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SF0199CD02382S

SF0199CD02382S

  • 厂商:

    ICST(IDT)

  • 封装:

  • 描述:

    SF0199CD02382S - 199 MHz Filter 0.200 MHz Bandwidth for GSM BTS Receiver IF - Integrated Circuit Sys...

  • 数据手册
  • 价格&库存
SF0199CD02382S 数据手册
Integrated Circuit Systems, Inc. 199 MHz Filter 0.200 MHz Bandwidth for GSM BTS Receiver IF Part Number SF0199CD02382S TYPICAL PERFORMANCE 0 -10 -20 -30 -40 -50 -60 -70 187 190 193 196 199 202 205 208 211 Horizontal: 0.40 MHz/div Vertical (from top): Magnitude 10 dB/div Magnitude 1 dB/div Group Delay 500 ns/div Horizontal: 3.0 MHz/div Vertical: Magnitude 10 dB/div SPECIFICATION Parameter Normal Center Frequency FC Insertion Loss at Fc 1 1 dB Bandwidth Passband Ripples over Fc+/-100 KHz Group Delay Ripples over Fc+/-100 KHz Rejection, FC ± (0.600 to 0.800) MHz Rejection, FC ± (0.800 to 17.00) MHz Rejection, FC ± (17.00 to 80.00) MHz Operating Temperature Range Impedance Matching to 50 Ω Unbalanced Impedance Matching to 200 Ω Balanced Min Typ 199.00 7 470 0.25 175 Max 8 0.5 500 Units MHz dB KHz dB p-p ns p-p dB dB dB °C 200 20 30 35 -35 52 +85 External L-C External L-C Note: 1. All dB values are referenced to the insertion loss value at Fc. Rev X9 1-Feb-05 Page 1 of 4 Integrated Circuit Systems • Surface Acoustic Wave Products 324 Clark Street, Worcester, MA 01606, USA • Phone 508-852-5400 • Fax 508-852-8456 www.icst.com QF12/3 Integrated Circuit Systems, Inc. PACKAGE AND SUGGESTED PCB FOOTPRINT PACKAGE INFORMATION 199 MHz Filter 0.200 MHz Bandwidth for GSM BTS Receiver IF Part Number SF0199CD02382S SUGGESTED PCB FOOTPRINT 9.30 1.10 1.34 9.10+0.20 -0.10 1.60 1.02 MARKING THE DATE CODE CONSISTS OF: YY=YEAR, WW=WEEK, M=MANUFACTURING SITE CODE ESD LOGO MARKING CODE Integrated Circuit Systems • Surface Acoustic Wave Products 324 Clark Street, Worcester, MA 01606, USA • Phone 508-852-5400 • Fax 508-852-8456 www.icst.com QF12/3 CD02382S CD02382S YYWWM 2.54 2.00 MAX YYWWM ICS 0.80 10X 2.54 2.54 5.08 7.10+0.20 -0.10 7.30 2.54 2.62 0.88 PIN NO. 3 2 8 7 1,4,5,6,9,10,11 DESCRIPTION INPUT INPUT RETURN OUTPUT OUTPUT RETURN GROUND 1.20 9X NOTES: DIMENSIONS SHOWN ARE NOMINAL IN MILLIMETERS. ALL TOLERANCES ARE ±0.15MM EXCEPT OVERALL LENGTH AND WIDTH Package Material: Body: Al2O3 ceramic Lid: Kovar, Ni plated Terminations: Au plating 0.5-1.0 um, over a 2-6 um Ni plating ICS Rev X9 1-Feb-05 Page 2 of 4 Integrated Circuit Systems, Inc. 199 MHz Filter 0.200 MHz Bandwidth for GSM BTS Receiver IF Part Number SF0199CD02382S MATCHING CIRCUIT for Balanced, 200 Ω Impedance at Both Input and Output 3 8 2 7 Typical component values: Cs1 =Cs2=3.3 pF Ls1 = 72 nH Cs3=Cs4=4.7 pF Ls2 = 68 nH Note: Component values may change depending on PCB layout and parasitic. MAXIMUM RATINGS Parameter Operating Temperature Range Storage Temperature Range Maximum Input Power Level D. C. Voltage between Each Terminal Min -35 -45 Max +85 +85 20 15 Units ºC ºC dBm V Rev X9 1-Feb-05 Page 3 of 4 Integrated Circuit Systems • Surface Acoustic Wave Products 324 Clark Street, Worcester, MA 01606, USA • Phone 508-852-5400 • Fax 508-852-8456 www.icst.com QF12/3 Integrated Circuit Systems, Inc. 199 MHz Filter 0.200 MHz Bandwidth for GSM BTS Receiver IF Part Number SF0199CD02382S PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS Parameter Life Testing Temperature Cycling Vibration Mechanical Shock Qualification Conditions High temperature bake at +85 ºC for 168 hours. MIL-STD 883, Method 1010: -40 ºC to +85 ºC, 10 cycles, 10 minutes dwell at temperature extremes MIL-STD-202, Method 201A: 10 to 55 Hz, double amplitude of 0.06” for 2 hours in each axis. MIL-STD-883, Method 2002, Test Condition B: 1500 g’s, 3 impacts each axis Peak temperature 240+/-5 ºC for 10 seconds. Pre-heat: 150-170 ºC for 60 to 90 seconds. Peak dwell: over 200 ºC for 23 to 26 seconds. Handling: Class 1 per MIL-STD-1686 Reflow Profile is shown at the bottom of this table. MIL-STD 883 Method 2004, Condition D 8 oz for 30 seconds. MIL-STD-883 Method 2003: 245 ºC +/-5 ºC; 95% coverage; no steam aging MIL-STD 883 Method 1014: Condition A2 and Condition C (no bomb) Class I per MIL-STD-883 Method 3015 Do not subject devices to ultrasonic cleaning, which may cause deterioration and destruction of the device. Solder Heat Resistance and Reflow Condition Lead Integrity Solderability Hermeticity ESD Classification Precautions Reflow Profile 250 200 TEM P (deg C) 150 100 50 0 0 50 100 15 0 TIM E (se c) 200 25 0 300 ISO 9001 Registered Rev X9 1-Feb-05 Page 4 of 4 Integrated Circuit Systems • Surface Acoustic Wave Products 324 Clark Street, Worcester, MA 01606, USA • Phone 508-852-5400 • Fax 508-852-8456 www.icst.com QF12/3
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