HM5401

HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE9503 Issued Date : 1996.04.09 Revised Date : 2002.08.27 Page No. : 1/4 HM5401 PNP EPITAXIAL PLANAR TRANSISTOR Description The HM5401 is designed for general purpose applications requiring high breakdown voltages. Features • High current-emitter breakdown voltage.VCEO=150V(@IC=1mA) • Complements to NPN type HM5551 SOT-89 Absolute Maximum Ratings • Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 °C Junction Temperature .................................................................................... +150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) ....................................................................................... 1 W • Maximum Voltages and Currents (Ta=25°C) VCBO Collector to Base Voltage ...................................................................................... -160 V VCES Collector to Emitter Voltage ................................................................................... -150 V VEBO Emitter to Base Voltage ............................................................................................. -5 V IC Collector Current ...................................................................................................... -600 mA Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat)1 *VCE(sat)2 *VBE(sat)1 *VBE(sat)2 *hFE1 *hFE2 *hFE3 fT Cob Min. -160 -150 -5 50 60 50 100 Max. -50 -50 -0.2 -0.5 -1 -1 240 6 Unit V V V nA nA V V V V Test Conditions IC=-100uA IC=-1mA IE=-10uA VCB=-120V VEB=-5V IC=-10mA, IB=-1mA IC=-50mA, IB=-5mA IC=-10mA, IB=-1mA IC=-50mA, IB=-5mA VCE=-5V, IC=-1mA VCE=-5V, IC=-10mA VCE=-5V, IC=-50mA VCE=-10V, IC=-10mA, f=100MHz VCB=-10V, f=1MHz *Pulse Test: Pulse Width ≤380us, Duty Cycle≤2% MHz pF HM5401 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 o Spec. No. : HE9503 Issued Date : 1996.04.09 Revised Date : 2002.08.27 Page No. : 2/4 Saturation Voltage & Collector Current 100000 VCE(sat) @ IC=10IB 125 C 100 25 C 75 C o o Saturation Voltage (mV) 10000 hFE 1000 75 C 125 C 100 o o 10 25 C o hFE @ VCE=5V 1 1 10 100 1000 10 0.1 1 10 100 1000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collector Current 1000 25 C o Capacitance & Reverse-Biased Voltage 100 Saturation Voltage (mV) 75 C 125 C o o Capacitance (pF) VBE(sat) @ IC=10IB 10 Cob 100 0.1 1 10 100 1000 1 0.1 1 10 100 Collector Current-IC (mA) Reverse Biased Voltage (V) Cutoff Frequency & Collector Current 1000 10000 Safe Operating Area PT=1ms Cutoff Frequency (MHz).. . Collector Current-IC (mA) 1000 PT=100ms PT=1s VCE=10V 100 100 10 10 1 10 100 1000 1 1 10 100 Collector Current (mA) Forward Biased Voltage-VCE (V) HM5401 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE9503 Issued Date : 1996.04.09 Revised Date : 2002.08.27 Page No. : 3/4 PD - Tc 6 1.2 PD - Ta 5 1 PD(W) , Power Dissipation 4 PD(W) , Power Dissipation 0 50 100 150 o 0.8 3 0.6 2 0.4 1 0.2 0 200 0 0 50 100 150 o 200 Temperature-TC( C ) Temperature-Ta ( C ) HM5401 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. SOT-89 Dimension Marking: Spec. No. : HE9503 Issued Date : 1996.04.09 Revised Date : 2002.08.27 Page No. : 4/4 C H Date Code HM 5401 Laser Marking B 1 E F G A 2 3 D Style: Pin 1.Base 2.Collector 3.Emitter I 3-Lead SOT-89 Plastic Surface Mounted Package HSMC Package Code: M *: Typical DIM A B C D E Inches Min. Max. 0.1732 0.1811 0.1594 0.1673 0.0591 0.0663 0.0945 0.1024 0.0141 0.0201 Millimeters Min. Max. 4.40 4.60 4.05 4.25 1.50 1.70 2.40 2.60 0.36 0.51 DIM F G H I Inches Min. Max. 0.0583 0.0598 0.1165 0.1197 0.0551 0.0630 0.0138 0.0161 Millimeters Min. Max. 1.48 1.52 2.96 3.04 1.40 1.60 0.35 0.41 Notes: 1.Dimension and tolerance based on our Spec. dated May. 05,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: • Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HM5401 HSMC Product Specification