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HI3669

HI3669

  • 厂商:

    HSMC

  • 封装:

  • 描述:

    HI3669 - NPN EPITAXIAL PLANAR TRANSISTOR - Hi-Sincerity Mocroelectronics

  • 数据手册
  • 价格&库存
HI3669 数据手册
HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE9029-B Issued Date : 1997.11.14 Revised Date : 2000.11.01 Page No. : 1/3 HI3669 NPN EPITAXIAL PLANAR TRANSISTOR Description The HI3669 is designed for using in power amplifier applications, power switching application. Absolute Maximum Ratings (Ta=25°C) • Maximum Temperatures Tstg Storage Temperature .................................................................................... -55 ~ +150 °C Tj Junction Temperature ................................................................................................ +150 °C • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) ................................................................................. 1.25 W • Maximum Voltages and Currents BVCBO Collector to Base Breakdown Voltage ................................................................... 80 V BVCEO Collector to Emitter Breakdown Voltage ................................................................ 80 V BVEBO Emitter to Base Emitter Breakdown Voltage............................................................ 5 V IC Collector Current (DC)...................................................................................................... 2 A Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE fT Cob Ton Tstg Tf Min. 80 80 5 300 Typ. 0.15 0.9 100 30 0.2 1.0 0.2 Max. 1000 1000 0.5 1.2 Unit V V V nA nA V V MHz pF uS uS uS Test Conditions IC=100uA IC=10mA IE=100uA VCB=80V VEB=5V IC=1A, IB=50mA IC=1A, IB=50mA VCE=2V, IC=500mA VCE=2V, IC=500mA VCB=10V, f=1MHz IB1=-IB2=50mA, Duty Cycle≤1% *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 10000 100000 Spec. No. : HE9029-B Issued Date : 1997.11.14 Revised Date : 2000.11.01 Page No. : 2/3 Saturation Voltage & Collector Current VCE=10V 100 Saturation Voltage (mV) 1000 10000 hFE 1000 10 100 VCE(sat) @ IC=20IB 1 0.1 1 10 100 1000 10000 10 0.1 1 10 100 1000 10000 Collector Current (mA) Collector Current (mA) Saturation Voltage & Collector Current 10000 Capacitance & Reverse-Biased Voltage 100.0 Saturation Voltage (mV) 1000 Capacitance (pF) 10.0 Cob VBE(sat) @ IC=20IB 100 0 1 10 100 1000 10000 1.0 0.1 Collector Current (mA) 1.0 10.0 Reverse Biased Voltage (V) 100.0 Safe Operating Area 100000 10000 Collector Current (mA) 1000 100 PT=1ms PT=100ms PT=1s 10 1 1 10 100 1000 Forward Voltage (V) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-251 Dimension Marking : HSMC Logo Spec. No. : HE9029-B Issued Date : 1997.11.14 Revised Date : 2000.11.01 Page No. : 3/3 A B C D Product Series Rank Part Number Date Code Ink Mark F 3 I E K 2 1 G Style : Pin 1.Base 2.Collector 3.Emitter H J 3-Lead TO-251 Plastic Package HSMC Package Code : I *:Typical DIM A B C D E F Inches Min. Max. 0.0177 0.0217 0.0354 0.0591 0.0177 0.0236 0.0866 0.0945 0.2520 0.2677 0.2677 0.2835 Millimeters Min. Max. 0.45 0.55 0.90 1.50 0.45 0.60 2.20 2.40 6.40 6.80 6.80 7.20 DIM G H I J K Inches Min. Max. 0.2559 *0.1811 0.0354 0.0315 0.2047 0.2165 Millimeters Min. Max. 6.50 *4.60 0.90 0.80 5.20 5.50 Notes : 1.Dimension and tolerance based on our Spec. dated May. 24,1995. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : • Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 • Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 • Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification
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