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HJ6668

HJ6668

  • 厂商:

    HSMC

  • 封装:

  • 描述:

    HJ6668 - PNP EPITAXIAL PLANAR TRANSISTOR - Hi-Sincerity Mocroelectronics

  • 数据手册
  • 价格&库存
HJ6668 数据手册
HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : Preliminary Data Issued Date : 1999.03.01 Revised Date : 2000.11.01 Page No. : 1/3 HJ6668 PNP EPITAXIAL PLANAR TRANSISTOR Description The HJ6668 is designed for general-purpose amplifier and switching applications. Absolute Maximum Ratings (Ta=25°C) • Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 °C Junction Temperature ................................................................................... +150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Tc=25°C) .................................................................................... 65 W • Maximum Voltages and Currents BVCBO Collector to Base Voltage ..................................................................................... -80 V BVCEO Collector to Emitter Voltage.................................................................................. -80 V BVEBO Emitter to Base Voltage .......................................................................................... -5 V IC Collector Current ........................................................................................................... -10 A Characteristics (Ta=25°C) Symbol BVCBO BVCEO IEBO ICEO ICEV *VCE(sat)1 *VCE(sat)2 *VBE(on)1 *VBE(on)2 *hFE1 *hFE2 Min. -80 -80 1 100 Typ. Max. -100 -1 -300 -2 -3 -2.8 -4.5 20 Unit V V mA mA uA V V V V K Test Conditions IC=-10mA IC=-200mA VEB=-5V VCE=-80V VCE=-80V, VBE(off)=-1.5V IC=-5A, IB=-10mA IC=-10A, IB=-100mA IC=-5A, VCE=-3V IC=-10A, VCE=-3V IC=-5A, VCE=-3V IC=-10A, VCE=-3V *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 10000 10000 Spec. No. : Preliminary Data Issued Date : 1999.03.01 Revised Date : 2000.11.01 Page No. : 2/3 Saturation Voltage & Collector Current Saturation Voltage (mV) 1000 hFE @ VCE=3V VBE(sat) @ IC=100IB hFE 100 1000 VCE(sat) @ IC=100IB 10 1 1 10 100 1000 10000 100 10 100 1000 10000 Collector Current (mA) Collector Current (mA) On Voltage & Collector Current 10000 10 Switching Time & Collector Current VCC=30V, IC=250IB1=-250IB2 Switching Times (us) On Voltage (mV) Tstg 1 Tf Ton 1000 VBE(on) @ VCE=3V 100 10 100 1000 10000 0.1 1 10 Collector Current (mA) Collector Current (A) Capacitance & Reverse-Biased Voltage 1000 Capacitance (pF) 100 Cob 10 0.1 1 10 100 Reverse-Biased Voltage (V) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-252 Dimension A C Spec. No. : Preliminary Data Issued Date : 1999.03.01 Revised Date : 2000.11.01 Page No. : 3/3 Marking : HSMC Logo Part Number Date Code Product Series Rank B D L F G Ink Mark Style : Pin 1.Base 2.Collector 3.Emitter 3 H E K 2 I 1 J 3-Lead TO-252 Plastic Surface Mount Package HSMC Package Code : J *:Typical DIM A B C D E F Inches Min. Max. 0.0177 0.0217 0.0650 0.0768 0.0354 0.0591 0.0177 0.0236 0.2520 0.2677 0.2125 0.2283 Millimeters Min. Max. 0.45 0.55 1.65 1.95 0.90 1.50 0.45 0.60 6.40 6.80 5.40 5.80 DIM G H I J K L Inches Min. Max. 0.0866 0.1102 *0.0906 0.0354 0.0315 0.2047 0.2165 0.0551 0.0630 Millimeters Min. Max. 2.20 2.80 *2.30 0.90 0.80 5.20 5.50 1.40 1.60 Notes : 1.Dimension and tolerance based on our Spec. dated May. 05,1996. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : • Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 • Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 • Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification
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