BC7601

BC7601/BC7602 BLE Transparent Transmission Controller Features General Description • 3.3V operating voltage The BC7601/BC7602 devices are fully-integrated, single-chip Bluetooth Low Energy, BLE, controllers. The devices are specially designed to act as BLE slave controllers in accordance with the Bluetooth specification v4.1. • Integrated high performance RF and MODEM for enhanced BLE. • Few external components required as well as on-chip 32 MHz crystal capacitors to reduce the BOM cost. The devices can be controlled by any external microcontroller through the Application Controller Interface, ACI, which is designed to allow the devices to easily communicate with external circuitry. The UART and SPI interfaces are available as the ACI transport layers. • Integrated DC/DC converter and LDOs allowing a wider supply range with a single power supply • Over 75dB RX of gain in programmable gain steps • Integrated SPI and UART for ACI interfaces • Includes Sleep and Power Down modes for low power consumption Additionally, during intervals where there is no active BLE RF connection, the devices will enter a Sleep Mode thus further reducing power consumption. • Embedded patch memory to reduce system development effort and cost – BC7602 only • Package types: ♦♦ BC7601: 32-pin QFN – 4mmx4mm ♦♦ BC7602: 46-pin QFN – 6.5mmx4.5mm In general practice, the BC7601/BC7602 devices will be required to download a patch code for full BLE optimisation. For convenience and system cost reduction, the BC7602 device already supports an internal patch code and so does not need to patch from the external microcontroller. Applications • Health care products • Smart home appliances • Beacons Block Diagram VDDIF_15 VDDRF_15 VDDLO_15 RST_N PDN INT_EXT Balun RFIO WAKEUP VCO PA STATE Frequency Synthesizer Switch SPI_INT BLE Controller SPI_CS/UR_CTS ACI Mixer +Gain LNA XI XO DC/DC Converter Xtal OSC SPI_MOSI/UR_RXD IF Filter & Demod SPI_MISO/UR_TXD SPI-UR_N EE_WP EEPROM LDO IIC_CLK (BC7602 Only) IIC_SDA PVIN Rev. 1.10 SPI_CLK/UR_RTS DCDC_SW VOUT_15 DVDD_12 SCL 1 SDA WP A[2:0] Expose Pad : RFGND May 19, 2017 BC7601/BC7602 Pin Assignment DC_TEST VDDLO_15 XI XO DVDD_12 NC IIC_SDA EE_WP DFT SPI_CS/UR_CTS SPI_CLK/UR_RTS SPI_MOSI/UR_RXD SPI_MISO/UR_TXD NC PDN PVIN 1 2 32 31 30 29 28 27 26 25 24 23 3 22 4 21 BC7601 5 20 32 QFN-A 6 19 7 18 8 17 9 10 11 12 13 14 15 16 RFGND RFIO VDDRF_15 VDDIF_15 RFGND IIC_CLK NC RST_N STATE INT_EXT WAKEUP SPI-UR_N SPI_INT VOUT_15 DCDC_SW NC RFGND RST_N STATE INT_EXT WAKEUP SPI-UR_N NC PVIN DCDC_SW VOUT_15 NC SDA SCL NC WP VDD NC NC NC NC A0 A1 A2 VSS 46 45 44 4342 414039 38 37 3635 34 33 1 32 2 31 3 30 4 29 BC7602 5 28 46 QFN-A 27 6 7 26 25 8 24 9 10111213 1415 16171819 202122 23 RFGND RFIO VDDRF_15 VDDIF_15 RFGND NC NC SPI_CS/UR_CTS SPI_CLK/UR_RTS SPI_MOSI/UR_RXD SPI_MISO/UR_TXD SPI_INT PDN NC Rev. 1.10 2 IIC_CLK EE_WP IIC_SDA DVDD_12 XO XI VDDLO_15 DC_TEST VDDRF_15 RFGND May 19, 2017 BC7601/BC7602 Pin Description BC7601 No Type DFT Name 1 DI For normal operation connect to RFGND. Description SPI_CS/UR_CTS 2 DI SPI CS or UART CTS; selected by SPI-UR_N during the power-on period SPI_CLK/UR_RTS 3 DI SPI CLK or UART RTS; selected by SPI-UR_N during the power-on period SPI_MOSI/UR_RXD 4 DI SPI MOSI or UART RXD; selected by SPI-UR_N during the power-on period SPI_MISO/UR_TXD 5 DO SPI MISO or UART TXD; selected by SPI-UR_N during the power-on period NC 6 — No Connection – connect to RFGND PDN 7 DI Power down control pin When low the device enters the Power down mode PVIN 8 P Power-supply; 2.2V~3.6V NC 9 — No Connection – connect to RFGND DCDC_SW 10 P Switching Output – connect to the switching end of the inductor VOUT_15 11 P 1.5V power output SPI_INT 12 DO SPI interrupt request when SPI mode is selected SPI-UR_N 13 DI SPI/UART mode select