Differential-to-HSTL Zero Delay Clock Generator
ICS872S480
DATA SHEET
General Description
The ICS872S480 is a Zero Delay Clock Generator with hitless input clock switching capability. The ICS872S480 is ideal for use in redundant, fault tolerant clock trees where low jitter frequency synthesis are critical. The device receives two differential clock signals from which it generates two outputs with “zero” delay. The output and feedback dividers are configured to allow for a 1:1 frequency generation ratio. The ICS872S480 Dynamic Clock Switch (DCS) circuit continuously monitors both input clock signals. Upon detection of an invalid clock input (stuck LOW or HIGH for at least one complete clock period of the VCO feedback frequency), the loss of reference monitor will be set HIGH. If that clock is the primary clock, the DCS will switch to the good secondary clock and phase/frequency alignment will occur with minimal output phase disturbance. Once the primary clock is restored to a good state, the DCS will automatically switch back to the primary clock input. The low jitter characteristics with input clock monitoring and DCS capability make the ICS872S480 an ideal choice for DDR3 applications requiring fault tolerant reference clocks.
Features
• • • • • • • • • • • • • •
Three differential HSTL output pairs Selectable differential CLKx, nCLKx input pairs CLKx, nCLKx pairs can accept the following differential input levels: LVPECL, LVDS, HSTL, HCSL Output frequency range: 350MHz to 950MHz Input frequency range: 350MHz to 950MHz VCO range: 970MHz to 2250MHz External feedback for “zero delay” clock regeneration with configurable frequencies Static phase offset: ±100ps (maximum) Cycle-to-cycle jitter: 25ps (maximum) Output skew: 20ps (maximum) 3.3V operating voltage supply Selectable DDR3 or DDR3 low voltage output 0°C to 70°C ambient operating temperature Available in lead-free (RoHS 6) package
Function Table
Input FREQ_SEL 0 1 (default) Output Divider 2 4 Input & Output Frequency (MHz)
Pin Assignment
AUTO_SEL
GND
VDD
485 350
950 562.5
CLK0 nCLK0 GND 1 2 3 4 5 6 7 8
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 9 nQFB 10 11 12 13 14 15 16 nQ1 Q1 Q0 QFB nQ0 VDD VDD 17 VDD LOR0 LOR1 CLK_IND GND FREQ_SEL OE VDDA
Output Voltage Table
Input VOUT_SEL 0 (default) 1 HSTL Output Style 1.5V 1.35V
CLK1 nCLK1 PLL_BYPASS FB_IN nFB_IN
ICS872S480 32-Lead VFQFN 5mm x 5mm x 0.925mm package body K Package Top View
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VDD
Minimum
Maximum
VOUT_SEL
REF_SEL
nc
nc
ICS872S480 Data Sheet
DIFFERENTIAL-TO-HSTL ZERO DELAY CLOCK GENERATOR
Block Diagram
VOUT_SEL OE PLL_Bypass
Pulldown Pullup
Pulldown
Q0, nQ0 CLK0 nCLK0
Pullup Pulldown
Activity Detector
0 1
Activity Detector
1 PD + CP + LF
Output Divider
LOR0 CLK1 nCLK1
Pullup Pulldown
Q1, nQ1
VCO
0
LOR1
QFB, nQFB
CLK_IND REF_SEL
Pulldown
Dynamic Switch Logic
1 0
AUTO_SEL
Pullup
FB_IN nFB_IN
Pullup Pulldown
FREQ_SEL
Pullup
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ICS872S480 Data Sheet
DIFFERENTIAL-TO-HSTL ZERO DELAY CLOCK GENERATOR
Table 1. Pin Descriptions
Number 1 2 3, 20, 28 4 5 6 7 8 9, 10 11, 16, 24, 25, 32 12, 13 14, 15 17 18 19 21 22 23 26 27, 29 30 Name CLK0 nCLK0 GND CLK1 nCLK1 PLL_BYPASS FB_IN nFB_IN nQFB, QFB VDD nQ1, Q1 nQ0, Q0 VDDA OE FREQ_SEL CLK_IND LOR1 LOR0 Input Input Power Input Input Input Input Input Output Power Output Output Power Input Input Output Output Output Input Unused Input Pullup Pulldown Pullup Pullup Pulldown Pullup Pulldown Pulldown Pullup Type Pulldown Pullup Description Non-inverting differential clock input. Inverting differential clock input. Power supply ground. Non-inverting differential clock input. Inverting differential clock input. PLL bypass pin. When HIGH, the PLL is bypassed and the reference clock is passed directly to the output dividers. LVCMOS/LVTTL interface levels. Non-inverting differential external feedback input. Inverting differential external feedback input. Differential feedback output pair. HSTL interface levels. See Table 4D. Core supply pins. Differential output pair. HSTL interface levels. Differential output pair. HSTL interface levels. Analog supply pin. Output enable pin. LVCMOS/LVTTL interface levels. Frequency select pin. LVCMOS/LVTTL interface levels. Clock indicator pin. When LOW, CLK0, nCLK0 is selected. When HIGH, CLK1, nCLK1 is selected. Loss of Reference Indicator for CLK1, nCLK1. LVCMOS/LVTTL interface levels. Loss of Reference Indicator for CLK0, nCLK0. LVCMOS/LVTTL interface levels. Output voltage select pin. LVCMOS/LVTTL interface levels. No connect. Dynamic Clock switch enable pin. When LOW, disables internal Dynamic Clock Switch circuitry and CLK_INDICATOR will track REF_SEL. When HIGH, Dynamic Clock Switch is enabled. LVCMOS/LVTTL interface levels. Reference clock select pin. When LOW selects CLK0, nCLK0, when HIGH selects CLK1, nCLK1. LVCMOS/LVTTL interface levels.
VOUT_SEL
nc AUTO_SEL
31
REF_SEL
Input
Pulldown
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
Table 2. Pin Characteristics
Symbol CIN RPULLUP RPULLDOWN Parameter Input Capacitance Input Pullup Resistor Input Pulldown Resistor Test Conditions Minimum Typical 2 51 51 Maximum Units pF kΩ kΩ
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ICS872S480 Data Sheet
DIFFERENTIAL-TO-HSTL ZERO DELAY CLOCK GENERATOR
Absolute Maximum Ratings
NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability. Item Supply Voltage, VDD Inputs, VI Outputs, VO Package Thermal Impedance, θJA Storage Temperature, TSTG Rating 4.6V -0.5V to VDD + 0.5V -0.5V to VDD + 0.5V 42.7°C/W (0 mps) -65°C to 150°C
DC Electrical Characteristics
Table 4A. Power Supply DC Characteristics, VDD = 3.3V ± 5%, TA = 0°C to 70°C
Symbol VDD VDDA IDD IDDA Parameter Core Supply Voltage Analog Supply Voltage Power Supply Current Analog Supply Current Outputs terminated 50Ω to GND Test Conditions Minimum 3.135 VDD –0.25 Typical 3.3 3.3 Maximum 3.465 VDD 275 25 Units V V mA mA
Table 4B. LVCMOS/LVTTL DC Characteristics, VDD = 3.3V ± 5%, TA = 0°C to 70°C
Symbol VIH VIL Parameter Input High Voltage Input Low Voltage PLL_BYPASS, REF_SEL, VOUT_SEL OE, FREQ_SEL, AUTO_SEL PLL_BYPASS, REF_SEL, VOUT_SEL OE, FREQ_SEL, AUTO_SEL VDD = VIN = 3.465V VDD = VIN = 3.465V VDD = 3.465V, VIN = 0V VDD = 3.465V, VIN = 0V -10 -150 Test Conditions Minimum 2.2 -0.3 Typical Maximum VDD + 0.3 0.8 150 10 Units V V µA µA µA µA
IIH
Input High Current
IIL
Input Low Current
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ICS872S480 Data Sheet
DIFFERENTIAL-TO-HSTL ZERO DELAY CLOCK GENERATOR
Table 4C. Differential DC Characteristics, VDD = 3.3V ± 5%, TA = 0°C to 70°C
Symbol IIH Parameter Input High Current Input Low Current CLK0, CLK1, FB_IN nCLK0, nCLK1, nFB_IN CLK0, CLK1, FB_IN nCLK0, nCLK1, nFB_IN Test Conditions VDD = VIN = 3.465V VDD = VIN = 3.465V VDD = 3.465V, VIN = 0V VDD = 3.465V, VIN = 0V -10 -150 0.15 0.3 1.75 VDD – 0.85 Minimum Typical Maximum 150 10 Units µA µA µA µA V V
IIL VPP VCMR
Peak-to-Peak Voltage; NOTE 1 Common Mode Input Voltage; NOTE 1, 2
NOTE 1: VIL should not be less than -0.3V. NOTE 2: Common mode input voltage is defined as VIH.
Table 4D. HSTL DC Characteristics, VDD = 3.3V ± 5%, TA = 0°C to 70°C
Symbol VOX Parameter Output Crosspoint Voltage, NOTE 1 Differential Output Voltage; NOTE 1 Test Conditions VOUT_SEL = 0 VOUT_SEL = 1 VOUT_SEL = 0 VOUT_SEL = 1 Minimum 0.7 0.6 0.8 0.8 Typical 0.8 0.7 0.9 0.9 Maximum 0.9 0.8 1.0 1.0 Units V V V V
VOD
NOTE 1: Outputs terminated with 50Ω to ground.
Table 5. Input Frequency Characteristics, VDD = 3.3V ± 5%, TA = 0°C to 70°C
Symbol FIN Parameter Input Frequency CLK0, nCLK0, CLK1, nCLK1 Test Conditions FSEL = 1 FSEL = 0 Minimum 485 350 Typical Maximum 950 562.5 Units MHz MHz
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ICS872S480 Data Sheet
DIFFERENTIAL-TO-HSTL ZERO DELAY CLOCK GENERATOR
AC Electrical Characteristics
Table 6. AC Characteristics, VDD = 3.3V ± 5%, TA = 0°C to 70°C
Symbol fOUT Parameter Output Frequency fOUT = 400MHz t(Ø) Static Phase Offset; NOTE 1, 2 fOUT = 533.3MHz fOUT = 666.6MHz fOUT = 800MHz fOUT = 400MHz tdyn(Ø) Dynamic Phase Offset; NOTE 7 fOUT = 533.3MHz fOUT = 666.6MHz fOUT = 800MHz pdev tsk(o) tjit(cc) tL tLdcs Output Period Deviation; NOTE 3, 7 Output Skew; NOTE 2, 4 Cycle-to-Cycle Jitter; NOTE 3, 7 PLL Lock Time; NOTE 7 DCS PLL Lock Time; NOTE 6, 7 fOUT = 400MHz 2.00 2.00 2.00 2.50 2.00 2.00 2.50 3.00 47 fOUT = 533.3MHz fOUT = 666.6MHz fOUT = 800MHz fOUT = 400MHz fOUT = 533.3MHz fOUT = 666.6MHz fOUT = 800MHz odc Output Duty Cycle 1.7 3.50 4.25 4.25 5.25 3.85 4.50 4.65 5.65 5.75 6.50 6.75 8.65 6.35 6.85 7.25 8.25 53 Test Conditions Minimum 350 -25 -50 -50 -50 Typical Maximum 950 75 50 50 50 ±20 ±25 ±20 ±20 100 20 25 3 Units MHz ps ps ps ps ps ps ps ps ps ps ps ms µs V/ns V/ns V/ns V/ns V/ns V/ns V/ns V/ns %
VOUT_SEL = 0
tSLEW Output Slew Rate; NOTE 5
VOUT_SEL = 1
NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium has been reached under these conditions. NOTE 1: Defined as the time difference between the input reference clock and the averaged feedback input signal across all conditions, when the PLL is locked and the input reference frequency is stable. Characterized using HSTL input level of 900mV, swing centered around 0.6V. NOTE 2: This parameter is defined in accordance with JEDEC Standard 65. NOTE 3: This parameter is defined as the maximum output period deviation during a dynamic switch event with reference inputs 180° out of phase. This does not factor in any cycle-to-cycle jitter seen on the input or output. NOTE 4: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at the output differential cross points. NOTE 5: Output slew rate is measured at VOX ± 150mV for VOUT_SEL = 0 and VOX ±135mV for VOUT_SEL = 1. NOTE 6: This parameter is defined as PLL lock time after a dynamic switch event with reference inputs 180° out of phase. NOTE 7: This parameter is guaranteed by characterization. Not tested in production.
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ICS872S480 Data Sheet
DIFFERENTIAL-TO-HSTL ZERO DELAY CLOCK GENERATOR
Parameter Measurement Information
3.3V ± 5% 3.3V ± 5%
VDD
VDD VDDA
Qx
SCOPE
nCLK0, nCLK1
V
PP
Cross Points
V
CMR
HSTL
nQx
CLK0, CLK1
GND
GND
0V
3.3V Output Load AC Test Circuit
Differential Input Level
nQ[0:1] nQx Q[0:1] Qx
t cycle n
➤
t jit(cc) = |t cycle n – t cycle n+1| 1000 Cycles
Cycle-to-Cycle Jitter
nCLK[0:1] CLK[0:1] nFB_IN FB_IN nQ[0:1] Q[0:1]
➤ t (Ø)
t(Ø)mean = Static Phase Offset (where t(Ø) is any random sample, and t(Ø)mean is the average of the sampled cycles measured on controlled edges)
Static Phase Offset
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➤
➤
➤
t cycle n+1
➤
nQy Qy
t sk(o)
Output Skew
t PW
t
PERIOD
odc =
t PW t PERIOD
x 100%
Output Duty Cycle/Pulse Width/Period
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ICS872S480 Data Sheet
DIFFERENTIAL-TO-HSTL ZERO DELAY CLOCK GENERATOR
Parameter Measurement Information, continued
nCLK[0:1] nCLK[0:1]
∆t
+VAC VOX VOD
∆t
nFB_IN
-VAC
FB_IN
Histogram Dynamic Phase Offset
➤ t (Ø)
Dynamic Phase Offset = t(Ø) – t(Ø)mean tdyn(Ø) = Peak-to-Peak value of Dynamic Phase Offset Histogram Where t(Ø) is any random sample, and t(Ø)mean is the average of the sampled cycles measured on the controlled edges
Dynamic Phase Offset
PLL Lock Time
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➤ ➤
t (Ø)mean
VAC = 150mV for VOUT_SEL = 0 VAC = 135mV for VOUT_SEL = 1 tSLEW = 2 * VAC ∆t
Slew Rate
8
©2011 Integrated Device Technology, Inc.
ICS872S480 Data Sheet
DIFFERENTIAL-TO-HSTL ZERO DELAY CLOCK GENERATOR
Applications Information
Clock Redundancy and Reference Selection
The ICS872S480 accepts two differential input clocks, CLK0, nCLK0 and CLK1, nCLK1, for the purpose of redundancy. Only one of these clocks can be selected at any given time for use as the reference. CLK0, nCLK0 is defined as the initial, or primary clock, while the remaining clock is the redundant or secondary clock. The output signal CLK_IND indicates which clock input is being used as the reference (LOW = CLK0, nCLK0, HIGH = CLK1, nCLK1).
Output Transitioning
After a successful DCS initiated clock switch, the internal PLL of the ICS872S480 will begin slewing to phase/frequency alignment of the newly selected clock input. The PLL will achieve lock to the new input with minimal phase disturbance at the outputs.
Recommended Power-up Sequence
1.Before startup, set AUTO_SEL low so the PLL will operate in manual switch mode, plus set REF_SEL low to ensure that the primary reference clock, CLK0, nCLK0, is selected. This will ensure that during startup, the PLL will acquire lock using the primary reference clock input. 2.Once powered-up, and assuming a stable clock is present at the primary clock input, the PLL will begin to phase/frequency slew as it attempts to achieve lock with the input reference clock. 3.Drive AUTO_SEL HIGH to enable DCS mode.
Failure Detection and Alarm Signaling
Within the ICS872S480 device, CLK0, nCLK0 and CLK1, nCLK1 are continuously monitored for failures. A failure on either of these clocks is detected when one of the clock signals is stuck HIGH or LOW for at least 1 period of the feedback. Upon detection of a failure, the corresponding loss-of-reference signal, LOR0 or LOR1, will be set HIGH. The input clocks are continuously monitored and the loss-of-reference signals will continue to reflect the real-time status of each input clock.
Manual Clock Switching
When input signal AUTO_SEL is driven LOW, the clock specified by REF_SEL will always be used as the reference, even when a clock failure is detected at the reference. In order to switch between CLK0, nCLK0 and CLK1, nCLK1 as the reference clock, the level on REF_SEL must be driven to the appropriate level. When the level on REF_SEL is changed, the selection of the new clock will take place, and CLK_IND will be updated to indicate which clock is now supplying the reference to the PLL.
Alternate Power-up Sequence
If both input clocks are valid before power up, the part may be powered-up in DCS mode. However, it cannot be guaranteed that the PLL will achieve lock with one specific input clock. 1.Before startup, leave AUTO_SEL floating and the internal pullup will enable DCS mode. 2.Once powered up, the PLL will begin to phase/frequency slew as it attempts to achieve lock with one of the input reference clocks.
Dynamic Clock Switching
The Dynamic Clock Switching (DCS) process serves as an automatic safety mechanism to protect the stability of the PLL when a failure occurs on the reference. When input signal AUTO_SEL is not driven HIGH, an internal pullup pulls it HIGH so that DCS is enabled. If DCS is enabled and a failure occurs on the initial clock, the ICS872S480 device will check the status of the secondary clock. If the secondary clock is detected as a good input clock, the ICS872S480 will automatically de-select the initial clock as the reference and multiplex in the secondary clock. When a successful switch from the initial to secondary clock has been accomplished, CLK_IND will be updated to indicate the new reference. If and when the fault on the initial clock is corrected, the corresponding loss-of-reference flag will be updated to represent this clock as good again. Once updated, the DCS will undergo an automatic clock switch. See the Dynamic Clock Switch State Diagram and for additional details on the functionality of the Dynamic Clock Switching circuit.
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ICS872S480 Data Sheet
DIFFERENTIAL-TO-HSTL ZERO DELAY CLOCK GENERATOR
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State Diagram
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ICS872S480 Data Sheet
DIFFERENTIAL-TO-HSTL ZERO DELAY CLOCK GENERATOR
Wiring the Differential Input to Accept Single-Ended Levels
Figure 1 shows how a differential input can be wired to accept single ended levels. The reference voltage VREF = VDD/2 is generated by the bias resistors R1 and R2. The bypass capacitor (C1) is used to help filter noise on the DC bias. This bias circuit should be located as close to the input pin as possible. The ratio of R1 and R2 might need to be adjusted to position the VREF in the center of the input voltage swing. For example, if the input clock swing is 2.5V and VDD = 3.3V, R1 and R2 value should be adjusted to set VREF at 1.25V. The values below are for when both the single ended swing and VDD are at the same voltage. This configuration requires that the sum of the output impedance of the driver (Ro) and the series resistance (Rs) equals the transmission line impedance. In addition, matched termination at the input will attenuate the signal in half. This can be done in one of two ways. First, R3 and R4 in parallel should equal the transmission line impedance. For most 50Ω applications, R3 and R4 can be 100Ω. The values of the resistors can be increased to reduce the loading for slower and weaker LVCMOS driver. When using single-ended signaling, the noise rejection benefits of differential signaling are reduced. Even though the differential input can handle full rail LVCMOS signaling, it is recommended that the amplitude be reduced. The datasheet specifies a lower differential amplitude, however this only applies to differential signals. For single-ended applications, the swing can be larger, however VIL cannot be less than -0.3V and VIH cannot be more than VDD + 0.3V. Though some of the recommended components might not be used, the pads should be placed in the layout. They can be utilized for debugging purposes. The datasheet specifications are characterized and guaranteed by using a differential signal.
Figure 1. Recommended Schematic for Wiring a Differential Input to Accept Single-ended Levels
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ICS872S480 Data Sheet
DIFFERENTIAL-TO-HSTL ZERO DELAY CLOCK GENERATOR
Differential Clock Input Interface
The CLK /nCLK accepts LVDS, LVPECL, HSTL, HCSL and other differential signals. Both differential signals must meet the VPP and VCMR input requirements. Figures 3A to 3E show interface examples for the CLK/nCLK input driven by the most common driver types. The input interfaces suggested here are examples only. Please consult with the vendor of the driver component to confirm the driver termination requirements. For example, in Figure 3A, the input termination applies for IDT open emitter HSTL drivers. If you are using an HSTL driver from another vendor, use their termination recommendation.
3.3V 1.8V Zo = 50Ω CLK Zo = 50Ω nCLK
3.3V 3.3V Zo = 50Ω CLK Zo = 50Ω nCLK
LVHSTL IDT LVHSTL Driver
R1 50Ω R2 50Ω
Differential Input
LVPECL
R1 50Ω R2 50Ω
Differential Input
R2 50Ω
Figure 3A. CLK/nCLK Input Driven by an IDT Open Emitter HSTL Driver
Figure 3B. CLK/nCLK Input Driven by a 3.3V LVPECL Driver
3.3V 3.3V 3.3V Zo = 50Ω CLK Zo = 50Ω nCLK R1 100Ω CLK R3 125Ω R4 125Ω 3.3V Zo = 50Ω 3.3V
LVPECL
R1 84Ω R2 84Ω
Differential Input
Zo = 50Ω
nCLK
LVDS
Receiver
Figure 3C. CLK/nCLK Input Driven by a 3.3V LVPECL Driver
Figure 3D. CLK/nCLK Input Driven by a 3.3V LVDS Driver
3.3V
3.3V
*R3
33Ω
Zo = 50Ω CLK Zo = 50Ω nCLK
HCSL
*R4
33Ω R1 50Ω R2 50Ω
Differential Input
*Optional – R3 and R4 can be 0Ω
Figure 3E. CLK/nCLK Input Driven by a 3.3V HCSL Driver
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ICS872S480 Data Sheet
DIFFERENTIAL-TO-HSTL ZERO DELAY CLOCK GENERATOR
Recommendations for Unused Input Pins Inputs:
LVCMOS Control Pins
All control pins have internal pullups or pulldowns; additional resistance is not required but can be added for additional protection. A 1kΩ resistor can be used.
Outputs:
HSTL Outputs
All unused HSTL outputs can be left floating. We recommend that there is no trace attached. Both sides of the differential output pair should either be left floating or terminated.
CLK/nCLK Inputs
For applications not requiring the use of the differential input, both CLK and nCLK can be left floating. Though not required, but for additional protection, a 1kΩ resistor can be tied from CLK to ground.
HSTL Output Termination
VDDO VDD
Zo = 50 + Zo = 50 HSTL R1 50 R2 50 HSTL
ICS HiPerClockS HSTL Driv er
Figure 4. Output Termination
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ICS872S480 Data Sheet
DIFFERENTIAL-TO-HSTL ZERO DELAY CLOCK GENERATOR
VFQFN EPAD Thermal Release Path
In order to maximize both the removal of heat from the package and the electrical performance, a land pattern must be incorporated on the Printed Circuit Board (PCB) within the footprint of the package corresponding to the exposed metal pad or exposed heat slug on the package, as shown in Figure 5. The solderable area on the PCB, as defined by the solder mask, should be at least the same size/shape as the exposed pad/slug area on the package to maximize the thermal/electrical performance. Sufficient clearance should be designed on the PCB between the outer edges of the land pattern and the inner edges of pad pattern for the leads to avoid any shorts. While the land pattern on the PCB provides a means of heat transfer and electrical grounding from the package to the board through a solder joint, thermal vias are necessary to effectively conduct from the surface of the PCB to the ground plane(s). The land pattern must be connected to ground through these vias. The vias act as “heat pipes”. The number of vias (i.e. “heat pipes”) are application specific and dependent upon the package power dissipation as well as electrical conductivity requirements. Thus, thermal and electrical analysis and/or testing are recommended to determine the minimum number needed. Maximum thermal and electrical performance is achieved when an array of vias is incorporated in the land pattern. It is recommended to use as many vias connected to ground as possible. It is also recommended that the via diameter should be 12 to 13mils (0.30 to 0.33mm) with 1oz copper via barrel plating. This is desirable to avoid any solder wicking inside the via during the soldering process which may result in voids in solder between the exposed pad/slug and the thermal land. Precautions should be taken to eliminate any solder voids between the exposed heat slug and the land pattern. Note: These recommendations are to be used as a guideline only. For further information, please refer to the Application Note on the Surface Mount Assembly of Amkor’s Thermally/ Electrically Enhance Leadframe Base Package, Amkor Technology.
PIN
SOLDER
EXPOSED HEAT SLUG
SOLDER
PIN
PIN PAD
GROUND PLANE THERMAL VIA
LAND PATTERN (GROUND PAD)
PIN PAD
Figure 5. P.C. Assembly for Exposed Pad Thermal Release Path – Side View (drawing not to scale)
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ICS872S480 Data Sheet
DIFFERENTIAL-TO-HSTL ZERO DELAY CLOCK GENERATOR
Schematic Example
Figure 6 shows an example of ICS872S480 application schematic. In this example, the device is operated at VDD = 3.3V. As with any high speed analog circuitry, the power supply pins are vulnerable to random noise. To achieve optimum jitter performance, power supply isolation is required. The ICS872S480 provides separate power supplies to isolate from coupling into the internal PLL. In order to achieve the best possible filtering, it is recommended that the placement of the filter components be on the device side of the PCB as close to the power pins as possible. If space is limited, the 0.1uf capacitor in each power pin filter should be placed on the device side of the PCB and the other components can be placed on the opposite side. Power supply filter recommendations are a general guideline to be used for reducing external noise from coupling into the devices. The filter performance is designed for a wide range of noise frequencies. This low-pass filter starts to attenuate noise at approximately 10kHz. If a specific frequency noise component is known, such as switching power supplies frequencies, it is recommended that component values be adjusted and if required, additional filtering be added. Additionally, good general design practices for power plane voltage stability suggests adding bulk capacitance in the local area of all devices. The schematic example focuses on functional connections and is not configuration specific. Refer to the pin description and functional tables in the datasheet to ensure that the logic control inputs are properly set.
R1 3.3V R2 125 R3 125 AUTO_SEL REF_SEL Zo = 50 CLK0 nCLK0 Zo = 50 R6 84 R7 84 1 2 3 4 5 6 7 8 U1 VDD VOUT_SEL VDD VDD 32 31 30 29 28 27 26 25 CLK_IND 2.2K LD3 R5 LOR0 2.2K R4 LOR1 2.2K LD2 LD1
LVPECL Driv er
VD D R EF _SE L A U T O _S EL nc GN D nc V O U T _S EL VD D
3.3V R8 125 R9 125
PLL_BYPASS
CLK0 nCLK0 GND CLK1 nCLK1 PLL_BYPASS FB_IN nFB_IN
VDD LOR0 LOR1 CLK_IND GND FREQ_SEL OE VDDA
24 23 22 21 20 19 18 17
Q0 FREQ_SEL OE nQ0
Zo = 50 Ohm +
Zo = 50 Ohm
-
Zo = 50
CLK1 nCLK1
nF B _IN
F B _IN
nQ F B QFB VD D nQ 1 Q1 nQ 0 Q0 VD D
R10 50 VDDA R12 10
R11 50
Zo = 50 R13 84 R14 84 R15 50 R16 50 VDD VDD nQ1 Q1 nQ0 Q0 C1 0.1u
LVPECL Driv er
9 10 11 12 13 14 15 16
C2 10u
VDD=3.3V
BLM18BB221SN1 1 2 Ferrite Bead C4 VDD1 C5 10uF 0.1uF nQ1 Zo = 50 Ohm Q1 Zo = 50 Ohm +
3.3V
Logic Control Input Examples
VDD
Set Logic Input to '1'
RU1 1K
VDD
Set Logic Input to '0'
RU2 Not Install 3.3V 1 C6 0.1uF
C3 0.1uF
To Logic Input pins
RD1 Not Install RD2 1K
To Logic Input pins
BLM18BB221SN1 2 Ferrite Bead C7 10uF (U1, 11) C8 0.1u (U1, 16) C9 0.1u (U1, 24) C10 0.1u (U1, 25) (U1, 32) C11 0.1u VDD C12 0.1u R17 50 R18 50
Figure 6. ICS872S480 Schematic Layout
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ICS872S480 Data Sheet
DIFFERENTIAL-TO-HSTL ZERO DELAY CLOCK GENERATOR
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS872S480. Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for theICS872S480 is the sum of the core power plus the power dissipated in the load(s). The following is the power dissipation for VDD = 3.3V + 5% = 3.465V, which gives worst case results. • Power (core)MAX = VDD_MAX * (IDD_MAX + IDDA_MAX)= 3.465V * (275mA + 25mA) = 1039.5mW
2. Junction Temperature. Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad, and directly affects the reliability of the device. The maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond wire and bond pad temperature remains below 125°C. The equation for Tj is as follows: Tj = θJA * Pd_total + TA Tj = Junction Temperature θJA = Junction-to-Ambient Thermal Resistance Pd_total = Total Device Power Dissipation (example calculation is in section 1 above) TA = Ambient Temperature In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming no air flow and a multi-layer board, the appropriate value is 42.7°C/W per Table 7 below. Therefore, Tj for an ambient temperature of 70°C with all outputs switching is: 70°C + 1.040W * 42.7°C/W = 114.4°C. This is below the limit of 125°C. This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of board (multi-layer).
Table 7. Thermal Resistance θJA for 32 Lead VFQFN, Forced Convection
θJA vs. Air Flow Meters per Second Multi-Layer PCB, JEDEC Standard Test Boards 0 42.7°C/W 1 37.3°C/W 2.5 33.5°C/W
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Reliability Information
Table 8. θJA vs. Air Flow Table for a 32-lead VFQFN
θJA vs. Air Flow Meters per Second Multi-Layer PCB, JEDEC Standard Test Boards 0 42.7°C/W 1 37.3°C/W 2.5 33.5°C/W
Transistor Count
The transistor count for ICS872S480 is: 2110
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Package Outline and Package Dimensions
Package Outline - K Suffix for 32 Lead VFQFN
S eating Plan e Ind ex Area N A1 A3 L N 1 2 E2 (N -1)x e
E2 2
(Re f.) (Ref.)
(N -1)x e
(R ef.)
N &N Even
e (Ty p.) 2 If N & N
Anvil Anvil Singulation Singula tion
are Even
OR
To p View
b A D Chamfer 4x 0.6 x 0.6 max OPTIONAL 0. 08 C C
(Ref.)
e D2 2 D2
N &N Odd
Th er mal Ba se
Bottom View w/Type A ID
Bottom View w/Type C ID
2 1
CHAMFER
2 1
RADIUS
4
N N-1
4
N N-1
There are 2 methods of indicating pin 1 corner at the back of the VFQFN package are: 1. Type A: Chamfer on the paddle (near pin 1) 2. Type C: Mouse bite on the paddle (near pin 1)
Table 9. Package Dimensions
JEDEC Variation: VHHD-2/-4 All Dimensions in Millimeters Symbol Minimum Nominal Maximum N 32 A 0.80 1.00 A1 0 0.05 A3 0.25 Ref. b 0.18 0.25 0.30 8 ND & NE D&E 5.00 Basic D2 & E2 3.0 3.3 e 0.50 Basic L 0.30 0.40 0.50 Reference Document: JEDEC Publication 95, MO-220 ICS872S480BK REVISION A APRIL 19, 2011 18 ©2011 Integrated Device Technology, Inc. NOTE: The following package mechanical drawing is a generic drawing that applies to any pin count VFQFN package. This drawing is not intended to convey the actual pin count or pin layout of this device. The pin count and pinout are shown on the front page. The package dimensions are in Table 9.
ICS872S480 Data Sheet
DIFFERENTIAL-TO-HSTL ZERO DELAY CLOCK GENERATOR
Ordering Information
Table 10. Ordering Information
Part/Order Number 872S480BKLF 872S480BKLFT Marking ICS72S480BL ICS72S480BL Package “Lead-Free” 32 Lead VFQFN “Lead-Free” 32 Lead VFQFN Shipping Packaging Tray 2500 Tape & Reel Temperature 0°C to 70°C 0°C to 70°C
NOTE: Parts that are ordered with an "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications, such as those requiring extended temperature ranges, high reliability or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.
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ICS872S480 Data Sheet
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