HMC441_09

HMC441 v06.0508 GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 6 - 18 GHz Typical Applications The HMC441 is ideal for: • Point-to-Point and Point-to-Multi-Point Radios Features Gain: 15.5 dB Saturated Power: +22 dBm @ 23% PAE Single Supply Voltage: +5V w/ Optional Gate Bias 50 Ohm Matched Input/Output Die Size: 0.94 x 0.94 x 0.1 mm 3 LINEAR & POWER AMPLIFIERS - CHIP • VSAT • LO Driver for HMC Mixers • Military EW & ECM Functional Diagram General Description The HMC441 is an efficient GaAs PHEMT MMIC Medium Power Amplifier which operates between 6 and 18 GHz*. The amplifier provides 15.5 dB of gain, +22 dBm of saturated power, and 23% PAE from a +5V supply voltage. An optional gate bias is provided to allow adjustment of gain, RF output power, and DC power dissipation. The HMC441 amplifier can easily be integrated into Multi-Chip-Modules (MCMs) due to its small size. The backside of the die is both RF and DC ground, simplifying the assembly process and reducing performance variation. All data is tested with the chip in a 50 Ohm test fixture connected via 0.025mm (1 mil) diameter wire bonds of minimal length 0.31mm (12 mils). Vgg1, Vgg2: Optional Gate Bias Electrical Specifi cations, TA = +25° C, Vdd1 = Vdd2 = 5V, Vgg1 = Vgg2 = Open Parameter Frequency Range Gain Gain Variation Over Temperature Input Return Loss Output Return Loss Output Power for 1 dB Compression (P1dB) Saturated Output Power (Psat) Output Third Order Intercept (IP3) Noise Figure Supply Current (Idd) 15.5 17 13 Min. Typ. 7.0 - 8.0 15.5 0.015 10 14 18.5 20 29 5.0 90 115 16 18 0.02 14 Max. Min. Typ. 8.0 - 12.5 16.5 0.015 13 17 19 21 31 4.5 90 115 17 19 0.02 13 Max. Min. Typ. 12.5 - 14.0 15.5 0.015 15 23 20 22 32 4.5 90 17 19 0.02 12 Max. Min. Typ. 14.0 - 15.5 14.5 0.015 14 18 20 22 32 4.5 90 115 0.02 Max. Units GHz dB dB/ °C dB dB dBm dBm dBm dB mA *Contact HMC for Electrical Spec Limits for 6-7 & 15.5 - 18 GHz. 3-8 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC441 v06.0508 GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 6 - 18 GHz Broadband Gain & Return Loss 20 15 10 RESPONSE (dB) 5 0 -5 -10 -15 -20 -25 -30 4 6 8 10 12 14 16 18 20 FREQUENCY (GHz) Gain vs. Temperature 20 16 S21 S11 S22 GAIN (dB) 12 +25 C +85 C -55 C 3 LINEAR & POWER AMPLIFIERS - CHIP 3-9 8 4 0 6 8 10 12 14 16 18 FREQUENCY (GHz) Input Return Loss vs. Temperature 0 Output Return Loss vs. Temperature 0 -5 -4 RETURN LOSS (dB) RETURN LOSS (dB) -10 -15 -20 -25 -30 -20 6 8 10 12 14 16 18 FREQUENCY (GHz) -35 6 8 10 12 14 16 18 FREQUENCY (GHz) +25 C +85 C -55 C +25 C +85 C -55 C -8 -12 -16 P1dB vs. Temperature 25 Psat vs. Temperature 25 23 P1dB (dBm) Psat (dBm) 23 21 21 +25 C +85 C -55 C 19 +25 C +85 C -55 C 19 17 17 15 6 8 10 12 14 16 18 FREQUENCY (GHz) 15 6 8 10 12 14 16 18 FREQUENCY (GHz) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC441 v06.0508 GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 6 - 18 GHz Power Compression @ 11 GHz 30 Pout (dBm), GAIN (dB), PAE (%) 25 20 15 10 5 0 -10 Pout (dBm) Gain (dB) PAE (%) Power Compression @ 15 GHz 30 Pout (dBm), GAIN (dB), PAE (%) 25 20 15 10 5 0 -10 Pout (dBm) Gain (dB) PAE (%) 3 LINEAR & POWER AMPLIFIERS - CHIP -6 -2 2 6 10 -6 -2 2 6 10 14 INPUT POWER (dBm) INPUT POWER (dBm) Output IP3 vs. Temperature 36 Noise Figure vs. Temperature 10 +25 C +85 C -55 C 32 NOISE FIGURE (dB) 16 18 8 IP3 (dBm) 28 +25 C +85 C -55 C 6 24 4 20 2 16 6 8 10 12 14 FREQUENCY (GHz) 0 6 8 10 12 14 16 18 FREQUENCY (GHz) Gain & Power vs. Supply Voltage @ 11 GHz 24 GAIN (dB), P1dB (dBm), Psat (dBm) 22 Reverse Isolation vs. Temperature 0 -10 ISOLATION (dB) -20 -30 -40 -50 -60 +25 C +85 C -55 C 20 18 16 14 12 10 2.7 Gain P1dB Psat 3 3.3 3.6 3.9 4.2 4.5 4.8 5.1 5.4 6 8 10 12 14 16 18 Vdd (V) FREQUENCY (GHz) 3 - 10 