HSC3953

HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6602 Issued Date : 1993.03.15 Revised Date : 2001.01.01 Page No. : 1/3 HSC3953 NPN EPITAXIAL PLANAR TRANSISTOR Description High–definition CRT display video output, wide-band amplifier. Features • High fT: 500MHz • High Breakdown Voltage: BVCEO=120Vmin • Small Reverse Transfer Capacitance & Excellent HF Response: Cre=1.7pF Absolute Maximum Ratings (Ta=25°C) • Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 °C Junction Temperature ................................................................................... +150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Ta=25°C)................................................................................... 1.3 W Total Power Dissipation (Tc=25°C) ...................................................................................... 8 W • Maximum Voltages and Currents BVCBO Collector to Base Voltage .................................................................................... 120 V BVCEO Collector to Emitter Voltage................................................................................. 120 V BVEBO Emitter to Base Voltage ........................................................................................... 3 V IC Collector Current ....................................................................................................... 200 mA Icp Peak Collector Current............................................................................................. 400 mA Electrical Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 fT Min. 120 120 3 60 40 Typ. 400 Max. 0.1 0.1 1 1 320 Unit V V V uA uA V V Test Conditions IC=100uA, IE=0 IC=1mA, IB=0 IE=100uA, IC=0 VCB=120V, IE=0 VEB=2V IC=30mA, IB=3mA IC=30mA, IB=3mA IC=10mA, VCE=10V IC=100mA, VCE=10V IC=50mA , VCE=10V *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% MHz Classification Of hFE1 Rank Range D 60-120 E 100-200 F 160-320 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 1000 Spec. No. : HE6602 Issued Date : 1993.03.15 Revised Date : 2001.01.01 Page No. : 2/3 Saturation Voltage & Collector Current Saturation Voltage (mV) 100 hFE VCE=10 V 100 VCE(sat) @ IC=10IB 10 10 0.1 1 10 100 1000 1 0.1 1 10 100 1000 Collector Current (mA) Collector Current (mA) Saturation Voltage & Collector Current 1000 10 Output Capacitance & Reverse-Biased Voltage Saturation Voltage (mV) VBE(sat) @ IC=10IB Capacitance (Pf) Cob 100 0.1 1 10 100 1000 1 0.1 1 10 100 Collector Current (mA) Reverse-Biased Voltage (V) Safe Operating Area 1000 Collector Current (A) 100 PT=1ms PT=100ms PT=1s 10 1 10 100 1000 Forward Voltage (V) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-126ML Dimension Marking : Spec. No. : HE6602 Issued Date : 1993.03.15 Revised Date : 2001.01.01 Page No. : 3/3 A B D E F 3 2 I G 1 J M L K O H HSMC Logo Part Number Date Code Product Series Rank Ink Marking C Style : Pin 1.Emitter 2.Collector 3.Base N 3-Lead TO-126ML Plastic Package HSMC Package Code : D *:Typical DIM A B C D E F G H Inches Min. Max. 0.1356 0.1457 0.0170 0.0272 0.0344 0.0444 0.0501 0.0601 0.1131 0.1231 0.0737 0.0837 0.0294 0.0494 0.0462 0.0562 Millimeters Min. Max. 3.44 3.70 0.43 0.69 0.87 1.12 1.27 1.52 2.87 3.12 1.87 2.12 0.74 1.25 1.17 1.42 DIM I J K L M N O Inches Min. Max. *0.1795 0.0268 0.0331 0.5512 0.5906 0.2903 0.3003 0.1378 0.1478 0.1525 0.1625 0.0740 0.0842 Millimeters Min. Max. *4.56 0.68 0.84 14.00 15.00 7.37 7.62 3.50 3.75 3.87 4.12 1.88 2.14 Notes : 1.Dimension and tolerance based on our Spec. dated Mar. 6,1995. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : • Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 • Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 • Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification