HLM358

HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : IC200409 Issued Date : 2004.05.01 Revised Date : 2004.05.14 Page No. : 1/7 HLM358P / HLM358S LOW POWER DUAL OPERATIONAL AMPLIFIERS Description These devices consist of two independent, high gain, internally frequencycompensated operational amplifiers designed operate from a single supply over a wide range of voltages. Operation from split supplies also is possible if the difference between the two supplies is 3V to 32V, and Vcc is at least 1.5V more positive than the input common-mode voltage, The low supply-current drain is independent of the magnitude of the power supply voltage. 8-Lead Plastic DIP-8 Package Code: P • 8-Lead Plastic SO-8 Package Code: S Features • Two internally compensated OP amps • Internally frequency compensated for unity gain • Short Circuit Protected Outputs • W ide power supply range: 3VDC to 32VDC (Single supply) • Input common-mode voltage range includes ground • Large output voltage swing: 0VDC to Vcc-1.5VDC Logic Diagram (each amplifier) IN + IN - + OUTPUT - Pin Configurations Pin 1: Output 1 1 2 3 4 Out Pin 5 : Non Inverting Input 2 Pin 6 : Inverting Input 2 Pin 7 : Output 2 Pin 8 : Vcc 8 7 Out Pin 2: Inverting Input 1 Pin 3: Non Inverting Input 1 Pin 4: VEE + 6 5 + Schematic Diagram Vcc 6uA 100uA Q5 6uA Q6 Cc Q7 Rsc Q2 Inverting Input + Non Inverting Input Q8 Q9 Q1 Q3 Q4 Q11 Output Q13 Q10 Q12 50uA HLM358P, HLM358S HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Absolute Maximum Ratings (Ta=25oC, unless otherwise specified) Symbol VCC VCC, VEE VIDR VICR tSC TJ Tstg TA PD Parameter Power Supply Voltage (Single Supply) Power Supply Voltage (Split Supplies) Input Differential Voltage Range Input Common Mode Voltage Range Output Short Circuit Duration Junction Temperature Storage Temperature Range Operating Ambient Temperature Range Maximum Power Dissipation (DIP-8) Maximum Power Dissipation (SO-8) Spec. No. : IC200409 Issued Date : 2004.05.01 Revised Date : 2004.05.14 Page No. : 2/7 Range 32 ±16 ±32 -0.3 to +32 Continuous 150 -55 to +125 0 to +70 800 500 Units VDC VDC VDC VDC o C °C °C mW Electrical Characteristics (VCC=5V, VEE=Ground, Ta=25oC, unless otherwise specified) Symbol VIO IIO IIB AVOL CMR CS PSR ∆VIO/∆T ∆IIO/∆T VICR VOH VOL ICC ISource ISink ICC ISC Parameter Input Offset Voltage Input Offset Current Input Bias Current Large Signal Voltage Gain Common-Mode Rejection Ratio Channel Separation Power Supply Rejection Average Temperature Coefficient of Input Offset Voltage Average Temperature Coefficient of Input Offset Current Input Common Mode Voltage Range Output Voltage (High Limit) Output Voltage (Low Limit) Supply current Output Source Current Output Sink Current Power Supply Current Output Short Circuit to Ground Test Conditions VCC=5V~30V, VICR=0V~VCC-1.5V, VO=1.4V, RS=0Ω IIN(+)-IIN(-) IIN(+) or