G1431F2U

Global Mixed-mode Technology Inc. G1431 2W Stereo Audio Amplifier Features Internal Gain Control, Which Eliminates External Gain-Setting Resistors Depop Circuitry Integrated Output Power at 1% THD+N, VDD=5V --2.0W/CH (typical) into a 4Ω Load --1.2W/CH (typical) into a 8Ω Load Bridge-Tied Load (BTL) Supported Fully differential Input Shutdown Control Available Surface-Mount Power Package 20-Pin TSSOP-P General Description G1431 is a stereo audio power amplifier in 20pin TSSOP thermal pad package. It can drive 2.0W continuous RMS power into 4Ω load per channel in Bridge-Tied Load (BTL) mode at 5V supply voltage. Its THD is smaller than 1% under the above operation condition. To simplify the audio system design in the notebook application and to enlarge the driving power, G1431 supports the Bridge-Tied Load (BTL) mode for driving the speakers. For the low current consumption applications, the SHDN mode is supported to disable G1431 when it is idle. The current consumption can be reduced to 150µA (typically). Amplifier gain is internally configured and controlled by two terminals (GAIN0, GAIN1). BTL gain settings of 6dB, 10dB, 15.6dB, 21.6dB are provided. Applications Stereo Power Amplifiers for Notebooks or Desktop Computers Multimedia Monitors Stereo Power Amplifiers for Portable Audio Systems Ordering Information ORDER MARKING NUMBER G1431F2U G1431 TEMP. RANGE PACKAGE (Pb free) -40°C to +85°C TSSOP-20 (FD) Pin Configuration G1431 GND GAIN0 GAIN1 LOUT+ LINPVDD RIN+ LOUTLIN+ 1 2 3 4 5 6 7 8 9 20 19 18 17 16 15 14 13 12 11 GND SHUTDOWN ROUT+ RINVDD VDD PVDD ROUTGND NC GND Thermal Pad BYPASS 10 Top View TSSOP-20 Bottom View Ver: 1.3 Sep 23, 2005 TEL: 886-3-5788833 http://www.gmt.com.tw 1 Global Mixed-mode Technology Inc. Absolute Maximum Ratings Supply Voltage, VCC…………………..…...…….……...6V Operating Ambient Temperature Range TA…….…………………………….……….-40°C to +85°C Maximum Junction Temperature, TJ…..……….….150°C Storage Temperature Range, TSTG….…-65°C to+150°C Reflow Temperature (soldering, 10sec)…............260°C G1431 Power Dissipation (1) TA ≤ 25°C ………...….…………………………..2.7W TA ≤ 70°C ………...….…………………………..1.7W Electrostatic Discharge, VESD Human body mode.…………………….……….3000V(2) Note: (1) (2) : Recommended PCB Layout : Human body model : C = 100pF, R = 1500Ω, 3 positive pulses plus 3 negative pulses Electrical Characteristics DC Electrical Characteristics, TA=+25°C PARAMETER Supply voltage VDD High-Level Input voltage, VIH Low-Level Input voltage, VIL DC Differential Output Voltage Supply Current in Mute Mode IDD in Shutdown SYMBOL VDD VIH VIL VO(DIFF) IDD ISD CONDITIONS SHUTDOWN , GAIN0, GAIN1 SHUTDOWN , GAIN0, GAIN1 MIN 4.5 2 --------- TYP 5 ----5 7.5 160 MAX 5.5 --0.8 50 11 300 UNIT V V V mV mA µA VDD = 5V,Gain = 2 VDD = 5V Stereo BTL VDD = 5V (AC Operation Characteristics, VDD = 5.0V, TA=+25°C, RL = 4Ω, unless otherwise noted) PARAMETER Output power (each channel) see Note SYMBOL P(OUT) CONDITIONS THD = 1%, BTL, RL = 4Ω G=-2V/V THD = 1%, BTL, RL = 8Ω G=-2V/V THD = 10%, BTL, RL = 4Ω G=-2V/V THD = 10%, BTL, RL = 8Ω G=-2V/V PO = 1.6W, BTL, RL = 4Ω G=-2V/V PO = 1W, BTL, RL = 8Ω G=-2V/V THD = 5% F=1kHz, BTL mode G=-2V/V CBYP=1uF f = 1kHz PO = 500mW, BTL, G=-2V/V BTL,G=-2V/V, A Weighted