HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6828 Issued Date : 1993.12.07 Revised Date : 2002.10.24 Page No. : 1/3
HBC846
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HBC846 is designed for switching and AF amplifier amplification suitable for automatic insertion in thick and thin-film circuits.
Absolute Maximum Ratings
SOT-23
• Maximum Temperatures Storage Temperature .......................................................................................... -55 to +150 °C Junction Temperature.................................................................................................... +150 °C • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) ............................................................................... 225 mW • Maximum Voltages and Currents (Ta=25°C) VCBO Collector to Base Voltage ......................................................................................... 80 V VCEO Collector to Emitter Voltage...................................................................................... 65 V VEBO Emitter to Base Voltage.............................................................................................. 6 V IC Collector Current ....................................................................................................... 100 mA
Characteristics (Ta=25°C)
Symbol BVCBO BVCEO BVEBO ICBO *VCE(sat)1 *VCE(sat)2 *VBE(sat)1 *VBE(sat)2 VBE(on)1 VBE(on)2 *hFE fT Cob Min. 80 65 6 580 110 Typ. 90 200 700 900 300 3.5 Max. 15 250 600 700 770 800 6 Unit V V V nA mV mV mV mV mV mV MHz pF Test Conditions IC=100uA IC=1mA IE=10uA VCB=30V IC=10mA, IB=0.5mA IC=100mA, IB=5mA IC=10mA, IB=0.5mA IC=100mA, IB=5mA VCE=5V, IC=2mA VCE=5V, IC=10mA VCE=5V, IC=2mA VCE=5V, IC=10mA VCB=10V, f=1MHz, IE=0
*Pulse Test: Pulse Width ≤380us, Duty Cycle≤2%
Classification Of hFE
Rank hFE A 110-220 B 200-450 C 420-800
HBC846
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000
100000
Spec. No. : HE6828 Issued Date : 1993.12.07 Revised Date : 2002.10.24 Page No. : 2/3
Saturation Voltage & Collector Current
10000
100
Saturation Voltage (mV)
hFE @ V CE=5V
hFE
1000
V BE(sat) @ IC = 20IB
10
V CE(sat) @ IC=20IB 100
1 0.1 1 10 100 1000
10 0.1 1 10 100 1000
Collector Current (mA)
Collector Current (mA)
On Voltage & Collector Current
10000 10
Capacitance & Reverse-Biased Voltage
Capacitance (pF)
On Voltage (mV)
Cob 1
1000 V BE(on) @ V CE=5V
100 0.1 1 10 100 1000
0.1 0.1
1
10
100
Collector Current (mA)
Reverse-Biased Voltage (V)
Cutoff Frequency & Collector Current
1000 10000
Safe Operating Area
PT=1ms 1000 PT=100ms PT=1s 100
V CE=5V
100
Collector Current-IC (mA)
100
Cutoff Frequence (MHz)
10
10 1 10
1 1 10 100
Collector Current (mA)
Forward Voltage-Vce (V)
HBC846
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Spec. No. : HE6828 Issued Date : 1993.12.07 Revised Date : 2002.10.24 Page No. : 3/3
A L
Marking:
3 BS 1 V G 2
8A
Rank Code Control Code
3-Lead SOT-23 Plastic Surface Mounted Package HSMC Package Code: N
C
D
H
K
J
Style: Pin 1.Base 2.Emitter 3.Collector *: Typical
DIM A B C D G H
Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040
Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10
DIM J K L S V
Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256
Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HBC846
HSMC Product Specification
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