HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6450 Issued Date : 1992.11.25 Revised Date : 2002.04.18 Page No. : 1/3
HM28S
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HM28S is a NPN silicon transistor, designed for use in general-purpose SPEECH SYNTHSIZER (Voice Rom) IC audio output driver stage amplifier applications.
Features
• Excellent hFE Linearity • High DC Current Gain • High Power Dissipation
TO-92
Absolute Maximum Ratings
• Maximum Temperatures Storage Temperature ........................................................................................................ -55 ~ +150 °C Junction Temperature .................................................................................................. 150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Ta=25°C)............................................................................................. 850 mW • Maximum Voltages and Currents (Ta=25°C) VCBO Collector to Base Voltage..................................................................................................... 40 V VCEO Collector to Emitter Voltage ................................................................................................. 20 V VEBO Emitter to Base Voltage.......................................................................................................... 6 V IC Collector Current ..................................................................................................................... 1.25 A IB Base Current ............................................................................................................................. 0.4 A
Characteristics (Ta=25°C)
Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *hFE1 *hFE2 hFE3 hFE4 fT Cob Min. 40 20 6 290 300 300 300 100 Typ. 9 Max. 100 100 0.55 1000 Unit V V V nA nA V Test Conditions IC=100uA, IE=0 IC=1mA, IB=0 IE=100uA, IC=0 VCB=35V, IE=0 VEB=6V, IC=0 IC=600mA, IB=20mA VCE=1V, IC=1mA VCE=1V, IC=0.1A VCE=1V, IC=0.3A VCE=1V, IC=0.5A VCE=10V, IC=50mA, f=1MHz VCB=10V, f=1MHz, IE=0
*Pulse Test: Pulse Width ≤380us, Duty Cycle≤2%
MHz pF
Classification of hFE2
Rank Range
HM28S
B 300-550
C 500-700
D 650-1000
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000 1000 VCE(sat) @ IC=30IB
Spec. No. : HE6450 Issued Date : 1992.11.25 Revised Date : 2002.04.18 Page No. : 2/3
Saturation Voltage & Collector Current
75 C 25 C hFE @ VCE=1V
o
o
Saturation Voltage (mV)
125 C
o
hFE
100 75 C 25 C 125 C
o o o
100 0.1 1 10 100 1000
10 0.1 1 10 100 1000
Collector Current-IC (mA)
Collector Current-IC (mA)
Capacitance & Reverse-Biased Voltage
100 1000
Cutoff Frequency & Collector Current
Cutoff Frequency (MHz).. .
fT 100
Capacitance (pF)
10 Cob
10
1 0.1 1 10 100 1000
1 1 10 100 1000
Reverse Biased Voltage (V)
Collector Current (mA) -VCE=10V
Safe Operating Area
10000
900 800
Power Derating
Collector Current-IC (mA)
1000 PT=1ms PT=100ms 100 PT=1s
Power Dissipation-PD(mW)
700 600 500 400 300 200 100
10
1 1 10 100
0 0 50 100
o
150
200
Forward Biased Voltage-VCE (V)
Ambient Temperature-Ta ( C)
HM28S
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-92 Dimension
A B
1 2 3
Date Code
Spec. No. : HE6450 Issued Date : 1992.11.25 Revised Date : 2002.04.18 Page No. : 3/3
α2
Marking:
H 28S M
Control Code
α3
C
Style: Pin 1.Emitter 2.Collector 3.Base
D
H I E F
G
α1
3-Lead TO-92 Plastic Package HSMC Package Code: A
*: Typical
DIM A B C D E F
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
DIM G H I α1 α2 α3
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5° *2° *2°
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5° *2° *2°
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HM28S
HSMC Product Specification
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