HMBD2003S

HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6857 Issued Date : 1994.01.25 Revised Date : 2002.10.25 Page No. : 1/2 HMBD2003\C\S Description The HMBD2003\C\S are general purpose diodes fabricated in planar technology, and encapsulated in small plastic SMD SOT-23 package. Features • Small plastic SMD package • Switching speed: max. 50 nS • General application: Continuous reverse voltage: Max. 200 V Repetitive peak reverse voltage: Max. 250 V Repetitive peak forward current: Max. 625 mA SOT-23 Absolute Maximum Ratings (Ta=25°C) Characteristic HMBD2003 Repetitive Peak Reverse Voltage HMBD2003C Repetitive Peak Reverse Voltage HMBD2003S Repetitive Peak Reverse Voltage HMBD2003 Continuous reverse voltage HMBD2003C Continuous reverse voltage HMBD2003S Continuous reverse voltage Forward Continuous Current at Ta=25°C Repetitive Peak Forward Current at Ta=25°C Surge Forward Current at t =1mS, Ta=25°C Power Dissipation Junction Temperature Storage Temperature Range Symbol VRRM Value 250 250 250 200 200 200 225 625 1 250 Max 150 -65~+150 Unit V VR lF IFRM IFSM PD Tj Tstg V mA mA A mV °C °C Characteristics (Ta=25°C) Characteristic Forward Voltage HMBD2003 Reverse Current HMBD2003C Reverse Current HMBD2003S Reverse Current Total Capacitance Reverse Recovery Time BVR Symbol VF(1) VF(2) IR CT Trr BVR Condition IF=100mA IF=200mA VR=200V VR=200V VR=200V VR=0V, f=1MHz IF=30mA to IR=30mA RL=100Ω measured at IR=3mA IR=100uA Min 5 50 250 Max 1 1.25 100 100 100 Unit V nA pF nS V HMBD2003, HMBD2003C, HMBD2003S HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. SOT-23 Dimension Diagram: L 1 3 Spec. No. : HE6857 Issued Date : 1994.01.25 Revised Date : 2002.10.25 Page No. : 2/2 A Marking: A82 2 1 2 3 3 HMBD2003 3 HMBD2003 BS 1 V G 2 1 2 1 2 C3C C3S HMBD2003C HMBD2003S HMBD2003C HMBD2003S 3-Lead SOT-23 Plastic Surface Mounted Package HSMC Package Code: N C D H K J *: Typical DIM A B C D G H Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040 Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10 DIM J K L S V Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256 Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65 Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: • Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HMBD2003, HMBD2003C, HMBD2003S HSMC Product Specification