HMN28D

HANBit HMN28D Non-Volatile SRAM MODULE 16Kbit (2K x 8-Bit), 24pin DIP, 5V Part No. HMN28D GENERAL DESCRIPTION The HMN28D are 16,384-bit, fully static, nonvolatile SRAM’s organized as 2,048 bytes by 8 bits. Each NVSRAM has a self-contained lithium energy source and control circuitry, which constantly monitors Vcc for an out-of-tolerance condition. When such a condition occurs, the lithium energy source is automatically switched on and writes protection is unconditionally enabled to prevent data corruption. The HMN28D devices can be used in place of existing 2K x 8 SRAM’s directly conforming to the popular byte wide 24-pin DIP standard. There is no limit on the number of write cycles that can be executed and no additional support circuitry is required for microprocessor interfacing. The HMN28D uses extremely low standby current CMOS SRAM’s, coupled with small lithium coin cells to provide nonvolatility without long write-cycle times and the write-cycle limitations associated with EEPROM. FEATURES w Access time : 70, 85, 120 and 150ns w High-density design : 2KByte Design w Battery internally isolated until power is applied w JEDEC standard 24-pin DIP Package w Low-power CMOS w Unlimited writes cycles w Data retention in the absence of VCC w 10-years minimum data retention in absence of power w Automatic write-protection during power-up/power-down cycles w Data is automatically protected during power loss w Conventional SRAM operation; unlimited write cycles PIN ASSIGNMENT A7 A6 A5 A4 A3 A2 A1 A0 DQ0 DQ1 DQ2 Vss 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 Vcc A8 A9 /WE /OE A10 /CE DQ7 DQ6 DQ5 DQ4 DQ3 24-pin Encapsulated package OPTIONS w Timing 70 ns 85 ns 120 ns 150 ns MARKING -70 -85 -120 -150 URL : www.hbe.co.kr Rev. 0.0 (April, 2002) 1 HANBit Electronics Co.,Ltd HANBit FUNCTIONAL DESCRIPTION HMN28D The HMN28D executes a read cycle whenever /WE is inactive(high) and /CE is active(low). The address specified by the address inputs(A0-A10) defines which of the 2,048 bytes of data is accessed. Valid data will be available to the eight data output drivers within tACC (access time) after the last address input signal is stable. When power is valid, the HMN28D operates as a standard CMOS SRAM. During power-down and power-up cycles, the HMN28D acts as a nonvolatile memory, automatically protecting and preserving the memory contents. The HMN28D is in the write mode whenever the /WE and /CE signals are in the active (low) state after address inputs are stable. The later occurring falling edge of /CE or /WE will determine the start of the write cycle. The write cycle is terminated by the earlier rising edge of /CE or /WE. All address inputs must be kept valid throughout the write cycle. /WE must return to the high state for a minimum recovery time (tWR) before another cycle can be initiated. The /OE control signal should be kept inactive (high) during write cycles to avoid bus contention. However, if the output bus been enabled (/CE and /OE active) then /WE will disable the outputs in tODW from its falling edge. The HMN28D provides full functional capability for VCC greater than 4.5 V and write protects by 4.37 V nominal. Powerdown/power-up control circuitry constantly monitors the VCC supply for a power-fail-detect threshold VPFD . When VCC falls below the VPFD threshold, the SRAM automatically write-protects the data. All inputs to the RAM become “ don’t care” and all outputs are high impedance. As VCC falls below approximately 3 V, the power switching circuit connects the lithium energy soure to RAM to retain data. During power-up, when VCC rises above approximately 3.0 volts, the power switching circuit connects external VCC to the RAM and disconnects the lithium energy source. Normal RAM operation can resume after VCC exceeds 4.5 volts. BLOCK DIAGRAM A0-A10 DQ0-DQ7 PIN DESCRIPTION A0-A10 : Address Input /CE : Chip Enable VSS : Ground /OE /WE 2K x 8 SRAM Block Power /CE CON VCC DQ0-DQ7 : Data In / Data Out /WE : Write Enable /CE Power – Fail Control Lithium Cell /OE : Output Enable VCC: Power (+5V) NC : No Connection URL : www.hbe.co.kr Rev. 0.0 (April, 2002) 2 HANBit Electronics Co.,Ltd HANBit TRUTH TABLE MODE Not selected Output disable Read Write /OE X H L X /CE H L L L /WE X H H L I/O OPERATION High Z High Z DOUT DIN HMN28D POWER Standby Active Active Active ABSOLUTE MAXIMUM RATINGS PARAMETER DC voltage applied on VCC relative to VSS DC Voltage applied on any pin excluding VCC relative to VSS Operating temperature Storage temperature Temperature under bias Soldering temperature SYMBOL VCC VT TOPR TSTG TBIAS TSOLDER RATING -0.3V to 7.0V -0.3V to 7.0V 0 to 70°C -40°C to 70°C -10°C to 70°C 260°C For 10 second VT≤ VCC+0.3 CONDITIONS NOTE: Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation should be restricted to the Recommended DC Operating Conditions detailed in this data sheet. Exposure to higher than recommended voltage for extended periods of time could affect device reliability. RECOMMENDED DC OPERATING CONDITIONS ( TA= TOPR ) PARAMETER Supply Voltage Ground Input high voltage Input low voltage SYMBOL VCC VSS VIH VIL MIN 4.5V 0 2.2 -0.3 TYPICAL 5.0V 0 MAX 5.5V 0 VCC+0.3V 0.8V NOTE: Typical values indicate operation at TA = 25℃ URL : www.hbe.co.kr Rev. 0.0 (April, 2002) 3 HANBit Electronics Co.,Ltd HANBit DC ELECTRICAL CHARACTERISTICS (TA= TOPR, VCCmin £ VCC≤ VCCmax ) PARAMETER Input Leakage Current Output Leakage Current Output high voltage Output low voltage Standby supply current Standby supply current CONDITIONS VIN=VSS to VCC /CE=VIH or /OE=VIH Or /WE=VIL IOH=-1.0mA IOL= 2.1mA /CE=VIH /CE≥ VCC-0.2V, 0V≤ VIN≤ 0.2V, or VIN≥ VCC-0.2V Operating supply current Power-fail-detect voltage Supply switch-over voltage Min.cycle,duty=100%, /CE=VIL, II/O=0㎃ ICC VPFD VSO 4.30 65 4.37 3 ISB1 2.5 SYMBOL ILI ILO VOH VOL ISB MIN 2.4 TYP. 4 HMN28D MAX ±1 ±1 0.4 2 100 UNIT mA mA V V ㎃ mA 15 4.50 - ㎃ V V CAPACITANCE (TA=25℃ , f=1MHz, VCC=5.0V) DESCRIPTION Input Capacitance Input/Output Capacitance CONDITIONS Input voltage = 0V Output voltage = 0V SYMBOL CIN CI/O MAX 10 10 MIN UNIT pF pF CHARACTERISTICS (Test Conditions) PARAMETER Input pulse levels Input rise and fall times Input and output timing reference levels Output load (including scope and jig) VALUE 0 to 3V 5 ns 1.5V (unless otherwise specified) See Figures 1and 2 +5V DOUT 1KΩ Figure 1. Output Load A 1.9KΩ DOUT 100㎊ 1KΩ Figure 2. Output Load B +5V 1.9KΩ 5㎊ URL : www.hbe.co.kr Rev. 0.0 (April, 2002) 4 HANBit Electronics Co.,Ltd HANBit READ CYCLE (TA= TOPR, VCCmin £ VCC≤ VCCmax ) PARAMETER Read Cycle Time Address Access Time Chip enable access time Output enable to Output valid Chip enable to output in low Z Output enable to output in low Z Chip disable to output in high Z Output disable to output high Z Output hold from address change SYMBOL tRC tACC tACE tOE tCLZ tOLZ tCHZ tOHZ tOH Output load A Output load A Output load A Output load B Output load B Output load B Output load B Output load A CONDITIONS MIN 70 5 5 0 0 10 -70 MAX 70 70 35 25 25 MIN 85 5 0 0 0 10 -85 MAX 85 85 45 35 25 -120 MIN 120 5 0 0 0 10 MAX 120 120 60 45 35 - HMN28D -150 MIN 150 10 5 0 0 10 MAX 150 150 70 60 50 - UNIT ns ns ns ns ns ns ns ns ns WRITE CYCLE (TA= TOPR, Vccmin £ Vcc ≤ Vccmax ) PARAMETER Write Cycle Time Chip enable to end of write Address setup time Address valid to end of write Write pulse width Write recovery time (write cycle 1) Write recovery time (write cycle 2) Data valid to end of write Data hold time (write cycle 1) Data hold time (write cycle 2) Write enabled to output in high Z Output active from end of write SYMBOL tWC tCW tAS tAW tWP tWR1 tWR2 tDW tDH1 tDH2 tWZ tOW Note 4 Note 4 Note 5 Note 5 Note 1 Note 2 Note 1 Note 1 Note 3 Note 3 CONDITIONS MIN 70 65 0 65 55 5 15 30 0 10 0 5 -70 MAX 25 MIN 85 75 0 75 65 5 15 35 0 10 0 0 -85 MAX 30 -120 MIN 120 100 0 100 85 5 15 45 0 10 0 0 MAX 40 -150 Min 150 100 0 90 90 5 15 50 0 0 0 5 Max 50 UNI T ns ns ns ns ns ns ns ns ns ns ns ns NOTE: 1. A write ends at the earlier transition of /CE going high and /WE going high. 2. A write occurs during the overlap of allow /CE and a low /WE. A write begins at the later transition of /CE going low and /WE going low. 3. Either tWR1 or tWR2 must be met. 4. Either tDH1 or tDH2 must be met. 5. If /CE goes low simultaneously with /WE going low or after /WE going low, the outputs remain in highimpedance state. URL : www.hbe.co.kr Rev. 0.0 (April, 2002) 5 HANBit Electronics Co.,Ltd HANBit POWER-DOWN/POWER-UP CYCLE (TA= TOPR, VCC=5V) PARAMETER VCC slew, 4.75 to 4.25V VCC slew, 4.75 to VSO VCC slew, VSO to VPFD (max) Chip enable recovery time Data-retention time in Absence of VCC Data-retention time in Absence of VCC Write-protect time SYMBOL tPF tFS tPU Time during which SRAM tCER is write-protected after VCC passes VPFD on power-up. tDR tDR-N TA = 25℃ TA = 25℃ ; industrial temperature range (-N) only Delay after VCC slews down tWPT past VPFD before SRAM is Write-protected. 40 100 10 6 40 80 CONDITIONS MIN 300 10 0 TYP. - HMN28D MAX - UNIT ㎲ ㎲ ㎲ 120 ms - years years 150 ㎲ TIMING WAVEFORM - READ CYCLE NO.1 (Address Access)*1,2 tRC Address tACC tOH DOUT Previous Data Valid Data Valid - READ CYCLE NO.2 (/CE Access)*1,3,4 /CE tACE tCLZ DOUT High-Z tRC tCHZ High-Z URL : www.hbe.co.kr Rev. 0.0 (April, 2002) 6 HANBit Electronics Co.,Ltd HANBit - READ CYCLE NO.3 (/OE Access)*1,5 tRC Address tACC /OE tOE DOUT tOLZ High-Z tOHZ Data Valid HMN28D High-Z NOTES: 1. /WE is held high for a read cycle. 2. Device is continuously selected: /CE = /OE =VIL. 3. Address is valid prior to or coincident with /CE transition low. 4. /OE = VIL. 5. Device is continuously selected: /CE = VIL - WRITE CYCLE NO.1 (/WE-Controlled)*1,2,3 tWC Address tAW tCW /CE tAS /WE tDW DIN tWZ DOUT Data Undefined (1) Data-in Valid tOW High-Z tDH1 tWP tWR1 URL : www.hbe.co.kr Rev. 0.0 (April, 2002) 7 HANBit Electronics Co.,Ltd HANBit - WRITE CYCLE NO.2 (/CE-Controlled)*1,2,3,4,5 tWC Address tAS /CE tWP /WE tDW DIN tWZ DOUT Data Undefined (2) NOTE: 1. /CE or /WE must be high during address transition. 2. Because I/O may be active (/OE low) during this period, data input signals of opposite polarity to the outputs must not be applied. 3. If /OE is high, the I/O pins remain in a state of high impedance. 4. Either tWR1 or tWR2 must be met. 5. Either tDH1 or tDH2 must be met. HMN28D tAW tCW tWR2 tDH2 Data-in Valid High-Z - POWER-DOWN/POWER-UP TIMING tPF VCC 4.75 VPFD VPFD 4.25 VSO tFS tWPT /CE tDR VSO tPU tCER URL : www.hbe.co.kr Rev. 0.0 (April, 2002) 8 HANBit Electronics Co.,Ltd HANBit PACKAGE DIMENSIONS Dimension A B C D E F G H J K Min 1.320 0.695 0.390 0.100 0.017 0.120 0.090 0.590 0.008 0.015 Max 1.340 0.720 0.415 0.130 0.030 0.160 0.110 0.630 0.012 0.021 HMN28D F A D B C E J H B G K All dimensions are in inches. ORDERING INFORMATION H M N 2 8 D - 70 I Operating Temp. : Blank = Commercial (0 to 70 °C ) I = Industrial (-40 to 85°C) Speed options : 70 = 70 ns 100 = 100 ns 120 = 120 ns 150 = 150 ns 200 = 200 ns Device : 2K x 8 bit Dip type package Nonvolatile SRAM HANBit Memory Module URL : www.hbe.co.kr Rev. 0.0 (April, 2002) 9 HANBit Electronics Co.,Ltd