HMC644_09

HMC644 v00.0607 GaAs MMIC 5-BIT DIGITAL PHASE SHIFTER, 15 - 18.5 GHz Typical Applications The HMC644 is ideal for: • EW Receivers Features Low RMS Phase Error: 4° Low Insertion Loss: 7 dB High Linearity: +40 dBm 360° Coverage, LSB = 11.25° Die Size: 2.75 x 0.99 x 0.1 mm 3 PHASE SHIFTERS - DIGITAL - CHIP • Weather & Military Radar • Satellite Communications • Beamforming Modules • Phase Cancellation Functional Diagram General Description The HMC644 is a 5-bit digital phase shifter die which is rated from 15 to 18.5 GHz, providing 360 degrees of phase coverage, with a LSB of 11.25 degrees. The HMC644 features very low RMS phase error of 4 degrees and extremely low insertion loss variation of ±0.5 dB across all phase states. This high accuracy phase shifter is controlled with complementary logic of 0/-3V, and requires no fixed bias voltage and is internally matched to 50 Ohms with no external components. Simple external level shifting circuitry can be used to convert a positive CMOS control voltage into complementary negative control signals. Electrical Specifi cations, TA = +25° C, 50 Ohm System, Control Voltage = 0/-3V Parameter Frequency Range Insertion Loss* Input Return Loss* Output Return Loss* Phase Error* RMS Phase Error Insertion Loss Variation* Input Power for 1 dB Compression Input Third Order Intercept Control Voltage Current *Note: Major States Shown Min. 15 7 10 8 ±5 4 ±0.5 23 40 ± 250V ESD strikes. Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting The chip is back-metallized and can be die mounted with electrically conductive epoxy. The mounting surface should be clean and fl at. Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible