85105AGIT

LOW SKEW, 1-TO-5, DIFFERENTIAL/ LVCMOS-TO-0.7V HCSL FANOUT BUFFER ICS85105I GENERAL DESCRIPTION The ICS85105I is a low skew, high performance 1IC S to-5 Differential-to-0.7V HCSL Fanout Buffer and HiPerClockS™ a member of the HiPerClockS™ family of High Perfor mance Clock Solutions from IDT. The ICS85105I has two selectable clock inputs. The CLK0, nCLK0 pair can accept most standard differential input levels. The single-ended CLK1 can accept LVCMOS or LVTTL input levels. The clock enable is internally synchronized to eliminate runt clock pulses on the outputs during asynchronous assertion/deassertion of the clock enable pin. Guaranteed output and part-to-part skew characteristics make the ICS85105I ideal for those applications demanding well defined performance and repeatability. FEATURES • Five 0.7V differential HCSL outputs • Selectable differential CLK0, nCLK0 or LVCMOS inputs • CLK0, nCLK0 pair can accept the following differential input levels: LVPECL, LVDS, LVHSTL, HCSL, SSTL • CLK1 can accept the following input levels: LVCMOS or LVTTL • Maximum output frequency: 500MHz • Translates any single-ended input signal to 3.3V HCSL levels with resistor bias on nCLK input • Output skew: 100ps (maximum) • Part-to-part skew: 600ps (maximum) • Propagation delay: 3.2ns (maximuml) • Additive phase jitter, RMS: 0.24ps (typical) • 3.3V operating supply • -40°C to 85°C ambient operating temperature • Available in both standard (RoHS 5) and lead-free (RoHS 6) packages BLOCK DIAGRAM CLK_EN Pullup CLK0 Pulldown nCLK0 Pullup/Pulldown CLK1 Pulldown CLK_SEL Pulldown D Q LE 0 Q0 nQ0 1 Q1 nQ1 Q2 nQ2 IREF Q3 nQ3 Q4 nQ4 PIN ASSIGNMENT GND CLK_EN CLK_SEL CLK0 nCLK0 CLK1 Q4 nQ4 IREF VDD 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 Q0 nQ0 VDD Q1 nQ1 Q2 nQ2 VDD Q3 nQ3 ICS85105I 20-Lead TSSOP 6.5mm x 4.4mm x 0.925mm Package Body G Package Top View IDT ™ / ICS™ 0.7V HCSL FANOUT BUFFER 1 ICS85105AGI REV. A JUNE 5, 2008 ICS85105I LOW SKEW, 1-TO-5, DIFFERENTIAL/LVCMOS-TO-0.7V HCSL FANOUT BUFFER TABLE 1. PIN DESCRIPTIONS Number 1 2 Name GND CLK_EN Power Input Type Description Power supply ground. Synchronizing clock enable. When HIGH, clock outputs follow clock input. Pullup When LOW, Qx outputs are forced low, nQx outputs are forced high. LVTTL / LVCMOS interface levels. Clock select input. When HIGH, selects CLK1 input. Pulldown When LOW, selects CLK0, nCLK0 inputs. LVTTL / LVCMOS interface levels. Pulldown Non-inver ting differential clock input. Pullup/ Inver ting differential clock input. Pulldown Pulldown Single-ended clock input. LVTTL / LVCMOS interface levels. Differential output pair. HCSL interface levels. An external fixed precision resistor (475Ω) from this pin to ground provides a reference current used for differential current-mode Qx/nQx outputs. Positive supply pins. Differential output pair. HCSL interface levels. Differential output pair. HCSL interface levels. 