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HJ3669

HJ3669

  • 厂商:

    HSMC

  • 封装:

  • 描述:

    HJ3669 - NPN EPITAXIAL PLANAR TRANSISTOR - Hi-Sincerity Mocroelectronics

  • 数据手册
  • 价格&库存
HJ3669 数据手册
HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6021-B Issued Date : 1996.04.15 Revised Date : 2000.11.01 Page No. : 1/3 HJ3953 NPN EPITAXIAL PLANAR TRANSISTOR Description High-definition CRT display video output, wide-band amp, Features • High fT: fT =400MHz • High breakdown voltage: VCEO=120V (min) • Small reverse transfer capacitance and excellent HF response Absolute Maximum Ratings (Ta=25°C) • Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 °C Junction Temperature .................................................................................................... +150 °C • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) ................................................................................... 1.3 W • Maximum Voltages and Currents BVCEO Collector to Emitter Voltage................................................................................. 120 V BVCBO Collector to Emitter Voltage................................................................................. 120 V BVEBO Emitter to Base Voltage ........................................................................................... 3 V IC Collector Current (DC)............................................................................................... 200 mA Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 fT Cob Min. 120 120 3 60 40 400 2.1 Typ. 160 Max. 100 100 1 1 320 Unit V V V nA nA V V Test Conditions IC=100uA, IE=0 IC=1mA, IB=0 IE=100uA, IC=0 VCB=80V, IE=0 VEB=2V, IC=0 IC=30mA, IB=3mA IC=30mA, IB=3mA VCE=10V, IC=10mA VCE=10V, IC=100mA VCE=10V, IC=50mA VCB=30V, f=1MHz *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% MHz pF Classification Of hFE1 Rank Range D 60-120 E 100-200 F 160-320 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 Spec. No. : HE6021-B Issued Date : 1996.04.15 Revised Date : 2000.11.01 Page No. : 2/3 Saturation Voltage & Collector Current 1000 Saturation Voltage (mV) 100 VCE=10V hFE 100 VCE(sat) @ IC=10IB 10 10 0.1 1 10 100 1000 1 0.1 1 10 100 1000 Collector Current (mA) Collector Current (mA) Saturation Voltage & Collector Current 1000 10 Output Capacitance & Reverse-Biased Voltage Saturation Voltage (mV) VBE(sat) @ IC=10IB Capacitance (Pf) Cob 100 0.1 1 10 100 1000 1 0.1 1 10 100 Collector Current (mA) Reverse-Biased Voltage (V) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-252 Dimension A C Spec. No. : HE6021-B Issued Date : 1996.04.15 Revised Date : 2000.11.01 Page No. : 3/3 Marking : HSMC Logo Part Number Date Code Product Series Rank B D L F G Ink Mark Style : Pin 1.Base 2.Collector 3.Emitter 3 H E K 2 I 1 J 3-Lead TO-252 Plastic Surface Mount Package HSMC Package Code : J *:Typical DIM A B C D E F Inches Min. Max. 0.0177 0.0217 0.0650 0.0768 0.0354 0.0591 0.0177 0.0236 0.2520 0.2677 0.2125 0.2283 Millimeters Min. Max. 0.45 0.55 1.65 1.95 0.90 1.50 0.45 0.60 6.40 6.80 5.40 5.80 DIM G H I J K L Inches Min. Max. 0.0866 0.1102 *0.0906 0.0354 0.0315 0.2047 0.2165 0.0551 0.0630 Millimeters Min. Max. 2.20 2.80 *2.30 0.90 0.80 5.20 5.50 1.40 1.60 Notes : 1.Dimension and tolerance based on our Spec. dated May. 05,1996. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : • Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 • Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 • Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification
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