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HLMP-1540

HLMP-1540

  • 厂商:

    HP

  • 封装:

  • 描述:

    HLMP-1540 - T-13/4 (5 mm), T-1 (3 mm), Ultra-Bright LED Lamps - Agilent(Hewlett-Packard)

  • 数据手册
  • 价格&库存
HLMP-1540 数据手册
Agilent HLMP-3707 T-13/4 (5 mm), T-1 (3 mm), Ultra-Bright LED Lamps Data Sheet HLMP-3707, -3807, -3907; HLMP-3750, -3850, -3950, -3960 HLMP-3390, -3490, -3590; HLMP-1340, -1440, -1540 HLMP-D640; HLMP-K640 Description These non-diffused lamps outperform conventional LED lamps. By utilizing new higher intensity material, we achieve superior product performance. The HLMP-3750/-3390/-1340 Series Lamps are Gallium Arsenide Phosphide on Gallium Phosphide red light emitting diodes. The HLMP-3850/-3490/-1440 Series are Gallium Arsenide Phosphide on Gallium Phosphide yellow light emitting diodes. The HLMP-3950/-3590/-3960/-1540/ -D640/-K640 Series Lamps are Gallium Phosphide green light emitting diodes. Features • Improved brightness • Improved color performance • Available in popular T-1 and T-13/4 packages • New sturdy leads • IC compatible/low current capability • Reliable and rugged • Choice of 3 bright colors High Efficiency Red High Brightness Yellow High Performance Green Applications • Lighted switches • Backlighting front panels • Light pipe sources • Keyboard indicators Selection Guide Luminous Intensity Iv (mcd) @ 20mA Package Description T-13/4 Color Red Device HLMP3707-L00xx 3750 3750-L00xx Yellow 3807-K00xx 3850 3850-K00xx 3850-KL0xx Green 3907-K00xx 3914-K00xx 3950 3950-K00xx 3950-LM0xx 3960-K0xxx Emerald Green T-13/ 4 Min. 90.2 90.2 90.2 96.2 96.2 96.2 96.2 111.7 111.7 111.7 111.7 170.0 111.7 6.7 35.2 37.6 37.6 43.6 43.6 35.2 8.6 35.2 35.2 23.5 23.5 23.5 23.5 27.3 27.3 43.6 4.2 4.2 10.6 Typ. 125.0 125.0 140.0 140.0 150.0 265.0 265.0 300.0 265.0 21.0 55.0 55.0 55.0 55.0 55.0 55.0 15.0 55.0 55.0 45.0 45.0 45.0 45.0 60.0 21.0 21.0 20.0 Max. 294.0 490.0 27.6 112.8 75.2 75.2 139.6 34.0 2q1/2 Degree 24 24 24 24 24 24 24 24 24 24 24 24 24 24 32 32 32 32 32 45 45 45 45 45 45 45 45 45 45 45 45 45 45 Package Outline F A A F A A A F D A A A E D B B B B B C C C C C C C C C C C C C C D640-E00xx 3390 3490 3490-I00xx Low Profile Red Yellow Green T-1 Red 3590 3590-I00xx 1340 1340-H00xx 1340-J00xx 1340-JK0xx Yellow 1440 1440-H00xx 1440-HI0xx 1440-HIB00 Green 1540 1540-H00xx 1540-IJ0xx Emerald Green K640 K640-D00xx K640-FGNxx 2 Package Dimensions 5.08 (0.200) 4.57 (0.180) 5.08 (0.200) 4.78 (0.188) 5.08 (0.200) 4.78 (0.188) 9.19 (0.362) 8.43 (0.332) 9.07 (0.357) 8.56 (0.337) 12.47 (0.491) 11.71 (0.461) 13.11 (0.516) 12.34 (0.486) 9.07 (0.357) 8.56 (0.337) 0.89 (0.035) 0.64 (0.025) 25.40 (1.00) MIN. 0.89 (0.035) 0.64 (0.025) 1.02 (0.040) MAX. 0.89 (0.035) 0.64 (0.025) 1.02 (0.040) MAX. EPOXY MENISCUS 1.32 (0.052) 1.02 (0.040) 0.102 (0.004) MAX. TYP. 0.10 (0.004) MAX. 22.86 MIN. (0.900) 23.0 MIN. (0.900) CATHODE LEAD (NOTE 1) 1.27 (0.050) NOM. 0.46 (0.018) SQUARE NOMINAL 1.52 (0.060) 1.02 (0.040) 0.74 (0.029) 0.58 (0.023) SQUARE 1.52 (0.060) 1.02 (0.040) 0.53 (0.021) SQ. 0.43 (0.017) 6.10 (0.240) 5.59 (0.220) ∅ CATHODE FLAT 6.10 (0.240) 5.60 (0.220) 6.10 (0.240) 5.60 (0.220) CATHODE FLAT 2.79 (0.110) 2.29 (0.090) 2.54 (0.100) NOM. 2.54 (0.100) NOM. PACKAGE OUTLINE "D" HLMP-D640 PACKAGE OUTLINE "E" HLMP-3960 PACKAGE OUTLINE "F" HLMP-3707/-3807/-3907 3 Part Numbering System HLMP - x x xx - x x x xx Mechanical Options 00: Bulk 01: Tape & Reel, Crimped Leads 02, Bx: Tape & Reel, Straight Leads A1, B1: Right Angle Housing, Uneven Leads A2, B2: Right Angle Housing, Even Leads Dx, Ex: Ammo Pack, Straight Leads FH: 2 Iv Bin Select with Inventory Control Vx: Ammo Pack, Crimped Leads Color Bin Options 0: Full Color Bin Distribution B: Color Bin 2 & 3 Only N: Color Bin 6 & 7 Only Maximum Iv Bin Options 0: Open (No. Max. Limit) Others: Please Refer to the Iv Bin Table Minimum Iv Bin Options Please Refer to the Iv Bin Table Color Options 3, 7: GaP HER 4, 8: GaP Yellow (except K4xx series) 5, 9: GaP Green 6: GaP Emerald Green Package Option 1, K: T-1 (3 mm) 3, D: T-13/4 (5 mm) Absolute Maximum Ratings at TA = 25°C Parameter Peak Forward Current Average Forward Current[1] DC Current[2] Transient Forward Current[3] (10 µs Pulse) Reverse Voltage (IR = 100 µA) LED Junction Temperature Operating Temperature Range Storage Temperature Range Red 90 25 30 500 5 110 -55 to +100 Yellow 60 20 20 500 5 110 -55 to +100 Green/Emerald Green 90 25 30 500 5 110 -20 to +100 -55 to +100 Units mA mA mA mA V °C °C Notes: 1. See Figure 2 to establish pulsed operating conditions. 2. For Red and Green series derate linearly from 50°C at 0.5 mA/°C. For Yellow series derate linearly from 50°C at 0.2 mA/°C. 3. The transient peak current is the maximum non-recurring peak current the devices can withstand without damaging the LED die and wire bonds. It is not recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward Current. 4 Electrical/Optical Characteristics at TA = 25°C Symbol λPEAK Description Peak Wavelength T-13/4 37xx 38xx 39xx D640 37xx 38xx 39xx D640 37xx 38xx 39xx D640 37xx 38xx 39xx D640 37xx 38xx 39xx D640 37xx 38xx 39xx D640 T-13/4 Low Dome 3390 3490 3590 3390 3490 3590 3390 3490 3590 3390 3490 3590 3390 3490 3590 3390 3490 3590 1340 1440 1540 K640 VF Forward Voltage 37xx 38xx 39xx D640 37xx 38xx 39xx D640 37xx 38xx 39xx D640 3390 3490 3590 3390 3490 3590 3390 3490 3590 1340 1440 1540 K640 1340 1440 1540 K640 1340 1440 1540 K640 1.5 1.5 1.5 5.0 T-1 1340 1440 1540 K640 1340 1440 1540 K640 1340 1440 1540 K640 1340 1440 1540 K640 1340 1440 1540 K640 Min. Typ. 635 583 565 558 626 585 569 560 40 36 28 24 90 90 500 3100 11 15 18 35 210 210 210 510 290 290 290 290 1.9 2.1 2.2 2.2 2.6 2.6 3.0 3.0 Max. Units nm Test Conditions Measurement at Peak λd Dominant Wavelength nm Note 1 ∆λ3/4 Spectral Line Halfwidth nm τs Speed of Respond ns C Capacitance pF VF = 0, f = 1 MHz RθJ-PIN Thermal Resistance °C/W Junction to Cathode Lead V IF = 20 mA (Figure 3) VR Reverse Breakdown Voltage Luminous Efficacy V IF = 100 µA ηv 145 500 595 655 lumens watt Note 2 Notes: 1. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 2. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = IV/hV , where IV is the luminous intensity in candelas and hV is the luminous efficacy in lumens/watt. 5 Red, Yellow, and Green 1.0 EMERALD GREEN TA = 25° C RELATIVE INTENSITY GREEN HIGH EFFICIENCY RED 0.5 YELLOW 0 500 550 600 WAVELENGTH – nm 650 700 Figure 1. Relative intensity vs. wavelength. Figure 2. Maximum tolerable peak current vs. pulse duration. (IDC MAX as per MAX ratings). Figure 3. Forward current vs. forward voltage. Figure 4. Relative luminous intensity vs. forward current. Figure 5. Relative efficiency (luminous intensity per unit current) vs. peak current. 6 Figure 6. Relative luminous intensity vs. angular displacement. T-13/4 lamp. Figure 7. Relative luminous intensity vs. angular displacement. T-13/4 low profile lamp. Intensity Bin Limits Color Red Bin G H I J K L M N O P Q R S T U V W X Y Z Intensity Range (mcd) Min. Max. 9.7 15.5 15.5 24.8 24.8 39.6 39.6 63.4 63.4 101.5 101.5 162.4 162.4 234.6 234.6 340.0 340.0 540.0 540.0 850.0 850.0 1200.0 1200.0 1700.0 1700.0 2400.0 2400.0 3400.0 3400.0 4900.0 4900.0 7100.0 7100.0 10200.0 10200.0 14800.0 14800.0 21400.0 21400.0 30900.0 Figure 8. Relative luminous intensity vs. angular displacement. T-1 lamp. Maximum tolerance for each bin limit is ±18%. 