HBC856

HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6832 Issued Date : 1994.02.03 Revised Date : 2002.10.24 Page No. : 1/3 HBC856 PNP EPITAXIAL PLANAR TRANSISTOR Description The HBC856 is designed for switching and AF amplifier amplification suitable for automatic insertion in thick and thin-film circuits. Absolute Maximum Ratings SOT-23 • Maximum Temperatures Storage Temperature .......................................................................................... -55 to +150 °C Junction Temperature.................................................................................................... +150 °C • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) ............................................................................... 225 mW • Maximum Voltages and Currents (Ta=25°C) VCBO Collector to Base Voltage ........................................................................................ -80 V VCEO Collector to Emitter Voltage..................................................................................... -65 V VEBO Emitter to Base Voltage............................................................................................. -5 V IC Collector Current....................................................................................................... -100 mA Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO *VCE(sat)1 *VCE(sat)2 *VBE(sat)1 *VBE(sat)2 VBE(on)1 VBE(on)2 *hFE fT Cob Min. -80 -65 -5 -600 75 Typ. -75 -250 -700 -850 150 4.5 Max. -15 -300 -650 -750 -820 800 Unit V V V nA mV mV mV mV mV mV MHz pF Test Conditions IC=-100uA IC=-1mA IE=-10uA VCB=-30V IC=-10mA, IB=-0.5mA IC=-100mA, IB=-5mA IC=-10mA, IB=-0.5mA IC=-100mA, IB=-5mA VCE=-5V, IC=-2mA VCE=-5V, IC=-10mA VCE=-5V, IC=-2mA VCE=-5V, IC=-10mA VCB=-10V, f=1MHz *Pulse Test: Pulse Width ≤380us, Duty Cycle≤2% Classification Of hFE Rank hFE A 125-250 B 220-475 C 420-800 Normal 75-475 HBC856 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 10 Spec. No. : HE6832 Issued Date : 1994.02.03 Revised Date : 2002.10.24 Page No. : 2/3 Saturation Voltage & Collector Current VCE=5V 100 Saturation Voltage (V) 1 hFE 10 0.1 V CE(sat) @ IC=20IB 1 0.01 0.1 1 10 100 0.01 0.01 0.1 1 10 100 Collector Current (mA) Collector Current (mA) On Voltage & Collector Current 10 1000 Cutoff Frequency & Collector Current Cutoff Frequnce (MHz) 1 V CE=5V On Voltage (V) VBE(on) @ VCE=5V 100 0.1 0.01 0.01 10 0.1 1 10 100 1 10 100 Collector Current (mA) Collector Current (mA) Capacitance & Reverse-Biased Voltage 10 10000 Safe Operation Area PT=1ms Collector Current-IC (mA) Cob 1000 PT=100ms 100 PT=1s Capacitance (pF) 1 10 0.1 0.1 1 10 100 1 1 10 100 Reverse-Biased Voltage (V) Forward Biased Voltage-VCE (V) HBC856 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. SOT-23 Dimension Spec. No. : HE6832 Issued Date : 1994.02.03 Revised Date : 2002.10.24 Page No. : 3/3 A L Marking: 3 BS 1 V G 2 9A Rank Code Control Code 3-Lead SOT-23 Plastic Surface Mounted Package HSMC Package Code: N C D H K J Style: Pin 1.Base 2.Emitter 3.Collector *: Typical DIM A B C D G H Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040 Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10 DIM J K L S V Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256 Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65 Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: • Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HBC856 HSMC Product Specification