3 4 5 6 7, 8 9 10, 13, 18 1 1, 1 2 14, 15 CLK_SEL CLK0 nCLK0 CLK1 Q4, nQ4 IREF VDD nQ3, Q3 nQ2, Q2 Input Input Input Input Output Input Power Output Output 16, 17 nQ1, Q1 Output Differential output pair. HCSL interface levels. nQ0, Q0 Output Differential output pair. HCSL interface levels. 19, 20 NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values. TABLE 2. PIN CHARACTERISTICS Symbol CIN RPULLUP RPULLDOWN Parameter Input Capacitance Input Pullup Resistor Input Pulldown Resistor Test Conditions Minimum Typical 4 51 51 Maximum Units pF kΩ kΩ IDT ™ / ICS™ 0.7V HCSL FANOUT BUFFER 2 ICS85105AGI REV. A JUNE 5, 2008 ICS85105I LOW SKEW, 1-TO-5, DIFFERENTIAL/LVCMOS-TO-0.7V HCSL FANOUT BUFFER TABLE 3A. CONTROL INPUT FUNCTION TABLE Inputs CLK_EN 0 0 1 1 CLK_SEL 0 1 0 1 Selected Source CLK0, nCLK0 CLK1 CLK0, nCLK0 CLK1 Q0:Q4 Disabled; LOW Disabled; LOW Enabled Enabled Outputs nQ0:nQ4 Disabled; HIGH Disabled; HIGH Enabled Enabled After CLK_EN switches, the clock outputs are disabled or enabled following a falling input clock edge as shown in Figure 1. Disabled nCLK0 CLK0, CLK1 Enabled CLK_EN nQ0:nQ4 Q0:Q4 FIGURE 1. CLK_EN TIMING DIAGRAM IDT ™ / ICS™ 0.7V HCSL FANOUT BUFFER 3 ICS85105AGI REV. A JUNE 5, 2008 ICS85105I LOW SKEW, 1-TO-5, DIFFERENTIAL/LVCMOS-TO-0.7V HCSL FANOUT BUFFER ABSOLUTE MAXIMUM RATINGS Supply Voltage, VDD Inputs, VI Outputs, IO Continuous Current Surge Current 4.6V -0.5V to VDD + 0.5V 50mA 100mA NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause per manent damage to the device. These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability. Package Thermal Impedance, θJA 20 Lead TSSOP 91.1°C/W (0 mps) Storage Temperature, TSTG -65°C to 150°C TABLE 4A. POWER SUPPLY DC CHARACTERISTICS, VDD = 3.3V±10%, TA = -40°C TO 85°C Symbol VDD IDD Parameter Positive Supply Voltage Power Supply Current Unterminated Test Conditions Minimum 2.97 Typical 3.3 Maximum 3.63 27 Units V mA TABLE 4B. LVCMOS / LVTTL DC CHARACTERISTICS, VDD = 3.3V±10%, TA = -40°C TO 85°C Symbol V IH VIL IIH IIL Parameter Input High Voltage Input Low Voltage Input High Current Input Low Current CLK1, CLK_SEL CLK_EN CLK1, CLK_SEL CLK_EN VIN = VDD = 3.63V VIN = VDD = 3.63V VIN = 0V, VDD = 3.63V VIN = 0V, VDD = 3.63V -5 -150 Test Conditions Minimum 2 -0.3 Typical Maximum VDD + 0.3 0.8 150 5 Units V V µA µA µA µA TABLE 4C. DIFFERENTIAL DC CHARACTERISTICS, VDD = 3.3V±10%, TA = -40°C TO 85°C Symbol IIH IIL VPP Parameter Input High Current Input Low Current CLK0/nCLK0 CLK0 nCLK0 Test Conditions VDD = VIN = 3.63V VDD = 3.63V, VIN = 0V VDD = 3.63V, VIN = 0V -5 -150 0.15 GND + 0.5 1.3 VDD - 0.85 Minimum Typical Maximum 150 Units µA µA µA V V Peak-to-Peak Input Voltage; NOTE 1 Common Mode Input Voltage; VCMR NOTE 1, 2 NOTE 1: VIL should not be less than -0.3V. NOTE 2: Common mode voltage is defined as VIH. IDT ™ / ICS™ 0.7V HCSL FANOUT BUFFER 4 ICS85105AGI REV. A JUNE 5, 2008 ICS85105I LOW SKEW, 1-TO-5, DIFFERENTIAL/LVCMOS-TO-0.7V HCSL FANOUT BUFFER TABLE 5. AC CHARACTERISTICS, VDD = 3.3V±10%, TA = -40°C TO 85°C Symbol Parameter fMAX tPD Output Frequency Propagation Delay; NOTE 1 Output Skew; NOTE 2, 4 Par t-to-Par t Skew; NOTE 3, 4 Buffer Additive Phase Jitter, RMS; refer to Additive Phase Jitter Section Absolute Maximum Output Voltage; NOTE 5, 10 Absolute Minimum Output Voltage; NOTE 5, 11 Ringback Voltage; NOTE 6, 13 Time before VRB is allowed; NOTE 6, 13 Absolute Crossing Voltage; NOTE 5, 8, 9 Total Variation of VCROSS over all edges; NOTE 5, 8, 12 Rise/Fall Edge Rate; NOTE 6, 7 Measured between -150mV to +150mV Test Conditions CLK_SEL = 0 CLK_SEL = 1 CLK_SEL = 0 CLK_SEL = 1 2.0 2.0 Minimum Typical Maximum 500 250 3.2 2.8 100 600 100MHz (12kHz - 20MHz) 0.24 1150 -300 -100 500 250 550 140 0.6 5.5 100 Units MHz MHz ns ns ps ps ps mV mV V ps mV mV V/ns t sk(o) t sk(pp) t jit VMAX VMIN VRB tSTABLE VCROSS ΔVCROSS Output Duty Cycle; NOTE 14 45 55 % odc All parameters measured at ƒ ≤ 250MHz unless noted otherwise. NOTE 1: Measured from the VDD/2 of the input to the differential output crossing point. NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at the output differential cross points. NOTE 3: Defined as skew between outputs on different devices operating at the same supply voltage, same temperature, and with equal load conditions. Using the same type of inputs on each device, the outputs are measured at the differential cross points. NOTE 4: This parameter is defined in accordance with JEDEC Standard 65. NOTE 5: Measurement taken from single-ended waveform. NOTE 6: Measurement taken from differential waveform. NOTE 7: Measured from -150mV to +150mV on the differential waveform (derived from Qx minus nQx). The signal must be monotonic through the measurement region for rise and fall time. The 300mV measurement window is centered on the differential zero crossing. See Parameter Measurement Information Section. NOTE 8: Measured at crossing point where the instantaneous voltage value of the rising edge of Qx equals the falling edge of nQx. See Parameter Measurement Information Section. NOTE 9: Refers to the total variation from the lowest crossing point to the highest, regardless of which edge is crossing. Refers to all crossing points for this measurement. See Parameter Measurement Information Section. NOTE 10: Defined as the maximum instantaneous voltage including overshoot. See Parameter Measurement Information Section. NOTE 11: Defined as the minimum instantaneous voltage including undershoot. See Parameter Measurement Information Section. NOTE 12: Defined as the total variation of all crossing voltage of Rising Qx and Falling nQx. This is the maximum allowed variance in the VCROSS for any par ticular system. See Parameter Measurement Information Section. NOTE: 13. TSTABLE is the time the differential clock must maintain a minimum ±150mV differential voltage after rising/falling edges before it is allowed to droop back into the VRB ±100mV differential range. See Parameter Measurement Information Section. NOTE 14: Input duty cycle must be 50%. IDT ™ / ICS™ 0.7V HCSL FANOUT BUFFER 5 ICS85105AGI REV. A JUNE 5, 2008 ICS85105I LOW SKEW, 1-TO-5, DIFFERENTIAL/LVCMOS-TO-0.7V HCSL FANOUT BUFFER ADDITIVE PHASE JITTER The spectral purity in a band at a specific offset from the fundamental compared to the power of the fundamental is called the dBc Phase Noise. This value is normally expressed using a Phase noise plot and is most often the specified plot in many applications. Phase noise is defined as the ratio of the noise power present in a 1Hz band at a specified offset from the fundamental frequency to the power value of the fundamental. This ratio is expressed in decibels (dBm) or a ratio of the power in the 1Hz band to the power in the fundamental. When the required offset is specified, the phase noise is called a dBc value, which simply means dBm at a specified offset from the fundamental. By investigating jitter in the frequency domain, we get a better understanding of its effects on the desired application over the entire time record of the signal. It is mathematically possible to calculate an expected bit error rate given a phase noise plot. Additive Phase Jitter, Integration Range: 12kHz - 20MHz at 100MHz = 0.22ps (typical) SSB PHASE NOISE dBc/HZ OFFSET FROM CARRIER FREQUENCY (HZ) As with most timing specifications, phase noise measurements has issues relating to the limitations of the equipment. Often the noise floor of the equipment is higher than the noise floor of the device. This is illustrated above. The device meets the noise floor of what is shown, but can actually be lower. The phase noise is dependent on the input source and measurement equipment. IDT ™ / ICS™ 0.7V HCSL FANOUT BUFFER 6 ICS85105AGI REV. A JUNE 5, 2008 ICS85105I LOW SKEW, 1-TO-5, DIFFERENTIAL/LVCMOS-TO-0.7V HCSL FANOUT BUFFER PARAMETER MEASUREMENT INFORMATION 3.3V±10% 3.3V±10% SCOPE VDD 50Ω VDD 33Ω 49.9Ω 50Ω Qx 2pF HCSL 50Ω GND 475Ω IREF 0V 0V HCSL 33Ω GND 475Ω IREF 49.9Ω 50Ω nQx 2pF This load condition is used for IDD, tsk(o), t PD, and t jit measurements. HCSL OUTPUT LOAD AC TEST CIRCUIT VDD HCSL OUTPUT LOAD AC TEST CIRCUIT PART 1 nQx Qx nCLK0 V PP Cross Points V PART 2 nQy Qy CMR CLK0 t sk(pp) GND DIFFERENTIAL INPUT LEVELS nQx Qx nQy Qy t sk(o) PART-TO-PART SKEW nCLK0 CLK0 nQ0:nQ4 Q0:Q4 tPD OUTPUT SKEW (DIFFERENTIAL INPUT) PROPAGATION DELAY (DIFFERENTIAL INPUTS) Rise Edge Rate Fall Edge Rate CLK1 +150mV nQ0:nQ4 Q0:Q4 tPD Q - nQ 0.0V -150mV PROPAGATION DELAY (LVCMOS INPUT) DIFFERENTIAL MEASUREMENT POINTS FOR RISE/FALL TIME IDT ™ / ICS™ 0.7V HCSL FANOUT BUFFER 7 ICS85105AGI REV. A JUNE 5, 2008 ICS85105I LOW SKEW, 1-TO-5, DIFFERENTIAL/LVCMOS-TO-0.7V HCSL FANOUT BUFFER PARAMETER MEASUREMENT INFORMATION, CONTINUED Clock Period (Differential) Positive Duty Cycle (Differential) Negative Duty Cycle (Differential) nQ VCROSS_DELTA = 140mV 0.0V Q Q - nQ DIFFERENTIAL MEASUREMENT POINTS FOR DUTY CYCLE/PERIOD SE MEASUREMENT POINTS FOR DELTA CROSS POINT TSTABLE VRB +150mV VRB = +100mV 0.0V VRB = -100mV -150mV Q - nQ VRB TSTABLE DIFFERENTIAL MEASUREMENT POINTS FOR RINGBACK VMAX = 1.15V nQ VCROSS_MAX = 550mV VCROSS_MIN = 250mV Q VMIN = -0.30V SE MEASUREMENT POINTS FOR ABSOLUTE CROSS POINT/SWING IDT ™ / ICS™ 0.7V HCSL FANOUT BUFFER 8 ICS85105AGI REV. A JUNE 5, 2008 ICS85105I LOW SKEW, 1-TO-5, DIFFERENTIAL/LVCMOS-TO-0.7V HCSL FANOUT BUFFER APPLICATION INFORMATION RECOMMENDATIONS FOR UNUSED INPUT AND OUTPUT PINS INPUTS: CLK INPUT For applications not requiring the use of a clock input, it can be left floating. Though not required, but for additional protection, a 1kΩ resistor can be tied from the CLK input to ground. CLK/nCLK INPUTS For applications not requiring the use of the differential input, both CLK and nCLK can be left floating. Though not required, but for additional protection, a 1kΩ resistor can be tied from CLK to ground. LVCMOS CONTROL PINS All control pins have internal pull-ups or pull-downs; additional resistance is not required but can be added for additional protection. A 1kΩ resistor can be used. OUTPUTS: DIFFERENTIAL OUTPUTs All unused differential outputs can be left floating. We recommend that there is no trace attached. Both sides of the differential output pair should either be left floating or terminated. WIRING THE DIFFERENTIAL INPUT TO ACCEPT SINGLE ENDED LEVELS Figure 2 shows how the differential input can be wired to accept single ended levels. The reference voltage V_BIAS = VDD/2 is generated by the bias resistors R1, R2 and C1. This bias circuit should be located as close as possible to the input pin. The ratio of R1 and R2 might need to be adjusted to position the V_BIAS in the center of the input voltage swing. For example, if the input clock swing is only 2.5V and VDD = 3.3V, V_BIAS should be 1.25V and R2/R1 = 0.609. VDD R1 1K Single Ended Clock Input CLK V_Bias nCLK C1 0.1u R2 1K FIGURE 2. SINGLE ENDED SIGNAL DRIVING DIFFERENTIAL INPUT IDT ™ / ICS™ 0.7V HCSL FANOUT BUFFER 9 ICS85105AGI REV. A JUNE 5, 2008 ICS85105I LOW SKEW, 1-TO-5, DIFFERENTIAL/LVCMOS-TO-0.7V HCSL FANOUT BUFFER DIFFERENTIAL CLOCK INPUT INTERFACE The CLK /nCLK accepts LVDS, LVPECL, LVHSTL, SSTL, HCSL and other differential signals. Both signals must meet the VPP and VCMR input requirements. Figures 3A to 3F show interface examples for the HiPerClockS CLK/nCLK input driven by the most common driver types. The input interfaces suggested here are examples only. Please consult with the vendor of the driver component to confirm the driver termination requirements. For example in Figure 3A, the input termination applies for IDT HiPerClockS open emitter LVHSTL drivers. If you are using an LVHSTL driver from another vendor, use their termination 3.3V 3.3V 3.3V 1.8V Zo = 50 Ohm Zo = 50 Ohm CLK Zo = 50 Ohm nCLK LVHSTL ICS HiPerClockS LVHSTL Driver R1 50 R2 50 R3 50 LVPECL HiPerClockS Input R1 50 R2 50 Zo = 50 Ohm nCLK HiPerClockS Input CLK FIGURE 3A. HIPERCLOCKS CLK/nCLK INPUT DRIVEN BY AN IDT OPEN EMITTER HIPERCLOCKS LVHSTL DRIVER FIGURE 3B. HIPERCLOCKS CLK/nCLK INPUT DRIVEN BY A 3.3V LVPECL DRIVER 3.3V 3.3V 3.3V R3 125 Zo = 50 Ohm CLK Zo = 50 Ohm nCLK LVPECL R1 84 R2 84 HiPerClockS Input R4 125 3.3V 3.3V LVDS_Driv er R1 100 Zo = 50 Ohm Zo = 50 Ohm CLK nCLK Receiv er FIGURE 3C. HIPERCLOCKS CLK/nCLK INPUT DRIVEN BY A 3.3V LVPECL DRIVER FIGURE 3D. HIPERCLOCKS CLK/nCLK INPUT DRIVEN