filter MIN ------------------- TYP 2 1.2 2.5 1.6 100 60 15 68 MAX ----------------- UNIT W Total harmonic distortion plus noise Maximum output power bandwidth Power supply ripple rejection Channel-to-channel output separation Input impedance Signal-to-noise ratio Output noise voltage THD+N BOM PSRR m% kHz dB dB MΩ dB µV (rms) ZI Vn 80 --See Table 2 --90 ----45 --- Note :Output power is measured at the output terminals of the IC at 1kHz. Ver: 1.3 Sep 23, 2005 TEL: 886-3-5788833 http://www.gmt.com.tw 2 Global Mixed-mode Technology Inc. Typical Characteristics Table of Graphs FIGURE THD +N Total harmonic distortion plus noise Vn Output noise voltage Supply ripple rejection ratio Crosstalk PO Output power PD Power dissipation vs Frequency vs Output Power vs Frequency vs Frequency vs Frequency vs Load Resistance vs Output Power 1,2,7,8,13,14 3,4,5,6,9,10,11,12,15,16,17,18 21 19 20 22 23 G1431 Total Harmonic Distortion Plus Noise vs Frequency 10 5 Total Harmonic Distortion Plus Noise vs Frequency 10 5 2 1 0.5 % 0.2 0.1 0.05 VDD=5V RL=3Ω Po=1.75W Av=21.6dB 2 1 VDD=5V RL=3Ω Av=6dB Po=0.5W Av=15.6dB % 0.5 0.2 Po=1W 0.1 Av=10dB Av=6dB 0.05 0.02 0.02 0.01 20 Po=1.5W 50 100 200 500 Hz 1k 2k 5k 10k 20k 0.01 20 50 100 200 500 Hz 1k 2k 5k 10k 20k Figure 1 Figure 2 Total Harmonic Distortion Plus Noise vs Output Power 10 5 10 Total Harmonic Distortion Plus Noise vs Output Power 5 VDD=5V RL=3Ω, Av=6dB 15kHz 1kHz % 15kHz VDD=5V RL=3Ω, Av=10dB 2 1 0.5 % 0.2 0.1 0.05 2 1 0.5 1kHz 0.2 0.1 0.05 20Hz 20Hz 0.02 0.02 0.01 3m 0.01 3m 5m 10m 20m 50m 100m W 200m 500m 1 2 3 5m 10m 20m 50m 100m W 200m 500m 1 2 3 Figure 3 Figure 4 Ver: 1.3 Sep 23, 2005 TEL: 886-3-5788833 http://www.gmt.com.tw 3 Global Mixed-mode Technology Inc. Typical Characteristics (continued) Total Harmonic Distortion Plus Noise vs Output Power 10 5 10 5 G1431 Total Harmonic Distortion Plus Noise vs Output Power 15kHz 15kHz 2 1 0.5 % 0.2 0.1 0.05 2 1 1kHz 1kHz % 0.5 0.2 0.1 0.02 0.01 3m VDD=5V RL=3Ω Av=15.6dB 5m 10m 20m 50m 20Hz 0.05 0.02 0.01 3m VDD=5V RL=3Ω Av=21.6dB 5m 10m 20m 50m 20Hz 100m W 200m 500m 1 2 3 100m W 200m 500m 1 2 3 Figure 5 Figure 6 Total Harmonic Distortion Plus Noise vs Frequency 10 5 Total Harmonic Distortion Plus Noise vs Frequency 10 5 2 1 0.5 % 0.2 0.1 0.05 VDD=5V RL=4Ω Po=1.75W Av=21.6dB 2 1 0.5 VDD=5V RL=4Ω Av=6dB Po=0.25W Av=15.6dB Av=6dB % 0.2 0.1 0.05 Po=1.5W 0.02 Av=10dB 50 100 200 500 Hz 1k 2k 5k 10k 20k 0.02 0.01 20 Po=1W 50 100 200 500 Hz 1k 2k 5k 10k 20k 0.01 20 Figure 7 Figure 8 Total Harmonic Distortion Plus Noise vs Output Power 10 5 10 5 Total Harmonic Distortion Plus Noise vs Output Power 15kHz VDD=5V RL=4Ω, Av=10dB 15kHz 2 1 0.5 % 0.2 0.1 0.05 VDD=5V RL=4Ω, Av=6dB 2 1 0.5 1kHz 1kHz % 0.2 0.1 0.05 20Hz 0.02 0.02 0.01 3m 5m 10m 20m 50m 100m W 200m 500m 1 2 3 0.01 3m 5m 20Hz 10m 20m 50m 100m W 200m 500m 1 2 3 Figure 9 Figure 10 Ver: 1.3 Sep 23, 2005 TEL: 886-3-5788833 http://www.gmt.com.tw 4 Global Mixed-mode Technology Inc. Typical Characteristics (continued) G1431 Total Harmonic Distortion Plus Noise vs Output Power 10 5 Total Harmonic Distortion Plus Noise vs Output Power 10 5 15kHz 15kHz 2 1 0.5 % 0.2 0.1 0.05 2 1 0.5 1kHz 1kHz % 0.2 0.1 0.02 0.01 3m VDD=5V RL=4Ω Av=15.6dB 5m 10m 20m 50m 100m W 20Hz 0.05 VDD=5V RL=4Ω Av=21.6dB 5m 10m 20m 50m 100m W 20Hz 0.02 200m 500m 1 2 3 0.01 3m 200m 500m 1 2 3 Figure 11 Figure 12 Total Harmonic Distortion Plus Noise vs Frequency 10 5 10 Total Harmonic Distortion Plus Noise vs Frequency 5 2 1 0.5 % 0.2 0.1 0.05 VDD=5V RL=8Ω Av=6dB 2 1 0.5 % VDD=5V RL=8Ω Po=1W Av=15.6dB Po=0.25W Po=1W Po=0.5W 50 100 200 500 Hz 1k 2k 5k 10k 20k 0.2 0.1 0.05 Av=21.6dB Av=6dB 0.02 0.01 20 0.02 Av=10dB 50 100 200 500 Hz 1k 2k 5k 10k 20k 0.01 20 Figure 13 Figure 14 Total Harmonic Distortion Plus Noise vs Output Power 10 5 10 5 Total Harmonic Distortion Plus Noise vs Output Power VDD=5V RL=8Ω Av=10dB 2 1 0.5 % 0.2 0.1 0.05 15kHz VDD=5V RL=8Ω Av=6dB 2 1 0.5 % 15kHz 1kHz 0.2 0.1 0.05 1kHz 20Hz 0.02 0.01 3m 5m 10m 20m 50m 100m W 200m 500m 1 2 3 0.02 20Hz 5m 10m 20m 50m 100m W 200m 500m 1 2 3 0.01 3m Figure 15 Figure 16 Ver: 1.3 Sep 23, 2005 TEL: 886-3-5788833 http://www.gmt.com.tw 5 Global Mixed-mode Technology Inc. Typical Characteristics (continued) Total Harmonic Distortion Plus Noise vs Output Power 10 5 10 G1431 Total Harmonic Distortion Plus Noise vs Output Power 5 15kHz 2 1 0.5 % 0.2 0.1 0.05 VDD=5V RL=8Ω Av=15.6dB 15kHz 2 1 1kHz % 0.5 1kHz 0.2 0.1 0.05 20Hz 0.02 0.01 3m 0.02 0.01 3m VDD=5V RL=8Ω Av=21.6dB 5m 10m 20m 50m 100m W 20Hz 5m 10m 20m 50m 100m W 200m 500m 1 2 3 200m 500m 1 2 3 Figure 17 Figure 18 Supply Ripple Rejection Ratio vs Frequency +0 -10 -20 -30 -40 d B -50 -60 -70 -80 -90 -100 20 Channel Separation -20 -25 -30 -35 -40 -45 -50 TT T T T TT T VDD=5V RL=8Ω Cb=1µF Av=21.6dB d B -55 -60 -65 -70 -75 VDD=5V Po=1W RL=8Ω Av=6dB L TO R Av=6dB -80 -85 -90 -95 R TO L 50 100 200 500 Hz 1k 2k 5k 10k 20k 50 100 200 500 Hz 1k 2k 5k 10k 20k -100 20 Figure 19 Figure 20 Output Noise vs Frequency 500u 400u 300u 200u Output Power vs Load Resistance 2.5 Output Power(W) VDD=5V RL=4Ω Av=6dB A-Weighted filter 2 100u V 70u 60u 50u 40u 30u 20u 1.5 1 VDD=5V THD+N=1% Each Channel 0.5 10u 20 50 100 200 500 Hz 1k 2k 5k 10k 20k 0 0 10 20 30 Load Resistance(Ω) 40 Figure 21 Figure 22 Ver: 1.3 Sep 23, 2005 TEL: 886-3-5788833 http://www.gmt.com.tw 6 Global Mixed-mode Technology Inc. Typical Characteristics (continued) G1431 Recommend PCB Footprint Power Dissipation vs Output Power 1.8 1.6 1.4 Power Dissipation 1.2 1 0.8 0.6 0.4 0.2 0 0 0.5 1 1.5 Po-Output Power(W) 2 2.5 RL=8Ω RL=4Ω VDD=5V Each Channel RL=3Ω Figure 23 Figure 24 Ver: 1.3 Sep 23, 2005 TEL: 886-3-5788833 http://www.gmt.com.tw 7 Global Mixed-mode Technology Inc. Pin Description PIN 1,11,13,20 2 3 4 5 6,15 7 8 9 10 12 14 16 17 18 19 G1431 NAME GND/HS GAIN0 GAIN1 LOUT+ LINPVDD RIN+ LOUTLIN+ BYPASS NC ROUTVDD RINROUT+ SHUTDOWN I/O I I O I I O I FUNCTION Ground connection for circuitry, directly connected to thermal pad. Bit 0 of gain control Bit 1 of gain control Left channel + output in BTL mode Negative left input for fully differential inputs. Power supply for output stages. Positive right input for fully differential inputs. AC ground for single-ended inputs. Left channel - output in BTL mode Positive left input for fully differential inputs. AC ground for single-ended inputs. Tap to voltage divider for internal mid-supply bias generator. NC O Right channel - output in BTL mode Analog VDD input supply. This terminal needs