IIN(-) VCC=15V, RL=2KΩ VCM=0V~VCC-1.5V 1KHz≤f≤20KHz VCC=5V~30V RS=0Ω RS=0Ω VCC=30V VCC=30V, RL=2KΩ VCC=30V, RL=10KΩ RL=10KΩ RL=∞,VCC=30V VCC=15V, VIN+=1V, VIN-=0V, VO=2V VCC=15V, VIN+=0V, VIN-=1V, VO=2V VCC=30V, Ta=Thigh to Tlow VCC=5V, Ta=Thigh to Tlow VCC=5V, GND at -5V, VO=0V 26 27 20 10 27 28 5 1 40 20 1 0.6 40 HLM358P/S Min 25 65 65 Typ 2 35 100 85 -120 100 7 10 Max 7 30 200 VCC-2V 20 2 2 1.2 60 Unit mV nA nA V/mV dB dB dB uV/oC pA/oC V V mV mA mA mA mA mA mA HLM358P, HLM358S HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Power Supply Current & Power Supply Voltage 1.8 14 12 10 8 6 4 2 0 1 10 Spec. No. : IC200409 Issued Date : 2004.05.01 Revised Date : 2004.05.14 Page No. : 3/7 Large Signal Frequency Response Ta=25 C R L =∞ 1.2 o 0.9 V OR, Output Voltage Range (Vpp).. . ICC, Power Supply Current (mA).. . 1.5 0.6 0.3 RL=2K VCC=15V VEE=GND AV=-100 RI=1K RF=100K 0 0 5 10 15 20 25 30 35 VCC, Power Supply Voltage (V) 100 1000 f, Frequency (KHz) Large Signal Open Loop Voltage Gain 120 1 8 Voltage Follower Pulse Response Output Voltage (V) .. 3 7 2 6 1 5 0 4 RL≥ 2.0K V+=15VDC AVOI, Open Loop Voltage Gain (dB) ... 100 VCC=15V VEE=Gnd o Ta=25 C 80 60 Input Voltage (V).. 1 10 100 1000 10000 100000 1000000 40 3 2 1 0 20 0 f, Frequency (Hz) 0 5 10 15 20 25 30 35 40 t, Time (us) Small Signal Voltage Follower Pulse Response (Non Inverting) 450 Voltage Gain 140 RL=20K 120 VO, Output Voltage (mV) 400 AVOL, Voltage Gain (dB)... 100 RL=2K 80 60 40 20 0 350 300 VCC=30V VEE=Gnd o Ta=25 C CL=50pF 250 200 0 1 2 3 4 5 6 7 8 0 5 10 15 20 25 30 35 t, Time (us) V+, Supply Voltage (V) HLM358P, HLM358S HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Power Supply Voltage & Input Bias Current 50 45 40 Ta=25 C o Spec. No. : IC200409 Issued Date : 2004.05.01 Revised Date : 2004.05.14 Page No. : 4/7 Input Voltage Range 15 Input Bias Current (nA).. . 35 30 25 20 15 10 5 0 0 5 10 15 20 25 30 35 VIN, Input Voltage (V).. . Negative 10 Positive 5 0 0 5 10 15 Power Supply Voltage (V) V+/V-, Power Supply Voltage (V) Typical Application Circuit Voltage Follower Non Inverting DC Amplifier VIN + 1/2 HLM358 OUT 1/2 HLM358 VIN + 1 10K VO OUT VO - R2 1M R AV=1+R1/R2 DC Summing Amplifier Squarewave Oscillator V1 V2 V3 V4 100K + 100K 100K OUT 1 100K R 1/2 HLM358 100K VO 0.001uF 1/2 HLM358 + OUT VO + 100K 100K VIN R2 100K 1 100K - R R4 100K VO=V1+V2-V3-V4 Where (V1+V2)≥(V3+V4) To keep VO≥0V HLM358P, HLM358S HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Typical Application Circuit Function Generator Spec. No. : IC200409 Issued Date : 2004.05.01 Revised Date : 2004.05.14 Page No. : 5/7 Pulse Generator Vref=1/2VCC + Vref 1/2 HLM358 C Triangle Wave Output 3 100K OUT 1 100K R 1N914 R + R1 2 300K R R2 150K 1/2 HLM358 100K OUT C 0.001uF 100K Square Wave Output 1/2 HLM358 + OUT VO + Rf Vref V+ 3 100K - R R5 100K 4 100K R F=(R1+RC)/4CRfR1 if R3=R2*R1/(R2+R1) DC