BY A 3.3V LVDS DRIVER 2.5V 3.3V 2.5V 2.5V 3.3V *R3 33 Zo = 50Ω CLK Zo = 50Ω nCLK Zo = 60Ω R3 120 R4 120 CLK Zo = 60Ω nCLK HCSL *R4 33 R1 50 R2 50 HiPerClockS Input SSTL R1 120 R2 120 HiPerClockS *Optional – R3 and R4 can be 0Ω FIGURE 3E. HIPERCLOCKS CLK/nCLK INPUT DRIVEN BY A 3.3V HCSL DRIVER FIGURE 3F. HIPERCLOCKS CLK/nCLK INPUT DRIVEN BY A 2.5V SSTL DRIVER IDT ™ / ICS™ 0.7V HCSL FANOUT BUFFER 10 ICS85105AGI REV. A JUNE 5, 2008 ICS85105I LOW SKEW, 1-TO-5, DIFFERENTIAL/LVCMOS-TO-0.7V HCSL FANOUT BUFFER RECOMMENDED TERMINATION Figure 4A i s the recommended termination for applications which require the receiver and driver to be on a separate PCB. All traces should be 50Ω impedance. FIGURE 4A. RECOMMENDED TERMINATION Figure 4B i s the recommended termination for applications which require a point to point connection and contain the driver and receiver on the same PCB. All traces should all be 50Ù impedance. FIGURE 4B. RECOMMENDED TERMINATION IDT ™ / ICS™ 0.7V HCSL FANOUT BUFFER 11 ICS85105AGI REV. A JUNE 5, 2008 ICS85105I LOW SKEW, 1-TO-5, DIFFERENTIAL/LVCMOS-TO-0.7V HCSL FANOUT BUFFER POWER CONSIDERATIONS This section provides information on power dissipation and junction temperature for the ICS85105I. Equations and example calculations are also provided. 1. Power Dissipation. The total power dissipation for the ICS85105I is the sum of the core power plus the power dissipated in the load(s). The following is the power dissipation for VDD = 3.3V + 10% = 3.63V, which gives worst case results. NOTE: Please refer to Section 3 for details on calculating power dissipated in the load. • • Power (core)MAX = VDD_MAX * IDD_MAX = 3.63V * 27mA = 98.01mW Power (outputs)MAX = 47.3mW/Loaded Output pair If all outputs are loaded, the total power is 5 * 47.3mW = 236.5mW Total Power_MAX (3.63V, with all outputs switching) = 98.01mW + 236.5mW = 334.51mW 2. Junction Temperature. Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C. The equation for Tj is as follows: Tj = θJA * Pd_total + TA Tj = Junction Temperature θJA = Junction-to-Ambient Thermal Resistance Pd_total = Total Device Power Dissipation (example calculation is in Section 1 above) TA = Ambient Temperature In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming no air flow and a multi-layer board, the appropriate value is 91.1°C/W per Table 6 below. Therefore, Tj for an ambient temperature of 85°C with all outputs switching is: 85°C + 0.335W * 91.1°C/W = 115.5°C. This is below the limit of 125°C. This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow, and the type of board (single layer or multi-layer). TABLE 6. THERMAL RESISTANCE θJA FOR 20-LEADN TSSOP, FORCED CONVECTION θ by Velocity (Meters per Second) JA 0 Multi-Layer PCB, JEDEC Standard Test Boards 91.1°C/W 1 86.7°C/W 2.5 84.6°C/W IDT ™ / ICS™ 0.7V HCSL FANOUT BUFFER 12 ICS85105AGI REV. A JUNE 5, 2008 ICS85105I LOW SKEW, 1-TO-5, DIFFERENTIAL/LVCMOS-TO-0.7V HCSL FANOUT BUFFER 3. Calculations and Equations. The purpose of this section is to calculate power dissipation on the IC per HCSL output