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC441 v06.0508 GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 6 - 18 GHz Gain, Power & Output IP3 vs. Gate Voltage @ 12 GHz GAIN (dB), P1dB (dBm), Psat (dBm), IP3 (dBm) 35 30 25 20 15 10 5 0 -1 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0 Idd 210 180 150 120 90 60 Gain P1dB Psat IP3 3 LINEAR & POWER AMPLIFIERS - CHIP 3 - 11 Idd (mA) 30 0 Vgg1, Vgg2 Gate Voltage (V) Absolute Maximum Ratings Drain Bias Voltage (Vdd1, Vdd2) Gate Bias Voltage (Vgg1,Vgg2) RF Input Power (RFIN)(Vdd = +5Vdc) Channel Temperature Continuous Pdiss (T= 85 °C) (derate 8.5 mW/°C above 85 °C) Thermal Resistance (channel to die bottom) Storage Temperature Operating Temperature +5.5 Vdc -8 to 0 Vdc +20 dBm 175 °C 0.76 W 118 °C/W -65 to +150 °C -55 to +85 °C Typical Supply Current vs. Vdd Vdd (V) +4.5 +5.0 +5.5 +2.7 +3.0 +3.3 Idd (mA) 88 90 92 80 82 83 Note: Amplifi er will operate over full voltage ranges shown above ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC441 v06.0508 GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 6 - 18 GHz Outline Drawing 3 LINEAR & POWER AMPLIFIERS - CHIP NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM] 2. DIE THICKNESS IS .004” 3. TYPICAL BOND IS .004” SQUARE 4. BACKSIDE METALLIZATION: GOLD 5. BOND PAD METALLIZATION: GOLD 6. BACKSIDE METAL IS GROUND. 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. Die Packaging Information [1] Standard GP-2 (Gel Pack) Alternate [2] [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. Pad Descriptions Pad Number 1 Function RFIN Description This pad is AC coupled and matched to 50 Ohms. Interface Schematic 2, 3 Vdd1, Vdd2 Power Supply Voltage for the amplifier. An external bypass capacitor of 100 pF is required. 4 RFOUT This pad is AC coupled and matched to 50 Ohms. 5, 6 Vgg1, Vgg2 Optional gate control for amplifier. If left open, the amplifier will run at standard current. Negative voltage applied will reduce current. 3 - 12 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC441 v06.0508 GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 6 - 18 GHz (a) Assembly for Single Supply Voltage Operation 3 LINEAR & POWER AMPLIFIERS - CHIP For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 3 - 13 HMC441 v06.0508 GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 6 - 18 GHz (b) Assembly with Optional Gate Bias Voltage Operation 3 LINEAR & POWER AMPLIFIERS - CHIP 3 - 14 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC441 v06.0508 GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 6 - 18 GHz Mounting & Bonding Techniques for Millimeterwave GaAs MMICs The die should be attached directly to the ground plane eutectically or with conductive epoxy (see HMC general Handling, Mounting, Bonding Note). 50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the surface of the substrate. One way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should brought as close to the die as possible in order to minimize bond wire length. Typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). 0.102mm (0.004”) Thick GaAs MMIC Wire Bond 0.076mm (0.003”) 3 LINEAR & POWER AMPLIFIERS - CHIP 3 - 15 RF Ground Plane 0.127mm (0.005”) Thick Alumina Thin Film Substrate Figure 1. Handling Precautions Follow these precautions to avoid permanent damage. Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: strikes. Follow ESD precautions to protect against ESD 0.150mm (0.005”) Thick Moly Tab 0.254mm (0.010”) Thick Alumina Thin Film Substrate Figure 2. 0.102mm (0.004”) Thick GaAs MMIC Wire Bond 0.076mm (0.003”) RF Ground Plane Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip may have fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment. Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible