A-SPI USB to SPI module End Connector Single row, receptacle x 10 Cable details N.A. Table 2-1 VA800A-SPI MPSSE module Descriptions and Part Numbers Note 1: The VCC power output signal is 5.0V. The source of 5.0V is the USB VBUS input, which is switched onto the power output signal. 2.2 Certifications The FTDI VA800A-SPI MPSSE modules are fully RoHS compliant. At the time of writing this datasheet the modules were being CE and FCC tested. Copyright © 2013 Future Technology Devices International Limited 0 Datasheet USB 2.0 HI-SPEED TO SPI MPSSE MODULE Version 1.0 Document Reference No.: FT_000882 Clearance No.: FTDI #354 Table of Contents 1. Introduction .................................................................................................. 1 1.1 2 3 Description ..................................................................................... 1 2.1 Ordering Information .................................................................................... 0 2.2 Certifications ................................................................................................. 0 Typical Applications ........................................................................ 2 3.1 4 Features ........................................................................................................ 1 Driver Support .............................................................................................. 2 VA800A-SPI MPSSE module connection and Mechanical Details ..... 3 4.1 VA800A-SPI MPSSE module Electrical Parameters ........................................ 4 4.1.1 VA800A-SPI MPSSE module I/O Characteristics ............................................. 4 5 Module PCB Circuit Schematic ........................................................ 6 6 Contact Information ....................................................................... 7 Appendix A - Module EEPROM Configuration ...................................... 11 Appendix B - List of Figures and Tables ............................................. 12 Appendix C – Revision History ........................................................... 13 Copyright © 2013 Future Technology Devices International Limited 1 Datasheet USB 2.0 HI-SPEED TO SPI MPSSE MODULE Version 1.0 Document Reference No.: FT_000882 Clearance No.: FTDI #354 3  Typical Applications Controlling the EVE series of grahics  controllers  Rapid USB integration into existing electronic systems USB to SPI interfaces  Prototyping platform for USB interface on new systems 3.1 Driver Support Royalty free D2XX Direct Drivers (USB Drivers + DLL S/W Interface)  Microsoft Windows 8 and 8 - 64-bit  Microsoft Windows 7 and Windows 7 64-bit  Microsoft Windows Vista and Vista 64-bit  Microsoft Windows XP and XP 64-bit  Microsoft Windows 2000, Server 2003, XP and Server 2008  Microsoft Windows CE 4.2, 5.0 and 6.0 Linux 2.6.32 or later The drivers listed above are all available to download for free from http://www.ftdichip.com/Drivers/D2XX.htm Copyright © 2013 Future Technology Devices International Limited 2 Datasheet USB 2.0 HI-SPEED TO SPI MPSSE MODULE Version 1.0 Document Reference No.: FT_000882 Clearance No.: FTDI #354 4 VA800A-SPI MPSSE module connection and Mechanical Details The following Figure 4-1 VA800A-SPI MPSSE module layout shows the VA800A-SPI MPSSE module layout. The module is 29mm x 32mm is dimension. 32mm 29mm Figure 4-1 VA800A-SPI MPSSE module layout The following Table 4-1 shows the module signals for these signals on the VA800A-SPI MPSSE module. Pin No. Name Type Description CN1-1 SCLK O SPI Clock input CN1-2 MOSI O Master Out Slave in CN1-3 MISO I Master In Slave out CN1-4 CS# O Chip select , active low CN1-5 INT# I Interrupt CN1-6 PD# O Active low, SPI device power down output. CN1-7 5V P 5V power supply CN1-8 -- -- NC CN1-9 GND P Ground CN1-10 GND P Ground Table 4-1 VA800A-SPI MPSSE module Connections (numbers refer to pad numbers on the PCB) Copyright © 2013 Future Technology Devices International Limited 3 Datasheet USB 2.0 HI-SPEED TO SPI MPSSE MODULE Version 1.0 Document Reference No.: FT_000882 Clearance No.: FTDI #354 4.1 VA800A-SPI MPSSE module Electrical Parameters Parameter Description Minimum Typical Maximum Units VCC Output Power Voltage 4.75 5 5.25 V IO Output Power Current - - 400 mA T Operating Temperature Range -40 Conditions o +85 C Table 4-2 VA800A-SPI MPSSE Operating Parameters 4.1.1 VA800A-SPI MPSSE module I/O Characteristics