to be isolated from PVDD to achieve highest performance. Negative right input for fully differential inputs. Right channel + output in BTL mode Places entire IC in shutdown mode when held low I O I Ver: 1.3 Sep 23, 2005 TEL: 886-3-5788833 http://www.gmt.com.tw 8 Global Mixed-mode Technology Inc. Application Circuit G1431 1 GND GND 20 2 GAIN0 SHUTDOWN 19 TO SYSTEM CONTROL 3 GAIN1 ROUT+ 18 CRINC3 VDD 1µF CS1 4 CLINC1 1µF CRIN+ C4 1µF VDD LOUT+ RIN- 17 RIGHT LINE INPUT SIGNAL R CS2 10µF SPEAKER L LEFT LINE INPUT SIGNAL 5 LIN- VDD 16 6 PVDD PVDD 15 1µF SPEAKER 7 RIN+ ROUT- 14 8 LOUT- GND 13 CLIN+ C2 1µF 9 Cb C5 1µF LIN+ NC 12 10 BYPASS GND 11 Typical Typical G1431 Application Circuit Using Single-Ended Inputs Ver: 1.3 Sep 23, 2005 TEL: 886-3-5788833 http://www.gmt.com.tw 9 Global Mixed-mode Technology Inc. Application Circuit (continued) G1431 1 GND GND 20 2 GAIN0 SHUTDOWN 19 TO SYSTEM CONTROL 3 GAIN1 ROUT+ 18 CRINC3 VDD 1µF CS1 RIGHT NEGATIVE DIFFERENTIAL INPUT SIGNAL 4 LEFT NEGATIVE DIFFERENTIAL INPUT SIGNAL CLINC1 1µF CRIN+ C4 1µF VDD LOUT+ RIN- 17 5 LIN- VDD 16 R L CS2 SPEAKER 10µF 6 PVDD PVDD 15 1µF SPEAKER RIGHT POSITIVE DIFFERENTIAL INPUT SIGNAL 7 RIN+ ROUT- 14 8 LOUT- GND 13 LEFT POSITIVE DIFFERENTIAL INPUT SIGNAL CLIN+ C2 1µF 9 Cb C5 1µF LIN+ NC 12 10 BYPASS GND 11 Typical Typical G1431 Application Circuit Using Differential Inputs Ver: 1.3 Sep 23, 2005 TEL: 886-3-5788833 http://www.gmt.com.tw 10 Global Mixed-mode Technology Inc. Application Information Gain setting via GAIN0 and GAIN1 inputs The internal gain setting is determined by two input terminals, GAIN0 and GAIN1. The gains listed in Table 1 are realized by changing the taps on the input resistors inside the amplifier. This will cause the internal input impedance, ZI, to be dependent on the gain setting. Although the real input impedance will shift by 30% due to process variation from part-to-part, the actual gain settings are controlled by the ratios of the resistors and the actual gain distribution from part-topart is quite good. Table 1 GAIN0 0 0 1 1 G1431 AV (dB) 21.6 15.6 10 6 30 45 70 90 Table 2 Zi (kΩ) GAIN1 0 1 0 1 AV (dB) 6 10 15.6 21.6 Input Capacitor In the typical application, an input capacitor Ci is required to allow the amplifier to bias the input signal to the proper dc level for optimum operation. In this case, Ci and the input impedance of the amplifier, Zi, form a high-pass filter with the –3dB determined by the equation: f-3dB= 1/ 2πRI Ci The value of Ci is important to consider as it directly affects the bass performance of the application circuit. For example, if the input resistor is 15kΩ, the input capacitor is 1µF, the flat bass response will be down to 10.6Hz. Because the small leakage current of the input capacitors will cause the dc offset voltage at the input to the amplifier that reduces the operation headroom, especially at the high gain applications. The lowleakage tantalum or ceramic capacitors are suggested to be used as the input coupling capacitors. When using the polarized capacitors, it is important to let the positive side connecting to the higher dc level of the application. Power Supply Decoupling The G1431 is a high-performance CMOS audio amplifier that requires adequate power supply decoupling to make sure the output total harmonic distortion (THD) as low as possible. The optimum decoupling is using two capacitors with different types that target different types of noise on the power supply leads. For high frequency transients, spikes, a good low ESR ceramic capacitor works best, typically 0.1µF/1µF used and placed as close as possible to the G1431 VDD lead. A larger aluminum electrolytic capacitor of 10µF or greater placed near the device power is recommended for filtering low-frequency noise. Optimizing DEPOP Operation Circuitry has been implemented in G1431 to minimize the amount of popping heard at power-up and when coming out of shutdown mode. Popping occurs whenever a voltage step is applied to the speaker and making the differential voltage generated at the two ends of the speaker. To avoid the popping heard, the bypass capacitor should be chosen promptly, 1/(CBx170kΩ) ≦ 1/(CI*(RI+RF)). Where 170kΩ is the output impedance of the mid-rail generator, CB is the mid-rail bypass capacitor, CI is the input coupling capacitor, RI is the input impedance, RF is the gain setTEL: 886-3-5788833 http://www.gmt.com.tw Input Resistance The typical input impedance at each gain setting is given in the Table 2. Each gain setting is achieved by varying the input resistance of the amplifier, which can be over 6 times from its minimum value to the maximum value. As a result, if a single capacitor is used in the input high pass filter, the –3dB or cut-off frequency will be also change over 3.5 times. To reduce the variation of the cut-off frequency, an additional resistor can be connected from the input pin of the amplifier to the ground, as shown in the figure below. With the extra resistor, the cut-off frequency can be re-calculated using equation : f-3dB= 1/ 2πC(R||RI). Using small external R can reduce the variation of the cut-off frequency. But the side effect is small external R will also let (R||RI) become small, the cut-off frequency will be larger and degraded the bass-band performance. The other side effect is with extra power dissipation through the external resistor R to the ground. So using the external resistor R to flatting the variation of the cut-off frequency, the user must also consider the bass-band performance and the extra power dissipation to choose the accepted external resistor R value. C Input Signal IN R Zi Zf Ver: 1.3 Sep 23, 2005 11 Global Mixed-mode Technology Inc. ting impedance which is on the feedback path. CB is the most important capacitor. Besides it is used to reduce the popping, CB can also determine the rate at which the amplifier starts up during startup or recovery from shutdown mode. De-popping circuitry of G1431 is shown as below Figure 1. The PNP transistor limits the voltage drop across the 120kΩ by slewing the internal node slowly when power is applied. At start-up, the voltage at BYPASS capacitor is 0. The PNP is ON to pull the mid-point of the bias circuit down. So the capacitor sees a lower effective voltage, and thus the charging is slower. This appears as a linear ramp (while the PNP transistor is conducting), followed by the expected exponential ramp of an R-C circuit. For better performance, CB is recommended to be at