G2056RC1U

G2056/G2056A Global Mixed-mode Technology Low-Voltage H-Bridge Driver Features „ „ „ „ „ „ „ General Description H-Bridge Motor Driver – Drives a DC Motor or Other Loads – Low MOSFET On-Resistance: HS + LS 280mΩ 1.8-A Maximum Drive Current Separate Motor and Logic Supply Pins: – Motor VM: 0 to 11 V – Logic VCC: 1.8 to 7 V PWM or PH-EN Interface – G2056: PWM, IN1 and IN2 – G2056A: PH and EN Low-Power Sleep Mode With 120-nA Maximum Sleep Current – nSLEEP pin Small Package and Footprint – 8-Pin WSON With Thermal Pad – 2.0 × 2.0 mm Protection Features – VCC Undervoltage Lockout (UVLO) – Overcurrent Protection (OCP) –Thermal Shutdown (TSD) The G2056x family of devices provides an integrated motor driver solution for cameras, consumer products, toys, and other low-voltage or battery-powered motion control applications. The device can drive one dc motor or other devices like solenoids. The output driver block consists of N- channel power MOSFETs configured as an H-bridge to drive the motor winding. An internal charge pump generates needed gate drive voltages. The G2056x family of devices can supply up to 1.8A of output current. It operates on a motor power supply voltage from 0 to 11V, and a device power supply voltage of 1.8V to 7V. The G2056 device has a PWM (IN1-IN2) input interface; the G2056A device has a PH-EN input interface;. Both interfaces are compatible with in dustry-standard devices. Internal shutdown functions are provided for overcurrent protection, short-circuit protection, undervoltage lockout, and overtemperature. Applications „ „ „ „ „ „ Cameras DSLR Lenses Consumer Porducts Toys Robotics Medical Devices Ordering Information ORDER NUMBER MARKING TEMP. RANGE PACKAGE (Green) G2056F11U G2056RC1U G2056ARC1U G2056 2056 206A -40°C to +85°C -40°C to +85°C -40°C to +85°C SOP-8 (FD) TDFN2X2-8 TDFN2X2-8 Note: F1: SOP-8 (FD) RC: TDFN2X2-8 1: Bonding Code U : Tape & Reel Green: Lead Free / Halogen Free Ver: 0.2 Mar 14, 2019 1 G2056/G2056A Global Mixed-mode Technology Pin Configuration G2056 G2056 1 8 OUT1 IN1 2 7 GND VCC IN2 3 VM 4 Thermal Pad SOP-8 (FD) 6 GND 5 OUT2 VM 8 VCC 1 OUT1 2 OUT2 3 GND 4 G2056A Thermal Pad Pad TDFN2X2-8 VM 8 VCC 1 7 nSLEEP OUT1 2 6 IN1 OUT2 3 5 IN2 GND 4 Thermal Pad Pad TDFN2X2-8 Note: Recommend connecting the Thermal Pad to the Ground for excellent power dissipation. Simplified Diagram Ver: 0.2 Mar 14, 2019 2 7 nSLEEP 6 PH 5 EN G2056/G2056A Global Mixed-mode Technology Absolute Maximum Ratings Operating Junction Temperature TJ. . . -40°C to 180°C Storage Temperature Tstg . . . . . . . . . . -65°C to 150°C ESD (HBM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±3KV ESD (CDM) . . . . . . . . . . . . . . . . . . . . . . . . . . . ±1500V Motor power-supply voltage (VM) . . . . . . .-0.3V to 12V Logic power-supply voltage (VCC) . . . . . . .-0.3V to 7V Control pin voltage (IN1,IN2,PH,EN,nSLEEP) . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to 7V Peak drive current (OUT1, OUT2) VBUS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Internally limited Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to 150°C Storage temperature, Tstg. . . . . . . . . -60°C to 150°C Thermal Resistance of Junction to Ambient, (θJA) SOP-8 (FD) . . . . . . . . . . . . . .. . . . . . . . . .135.56°C/W TDFN2X2-8. . . . . . . . . . . . . .. . . . . . . . . .228.50°C/W Continuous Power Dissipation(TA = +25°C) SOP-8 (FD). . . . . . . . . . . . . . .. . . . . . . . . .0.995W TDFN2X2-8. . . . . . . . . . . . . .. . . . . . . . . .0.591W Thermal Resistance of Junction to Case, (θJC) SOP-8 (FD) . . . . . . . . . . . . . .. . . . . . . . . .26.1°C/W TDFN2X2-8. . . . . . . . . . . . . .. . . . . . . . . .43.5°C/W Recommended Operating Conditions Motor power-supply voltage (VM) . . . . . . .0V to 11V Logic power-supply voltage (VCC) . . . . . . .1.8V to 7V Motor peak current (IOUT) . . . . . . . . . . . . . . . . 0 to 1.8A Externally applied PWM frequency (fPWM). .0 to 250kHz Logic level input voltage (VLOGIC) . . . . . . . . . 0V to 5.5V Operating ambient temperature (TA) . . .