HSB1109S

HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6514 Issued Date : 1993.03.15 Revised Date : 2002.02.06 Page No. : 1/4 HSB1109S PNP EPITAXIAL PLANAR TRANSISTOR Description The HSB1109S is designed for low frequency and high voltage amplifier applications complementary pair with HSD1609S. Absolute Maximum Ratings TO-92 • Maximum Temperatures Storage Temperature ............................................................................................ -50 ~ +150 °C Junction Temperature .................................................................................... +150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) ................................................................................ 900 mW • Maximum Voltages and Currents (Ta=25°C) VCBO Collector to Base Voltage ...................................................................................... -160 V VCEO Collector to Emitter Voltage ................................................................................... -160 V VEBO Emitter to Base Voltage ............................................................................................. -5 V IC Collector Current ...................................................................................................... -100 mA Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO *VCE(sat) VBE(on) *hFE1 *hFE2 fT Cob Min. -160 -160 -5 60 30 Typ. 140 5.5 Max. -10 -2 -1.5 320 Unit V V V uA V V Test Conditions IC=-10uA, IE=0 IC=-1mA. IB=0 IE=-10uA, IC=0 VCB=-140V, IE=0 IC=-30mA, IB=-3mA VCE=-5V, IC=-10mA VCE=-5V, IC=-10mA VCE=-5V, IC=-1mA VCE=-5V, IC=-10mA, f=100MHz VCB=-10V, IE=0, f=1MHz MHz pF *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% Classification Of hFE1 Rank Range B 60-120 C 100-200 D 160-320 HSB1109S HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 Spec. No. : HE6514 Issued Date : 1993.03.15 Revised Date : 2002.02.06 Page No. : 2/4 Saturation Voltage & Collector Current 1000 125 C o Saturation Voltage (mV) 75 C 100 125 C o o hFE 25 C 100 75 C o o 25 C o hFE @ VCE=5V VCE(sat) @ IC=10IB 10 10 1 10 100 0.1 1 10 100 Collector Current-IC (mA) Collector Current-IC (mA) ON Voltage & Collector Current 1000 Output Capacitance & Reverse-Blased Voltage 20 25 C o Output Capacttance-Cob (pF) 100 ON Voltage (mV) 15 75 C 125 C o o 10 5 VBE(ON) @ VCE=5V 100 0.1 1 10 0 0.1 1 10 100 1000 Collector Current-IC (mA) Reverse-Biased-VCB (V) Cutoff Frequency & Collector Current 1000 1000 Safe Operating Area Cutoff Frequency (MHz) 100 Collector Current (mA) 100 10 10 1 0.1 1 10 100 1000 1 1 10 100 1000 Collector Current-IC (mA) Forward Biased Voltage (V) HSB1109S HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6514 Issued Date : 1993.03.15 Revised Date : 2002.02.06 Page No. : 3/4 Power Derating 1000 900 Power Dissipation-PD (mW) 800 700 600 500 400 300 200 100 0 0 20 40 60 80 100 o 120 140 160 Ambient Temperature-Ta ( C) HSB1109S HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-92 Dimension A B 1 2 3 Date Code Spec. No. : HE6514 Issued Date : 1993.03.15 Revised Date : 2002.02.06 Page No. : 4/4 α2 Marking: H SB 1109S Rank Control Code α3 C Style: Pin 1.Emitter 2.Collector 3.Base D H I E F G α1 3-Lead TO-92 Plastic Package HSMC Package Code: A *: Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I α1 α2 α3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5° *2° *2° Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5° *2° *2° Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: • Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HSB1109S HSMC Product Specification