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IS41LV8512-50TI

IS41LV8512-50TI

  • 厂商:

    ICSI

  • 封装:

  • 描述:

    IS41LV8512-50TI - 512K x 8 (4-MBIT) DYNAMIC RAM WITH EDO PAGE MODE - Integrated Circuit Solution In...

  • 数据手册
  • 价格&库存
IS41LV8512-50TI 数据手册
IS41C8512 IS41LV8512 .EATURES • • • • 512K x 8 (4-MBIT) DYNAMIC RAM WITH EDO PAGE MODE Extended Data-Out (EDO) Page Mode access cycle TTL compatible inputs and outputs; tristate I/O Refresh Interval: 1024 cycles /16 ms Refresh Mode: RAS-Only, CAS-before-RAS (CBR), Hidden • JEDEC standard pinout • Single power supply: 5V ± 10% (IS41C8512) 3.3V ± 10% (IS41LV8512) • Byte Write and Byte Read operation via CAS • Industrail Temperature Range -40oC to 85oC DESCRIPTION The 1+51 IS41C8512 and IS41LV8512 is a 524,288 x 8-bit high-performance CMOS Dynamic Random Access Memories. The IS41C8512 offer an accelerated cycle access called EDO Page Mode. EDO Page Mode allows 512 random accesses within a single row with access cycle time as short as 10 ns per 8-bit. These features make the IS41C8512and IS41LV8512 ideally suited for high-bandwidth graphics, digital signal processing, high-performance computing systems, and peripheral applications. The IS41C8512 is packaged in a 28-pin 400mil SOJ and 400mil TSOP-2. KEY TIMING PARAMETERS Parameter Max. RAS Access Time (tRAC) Max. CAS Access Time (tCAC) Max. Column Address Access Time (tAA) Min. EDO Page Mode Cycle Time (tPC) Min. Read/Write Cycle Time (tRC) -35 35 10 18 12 60 -50 50 14 25 20 90 -60 60 15 30 25 110 Unit ns ns ns ns ns PIN CON.IGURATIONS 28 Pin SOJ, TSOP-2 PIN DESCRIPTIONS VCC I/O0 I/O1 I/O2 I/O3 NC WE RAS A9 A0 A1 A2 A3 VCC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 GND I/O7 I/O6 I/O5 I/O4 CAS OE NC A8 A7 A6 A5 A4 GND A0-A9 I/O0-7 WE OE RAS CAS Vcc GND NC Address Inputs Data Inputs/Outputs Write Enable Output Enable Row Address Strobe Column Address Strobe Power Ground No Connection ICSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors which may appear in this publication. © Copyright 2000, Integrated Circuit Solution Inc. Integrated Circuit Solution Inc. DR008-0B 1 IS41C8512 IS41LV8512 .UNCTIONAL BLOCK DIAGRAM OE WE CAS CLOCK GENERATOR WE CONTROL LOGICS OE CONTROL LOGIC CAS CAS WE OE RAS RAS CLOCK GENERATOR DATA I/O BUS REFRESH COUNTER DATA I/O BUFFERS ROW DECODER RAS COLUMN DECODERS SENSE AMPLIFIERS I/O0-I/O7 MEMORY ARRAY 524,288 x 8 ADDRESS BUFFERS A0-A9 TRUTH TABLE .unction Standby Read Write: Word (Early Write) Read-Write Hidden Refresh RAS-Only Refresh CBR Refresh Note: 1. EARLY WRITE only. Read Write(1) RAS H L L L L→H→L L→H→L L H→L CAS H L L L L L H L WE X H L H→L H L X X OE X L X L→H L X X X Address tR /tC I/O X High-Z ROW/COL DOUT ROW/COL DIN ROW/COL DOUT, DIN ROW/COL DOUT ROW/COL DOUT ROW/NA High-Z X High-Z 2 Integrated Circuit Solution Inc. DR008-0B IS41C8512 IS41LV8512 .unctional Description The IS41C8512 and IS41LV8512 is a CMOS DRAM optimized for high-speed bandwidth, low power applications. During READ or WRITE cycles, each bit is uniquely addressed through the 10 address bits. These are entered ten bits (A0-A9) at a time. The row address is latched by the Row Address Strobe (RAS). The column address is latched by the Column Address Strobe (CAS). RAS is used to latch the first ten bits and CAS is used the latter nine bits. CAS-before-RAS is a refresh-only mode and no data access or device selection is allowed. Thus, the output remains in the High-Z state during the cycle. Extended Data Out Page Mode EDO page mode operation permits all 512 columns within a selected row to be randomly accessed at a high data rate. In EDO page mode read cycle, the data-out is held to the next CAS cycle’s falling edge, instead of the rising edge. .or this reason, the valid data output time in EDO page mode is extended compared with the fast page mode. In the fast page mode, the valid data output time becomes shorter as the CAS cycle time becomes shorter. Therefore, in EDO page mode, the timing margin in read cycle is larger than that of the fast page mode even if the CAS cycle time becomes shorter. In EDO page mode, due to the extended data function, the CAS cycle time can be shorter than in the fast page mode if the timing margin is the same. The EDO page mode allows both read and write operations during one RAS cycle, but the performance is equivalent to that of the fast page mode in that case. Memory Cycle A memory cycle is initiated by bring RAS LOW and it is terminated by returning both RAS and CAS HIGH. To ensures proper device operation and data integrity any memory cycle, once initiated, must not be ended or aborted before the minimum tRAS time has expired. A new cycle must not be initiated until the minimum precharge time tRP, tCP has elapsed. Read Cycle A read cycle is initiated by the falling edge of CAS or OE, whichever occurs last, while holding WE HIGH. The column address must be held for a minimum time specified by tAR. Data Out becomes valid only when tRAC, tAA, tCAC and tOEA are all satisfied. As a result, the access time is dependent on the timing relationships between these parameters. Power-On Write Cycle A write cycle is initiated by the falling edge of CAS and WE, whichever occurs last. The input data must be valid at or before the falling edge of CAS or WE, whichever occurs first. After application of the VCC supply, an initial pause of 200 µs is required followed by a minimum of eight initialization cycles (any combination of cycles containing a RAS signal). During power-on, it is recommended that RAS track with VCC or be held at a valid VIH to avoid current surges. Refresh Cycle To retain data, 1024 refresh cycles are required in each 16 ms period. There are two ways to refresh the memory. 1. By clocking each of the 1024 row addresses (A0 through A9) with RAS at least once every 16 ms. Any read, write, read-modify-write or RAS-only cycle refreshes the addressed row. 2. Using a CAS-before-RAS refresh cycle. CAS-beforeRAS refresh is activated by the falling edge of RAS, while holding CAS LOW. In CAS-before-RAS refresh cycle, an internal 10-bit counter provides the row addresses and the external address inputs are ignored. Integrated Circuit Solution Inc. DR008-0B 3 IS41C8512 IS41LV8512 ABSOLUTE MAXIMUM RATINGS(1) Symbol VT VCC IOUT PD TA TSTG Parameters Voltage on Any Pin Relative to GND Supply Voltage Output Current Power Dissipation Commercial Operation