pin during the power-on period 1: SPI pins selected 0: UART pins selected WAKEUP 14 DI Wake-up pin Enters the Sleep Mode when low INT_EXT 15 DO External Interrupt STATE 16 DO IC state pin indicator 1: Operating mode 0: Sleep mode RST_N 17 DI Hardware reset, active low NC 18 — No Connection – connect to RFGND Connect to external host or EEPROM SCL pin. DIO IIC_CLK pin is baud rate selection when UART mode is selected. Where 0: 9600bps, 1: 115200bps. IIC_CLK 19 RFGND 20 P RF Power Ground VDDIF_15 21 P Analog power for IF section – connect to VOUT_15 VDDRF_15 22 P Analog power for RF section – connect to VOUT_15 RFIO 23 AIO RF input or output RFGND 24 P RF Power Ground DC_TEST 25 AO RF function test pin VDDLO_15 26 P Analog power for RF section, connect to VOUT_15 XI 27 AI Crystal oscillator input XO 28 AO Crystal oscillator output DVDD_12 29 P 1.2V internal digital power – connect 0.1μF capacitor to RFGND NC 30 — No Connection – connect to RFGND IIC_SDA 31 DIO Connect to external host or EEPROM SDA pin EE_WP 32 DO RFGND EP P Connect to external host or EEPROM WP pin Exposed Pad on package lower side. Internally connected to RFGND. Solder this exposed pad to a PCB pad that uses multiple ground vias to provide heat transfer out of the device into the PCB ground planes. These multiple ground vias are also required to achieve the noted RF performance. Legend: AI=Analog Input; AO=Analog Output; AIO=Analog In/out; DI=Digital Input; DO=Digital Output; DIO=Digital In/Out; P=Power Rev. 1.10 3 May 19, 2017 BC7601/BC7602 BC7602 Pin Type VDD Name 1 P EEPROM power supply; 1.8V~3.6V Description NC 2 — No Connection – connect to RFGND NC 3 — No Connection – connect to RFGND NC 4 — No Connection – connect to RFGND NC 5 — No Connection – connect to RFGND A0 6 DI EEPROM address A0 input A1 7 DI EEPROM address A1 input A2 8 DI EEPROM address A2 input VSS 9 P EEPROM Digital ground - connect to RFGND NC 10 — No Connection - connect to RFGND PDN 11 DI Power down control pin When low the device enters the Power down mode SPI_INT 12 DO SPI interrupt request when SPI mode is selected SPI_MISO/UR_TXD 13 DO SPI MISO or UART TXD; selected by SPI-UR_N during the power-on period SPI_MOSI/UR_RXD 14 DI SPI MOSI or UART RXD; selected by SPI-UR_N during the power-on period SPI_CLK/UR_RTS 15 DI SPI CLK or UART RTS; selected by SPI-UR_N during the power-on period SPI_CS/UR_CTS 16 DI SPI CS or UART CTS; selected by SPI-UR_N during the power-on period NC 17 — No Connection – connect to RFGND NC 18 — No Connection – connect to RFGND RFGND 19 P RF Power Ground VDDIF_15 20 P Analog power for IF section – connect to VOUT_15 VDDRF_15 21 P Analog power for RF section – connect to VOUT_15 RFIO 22 AIO RF input or output RFGND 23 P RF Power Ground VDDRF_15 24 P Analog power for RF section – connect to VOUT_15 DC_TEST 25 AO VDDLO_15 26 P Analog power for RF section – connect to VOUT_15 XI 27 AI Crystal oscillator input XO 28 AO Crystal oscillator output DVDD_12 29 P IIC_SDA 30 DIO Externally connected to SDA pin EE_WP 31 DIO Externally connected to WP pin IIC_CLK 32 DO Externally connected to SCL pin RST_N 33 DI Hardware reset input, active low STATE 34 DO IC state pin indicator 1: Operating mode 0: Sleep mode INT_EXT 35 DO External Interrupt WAKEUP 36 DI Wake-up pin Enters the Sleep Mode when low SPI-UR_N 37 DI SPI/UART mode select pin during the power-on period 1: SPI pins selected 0: UART pins selected NC 38 — No Connection – connect to RFGND PVIN 39 P Power-supply; 2.2V~3.6V DCDC_SW 40 P Switching Output - connect to the switching end of the inductor VOUT_15 41 P 1.5V power output NC 42 — No Connection – connect to RFGND SDA 43 Rev. 1.10 RF function test pin 1.2V internal digital power – connect 0.1μF capacitor to RFGND DIO EEPROM SDA 4 May 19, 2017 BC7601/BC7602 Pin Type SCL Name 44 DI EEPROM SCL NC 45 — No Connection – connect to RFGND WP 46 DI EEPROM WP P Exposed Pad on the lower side of the package. Internally connected to RFGND. Solder this exposed pad to a PCB pad that uses multiple ground vias to provide heat transfer out of the device into the PCB ground planes. These multiple ground vias are also required to achieve the noted RF performance. RFGND EP Description Legend: AI=Analog Input; AO=Analog Output; AIO=Analog In/out; DI=Digital Input; DO=Digital Output; DIO=Digital In/Out; P=Power Absolute Maximum Ratings Supply Voltage . .......................... VIN-0.3V to VIN+4.3V Storage Temperature ........................... -50°C to 125°C Input Voltage .............................. VIN-0.3V to VIN+0.3V Operating Temperature .............................0°C to 70°C Note: These are stress ratings only. Stresses exceeding the range specified under “Absolute Maximum Ratings” may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. D.C. Characteristics Symbol VIN Parameter Test Conditions Min. Typ. Max. Unit — 2.2(*) 3.3 3.6 V Power supply voltage(*) Digital Inputs VIH High level input voltage — 0.7 × VIN — — V VIL Low level input voltage — — — 0.2 × VIN V IIH High level input current — — 10 — μA IIL Low level input current — — 10 — μA CI Input capacitance — — 5 — pF V Digital Outputs VOH High level output voltage IOH = 1mA VIN -0.5 — — VOL Low level output voltage IOL = 1mA — — 0.5 V IOZ High impedance output current — — 1 μA — Supply current (Ta=25°C, VIN=3.3V, unless otherwise specified) IRX Rx mode — — 14.5 — mA ITX TX mode, 0 dBm output power — — 9 — mA ISLEEP Idle mode when MCU sleep — — 13 20 uA IACT Idle mode when MCU active — — 2 — mA IPDN Power down — — 280 360 nA Note: If the BC760x device is operating under the condition where VIN f ± 3MHz ( f=2400~2483.5MHz, PTX=0dBm ) — -55 — dBm 6 May 19, 2017 BC7601/BC7602 Functional Description Controller Interface Application Controller Interface Introduction The BC760x device includes an Application Controller Interface which supports two different transport layers selected according to the logic level of the STATE and SPI-UR_N pins during power-on. These devices are fully-integrated, single-chip Bluetooth Low Energy, BLE, controllers. The devices are specially designed to act as BLE slave devices in accordance with the Bluetooth specification v4.1. The devices can be controlled by any external microcontroller through the Application Controller Interface, ACI, which is specially designed to allow easy communication with external circuitry. The UART and SPI interfaces are available as the ACI transport layers. Additionally, during any time intervals where there is no active BLE RF connection, the devices will enter the Sleep Mode which can further reduce the power consumption. As the complexity of BLE RF controllers does not permit comprehensive RF operation information to be provided in this datasheet, the reader should therefore refer to the corresponding user manuals for a detailed understanding of the BLE RF. • STATE/SPI-UR_N with pull-high resistor – selects the SPI interface • STATE/SPI-UR_N with pull-down resistor – selects the UART interface For the SPI interface, the Write FIFO command must be sent first for each CMD from the host to the devices while the read FIFO command must be sent first for each Return operation. For the UART interface the write FIFO and read FIFO commands are not required. Data follows the little-endian format whose commands are shown in Figure 1. Packet Type Payload Ctrl CMD 0x25 8 bits CtrlCode 8 bits Read Ctrl Info CMD 0x20 8 bits CtrlCode 8 bits Ctrl Info Return 0x21 8 bits CtrlCode 8 bits Data Packet CMD 0x22 8 bits DataLength 8 bits Return Packet 0x26 8bit CtrlCode 8 bits Write Phy CMD 0x55 8 bits DataLength 8bit(