HM3906

HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE9506-B Issued Date : 1996.04.09 Revised Date : 2000.10.01 Page No. : 1/3 HM3906 PNP EPITAXIAL PLANAR TRANSISTOR Description The HM3906 is designed for general purpose switching and amplifier applications. Absolute Maximum Ratings • Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 °C Junction Temperature ................................................................................... +150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) ...................................................................................... 1 W • Maximum Voltages and Currents (Ta=25°C) VCBO Collector to Base Voltage ....................................................................................... -40 V VCEO Collector to Emitter Voltage .................................................................................... -40 V VEBO Emitter to Base Voltage ............................................................................................ -5 V IC Collector Current ..................................................................................................... -200 mA Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICEX *VCE(sat)1 *VCE(sat)2 *VBE(sat)1 *VBE(sat)2 *hFE1 *hFE2 *hFE3 *hFE4 *hFE5 fT Cob Min. -40 -40 -5 -650 60 80 100 60 30 250 Typ. Max. -50 -250 -400 -850 -950 300 4.5 Unit V V V nA mV mV mV mV Test Conditions IC=-100uA IC=-1mA IE=-10uA VCE=-30V, VBE=-3V IC=-10mA, IB=-1mA IC=-50mA, IB=-5mA IC=-10mA, IB=-1mA IC=-50mA, IB=-5mA VCE=-1V, IC=-100uA VCE=-1V, IC=-1mA VCE=-1V, IC=-10mA VCE=-1V, IC=-50mA VCE=-1V, IC=-100mA VCE=-20V, IC=-10mA, f=100MHz VCB=-5V, f=1MHz *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% MHz pF HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 1000 Spec. No. : HE9506-B Issued Date : 1996.04.09 Revised Date : 2000.10.01 Page No. : 2/3 Saturation Voltage & Collector Current hFE hFE @ VCE=1V 100 Saturation Voltage (mV) 100 VCE(sat) @ IC=10IB 10 0.1 1 10 100 1000 10 1 10 100 1000 Collector Current (mA) Collector Current (mA) Saturation Voltage & Collector Current 10000 Cutoff Frequency & Collector Current 1000 Saturation Voltage (mV) Cutoff Frequency (MHz) fT @ VCE=20V 1000 VBE(sat) @ IC=10IB 100 100 1 10 100 1000 10 Collector Current (mA) 1 10 Collector Current (mA) 100 1000 Capacitance & Reverse-Biased Voltage 100 10000 Safe Operating Area PT=1ms 1000 PT=100ms PT=1s Collector Current (A) Cob Capacitance (Pf) 100 10 10 1 0.1 1 0.1 1 10 100 0.01 1 10 100 Reverse Biased Voltage (V) Forward Voltage (V) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. SOT-89 Dimension Marking : Spec. No. : HE9506-B Issued Date : 1996.04.09 Revised Date : 2000.10.01 Page No. : 3/3 C H Date Code Part Number HSMC Logo Package Code B 1 E F G A 2 3 D Style : Pin 1.Base 2.Emitter 3.Collector I 3-Lead SOT-89 Plastic Surface Mounted Package HSMC Package Code : M *:Typical DIM A B C D E Inches Min. Max. 0.1732 0.1811 0.1594 0.1673 0.0591 0.0663 0.0945 0.1024 0.0141 0.0201 Millimeters Min. Max. 4.40 4.60 4.05 4.25 1.50 1.70 2.40 2.60 0.36 0.51 DIM F G H I Inches Min. Max. 0.0583 0.0598 0.1165 0.1197 0.0551 0.0630 0.0138 0.0161 Millimeters Min. Max. 1.48 1.52 2.96 3.04 1.40 1.60 0.35 0.41 Notes : 1.Dimension and tolerance based on our Spec. dated May. 05,1996. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : • Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 • Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 • Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification