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HBD136

HBD136

  • 厂商:

    HSMC

  • 封装:

  • 描述:

    HBD136 - PNP POWER TRANSISTORS - Hi-Sincerity Mocroelectronics

  • 数据手册
  • 价格&库存
HBD136 数据手册
HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : Preliminary Data Issued Date : 2001.08.01 Revised Date : 2001.08.24 Page No. : 1/3 HBD136 PNP POWER TRANSISTORS Description PNP power transistor in a TO-126 plastic package. NPN complements: HBD135 Features • High Current (max. 1.5A) • Low Voltage (max. 80V) Applications General purpose power applications, e.g. driver stages in hi-fi amplifiers and television circuits. Limiting Values Symbol VCBO VCEO VEBO IC ICM IBM PD Tstg Tj Tamb Parametor Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current (DC) Peak Collector Current Peak Base Current Total Dissipation at Storage Temperature Junction Temperature Operating Ambient Temperature Conditions Open Emitter Open Base Open Collector Min. -65 -65 Max. -45 -45 -5 -1.5 -2 -1 1.2 15 150 150 150 Unit V V V A A A W W °C °C °C Ta=25°C Tc=25°C - Electrical Characteristics (Tj=25°C, unless otherwise specified) Symbol ICBO IEBO *VCE(sat) *VBE hFE fT *hFE1/hFE2 Parameter Collector Cut-off Current Emitter Cut-off Current Collector-Emitter Saturation Voltage Base-Emitter Voltage DC Current Gain Transition Frequency DC current gain ratio of the complementary pairs Conditions IE=0, VCB=-30V IC=0, VEB=-5V IC=-500mA, IB=-50mA IC=-500mA, VCE=-2V VCE=-2V, IC=-5mA VCE=-2V, IC=-150mA VCE=-2V, IC=-500mA, IC=-50mA, VCE=-5V, f=100MHz |IC|=150mA, |VCE|=2V Min. 40 63 25 Typ. Max. -100 -100 230 1 -0.5 -1 250 1.6 Unit nA nA V V MHz - *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% HBD136 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 1000 Spec. No. : Preliminary Data Issued Date : 2001.08.01 Revised Date : 2001.08.24 Page No. : 2/3 Saturation Voltage & Collector Current 100 hFE @ VCE=2V Saturation Voltage (mV) hFE 100 VCE(sat) @ IC=10IB 10 0.1 1 10 100 1000 10000 10 1 10 100 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collector Current 1000 ON Voltage & Collector Current 1000 VBE(sat) @ IC=10IB Saturation Voltage (mV) VBE(on) @ VCE=2V ON Voltage (mV) 100 1 10 100 1000 10000 100 0.1 1 10 100 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) Safe Operating Arae 10 Collector Current-IC (A) 1 PT=1mS PT=100mS 0.1 PT=1S 0.01 1 10 100 1000 Forward Voltage (V) HBD136 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-126 Dimension D A B 123 G C I E J K M Spec. No. : Preliminary Data Issued Date : 2001.08.01 Revised Date : 2001.08.24 Page No. : 3/3 Marking : α3 Date Code H BD 136 Control Code α4 Laser Marking Style : Pin 1.Emitter 2.Collector 3.Base F H L α1 α2 3-Lead TO-126 Plastic Package HSMC Package Code : T *:Typical DIM α1 α2 α3 α4 A B C D E Inches Min. Max. *3° *3° *3° *3° 0.1500 0.1539 0.2752 0.2791 0.5315 0.6102 0.2854 0.3039 0.0374 0.0413 Millimeters Min. Max. *3° *3° *3° *3° 3.81 3.91 6.99 7.09 13.50 15.50 7.52 7.72 0.95 1.05 DIM F G H I J K L M Inches Min. Max. 0.0280 0.0319 0.0480 0.0520 0.1709 0.1890 0.0950 0.1050 0.0450 0.0550 0.0450 0.0550 *0.0217 0.1378 0.1520 Millimeters Min. Max. 0.71 0.81 1.22 1.32 4.34 4.80 2.41 2.66 1.14 1.39 1.14 1.39 *0.55 3.50 3.86 Notes : 1.Dimension and tolerance based on our Spec. dated Mar. 6,1995. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : • Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 • Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 HBD136 HSMC Product Specification
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