Temperature Industrial Operationg Temperature Storage Temperature 5V 3.3V 5V 3.3V Rating –1.0 to +7.0 –0.5 to +4.6 –1.0 to +7.0 –0.5 to +4.6 50 1 0 to +70 –40 to +85 –55 to +125 Unit V V mA W °C °C °C Note: 1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. RECOMMENDED OPERATING CONDITIONS (Voltages are referenced to GND.) Symbol VCC VIH VIL TA Parameter Supply Voltage Input High Voltage Input Low Voltage Commercial Ambient Temperature Industrial Ambient Temperature 5V 3.3V 5V 3.3V 5V 3.3V Min. 4.5 3.0 2.4 2.0 –1.0 –0.3 0 –40 Typ. 5.0 3.3 — — — — — — Max. 5.5 3.6 VCC + 1.0 VCC + 0.3 0.8 0.8 70 85 Unit V V V °C °C CAPACITANCE(1,2) Symbol CIN1 CIN2 CIO Parameter Input Capacitance: A0-A8 Input Capacitance: RAS, UCAS, LCAS, WE, OE Data Input/Output Capacitance: I/O0-I/O15 Max. 5 7 7 Unit p. p. p. Notes: 1. Tested initially and after any design or process changes that may affect these parameters. 2. Test conditions: TA = 25°C, f = 1 MHz. 4 Integrated Circuit Solution Inc. DR008-0B IS41C8512 IS41LV8512 ELECTRICAL CHARACTERISTICS(1) (Recommended Operating Conditions unless otherwise noted.) Symbol IIL IIO VOH VOL ICC1 Parameter Input Leakage Current Output Leakage Current Output High Voltage Level Output Low Voltage Level Standby Current: TTL Test Condition Any input 0V < VIN < Vcc Other inputs not under test = 0V Output is disabled (Hi-Z) 0V < VOUT < Vcc IOH = –2.5 mA IOL =+2.1mA RAS, CAS > VIH Commerical Industrial Commerical Industrial 5V 5V 3V 3V 5V 3V -35 -50 -60 -35 -50 -60 -35 -50 -60 -35 -50 -60 Speed Min. –10 –10 2.4 — — — — — — — — — — — — — — — — — — — Max. 10 10 — 0.4 3 4 2 3 2 1 230 180 170 220 170 160 230 180 170 230 180 170 Unit µA µA V V mA ICC2 ICC3 Standby Current: CMOS Operating Current: Random Read/Write(2,3,4) Average Power Supply Current Operating Current: EDO Page Mode(2,3,4) Average Power Supply Current Refresh Current: RAS-Only(2,3) Average Power Supply Current Refresh Current: CBR(2,3,5) Average Power Supply Current RAS, CAS > VCC – 0.2V RAS, CAS, Address Cycling, tRC = tRC (min.) RAS = VIL, CAS, Cycling tPC = tPC (min.) RAS Cycling, CAS > VIH tRC = tRC (min.) RAS, CAS Cycling tRC = tRC (min.) mA mA ICC4 mA ICC5 mA ICC6 mA Notes: 1. An initial pause of 200 µs is required after power-up followed by eight RAS refresh cycles (RAS-Only or CBR) before proper device operation is assured. The eight RAS cycles wake-up should be repeated any time the tRE. refresh requirement is exceeded. 2. Dependent on cycle rates. 3. Specified values are obtained with minimum cycle time and the output open. 4. Column-address is changed once each EDO page cycle. 5. Enables on-chip refresh and address counters. Integrated Circuit Solution Inc. DR008-0B 5 IS41C8512 IS41LV8512 AC CHARACTERISTICS(1,2,3,4,5,6) (Recommended Operating Conditions unless otherwise noted.) Symbol tRC tRAC tCAC tAA tRAS tRP tCAS tCP tCSH tRCD tASR tRAH tASC tCAH tAR tRAD tRAL tRPC tRSH tCLZ tCRP tOD tOE tOEHC tOEP tOES tRCS tRRH tRCH tWCH tWCR tWP tWPZ tRWL tCWL tWCS tDHR Parameter Random READ or WRITE Cycle Time Access Time from RAS(6, 7) Access Time from CAS(6, 8, 15) Access Time from Column-Address(6) RAS Pulse Width RAS Precharge Time CAS Pulse Width(26) CAS Precharge