-40°C to 85°C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and do not imply functional operation of the deivce at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliablility. Electrical Characteristics TA=25°C The device is not guaranteed to function outside its operating conditions. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNIT 0 --- 11 V POWER SUPPLIES (VM, VCC) VM operating voltage VM VM operating supply current IVM IVMQ VM = 5V; VCC = 3V; No PWM --- 40 100 µA VM = 5V; VCC = 3V; 50kHz PWM VM = 5V; VCC = 3V; nSLEEP = 0 ----1.8 --- 0.8 30 --300 1.5 95 7 500 mA nA V µA ----- 0.7 5 1.5 25 mA nA --- V VM sleep mode supply current VCC operating voltage VCC VCC operating supply current IVCC Input logic-low voltage falling threshold VIL 0.25 × VCC 0.38 × VCC Input logic-high voltage rising threshold VIH --- 0.46 × VCC VM = 5V; VCC = 3V; No PWM VM = 5V; VCC = 3V; 50kHz PWM VCC sleep mode supply current IVCCQ VM = 5V; VCC = 3V; nSLEEP = 0 CONTROL INPUTS (IN1 or PH, IN2 or EN, nSLEEP) Input logic hysteresis VHYS Input logic low current IIL Input logic high current IIH Pulldown resistance VIN = 0V VIN = 3.3V VIN = 3.3V, G2056A nSLEEP pin RPD Ver: 0.2 Mar 14, 2019 3 0.08 × VCC -5 --- ----- 0.5 × VCC 0.25× VCC 5 50 ----- 60 100 ----- V V µA µA µA kΩ G2056/G2056A Global Mixed-mode Technology Electrical Characteristics (Continued) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNIT --- 280 360 mΩ -200 --- 200 nA ----1.9 --- ------1 1.7 1.8 3.5 --- V A µs --160 1 170 --180 ms °C MOTOR DRIVER OUTPUTS (OUT1, OUT2) HS + LS FET on-resistance rDS(on) Off-state leakage current PROTECTION CIRCUITS IOFF VCC undervoltage lockout VUVLO Overcurrent protection trip level Overcurrent deglitch time IOCP tDEG Overcurrent retry time Thermal shutdown temperature tRETRY TTSD VM = 5V; VCC = 3V; IO = 800mA; TJ = 25°C VOUT = 0V VCC falling VCC rising Die temperature TJ Minimum Footprint PCB Layout Section SOP-8 (FD) TDFN2X2-8 Ver: 0.2 Mar 14, 2019 4 G2056/G2056A Global Mixed-mode Technology Timing Requirements TA = 25°C, VM = 5V, VCC = 3V, RL = 20Ω NO. 1 2 t1 t2 Delay time, PHASE high to OUT1 low Delay time, PHASE high to OUT2 high 3 4 5 6 t3 t4 t5 t6 Delay time, PHASE low to OUT1 high Delay time, PHASE low to OUT2 low Delay time, ENBL high to OUTx high Delay time, ENBL low to OUTx low 7 8 9 10 11 12 t7 t8 t9 t10 t11 t12 Output enable time Output disable time Delay time, INx high to OUTx high Delay time, INx low to OUTx low See Figure 2. Output rise time Output fall time Wake time, nSLEEP rising edge to part active twake See Figure 1. Figure 1. Input and Output Timing for G2056A Figure 2. Input and Output Timing for G2056 Ver: 0.2 Mar 14, 2019 5 MIN MAX UNIT ----- 160 200 ns ns --------- 200 160 200 160 ns ns ns ns --------30 30 --- 350 350 600 600 188 188 30 ns ns ns ns ns ns μs G2056/G2056A Global Mixed-mode Technology Pin Description PIN NAME I/O 8 VCC I 2 6 IN1/PH I 3 5 IN2/EN I 4 1 VM I 5 3 OUT2 O 6,7 4 GND - 8 2 OUT1 O - 7 nSLEEP I SOP-8 (FD) TDFN2X2-8 1 FUNCTION Logic power supply Bypass this pin to the GND pin with a 0.1µF ceramic capacitor rated for VCC IN1 /PH input See the Detailed Description section for more information. IN2 /EN input See the Detailed Description section for more information. Motor power supply Bypass this pin to the GND pin with a 0.1µF ceramic capacitor rated for VM. Motor output Connect these pins to the motor winding. Device ground This pin must be connected to ground. Motor output Connect these pins to the motor winding. Sleep mode input When this pin is in logic low, the device enters low-power sleep mode. The device operates normally when this pin is logic high. Internal pulldown Ver: 0.2 Mar 14, 2019 6 G2056/G2056A Global Mixed-mode Technology Detailed Description Overview The G2056x family of devices is an H-bridge driver that can drive one dc motor or other devices like solenoids. The outputs are controlled using either a PWM interface (IN1 and in2) on the G2056 device or a PH-EN interface on the G2056A device. A low-power sleep mode is included, which can be enabled using the nSLEEP pin. These devices greatly reduce the component count of motor driver systems by integrating the necessary driver FETs and FEET control circuitry into a single device. In addition, the G2056x family of devices adds protection features beyond traditional discrete implementations: undervoltage lockout, overcurrent protection, and thermal shutdown. Functional Block Diagram Figure 8. G2056 Functional Block Diagram Ver: 0.2 Mar 14, 2019 7 G2056/G2056A Global Mixed-mode Technology Functional Block Diagram (Continued) Figure 9. G2056A Functional Block Diagram Ver: 0.2 Mar 14, 2019 8 G2056/G2056A Global Mixed-mode Technology Feature Bridge Control The G2056 device is controlled using a PWM input interface, also called an IN-IN interface. Each output is controlled by a corresponding input pin. Table 1 shows the logic for the G2056 device. Table 1. G2056 Device Logic nSLEEP IN1 IN2 OUT1 OUT2 FUNCTION (DC MOTOR) 0 X X Z Z Coast 1 0 0 Z Z Coast 1 0 1 L H Reverse 1 1 0 H L Forward 1 1 1 L L Brake The G2056A device is controlled using a PHASE/ENABLE interface. This interface uses one pin to control the H-bridge current direction, and one pin to enable or disable the H-bridge. Table 2 shows the logic for the G2056A Table 1. G2056A Device Logic nSLEEP PH EN OUT1 OUT2 FUNCTION (DC MOTOR) 0 X X Z Z Coast 1 X 0 L L Brake 1 1 1 L H Reverse 1 0 1 H L Forward Sleep Mode If the nSLEEP pin is brought to a logic-low state, the G2056x family of devices enters a low-power sleep mode. In this state, all unnecessary internal circuitry is powered down. Power Supplies and Input Pins The input pins can be driven within the recommended operating conditions with or without the VCC, VM, or both power supplies present. No leakage current path will exist to the supply. Each input pin has a weak pulldown resistor (approximately 100kΩ ) to ground. The VCC and VM supplies can be applied and removed in any order. When the VCC supply is removed, the device enters a low-power state and draws very little current from the VM supply. The VCC and VM pins can be connected together if the supply voltage is between 1.8 and 7V The VM voltage supply does not have any undervoltage-lockout protection (UVLO) so as long as VCC > 1.8V; the internal device logic remains active, which means that the VM pin voltage can drop to 0V. However, the load cannot be sufficiently driven at low VM voltages. Protection Circuits The G2056 family of devices is fully protected against VCC undervoltage, overcurrent, and overtemperature events. VCC Undervoltage Lockout If at any time the voltage on the VCC pin falls below the undervoltage lockout threshold voltage, all FETs in the H-bridge are disabled. Operation resumes when the VCC pin voltage rises above the UVLO threshold. Ver: 0.2 Mar 14, 2019 9 G2056/G2056A Global Mixed-mode Technology Overcurrent Protection (OCP) An analog current-lomit circuit on each FET limits the current through the FET by removing the gater drive. If this analog current limit persists for longer than tDEG, all FETs in the H-bridge are disabled. Operation resumes automatically after tRETRY has elapsed. Overcurrent conditions are detected on both the high-side and low-side FETs. A short to the VM pin, GND, or from the OUT1 pin to the OUT2 pin results in an overcurrent condition. Thermal Shutdown (TSD) If the die temperature exceeds safe limits, all FETs in the H-bridge are disabled. After the die temperature falls to a safe level , operation automatically resumes. Table 3. Fault Behavior FAULT CONDITION H-BRIDGE RECOVERY VCC undervoltage (UVLO) VCC < 1.7V Disabled VCC > 1.8V Overcurrent (OCP) IOUT > 1.9A (MIN) Disabled tRETRY elapses Thermal Shutdown (TSD) TJ > 160°C (MIN) Disabled TJ < 160°C 7.4 Device Functional Modes The G2056 family of devices is active unless the nSLEEP pin is brought logic low. In sleep mode, the H-bridge FETs are disabled Hi-Z. The G2056 is brought out of sleep mode automatically if nSLEEP is brought logic high. The H-bridge outputs are disabled during undervoltage lockout, overcurrent, and overtemperature fault conditions. Table 4. Operation Modes MODE CONDITION H-BRIDGE Operating nSLEEP pin = 1 Operating Sleep mode nSLEEP pin = 0 Disabled Fault encountered Any fault condition met Disabled Ver: 0.2 Mar 14, 2019 10 G2056/G2056A Global Mixed-mode Technology Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. Application Information The G2056 family of devices is device is