pair. HCSL output driver circuit and termination are shown in Figure 5. VDD IOUT = 17mA ➤ VOUT RREF = 475Ω ± 1% RL 50Ω IC FIGURE 5. HCSL DRIVER CIRCUIT AND TERMINATION HCSL is a current steering output which sources a maximum of 17mA of current per output. To calculate worst case on-chip power dissipation, use the following equations which assume a 50Ω load to ground. The highest power dissipation occurs when VDD is HIGH. Power = (VDD_HIGH – VOUT ) * IOUT, since VOUT = IOUT * RL = (VDD_HIGH – IOUT * RL) * IOUT = (3.63V – 17mA * 50Ω) * 17mA Total Power Dissipation per output pair = 47.3mW IDT ™ / ICS™ 0.7V HCSL FANOUT BUFFER 13 ICS85105AGI REV. A JUNE 5, 2008 ICS85105I LOW SKEW, 1-TO-5, DIFFERENTIAL/LVCMOS-TO-0.7V HCSL FANOUT BUFFER RELIABILITY INFORMATION TABLE 7. θJAVS. AIR FLOW TABLE FOR 20 LEAD TSSOP θ by Velocity (Meters per Second) JA 0 Multi-Layer PCB, JEDEC Standard Test Boards 91.1°C/W 1 86.7°C/W 2.5 84.6°C/W TRANSISTOR COUNT The transistor count for ICS85105I is: 614 PACKAGE OUTLINE AND DIMENSIONS PACKAGE OUTLINE - G SUFFIX FOR 20 LEAD TSSOP TABLE 8A. PACKAGE DIMENSIONS SYMBOL N A A1 A2 b c D E E1 e L α aaa 0.45 0° -4.30 0.65 BASIC 0.75 8° 0.10 -0.05 0.80 0.19 0.09 6.40 6.40 BASIC 4.50 Millimeters Minimum 20 1.20 0.15 1.05 0.30 0.20 6.60 Maximum Reference Document: JEDEC Publication 95, MO-153 IDT ™ / ICS™ 0.7V HCSL FANOUT BUFFER 14 ICS85105AGI REV. A JUNE 5, 2008 ICS85105I LOW SKEW, 1-TO-5, DIFFERENTIAL/LVCMOS-TO-0.7V HCSL FANOUT BUFFER TABLE 9. ORDERING INFORMATION Part/Order Number 85105AGI 85105AGIT 85105AGILF 85105AGILFT Marking ICS85105AGI ICS85105AGI ICS85105AGIL ICS85105AGIL Package 20 lead TSSOP 20 lead TSSOP 20 lead "Lead-Free" TSSOP 20 lead "Lead-Free" TSSOP Shipping Packaging tube 2500 tape & reel tube 2500 tape & reel Temperature -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C NOTE: Par ts that are ordered with an "LF" suffix to the par t number are the Pb-Free configuration and are RoHS compliant. While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology, Incorporated (IDT) assumes no responsibility for either its use or for infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial and industrial applications. Any other applications such as those requiring high reliability or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments. IDT ™ / ICS™ 0.7V HCSL FANOUT BUFFER 15 ICS85105AGI REV. A JUNE 5, 2008 ICS85105I LOW SKEW, 1-TO-5, DIFFERENTIAL/LVCMOS-TO-0.7V HCSL FANOUT BUFFER Innovate with IDT and accelerate your future networks. Contact: www.IDT.com For Sales 800-345-7015 (inside USA) +408-284-8200 (outside USA) Fax: 408-284-2775 www.IDT.com/go/contactIDT For Tech Support netcom@idt.com +480-763-2056 Corporate Headquarters Integrated Device Technology, Inc. 6024 Silver Creek Valley Road San Jose, CA 95138 United States 800-345-7015 (inside USA) +408-284-8200 (outside USA) © 2008 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT, the IDT logo, ICS and HiPerClockS are trademarks of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners. Printed in USA