AS0A621-H2S6-7H

DDRIII SO DIMM Socket SPECIFICATIONS AS Series 5.2mm Height SM T Type 0.60mm Pitch 204 Pos. Mechanical Contact Retention Force: 0.10kg min. Durability : 60 Cycles Electrical Voltage Rating: 25V Current Rating: 0.5A Contact Resistance: 50mΩ max. Dielectric Withstanding Voltage: 250V AC/1 min. Insulation Resistance: 100MΩ Physical Housing: Thermoplastic, UL 94V-0 rated in Ivory Color Contact: Copper alloy Plating: See “ORDERING INFORMATION” Metal Spring: Copper alloy Operating Temperature: -55℃ to +85℃ DRAWING 6 6 .8 0 6 2 .10 3 3 .4 0 4 .6 0 3 .5 0 DIM. B 3 .0 0 POS.NO. 2 0 4 POS.NO. 2 12 ,0 0 2 .0 0 3 .10 DIM. A 7 1.3 1.10 1.6 0 6 3 .7 POS.NO. 1 0 .6 0 3 .0 0 DIM. A 1.6 5 POS.NO. 2 POS.NO. 1 6 6 .8 0 DIM. B 1.3 5 POS.NO. 2 0 4 0 .6 0 POS.NO. 2 0 3 2 5 .8 DIM. A POS.NO. 2 0 3 DIM. B REC OMMEDED P.C .B LAYOUT 5 .2 1.3 5 DIM. A DIM. B 1,6 5 6 8 .0 0 6 9 .6 ORDERING I NF OR MATI ON PRODUCT NO.: A S 0 A6 2 * - H 2 * 6 - * H Memory Module Socket Horizontal Type Single Row No. Of Pos. A6=204 Pos. H=HALOGEN /LEAD FREE A S0 A6 2 * - H2 S6 - * H 2 1.0 0 3 9 .0 0 A S0 A6 2 * - H2 R6 - * H P/ N 3 9 .0 0 2 1.0 0 DIM.A DIM.B Package Code 4=Soft Tray 7=Tape Reel 6=Normal Type SMT Type Contact Area Plating 1=Gold Flash Y=5u"Gold Plating 6=10u"Gold Plating 7=15u"Gold Plating 3=30u"Gold Plating S=Standard R=Reverse 2=5.2mm Height H=DDR SODIMM All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.