HI13003

HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE9034 Issued Date : 1999.03.17 Revised Date : 2002.05.08 Page No. : 1/3 HI13003 NPN EPITAXIAL PLANAR TRANSISTOR Description These devices are designed for high-voltage, high-speed power switching inductive circuits where fall time is critical. They are particularly suited for 115 and 220V switchmode applications such as Switching Regulators, Inverters, Motor Controls, Solenoid/Relay drivers and Deflection circuits. TO-251 Absolute Maximum Ratings (Ta=25°C) • Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 °C Junction Temperature ...................................................................................... 150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Tc=25°C) ..................................................................................... 40 W Total Power Dissipation (Ta=25°C) .................................................................................... 1.3 W • Maximum Voltages and Currents (Ta=25°C) BVCEV Collector to Emitter Voltage .................................................................................. 700 V VCEO Collector to Emitter Voltage .................................................................................... 400 V VEBO Emitter to Base Voltage .............................................................................................. 9 V IC Collector Current ........................................................................................................... 1.5 A Characteristics (Ta=25°C) Symbol BVCEO BVCEV IEBO ICEV *VCE(sat)1 *VCE(sat)2 *VCE(sat)3 *VBE(sat)1 *VBE(sat)2 *hFE1 *hFE2 Cob Min. 400 700 8 5 Typ. 21 Max. 1 1 0.5 1 3 1 1.2 40 25 Unit V V mA mA V V V V V Test Conditions IC=10mA IC=1mA, VBE(OFF)=1.5V VEB=9V VCE=700V, VBE(OFF)=1.5V IC=0.5A, IB=0.1A IC=1A, IB=0.25A IC=1.5A, IB=0.5A IC=0.5A, IB=0.1A IC=1A, IB=0.25A IC=0.5A, VCE=2V VCE=2V, IC=1A VCB=10V, IE=0, f=1MHz pF *Pulse Test: Pulse Width ≤380us, Duty Cycle≤2% HI13003 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 100 Spec. No. : HE9034 Issued Date : 1999.03.17 Revised Date : 2002.05.08 Page No. : 2/3 Saturation Voltage & Collector Current 1000 VCE(sat) @ IC=3IB 125 C o 75 C o Saturation Voltage (mV) 75 C o 25 C o hFE 10 100 125 C o hFE @ VCE=2V 25 C o 1 0.1 1 100 Collector Current-IC (mA) 10 1000 10000 10 1 10 100 1000 10000 Collector Current-IC (mA) Saturation Voltage & Collector Current 10000 VCE(sat) @ IC=4IB 10000 Saturation Voltage & Collector Current VCE(sat) @ IC=5IB Saturation Voltage (mV) 1000 75 C 125 C 100 o o Saturation Vpltage (mV) 1000 75 C 125 C 100 25 C o o o 25 C o 10 1 10 100 1000 10000 10 1 10 100 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collector Current 10000 VBE(sat) @ IC=4IB Saturation Voltage & Collector Current 10000 VBE(sat) @ IC=5IB Saturation Voltage (mV) Saturation Voltage (mV) 75 C 1000 25 C o o 75 C 1000 25 C o o 125 C o 125 C o 100 1 10 100 1000 10000 100 1 10 100 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) HI13003 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-251 Dimension Marking: Spec. No. : HE9034 Issued Date : 1999.03.17 Revised Date : 2002.05.08 Page No. : 3/3 A B C D H I 13003 Date Code Control Code F 3 I E K 2 1 G Style: Pin 1.Base 2.Collector 3.Emitter H J 3-Lead TO-251 Plastic Package HSMC Package Code: I *: Typical DIM A B C D E F Inches Min. Max. 0.0177 0.0217 0.0354 0.0591 0.0177 0.0236 0.0866 0.0945 0.2520 0.2677 0.2677 0.2835 Millimeters Min. Max. 0.45 0.55 0.90 1.50 0.45 0.60 2.20 2.40 6.40 6.80 6.80 7.20 DIM G H I J K Inches Min. Max. 0.2559 *0.1811 0.0354 0.0315 0.2047 0.2165 Millimeters Min. Max. 6.50 *4.60 0.90 0.80 5.20 5.50 Notes: 1.Dimension and tolerance based on our Spec. dated May. 24,1995. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: • Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HI13003 HSMC Product Specification