GHB-GW20-Y

55 Commerce Way Woburn, MA 01801 (781) 935 - 4442 (781) 938 - 5867 www.gilway.com GHB-GW20-Y Features ? SUBMINIATURE PACKAGE. ?WIDE VIEWING ANGLE. ?LONG Description The Super Bright Yellow source color devices are made with DH InGaAlP on GaAs substrate Light Emitting Diode. LIFE - SOLID STATE RELIABILITY. ?LOW PACKAGE PROFILE. ?PACKAGE : SUBMINIATURE SOLID STATE LAMP 1000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.25(0.01") unless otherwise noted. 3. Lead spacing is measured where the lead emerge package. 4. Specifications are subject to change without notice. REV NO: V.2 DATE: NOV/13/2002 PAGE: 1 OF 4 Selection Guide Par t No.. Pa No. art No Dic e ic Lens Typ L ens Ty p e ens Ty s Iv (m c d ) Iv (mcd) (mc d @ 20 mA Miin. in . n Ty p.. Typ Ty p yp 7 00 20° V i ew i n g Viewin Vi in iew Angle GHB-GW20-Y S UPER BRIGHTYELLOW (InGaAIP) WATER CLEAR 110 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25 C Sy m b o l Sy ymbo ymbol peak D 1/2 C VF IR P a r a m e t er Pa aramete Peak Wavelength Dominate Wavelength Spectral Line Half-width Capacitance Forward Voltage Reverse Current e D ev i c e evic Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Ty p.. Ty p yp 590 588 28 25 2.0 2.5 10 x Max .. ax Un its nit nm nm nm pF V uA Tes t Co n d it io ns Test Cond ition s est s I F =20mA I F =20mA I F =20mA V F =0V;f =1MHz I F =20mA V R = 5V Absolute Maximum Ratings at TA=25 C P ar am e t er Paramet Pa arameter Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating/Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Y B Sup er Briigh t Yello w Su p er B r g h Ye u uper Br Brigh Yellow Yello 125 30 150 5 -40 C To +85 C Un its Unit nit mW mA mA V REV NO: V.2 DATE: NOV/13/2002 PAGE: 2 OF 4 REV NO: V.2 DATE: NOV/13/2002 PAGE: 3 OF 4 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) REV NO: V.2 DATE: NOV/13/2002 PAGE: 4 OF 4