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HI-5001PSIF

HI-5001PSIF

  • 厂商:

    HOLTIC

  • 封装:

  • 描述:

    HI-5001PSIF - 1Mbps CAN Transceiver with Low Power Standby Mode - Holt Integrated Circuits

  • 数据手册
  • 价格&库存
HI-5001PSIF 数据手册
HI-5000, HI-5001, HI-5002 September 2011 1Mbps CAN Transceiver with Low Power Standby Mode PIN CONFIGURATIONS (Top Views) TXD - 1 GND - 2 VDD - 3 RXD - 4 HI-5000PSI 8 - STB 7 - CANH 6 - CANL 5 - SPLIT GENERAL DESCRIPTION The HI-5000 is a 1 Mbps Controller Area Network (CAN) transceiver. It interfaces between a CAN protocol controller and the physical wires of the bus in a CAN network. Differential output amplitude and current drive capability are specifically enhanced to meet the needs of long cable runs typical in many applications such as industrial automation. The HI-5000 supports two modes of operation: Normal Mode and Standby Mode. The Standby Mode is a very low-current mode which continues to monitor bus activity and allows an external controller to manage wake-up. Superior common-mode receiver performance makes the device especially suitable for applications where ground reference voltages may vary from point to point over long distances along the CAN bus. In addition, the HI-5000 provides a SPLIT pin to give an output reference voltage of VDD/2 which can be used for stabilizing the recessive bus level when the split termination technique is used to terminate the bus. A TXD dominant time-out feature also protects the bus from being driven into a permanent dominant state (socalled “babbling idiot”) if pin TXD becomes permanently low due to application failure. The device also has short circuit protection to +/-58V on CANH, CANL and SPLIT pins and ESD protection to +/- 6kV on all pins. The HI-5001 is identical to the HI-5000 except the SPLIT pin is substituted with a VIO supply voltage pin. This allows the HI-5001 to interface directly with controllers with 2.5V or 3.3V supply voltages. The HI-5002 provides both the SPLIT and VIO supply voltage pins in a compact 16-pin QFN. All three devices are available in industrial -40 C to +85 C temperature ranges. “RoHS compliant” lead-free options are also available. o o TXD - 1 GND - 2 VDD - 3 RXD - 4 HI-5001PSI 8 - STB 7 - CANH 6 - CANL 5 - VIO 8 - PIN PLASTIC NARROW BODY SOIC 16 15 14 13 12 11 10 9 TXD STDBY GND GND VDD VDD 1 2 3 4 HI-5002PCI CANH CANH CANL CANL 16 - PIN PLASTIC 4 x 4mm QFN FEATURES · Compatible with ISO 11898-5 standard. · Signaling rates up to 1Mbit/s. · Internal VDD/2 voltage source available to stabilize the · · · · · recessive bus level if split termination is used (HI-5000 SPLIT pin). VIO input on HI-5001 allows for direct interfacing with 2.5V or 3.3V controllers. Detection of permanent dominant on TXD pin (babbling idiot protection). High impedance allows connection of up to 120 nodes. CANH, CANL and SPLIT pins short-circuit proof to +/-58V. Will not disturb the bus if unpowered. ( DS 5000 Rev. B) HOLT INTEGRATED CIRCUITS www.holtic.com VIO RXD SPLIT 5 6 7 8 09/11 HI-5000, HI-5001, HI-5002 PIN DESCRIPTIONS SIGNAL TXD GND VDD RXD CANL CANH STB SPLIT (HI-5000) VIO (HI-5001) FUNCTION INPUT POWER POWER OUTPUT BUS I/O BUS I/O INPUT INPUT INPUT DESCRIPTION 100kOhm internal pull-up. Transmit Data Input. Chip 0V supply Positive supply, 5V +/-5%. Bypass with 0.1uF ceramic capacitor. Receive Data Output. CAN Bus Line Low. CAN Bus Line High. 100kOhm internal pull-up. Standby Mode selection input. Drive STB low or connect to GND for Normal operation. Drive STB high to select low-current Standby Mode. Supplies a VDD/2 output to provide recessive bus level stabilization when a split termination is used to terminate the bus. Connect to a 2.5V or 3.3V supply to allow compatibility of all digital I/O (RXD, TXD, STB) with a low voltage controller input. BLOCK DIAGRAM VDD V Split SPLIT (HI-5000) CANH TXD Dominant Detect CANL Driver TXD Standby Control STB VIO (HI-5001) RXD MUX Main Receiver GND Low power Standby Rx Figure 1. HI-5000 Functional Block Diagram HOLT INTEGRATED CIRCUITS 2 HI-5000, HI-5001, HI-5002 FUNCTIONAL DESCRIPTION OPERATING MODES The HI-5000 provides two modes of operation which are selectable via the STB pin. Table 1 summarizes the modes. Table 1 - Operating Modes due to an unpowered node with high leakage from the bus lines to ground), the split circuit will force the recessive voltage to VDD/2. INTERNAL PROTECTION FEATURES Short-circuit protection Short-circuit protection is provided on the CANH, CANL and SPLIT pins. These pins are protected from ESD to over 6KV (HBM) and from shorts between -58V and +58V continuous, as specified in ISO 11898-5. The short circuit current is limited to less than 200mA typical. TXD permanent dominant time-out Normal Mode Normal mode is selected by setting the STB pin to a LOW logic level (GND). In this mode, the transceiver transmits and receives data in the usual way from the CANH and CANL bus lines. The differential receiver converts the analog bus data to digital data which is output on the RXD pin (Note: the RXD output on HI-5001 is compatible with 2.5V or 3.3V controllers if the VIO pin is connected to a 2.5V or 3.3V supply). Standby Mode Standby Mode is selected by setting the STB pin to a HIGH logic level. In this mode, the transmitter is switched off and a low power differential receiver monitors the bus lines for activity. A dominant signal of more than 3ms will be reflected on the RXD pin as a logic LOW, where it may be detected by the host as a wake-up request. The device will not leave standby mode until the host forces the STB pin to a logic low. A timer circuit prevents the bus lines being driven into a permanent dominant state, which would result in a situation blocking all bus traffic. This could happen in the case of the TXD pin becoming permanently low due to a hardware or application failure. The timer is triggered by a negative edge on the TXD pin (start of dominant state). If the TXD pin is not set high (recessive state) after a typical time of 2ms, the transmitter outputs will be disabled, putting the bus lines into the recessive state. The timer is reset by a positive edge on the TXD pin. Note that the minimum TXD dominant time-out time, tdom = 300μs, defines the minimum possible bit rate of 40kbit/s (the CAN protocol specifies a maximum of 11 successive dominant bits − 5 successive dominant bits immediately followed by an error frame). Fail-safe features Pin TXD has a pull up in order to set a recessive level if pin TXD is left open. Pins TXD and STB will become floating if power is lost. This will prevent reverse currents via these pins. MODE Normal Standby STB pin LOW HIGH SPLIT Circuit The SPLIT pin provides a stable VDD/2 DC voltage. This pin can be used to stabilize the recessive common mode voltage by connecting the SPLIT pin to the center tap of the split termination (see figure 7). In the case of a recessive bus voltage dropping below the ideal value of VDD/2 (e.g. HOLT INTEGRATED CIRCUITS 3 HI-5000, HI-5001, HI-5002 TIMING DIAGRAMS Timing Delays HIGH TXD LOW CANH CANL Dominant 0.9V VDIFF(BUS) = VCANH - VCANL 0.5V Recessive HIGH RXD tdr(TXD) tdf(TXD) tdf(RXD) tProp1 tProp2 tdr(RXD) 50% 50% LOW TXD dominant time-out feature tdom(TXD) recessive TXD dominant transmitter disabled CANH CANL transmitter enabled tRdom HIGH LOW HOLT INTEGRATED CIRCUITS 4 HI-5000, HI-5001, HI-5002 ABSOLUTE MAXIMUM RATINGS (Voltages referenced to GND = 0V) Supply Voltage, VDD, VIO : .....................................................................7V Current at Input pins ......................................................-100mA to +100mA DC Voltages at TXD, RXD and STB ..............................-0.5V to VDD +0.5V DC Voltages at CANH, CANL and SPLIT: ...............................-58V to +58V Internal Power Dissipation: ..............................................................900mW Electrostatic Discharge (ESD)1, All pins ..........................................+/- 6kV Operating Temperature Range: (Industrial).........................-40°C to +85°C Maximum Junction Temperature2 ......................................................175°C Storage Temperature Range: Soldering Temperature: -65°C to +150°C (Ceramic)......................60 sec. at +300°C (Plastic - leads).............10 sec. at +280°C (Plastic - body) .....................+260°C Max. NOTES: 1. Human Body Model (HBM). 2. Junction Temperature TJ is defined as TJ = TAMB + P × Rth, where TAMB is the ambient or operating temperature, P is the power dissipation and Rth is a fixed thermal resistance value which depends on the package and circuit board mounting conditions. Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS VDD = 5V±5%, Operating temperature range (unless otherwise noted). Positive currents flow into the IC. LIMITS PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNIT SUPPLY CURRENT VDD Supply Current VIO Supply Current IDD IIO Recessive: VTXD = VDD Dominant: VTXD = 0 V Standby Mode: VTXD = VDD 6 50 15 10 70 30 100 mA mA μA μA DIGITAL INPUTS (Pins TXD, STB) HIGH-level input voltage (see Note 1) LOW-level input voltage HIGH-level input current LOW-level input current VIH VIL IIH IIL VTXD = VDD or VIO VTXD = 0 V 70%VDD − 0.5 −5 0 − 50 VDD + 0.5 30%VDD +5 − 150 V V μA μA DIGITAL OUTPUTS HIGH-level output voltage (RXD Pin) (see Note 1) LOW-level output voltage (RXD Pin) Output voltage (SPLIT Pin) Standby leakage current (SPLIT Pin) VOH VOL VSPLIT ISTB IOH = 1mA IOL = 1mA − 100 μA < ISPLIT < 100 μA 90%VDD 0 0.45VDD -5 0.1 0.5VDD 10%VDD 0.55VDD +5 V V V μA DRIVER CANH dominant output voltage CANL dominant output voltage Recessive output voltage Bus output voltage in standby Dominant differential output voltage Recessive differential output voltage Matching of dominant output voltage, VDD − VO(CANH) − VO(CANL) Steady state common mode output voltage VO(CANH) VO(CANL) VCANH(r), VCANL(r) VSTB VDIFF(d)(o) VDIFF(r)(o) VOM VOC(ss) VTXD = 0 V VTXD = 0 V (See Fig. 2) VTXD = VDD, RL = 0 (See Fig. 2) VTXD = VDD, RL = 0 (See Fig. 2) VTXD = 0 V, 45 Ω < RL < 65 Ω VTXD = VDD, no load (See Fig. 2) (See Fig. 4) VSTB = 0V, RL = 60 Ω (See Fig. 5) 3 0.5 2 -0.1 1.5 − 50 − 100 2 1.8 0 -40 0.5VDD 3.6 1.4 0.5VDD 4.25 1.75 3 0.1 3 50 150 3 V V V V V mV mV V NOTE: 1. When VIO is connected (HI-5001 or HI-5002), limits are referenced wrt VIO rather than VDD. HOLT INTEGRATED CIRCUITS 5 HI-5000, HI-5001, HI-5002 DC ELECTRICAL CHARACTERISTICS (cont.) VDD = 5V±5%, Operating temperature range. Positive currents flow into the IC. LIMITS PARAMETER Short-circuit steady-state output current SYMBOL IOS(ss) CONDITIONS VCANH = +58V, VCANL open VCANH = -58V, VCANL openV VCANL = +58V, VCANH open VCANL = -58V, VCANH open (See Fig. 6) MIN -20 -200 100 -20 TYP MAX 20 100 200 20 UNIT mA mA mA mA RECEIVER Differential receiver threshold voltage Differential hysteresis voltage Differential hysteresis voltage in Standby mode Input leakage current, unpowered node Differential input resistance Common mode input resistance Deviation between common mode input resistance between CANH and CANL VTh(Rx)(diff) VHys(Rx)(diff) VHys(Stb)(diff) ICANH, ICANL RIN(DIFF) RIN(CM) RIN(CM)(m) − 12 V < VCANH, VCANL < + 12 V − 12 V < VCANH, VCANL < + 12 V − 12 V < VCANH, VCANL < + 12 V VDD = VIO 0 V VCANH = VCANL = 5V VTXD = VDD − 12 V < VCANH, VCANL < + 12 V VTXD = VDD − 12 V < VCANH, VCANL < + 12 V VCANH = VCANL 500 50 500 − 200 25 15 −3 50 30 700 120 900 200 1150 + 200 75 45 +3 mV mV mV μA kΩ kΩ % AC ELECTRICAL CHARACTERISTICS VDD = 5V±5%, Operating temperature range. Positive currents flow into the IC. LIMITS PARAMETER Bit time Bit rate Common mode input capacitance Differential input capacitance3 Delay TXD to bus active Delay TXD to bus inactive Delay bus active to RXD Delay bus inactive to RXD Propagation delay TXD to RXD (recessive to dominant) Propagation delay TXD to RXD (dominant to recessive) TXD permanent dominant time-out TXD permanent dominant timer reset time 3 SYMBOL tBit fBit CIN(CM) CDIFF(CM) tdr(TXD) tdf(TXD) tdf(RXD) tdr(RXD) tProp1 tProp2 tdom tRdom CONDITIONS MIN 1 40 TYP MAX 25 1000 UNIT μs kHz pF pF VTXD = VDD, 1Mbit/s data rate VTXD = VDD, 1Mbit/s data rate See Timing Diagrans 20 10 40 40 30 70 70 110 90 90 70 150 160 240 6 1 0.5 3 5 ns ns ns ns ns ns ms μs μs VTXD = 0 V Rising edge on TXD while in permanent dominant state 0.3 2 Dominant time required on bus for standby receiver detection twake NOTES: 1. All currents into the device pins are positive; all currents out of the device pins are negative. 2. All typicals are given for VDD = 5V, TA = 25°C. 3. Guaranteed by design but not tested. HOLT INTEGRATED CIRCUITS 6 HI-5000, HI-5001, HI-5002 Application and Test Information Transceiver TXD RL VO(CANH) VO(CANL) VDIFF(d)(o) STB Dominant Recessive ~3.5V: VO(CANH) ~2.5V ~1.5V: VO(CANL) Figure 2. CAN Bus Driver Circuit Transceiver 0V TXD CANH VDIFF(d)(o) 300 W +/- 1% RL + _ -12V
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