Parameter Description Minimum Typical Voh Output Voltage High 2.40 3.14 Maximum Units Conditions Ioh = +/-2mA V I/O Drive strength* = 4mA 3.20 V 3.22 V 3.22 V I/O Drive strength* = 8mA I/O Drive strength* = 12mA I/O Drive strength* = 16mA Iol = +/-2mA Vol Output Voltage Low 0.18 0.40 V I/O Drive strength* = 4mA Vil Vih Vt Vt- Vt+ Rpu Rpd Input low Switching Threshold 2.00 Switching Threshold Schmitt trigger negative going threshold voltage 0.80 resistance V 0.07 V 0.80 I/O Drive strength* = 12mA I/O Drive strength* = 16mA V LVTTL - V LVTTL 1.50 V LVTTL - V 1.60 2.00 V 40 75 190 KΩ Vin = 0 40 75 190 KΩ Vin =VCCIO Schmitt trigger positive Input pull-down 0.08 I/O Drive strength* = 8mA 1.10 going threshold voltage Input pull-up resistance V - Threshold Input High Switching 0.12 Copyright © 2013 Future Technology Devices International Limited 4 Datasheet USB 2.0 HI-SPEED TO SPI MPSSE MODULE Version 1.0 Document Reference No.: FT_000882 Clearance No.: FTDI #354 Parameter Description Minimum Typical Maximum Units Conditions Iin Input Leakage Current 15 45 85 μA Vin = 0 μA Vin = 5.5V or 0 Ioz Tri-state output leakage current ±10 Table 4-3 VA800A-SPI MPSSE module I/O Pin Characteristics * The I/O drive strength and slow slew-rate are configurable in the EEPROM. The I/O pins are +3.3v cells, which are +5V tolerant Copyright © 2013 Future Technology Devices International Limited 5 Datasheet USB 2.0 HI-SPEED TO SPI MPSSE MODULE Version 1.0 Document Reference No.: FT_000882 Clearance No.: FTDI #354 5 Module PCB Circuit Schematic The circuit schematics for the small electronic board, utilising the FTDI FT232H, are shown in Figure 5-1 . XL1 Shunt 2.0mm VBUS JP1 Q1 IRLML6402 3V3 600R/0.5A SMD 075-0805 FB2 600R/0.5A VBUS C2 C4 C13 6 7 3V3 34 R9 10k GND C14 10nF Do Not Populate R11 2 GND VCC CS CLK DI GND DO 5 4 3 1 27pF 6 Y1 12MHz 2 42 10k 27pF U2 1 GND C15 EECS EECLK EEDATA R8 5 12k/1% EECS 45 EECLK 44 EEDATA 43 C16 10nF CR2 0R 0R D1 D2 Red Green C1 R3 100k 0.1uF DM DP RESET EECS EECLK EEDATA XCSI TEST CN1 ADBUS0 ADBUS1 ADBUS2 ADBUS3 ADBUS4 ADBUS5 ADBUS6 ADBUS7 ACBUS0 ACBUS1 ACBUS2 ACBUS3 ACBUS4 ACBUS5 ACBUS6 ACBUS7 ACBUS8 ACBUS9 REF R4 2k GND 3 8 12 24 46 VCCD VCCCORE VCCA VPHY VPLL VCCIO VCCIO VCCIO VREGIN XCSO C6 13 14 15 16 17 18 19 20 21 25 26 27 28 29 30 31 32 33 AGND AGND AGND GND GND GND GND GND GND GND GND 0.1uF 0.1uF 0.1uF 4.7uF 0.1uF 4.7uF GND R6 R7 GND 3V3 39 38 37 R2 360R SCK MOSI MISO SS# 5V0 INT# SCK MOSI MISO SS# INT# PDN# PDN# D3 D4 1 2 3 4 5 6 7 8 9 10 GND D5 VBUSDTCT R10 33k GND 4 9 41 10 11 22 23 35 36 47 48 C12 C11 C10 C9 C8 C7 600R/0.5AFB3 1 2 3 4 5 VBUS DD+ ID GND CR1 USB Micro-B CN2 U1 FT232HL 40 C5 1uF 1uF 1uF GND 22k VBUSDTCT R1 470R C3 1uF 0.1uF 3V3 VBUS R5 5V0 F1 3V3 FB1 GND R12 2k 93LC56B_SOT-23 Figure 5-1 Circuit Schematic of VA800A-SPI Copyright © 2013 Future Technology Devices International Limited 6 Datasheet USB 2.0 HI-SPEED TO SPI MPSSE MODULE Version 1.0 Document Reference No.: FT_000882 Clearance No.: FTDI #354 6 Contact Information Head Office – Glasgow, UK Branch Office – Tigard, Oregon, USA Future Technology Devices International Limited Unit 1, 2 Seaward Place, Centurion Business Park Glasgow G41 1HH United Kingdom Tel: +44 (0) 141 429 2777 Fax: +44 (0) 141 429 2758 Future Technology Devices International Limited (USA) 7130 SW Fir Loop Tigard, OR 97223 USA Tel: +1 (503) 547 0988 Fax: +1 (503) 547 0987 E-mail (Sales) sales1@ftdichip.com E-Mail (Sales) us.sales@ftdichip.com E-mail (Support) support1@ftdichip.com E-Mail (Support) us.support@ftdichip.com E-mail (General Enquiries) admin1@ftdichip.com E-Mail (General Enquiries) us.admin@ftdichip.com Branch Office – Taipei, Taiwan Future Technology Devices International Limited (Taiwan) 2F, No. 516, Sec. 1, NeiHu Road Taipei 114 Taiwan , R.O.C. Tel: +886 (0) 2 8791 3570 Fax: +886 (0) 2 8791 3576 Branch Office – Shanghai, China Future Technology Devices International Limited (China) Room 1103, No. 666 West Huaihai Road, Shanghai, 200052 China Tel: +86 21 62351596 Fax: +86 21 62351595 E-mail (Sales) asia.sales1@ftdichip.com E-mail (Sales) cn.sales@ftdichip.com E-mail (Support) asia.support1@ftdichip.co m E-mail (Support) cn.support@ftdichip.com E-mail (General Enquiries) asia.admin1@ftdichip.com E-mail (General Enquiries) cn.admin@ftdichip.com Web Site http://ftdichip.com System and equipment manufacturers and designers are responsible to ensure that their systems, and any Future Technology Devices International Ltd (FTDI) devices incorporated in their systems, meet all applicable safety, regulatory and system-level performance requirements. All application-related information in this document (including application descriptions, suggested FTDI devices and other materials) is provided for reference only. While FTDI has taken care to assure it is accurate, this information is subject to customer confirmation, and FTDI disclaims all liability for system designs and for any applications assistance provided by FTDI. Use of FTDI devices in life support and/or safety applications is entirely at the user’s risk, and the user agrees to defend, indemnify and hold harmless FTDI from any and all damages, claims, suits or expense resulting from such use. This document is subject to change without notice. No freedom to use patents or other intellectual property rights is implied by the publication of this document. Neither the whole nor any part of the information contained in, or the product described in this document, may be adapted or reproduced in any material or electronic form without the prior written consent of the copyright holder. Future Technology Devices International Ltd, Un it 1, 2 Seaward Place, Centurion Business Park, Glasgow G41 1HH, United Kingdom. Scotland Registered Company Number: SC136640 Copyright © 2013 Future Technology Devices International Limited 7 Datasheet USB 2.0 HI-SPEED TO SPI MPSSE MODULE Version 1.0 Document Reference No.: FT_000882 Clearance No.: FTDI #354 Appendix A - Module EEPROM Configuration Each VA800A-SPI MPSSE module is controlled by the FTDI FT232H IC. This FT232H device contains an EEPROM which contains the USB configuration descriptors for that device. When the module is plugged into a PC or a USB reset is performed, the PC will read these descriptors. The default values stored into the internal EEPROM are defined in the following table Parameter Value USB Vendor ID (VID) 0403h FTDI default VID (hex) USB Product UD (PID) 6014h FTDI default PID (hex) Serial Number Enabled? Notes Yes A unique serial number is generated and programmed into Serial Number See Note Manufacturer Name FTDI Product Description See note Max Bus Power Current Power Source 500mA the EEPROM during device final test. VA800A-SPI Includes power available from the module plus power required for the FT232H Bus Powered Device Type FT232H USB Version 0200 Returns USB 2.0 device description to the host. Note: The device is a USB 2.0 Hi-Speed device (480Mb/s). Remote Wake Up Disabled 500uA suspend limit when in this state High Current I/Os Enabled Enables the high drive level on the CBUS I/O pins. Invert TXD Disabled Signal on this pin becomes TXD# if enable. Invert RXD Disabled Signal on this pin becomes RXD# if enable. Invert RTS# Disabled Signal on this pin becomes RTS if enable. Invert CTS# Disabled Signal on this pin becomes CTS if enable. Default Internal EEPROM Configuration Note: The internal EEPROM in the module can be re-programmed over USB using the utility program FT_PROG. Both can be downloaded from www.ftdichip.com. Copyright © 2013 Future Technology Devices International Limited 11 Datasheet USB 2.0 HI-SPEED TO SPI MPSSE MODULE Version 1.0 Document Reference No.: FT_000882 Clearance No.: FTDI #354 Appendix B - List of Figures and Tables List of Figures Figure 2-1 Using the VA800A-SPI MPSSE module ....................................................... 1 Figure 4-1 VA800A-SPI MPSSE module layout ............................................................ 3 Figure 5-1 Circuit Schematic of VA800A-SPI .............................................................. 6 List of Tables Table 2-1 VA800A-SPI MPSSE module Descriptions and Part Numbers ...................... 0 Table 4-1 VA800A-SPI MPSSE module Connections (numbers refer to pad numbers on the PCB) ................................................................................................................ 3 Table 4-2 VA800A-SPI MPSSE Operating Parameters ................................................ 4 Table 4-3 VA800A-SPI MPSSE module I/O Pin Characteristics ................................... 5 Copyright © 2013 Future Technology Devices International Limited 12 Datasheet USB 2.0 HI-SPEED TO SPI MPSSE MODULE Version 1.0 Document Reference No.: FT_000882 Clearance No.: FTDI #354 Appendix C – Revision History Version 1.0 First Release 24th October 2013 Copyright © 2013 Future Technology Devices International Limited 13