used to drive one dc motor or other devices like solenoids. The following design procedure can be used to configure the G2056 family of devices. Typical Application Figure 10. Schematic of G2056 Application Design Requirements Table 5 lists the required parameters for a typical usage case. Table 5. System Design Requirements REFERENCE EXAMPLE VALUE Motor supply voltage VM 9V Logic supply voltage VCC 3.3 V Target rms current IOUT 0.8 A DESIGN PARAMETER Detailed Design Procedure Motor Voltage The appropriate motor voltage depends on the ratings of the motor selected and the desired RPM. A higher voltage spins a brushed dc motor faster with the same PWM duty cycle applied to the power FETs. A higher voltage also increases the rate of current change through the inductive motor windings. Low-Power Operation When entering sleep mode, TI recommends setting all inputs as a logic low to minimize system power. Ver: 0.2 Mar 14, 2019 11 G2056/G2056A Global Mixed-mode Technology Power Supply Recommendations 9.1 Bulk Capacitance Having appropriate local bulk capacitance is an important factor in motor-drive system design. It is generally beneficial to have more bulk capacitance, while the disadvantages are increased cost and physical size. The amount of local capacitance needed depends on a variety of factors, including: The highest current required by the motor system The power-supply capacitance and ability to source current The amount of parasitic inductance between the power supply and motor system The acceptable voltage ripple The type of motor used (brushed dc, brushless dc, stepper) The motor braking method The inductance between the power supply and motor drive system limits the rate at which current can change from the power supply. If the local bulk capacitance is too small, the system responds to excessive current demands or dumps from the motor with a change in voltage. When adequate bulk capacitance is used, the motor voltage remains stable and high current can be quickly supplied. The data sheet generally provides a recommended value, but system-level testing is required to determine the appropriate size of bulk capacitor. Figure 15. Example Setup of Motor Drive System With External Power Supply The voltage rating for bulk capacitors should be higher than the operating voltage, to provide margin for cases when the motor transfers energy to the supply Ver: 0.2 Mar 14, 2019 12 G2056/G2056A Global Mixed-mode Technology Layout Guidelines The VM and VCC pins should be bypassed to GND using low-ESR ceramic bypass capacitors with a recommended value of 0.1µF rated for VM and VCC. These capacitors should be placed as close to the VM and VCC pins as possible with a thick trace or ground plane connection to the device GND pin. Layout Example Figure 16. Simplified Layout Example Power Dissipation Power dissipation in the G2056 family of devices is dominated by the power dissipated in the output FET resistance, or rDS(on). Use Equation 1 to estimate the average power dissipation when running a stepper motor. ٛ ٛ ٛ where PTOT is the total power dissipation rDS(on) is the resistance of the HS plus LS FETs IOUT(RMS) is the rms or dc output current being supplied to the load (1) The maximum amount of power that can be dissipated in the device is dependent on ambient temperature and heatsinking. NOTE The value of rDS(on) increases with temperature, so as the device heats, the power dissipation increases. The G2056 family of devices has thermal shutdown protection. If the die temperature exceeds approximately 150°C, the device is disabled until the temperature drops to a safe level. Any tendency of the device to enter thermal shutdown is an indication of either excessive power dissipation, insufficient heatsinking, or too high an ambient temperature. Ver: 0.2 Mar 14, 2019 13 G2056/G2056A Global Mixed-mode Technology Package Information SOP-8 (FD) Package Taping Specification Ver: 0.2 Mar 14, 2019 14 PACKAGE Q’TY/REEL SOP-8 (FD) 2,500 ea G2056/G2056A Global Mixed-mode Technology TDFN2X2-8 Package Taping Specification PACKAGE Q’TY/REEL TDFN2X2-8 3,000 ea GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications. Ver: 0.2 Mar 14, 2019 15