HM965

HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE9511 Issued Date : 1996.04.12 Revised Date : 2002.10.01 Page No. : 1/3 HM965 NPN EPITAXIAL PLANAR TRANSISTOR Description The HM965 is designed for use as AF output amplifier and glash unit. Features • Low VCE(sat) • High performance at low supply voltage SOT-89 Absolute Maximum Ratings • Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 °C Junction Temperature .................................................................................... +150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) .................................................................................... 1.2 W • Maximum Voltages and Currents (Ta=25°C) BVCBO Collector to Base Voltage....................................................................................... 40 V BVCEO Collector to Emitter Voltage.................................................................................... 20 V BVEBO Emitter to Base Voltage............................................................................................ 7 V IC Collector Current (Continuous) ......................................................................................... 5 A IC Collector Current (Peak PT=10mS) .................................................................................. 8 A Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *hFE1 *hFE2 fT Cob Min. 40 20 7 340 150 Typ. 0.35 150 Max. 0.1 0.1 1 800 50 Unit V V V uA uA V Test Conditions IC=100uA IC=1mA IE=10uA VCB=10V VEB=7V IC=3A, IB=0.1A VCE=2V, IC=0.5A VCE=2V, IC=2A VCE=6V, IE=50mA VCB=20V, f=1MHz *Pulse Test: Pulse Width ≤380us, Duty Cycle≤2% MHz pF Classifications Of hFE1 Rank Range R 340-600 S 560-800 HM965 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 10000 1000 Spec. No. : HE9511 Issued Date : 1996.04.12 Revised Date : 2002.10.01 Page No. : 2/3 Saturation Voltage & Collector Current VCE(sat) @ IC=30IB 125 C o 1000 25 C 75 C 100 o o Saturation Voltage (mV) HFE 100 75 C 125 C o o 25 C o hFE @ VCE=2V 10 10 100 1000 10000 10 1 10 100 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) Capacitance & Reverse-Biased Voltage 100 1000 Cutoff Frequency & Collector Current Cutoff Frequency (MHz).. . Capacitance (pF) 100 VCE=6V Cob 10 0.1 1 10 100 10 1 10 100 1000 Reverse-Biased Voltage (V) Collector Current (mA) Safe Operating Area 100000 PT=1ms Collector Current-IC (mA) 10000 PT=100ms 1000 PT=1s 100 10 1 10 100 Forward Biased Voltage-VCE (V) HM965 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. SOT-89 Dimension Marking: Spec. No. : HE9511 Issued Date : 1996.04.12 Revised Date : 2002.10.01 Page No. : 3/3 C H Date Code 965 Laser Marking HM B 1 E F G A 2 3 D Style: Pin 1.Base 2.Collector 3.Emitter I 3-Lead SOT-89 Plastic Surface Mounted Package HSMC Package Code: M *: Typical DIM A B C D E Inches Min. Max. 0.1732 0.1811 0.1594 0.1673 0.0591 0.0663 0.0945 0.1024 0.0141 0.0201 Millimeters Min. Max. 4.40 4.60 4.05 4.25 1.50 1.70 2.40 2.60 0.36 0.51 DIM F G H I Inches Min. Max. 0.0583 0.0598 0.1165 0.1197 0.0551 0.0630 0.0138 0.0161 Millimeters Min. Max. 1.48 1.52 2.96 3.04 1.40 1.60 0.35 0.41 Notes: 1.Dimension and tolerance based on our Spec. dated May. 05,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: • Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HM965 HSMC Product Specification