7 Intensity Bin Limits (continued) Color Yellow Bin H I J K L M N O P Q R S T U V W A B C D E F G H I J K L M N O P Q R S T U V W Intensity Range (mcd) Min. Max. 26.5 42.3 42.3 67.7 67.7 108.2 108.2 173.2 173.2 250.0 250.0 360.0 360.0 510.0 510.0 800.0 800.0 1250.0 1250.0 1800.0 1800.0 2900.0 2900.0 4700.0 4700.0 7200.0 7200.0 11700.0 11700.0 18000.0 18000.0 27000.0 1.1 1.8 1.8 2.9 2.9 4.7 4.7 7.6 7.6 12.0 12.0 19.1 19.1 30.7 30.7 49.1 49.1 78.5 78.5 125.7 125.7 201.1 201.1 289.0 289.0 417.0 417.0 680.0 680.0 1100.0 1100.0 1800.0 1800.0 2700.0 2700.0 4300.0 4300.0 6800.0 6800.0 10800.0 10800.0 16000.0 16000.0 25000.0 25000.0 40000.0 Color Categories Color Emerald Green Cat # 9 8 7 6 6 5 4 3 2 1 3 2 4 5 1 2 3 4 5 6 7 8 Lambda (nm) Min. 552.5 555.5 558.5 561.5 561.5 564.5 567.5 570.5 573.5 582.0 584.5 587.0 589.5 592.0 597.0 599.5 602.0 604.5 607.5 610.5 613.5 616.5 Max. 555.5 558.5 561.5 564.5 564.5 567.5 570.5 573.5 576.5 584.5 587.0 589.5 592.0 593.0 599.5 602.0 604.5 607.5 610.5 613.5 616.5 619.5 Green Yellow Orange Green/ Emerald Green Maximum tolerance for each bin limit is ±0.5 nm. Maximum tolerance for each bin limit is ±18%. 8 Mechanical Option Matrix Mechanical Option Code 00 01 02 A1 A2 B1 B2 BJ EG FH VR Definition Bulk Packaging, minimum increment 500 pcs/bag Tape & Reel, crimped leads, min. increment 1300 pcs/bag for T-13/4, 1800 pcs/bag for T-1 Tape & Reel, straight leads, min. increment 1300 pcs/bag for T-13/4, 1800 pcs/bag for T-1 T-1, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag T-1, Right Angle Housing, even leads, minimum increment 500 psc/bag T-13/4, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag T-13/4, Right Angle Housing, even leads, minimum increment 500 psc/bag T-1, Tape & Reel, straight leads, minimum increment 2000 pcs/bag Ammo Pack, straight leads in 5 K increment Devices that require inventory control and 2 Iv bin select Ammo Pack, crimped leads, min. increment 2 k for T-13/4 and T-1 Note: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representative for further clarification/information. 9 Precautions Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. • Recommended soldering conditions: Wave Soldering 105 °C Max. 30 sec Max. 250 °C Max. 3 sec Max. Manual Solder Dipping – – 260 °C Max. 5 sec Max. • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25° C, before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Recommended PC board plated through hole sizes for LED component leads: LED Component Lead Size 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) Diagonal 0.646 mm (0.025 inch) 0.718 mm (0.028 inch) Plated Through Hole Diameter 0.976 to 1.078 mm (0.038 to 0.042 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) Pre-heat Temperature Pre-heat Time Peak Temperature Dwell Time Note: Refer to application note AN1027 for more information on soldering LED components. TURBULENT WAVE 250 LAMINAR WAVE HOT AIR KNIFE BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD TEMPERATURE – °C 200 150 FLUXING CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150°C (100°C PCB) SOLDER WAVE TEMPERATURE = 245°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40° SOLDER: SN63; FLUX: RMA NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. 100 50 30 0 10 PREHEAT 20 30 40 50 60 70 80 90 100 TIME – SECONDS Figure 8. Recommended wave soldering profile. 10 www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/International), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright © 2005 Agilent Technologies, Inc. Obsoletes 5989-2810 November 12, 2005 5989-4254EN
HLMP-1540 价格&库存

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