Time(9, 25) CAS Hold Time (21) RAS to CAS Delay Time(10, 20) Row-Address Setup Time Row-Address Hold Time Column-Address Setup Time(20) Column-Address Hold Time(20) Column-Address Hold Time (referenced to RAS) RAS to Column-Address Delay Time(11) Column-Address to RAS Lead Time RAS to CAS Precharge Time RAS Hold Time(27) CAS to Output in Low-Z(15, 29) CAS to RAS Precharge Time(21) Output Disable Time(19, 28, 29) Output Enable Time(15, 16) OE HIGH Hold Time from CAS HIGH OE HIGH Pulse Width OE LOW to CAS HIGH Setup Time Read Command Setup Time(17, 20) Read Command Hold Time (referenced to RAS)(12) Read Command Hold Time (referenced to CAS)(12, 17, 21) Write Command Hold Time(17, 27) Write Command Hold Time (referenced to RAS)(17) Write Command Pulse Width(17) WE Pulse Widths to Disable Outputs Write Command to RAS Lead Time(17) Write Command to CAS Lead Time(17, 21) Write Command Setup Time(14, 17, 20) Data-in Hold Time (referenced to RAS) -35 -50 Min. Max. Min. Max. 60 35 — — 35 20 6 5 35 11 0 6 0 6 30 10 18 0 8 3 5 3 0 10 10 5 0 0 0 5 30 5 10 8 8 0 30 — — 10 18 10K 10K — — 28 — — — — — 20 — — — — — 12 10 — — — — — — — — — — — — — — 90 50 — — 50 30 8 8 50 19 0 8 0 8 40 14 25 0 14 3 5 3 0 10 10 5 0 0 0 8 40 8 10 14 14 0 40 — — 14 25 10K — 10K — — 36 — — — — — 25 — — — — — 12 15 — — — — — — — — — — — — — — -60 Min. Max. Units 110 — — — 60 40 10 10 60 20 0 10 0 10 40 15 30 0 15 3 5 3 — 10 10 5 0 0 0 10 50 10 10 15 15 0 40 — 60 15 30 10K — 10K — — 45 — — — — — 30 — — — — — 12 15 — — — — — — — — — — — — — — ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 6 Integrated Circuit Solution Inc. DR008-0B IS41C8512 IS41LV8512 AC CHARACTERISTICS (Continued)(1,2,3,4,5,6) (Recommended Operating Conditions unless otherwise noted.) Symbol tACH tOEH tDS tDH tRWC tRWD tCWD tAWD tPC tRASP tCPA tPRWC tCOH tO.. tWHZ tCLCH tCSR tCHR tORD tRE. tT Parameter Column-Address Setup Time to CAS Precharge during WRITE Cycle OE Hold Time from WE during READ-MODI.Y-WRITE cycle(18) Data-In Setup Time(15, 22) Data-In Hold Time(15, 22) READ-MODI.Y-WRITE Cycle Time RAS to WE Delay Time during READ-MODI.Y-WRITE Cycle(14) CAS to WE Delay Time(14, 20) Column-Address to WE Delay Time(14) EDO Page Mode READ or WRITE Cycle Time(24) RAS Pulse Width in EDO Page Mode Access Time from CAS Precharge(15) EDO Page Mode READ-WRITE Cycle Time(24) Data Output Hold after CAS LOW Output Buffer Turn-Off Delay from CAS or RAS(13,15,19, 29) Output Disable Delay from WE Last CAS going LOW to .irst CAS returning HIGH(23) CAS Setup Time (CBR RE.RESH)(30, 20) CAS Hold Time (CBR RE.RESH)(30, 21) OE Setup Time prior to RAS during HIDDEN RE.RESH Cycle Refresh Period (1024 Cycles) Transition Time (Rise or .all)(2, 3) -35 Min. Max. 15 8 0 6 80 45 25 30 12 35 — 40 5 3 3 10 8 8 0 — 1 — — — — — — — — — 100K 21 — — 15 15 — — — — 16 50 -50 Min. Max. 15 8 0 6 100 50 30 30 15 40 — 45 5 3 3 10 10 10 0 16 1 — — — — — — — — — 100K 27 — — 15 15 — — — — — 50 -60 Min. Max. 15 15 0 10 140 80 36 49 25 50 — 56 5 3 3 10 10 10 0 16 1 — — — — — — — — — 100K 34 — — 15 15 — — — — — 50 Units ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ms ns Integrated Circuit Solution Inc. DR008-0B 7 IS41C8512 IS41LV8512 Notes: 1. An initial pause of 200 µs is required after power-up followed by eight RAS refresh cycle (RAS-Only or CBR) before proper device operation is assured. The eight RAS cycles wake-up should be repeated any time the tRE. refresh requirement is exceeded. 2. VIH (MIN) and VIL (MAX) are reference levels for measuring timing of input signals. Transition times, are measured between VIH and VIL (or between VIL and VIH) and assume to be 1 ns for all inputs. 3. In addition to meeting the transition rate specification, all input signals must transit between VIH and VIL (or between VIL and VIH) in a monotonic manner. 4. If CAS and RAS = VIH, data output is High-Z. 5. If CAS = VIL, data output may contain data from the last valid READ cycle. 6. Measured with a load equivalent to one TTL gate and 50 p.. 7. Assumes that tRCD ≤ tRCD (MAX). If tRCD is greater than the maximum recommended value shown in this table, tRAC will increase by the amount that tRCD exceeds the value shown. 8. Assumes that tRCD ≥ tRCD (MAX). 9. If CAS is LOW at the falling edge of RAS, data out will be maintained from the previous cycle. To initiate a new cycle and clear the data output buffer, CAS and RAS must be pulsed for tCP. 10. Operation with the tRCD (MAX) limit ensures that tRAC (MAX) can be met. tRCD (MAX) is specified as a reference point only; if tRCD is greater than the specified tRCD (MAX) limit, access time is controlled exclusively by tCAC. 11. Operation within the tRAD (MAX) limit ensures that tRCD (MAX) can be met. tRAD (MAX) is specified as a reference point only; if tRAD is greater than the specified tRAD (MAX) limit, access time is controlled exclusively by tAA. 12. Either tRCH or tRRH must be satisfied for a READ cycle. 13. tO.. (MAX) defines the time at which the output achieves the open circuit condition; it is not a reference to VOH or VOL. 14. tWCS, tRWD, tAWD and tCWD are restrictive operating parameters in LATE WRITE and READ-MODI.Y-WRITE cycle only. If tWCS ≥ tWCS (MIN), the cycle is an EARLY WRITE cycle and the data output will remain open circuit throughout the entire cycle. If tRWD ≥ tRWD (MIN), tAWD ≥ tAWD (MIN) and tCWD ≥ tCWD (MIN), the cycle is a READ-WRITE cycle and the data output will contain data read from the selected cell. If neither of the above conditions is met, the state of I/O (at access time and until CAS and RAS or OE go back to VIH) is indeterminate. OE held HIGH and WE taken LOW after CAS goes LOW result in a LATE WRITE (OE-controlled) cycle. 15. Output parameter (I/O) is referenced to corresponding CAS input. 16. During a READ cycle, if OE is LOW then taken HIGH before CAS goes HIGH, I/O goes open. If OE is tied permanently LOW, a LATE WRITE or READ-MODI.Y-WRITE is not possible. 17. Write command is defined as WE going low. 18. LATE WRITE and READ-MODI.Y-WRITE cycles must have both tOD and tOEH met (OE HIGH during WRITE cycle) in order to ensure that the output buffers will be open during the WRITE cycle. The I/Os will provide the previously written data if CAS remains LOW and OE is taken back to LOW after tOEH is met. 19. The I/Os are in open during READ cycles once tOD or tO.. occur. 