least 1.5 times of input coupling capacitor CI. For example, if using 1µF input coupling capacitor, 2.2µF ceramic or tantalum low-ESR capacitors are recommended to achieve the better THD performance. VDD 100 kΩ 120 kΩ Bypass B ypass 100 kΩ G1431 voltage VO(PP) on the load will be two times than a ground reference configuration. The voltage on the load is doubled, this will also yield 4 times output power on the load at the same power supply rail and loading. Another benefit of using differential driving configuration is that BTL operation cancels the dc offsets, which eliminates the dc coupling capacitor that is needed to cancelled dc offsets in the ground reference configuration. Low-frequency performance is then limited only by the input network and speaker responses. Cost and PCB space can be minimized by eliminating the dc coupling capacitors. VDD Vo(PP) RL 2xVo(PP) -Vo(PP) VDD Figure 2 Figure 1 Bridged-Tied Load Mode Operation G1431 has two linear amplifiers to drive both ends of the speaker load in Bridged-Tied Load (BTL) mode operation. Figure 2 shows the BTL configuration. The differential driving to the speaker load means that when one side is slewing up, the other side is slewing down, and vice versa. This configuration in effect will double the voltage swing on the load as compared to a ground reference load. In BTL mode, the peak-to-peak Shutdown mode When the normal operation, the SHUTDOWN pin should be held high. Pulling SHUTDOWN low will mute the outputs and deactivate the most of the circuits. At this moment, the current of this device will be reduced to about 160µA to save the battery energy. The SHUTDOWN pin should never be left unconnected during the normal applications. INPUT * SHUTDOWN Low AMPLIFIER STATE OUTPUT Mute High BTL * Inputs should never be left unconnected X= do not care Ver: 1.3 Sep 23, 2005 TEL: 886-3-5788833 http://www.gmt.com.tw 12 Global Mixed-mode Technology Inc. Package Information D C L D1 G1431 E2 E1 E H 0.127 TYP θ A2 A1 e b A 0.05 TSSOP-20 (FD) Package Note: 1. JEDCE outline: MP-153 AC/MO-153 ACT (thermally enhanced variations only) 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 per side. 3. Dimension “E1” does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25 per side. 4. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total in excess of the “b” dimension at maximum material conditions. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07mm. 5. Dimensions “D” and “E1” to be determined at datum plane “H”. SYMBOLS A A1 A2 b C D D1 E E1 E2 e L θ MIN ----0.00 0.80 0.19 0.20 6.40 3.90 4.30 2.70 0.45 0º DIMENSION IN MM NOM --------1.00 --------6.50 ----6.40 BSC 4.40 ----0.65 BSC 0.60 ----- MAX 1.20 0.15 1.05 0.30 ----6.60 4.40 4.50 3.20 0.75 8º MIN ----0.000 0.031 0.007 0.008 0.252 0.154 0.169 0.106 0.018 0º DIMENSION IN INCH NOM --------0.039 --------0.256 ----0.252 BSC 0.173 ----0.026 BSC 0.024 ----- MAX 0.047 0.006 0.041 0.012 ----0.260 0.173 0.177 0.126 0.030 8º Taping Specification PACKAGE TSSOP-20 (FD) Q’TY/ REEL 2,500 ea F e e d D ir e c tio n T y p ic a l T S S O P P a c k a g e O r ie n ta tio n GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications. Ver: 1.3 Sep 23, 2005 TEL: 886-3-5788833 http://www.gmt.com.tw 13