Coupled Low-Pass RC Active Filter High Input Z, DC Differential Amplifier VIN 1 16K R R2 16K + 1 0.01uF C 1 100K R - 2 100K 3 100K OUT R C2 0.01uF 1/2 HLM358 - OUT VO R3 100K R 1/2 HLM358 V1+ V2+ + - 4 100K R 1/2 HLM358 + OUT VO R4 100K f0=1KHz, Q=1, AV=2 R1/R2=R4/R3 VO=1+R4/R3(V2-V1) As shown VO=2(V2-V1) Active Band-Pass Filter 2 100K 1 100K OUT R R 1/2 HLM358 + 1 330pF 5 470K C R V1+ 4 10M OUT R 1/2 HLM358 + 3 100K R 2 330pF OUT C 1/2 HLM358 + 6 470K R VO 7 100K R R7 1K VCC R8 100K C3 10uF f0=1KHz, Q=50, AV=100 (40dB) HLM358P, HLM358S HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. DIP-8 Dimension Marking: 8 7 6 5 Pb Free Mark Pb-Free: " . " Normal: None (Note) Spec. No. : IC200409 Issued Date : 2004.05.01 Revised Date : 2004.05.14 Page No. : 6/7 DIM A B H L M3 5 8 P Min. 6.29 9.22 3.25 3.17 0.38 2.28 7.49 8.56 0.229 94o Max. 6.40 9.32 *1.52 *1.27 *0.99 3.35 3.55 0.53 2.79 7.74 *3.00 8.81 0.381 97o A 1 2 3 4 C D Control Code Date Code E F G H I J K L M α1 B J F Note: Green label is used for pb-free packing Pin Style: 1.Output 1 2.Inverting input 1 3.Non inverting input 1 4.VEE 5.Non inverting input 2 6.Inverting input 2 7. Output 2 8.VCC C E D G H α1 K M L Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 I 8-Lead DIP-8 Plastic Package HSMC Package Code: P *: Typical, Unit: mm SO-8 Dimension A G Marking: Pb Free Mark Pb-Free: " . " (Note) H Normal: None 8 B 7 6 5 C 4 J H I S L M3 5 8 Control Code Pin 1 Index Date Code Pin1 Index 2 3 Note: Green label is used for pb-free packing Pin Style: 1.Output 1 2.Inverting input 1 3.Non inverting input 1 4.VEE 5.Non inverting input 2 6.Inverting input 2 7. Output 2 8.VCC Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 D E Part A K L N O Part A M DIM A B C D E F G H I J K L M N O Min. 4.85 3.85 5.80 1.22 0.37 3.74 1.45 4.80 0.05 0.30 0.19 0.37 0.23 0.08 0.00 Max. 5.10 3.95 6.20 1.32 0.47 3.88 1.65 5.10 0.20 0.70 0.25 0.52 0.28 0.13 0.15 *: Typical, Unit: mm F 8-Lead SO-8 Plastic Surface Mounted Package HSMC Package Code: S Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HLM358P, HLM358S HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Soldering Methods for HSMC’s Products 1. Storage environment: Temperature=10oC~35oC Humidity=65%±15% 2. Reflow soldering of surface-mount devices Figure 1: Temperature profile tP TP Ramp-up TL Tsmax Temperature tL Spec. No. : IC200409 Issued Date : 2004.05.01 Revised Date : 2004.05.14 Page No. : 7/7 Critical Zone TL to TP Tsmin tS Preheat Ramp-down 25 t 25oC to Peak Time Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Tsmax to TL - Ramp-up Rate Time maintained above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Time within 5oC of actual Peak Temperature (tP) Ramp-down Rate Time 25 C to Peak Temperature 3. Flow (wave) soldering (solder dipping) Products Pb devices. Pb-Free devices. o Sn-Pb Eutectic Assembly