20. The first χCAS edge to transition LOW. 21. The last χCAS edge to transition HIGH. 22. These parameters are referenced to CAS leading edge in EARLY WRITE cycles and WE leading edge in LATE WRITE or READMODI.Y-WRITE cycles. 23. Last falling χCAS edge to first rising χCAS edge. 24. Last rising χCAS edge to next cycle’s last rising χCAS edge. 25. Last rising χCAS edge to first falling χCAS edge. 26. Each χCAS must meet minimum pulse width. 27. Last χCAS to go LOW. 28. I/Os controlled, regardless CAS. 29. The 3 ns minimum is a parameter guaranteed by design. 30. Enables on-chip refresh and address counters. 8 Integrated Circuit Solution Inc. DR008-0B IS41C8512 IS41LV8512 READ CYCLE tRC tRAS tRP RAS tCSH tCRP tRCD tRSH tCAS tCLCH tRRH CAS tAR tRAD tASR tRAH tASC tRAL tCAH ADDRESS WE Row tRCS Column tRCH Row tAA tRAC tCAC tCLC tOFF(1) I/O Open tOE Valid Data tOD Open OE tOES Undefined Don’t Care Note: 1. tO.. is referenced from rising edge of RAS or CAS, whichever occurs last. Integrated Circuit Solution Inc. DR008-0B 9 IS41C8512 IS41LV8512 EARLY WRITE CYCLE (OE = DON'T CARE) tRC tRAS tRP RAS tCSH tCRP tRCD tRSH tCAS tCLCH CAS tAR tRAD tASR tRAH tASC tRAL tCAH tACH ADDRESS Row Column tCWL tRWL tWCR tWCS tWCH tWP Row WE tDHR tDS tDH I/O Valid Data Don’t Care 10 Integrated Circuit Solution Inc. DR008-0B IS41C8512 IS41LV8512 READ WRITE CYCLE (LATE WRITE and READ-MODI.Y-WRITE Cycles) tRWC tRAS tRP RAS tCSH tCRP tRCD tRSH tCAS tCLCH CAS tAR tRAD tASR tRAH tASC tCAH tACH tRAL ADDRESS Row tRCS Column tRWD tCWD tAWD Row tCWL tRWL tWP WE tAA tRAC tCAC tCLZ tDS tDH I/O Open tOE Valid DOUT tOD Valid DIN Open tOEH OE Undefined Don’t Care Integrated Circuit Solution Inc. DR008-0B 11 IS41C8512 IS41LV8512 EDO-PAGE-MODE READ CYCLE tRASP tRP RAS tCSH tCRP tRCD tCAS, tCLCH tCP tPC(1) tCAS, tCLCH tCP tRSH tCAS, tCLCH tCP CAS tAR tRAD tASR tASC tCAH tASC tCAH tASC tRAL tCAH ADDRESS Row tRAH tRCS Column Column Column tRCH Row tRRH WE tAA tRAC tCAC tCLZ tCAC tCOH tAA tCPA tCAC tCLZ tAA tCPA tOFF I/O Open tOE tOES Valid Data Valid Data tOEHC tOD tOES Valid Data tOE Open tOD OE tOEP Undefined Don’t Care Note: 1. tPC can be measured from falling edge of CAS to falling edge of CAS, or from rising edge of CAS to rising edge of CAS. Both measurements must meet the tPC specifications. 12 Integrated Circuit Solution Inc. DR008-0B IS41C8512 IS41LV8512 EDO-PAGE-MODE EARLY-WRITE CYCLE tRASP tRP RAS tCSH tCRP tRCD tCAS, tCLCH tCP tPC tCAS, tCLCH tCP tRSH tCAS, tCLCH tACH tRAL tCAH tCP CAS tAR tRAD tASR tASC tACH tCAH tASC tACH tCAH tASC ADDRESS Row tRAH Column tCWL tWCS tWCH tWP Column tCWL tWCS tWCH tWP Column tCWL tWCS tWCH tWP Row WE tWCR tDHR tDS tDH tDS tDH tDS tDH tRWL I/O OE Valid Data Valid Data Valid Data Don’t Care Integrated Circuit Solution Inc. DR008-0B 13 IS41C8512 IS41LV8512 EDO-PAGE-MODE READ-WRITE CYCLE (LATE WRITE and READ-MODI.Y WRITE Cycles) tRASP tRP RAS tCSH tCRP tRCD tCAS, tCLCH tCP tPC / tPRWC(1) tCAS, tCLCH tCP tRSH tCAS, tCLCH tCP CAS tASR tRAH tAR tRAD tASC tRAL tCAH tCAH tASC tCAH tASC ADDRESS Row tRWD tRCS Column tCWL tWP tAWD tCWD Column tCWL tWP tAWD tCWD Column tRWL tCWL tWP tAWD tCWD Row WE tAA tRAC tCAC tCLZ tDH tDS tAA tCPA tCAC tCLZ tDH tDS tAA tCPA tCAC tCLZ tDH tDS I/O Open tOE DOUT DIN tOD tOE DOUT DIN tOD tOE DOUT DIN tOD tOEH Open OE Undefined Don’t Care Note: 1. tPC can be measured from falling edge of CAS to falling edge of CAS, or from rising edge of CAS to rising edge of CAS. Both measurements must meet the tPC specifications. 14 Integrated Circuit Solution Inc. DR008-0B IS41C8512 IS41LV8512 EDO-PAGE-MODE READ-EARLY-WRITE CYCLE (Psuedo READ-MODI.Y WRITE) tRASP tRP RAS tCSH tPC tCRP tRCD tCAS tCP tCAS tPC tCP tRSH tCAS tCP CAS tASR tRAH tAR tRAD tASC tACH tRAL tCAH tCAH tASC tCAH tASC ADDRESS Row tRCS Column (A) Column (B) tRCH tWCS Column (N) tWCH Row WE tAA tRAC tCAC tCPA tCAC tCOH tAA tWHZ tDS tDH I/O Open tOE Valid Data (A) Valid Data (B) DIN Open OE Don’t Care Integrated Circuit Solution Inc. DR008-0B 15 IS41C8512 IS41LV8512 AC WAVE.ORMS READ CYCLE (With WE-Controlled Disable) RAS tCSH tCRP tRCD tCAS tCP CAS tAR tASR tRAD tRAH tASC tCAH tASC ADDRESS WE Row tRCS Column tRCH tRCS Column tAA tRAC tCAC tCLZ tWHZ tCLZ I/O Open tOE Valid Data Open tOD OE Undefined Don’t Care 4)5-ONLY RE.RESH CYCLE (OE, WE = DON'T CARE) tRC tRAS tRP RAS tCRP tRPC CAS tASR tRAH ADDRESS I/O Row Open Row Don’t Care 16 Integrated Circuit Solution Inc. DR008-0B IS41C8512 IS41LV8512 +*4 RE.RESH CYCLE (Addresses; WE, OE = DON'T CARE) tRP tRAS tRP tRAS RAS tRPC tCP tCHR tCSR tRPC tCSR tCHR CAS I/O Open HIDDEN RE.RESH CYCLE(1) (WE = HIGH; OE = LOW) tRAS tRP tRAS RAS tCRP tRCD tRSH tCHR CAS tAR tASR tRAD tRAH tASC tRAL tCAH ADDRESS Row Column tAA tRAC tCAC tCLZ tOFF(2) I/O Open tOE tORD Valid Data Open tOD OE Undefined Don’t Care Notes: 1. A Hidden Refresh may also be performed after a Write Cycle. In this case, WE = LOW and OE = HIGH. 2. tO.. is referenced from rising edge of RAS or CAS, whichever occurs last. Integrated Circuit Solution Inc. DR008-0B 17 IS41C8512 IS41LV8512 ORDERING IN.ORMATION IS41C8512 Commercial Range: 0°C to 70°C Speed (ns) Order Part No. 35 50 60 IS41C8512-35K IS41C8512-35T IS41C8512-50K IS41C8512-50T IS41C8512-60K IS41C8512-60T Package 400mil SOJ 400mil TSOP-2 400mil SOJ 400mil TSOP-2 400mil SOJ 400mil TSOP-2 ORDERING IN.ORMATION: IS41LV8512 Commercial Range: 0°C to 70°C Speed (ns) Order Part No. 35 50 60 IS41LV8512-35K IS41LV8512-35T IS41LV8512-50K IS41LV8512-50T IS41LV8512-60K IS41LV8512-60T Package 400mil SOJ 400mil TSOP-2 400mil SOJ 400mil TSOP-2 400mil SOJ 400mil TSOP-2 Industrial Range: -40°C to 85°C Speed (ns) Order Part No. 35 50 60 IS41C8512-35KI IS41C8512-35TI IS41C8512-50KI IS41C8512-50TI IS41C8512-60KI IS41C8512-60TI Package 400mil SOJ 400mil TSOP-2 400mil SOJ 400mil TSOP-2 400mil SOJ 400mil TSOP-2 Industrial Range: -40°C to 85°C Speed (ns) Order Part No. 35 50 60 IS41LV8512-35K IS41LV8512-35T IS41LV8512-50KI IS41LV8512-50TI IS41LV8512-60KI IS41LV8512-60TI Package 400mil SOJ 400mil TSOP-2 400mil SOJ 400mil TSOP-2 400mil SOJ 400mil TSOP-2 HEADQUARTER: NO.2, TECHNOLOGY RD. V, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN, R.O.C. TEL: 886-3-5780333 .ax: 886-3-5783000 BRANCH O..ICE: 7., NO. 106, SEC. 1, HSIN-TAI 5TH ROAD, HSICHIH TAIPEI COUNTY, TAIWAN, R.O.C. TEL: 886-2-26962140 .AX: 886-2-26962252 http://www.icsi.com.tw 18 Integrated Circuit Solution Inc. DR008-0B Integrated Circuit Solution Inc.
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