HBAW56

HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HN200216 Issued Date : 1998.07.27 Revised Date : 2002.10.24 Page No. : 1/3 HBAW56 HIGH-CONDUCTANCE ULTRA DIODE Description The HBAW56 consists of two high-speed switching diodes with common anodes, fabricated in planar technology, and encapsulated in the small plastic SMD SOT23 package. SOT-23 Features • Small SMD Package (SOT-23) • Ultra-high Speed • Low Forward Voltage • Fast Reverse Recovery Time Absolute Maximum Ratings • Maximum Temperatures Storage Temperature ............................................................................................ -65 ~ +150 °C Junction Temperature .................................................................................................... +150 °C • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) ................................................................................ 250 mW • Maximum Voltages and Currents (Ta=25°C) Reverse Voltage .................................................................................................................. 85 V Repetitive Reverse Voltage ................................................................................................. 75 V Forward Current ............................................................................................................. 215 mA Repetitive Forward Current ........................................................................................... 125 mA Forward Surge Current (1ms)......................................................................................... 450 mA Characteristics (Ta=25°C) Characteristic Forward Voltage Reverse Current Total Capacitance Reverse Recovery Time Symbol VF(1) VF(2) VF(3) VF(4) IR CT Trr Condition IF=1mA IF=10mA IF=50mA IF=150mA VR=75V VR=0, f=1MHz IF=IR=10mA, RL=100Ω measured at IR=1mA Min Max 715 855 1000 1250 1 2 4 Unit mV mV mV mV uA pF nS HBAW56 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Forward Biased Voltage & Forward Current 450 Spec. No. : HN200216 Issued Date : 1998.07.27 Revised Date : 2002.10.24 Page No. : 2/3 Capacitance & Reverse-Biased Voltage 1 300 150 0 0 500 1000 1500 2000 Capacitance-Cd (pF) 0.1 0.1 1 10 100 Current-IF (mA) Forward Biased Voltage-VF(mV) Reverse Biased Voltage-V R (V) Power Derating 300 250 PD(mW), Power Dissipation 200 150 100 50 0 0 20 40 o 60 80 100 120 140 160 Ta( C ), Ambient Temperature HBAW56 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. SOT-23 Dimension Diagram: L Spec. No. : HN200216 Issued Date : 1998.07.27 Revised Date : 2002.10.24 Page No. : 3/3 A Marking: 3 BS 1 V G 2 A1 Rank Code Control Code 3-Lead SOT-23 Plastic Surface Mounted Package HSMC Package Code: N C D H K J Style: Pin 1.Cathode 2.Cathode 3.Common Anode *: Typical DIM A B C D G H Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040 Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10 DIM J K L S V Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256 Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65 Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: • Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HBAW56 HSMC Product Specification