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BAR67-04

BAR67-04

  • 厂商:

    INFINEON

  • 封装:

  • 描述:

    BAR67-04 - Silicon PIN Diode - Infineon Technologies AG

  • 数据手册
  • 价格&库存
BAR67-04 数据手册
BAR67... Silicon PIN Diode • For low loss RF switches and attenuators • Very low capacitance at zero volt reverse bias at frequencies above 1 GHz (typ. 0.25 pF) • Low forward resistance (typ. 1.5 Ω @ 5mA) • Low harmonics • Pb-free (RoHS compliant) package 1) • Qualified according AEC Q101 BAR67-02V BAR67-04 !  , ,  Type BAR67-02V BAR67-04 Package SC79 SOT23 Configuration single series LS(nH) 0.6 1.8 Marking T PMs Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Diode reverse voltage Forward current Total power dissipation TS ≤ 118°C, BAR67-02V TS ≤ 25°C, BAR67-04 Junction temperature Operating temperature range Storage temperature Thermal Resistance Parameter Junction - soldering point 2) BAR67-02V BAR67-04 1Pb-containing 2For Symbol VR IF Ptot Value 150 200 250 250 Unit V mA mW Tj T op T stg 150 -55 ... 125 -55 ... 150 °C Symbol RthJS Value ≤ 115 ≤ 290 Unit K/W package may be available upon special request calculation of RthJA please refer to Application Note Thermal Resistance 1 2007-04-19 BAR67... Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter DC Characteristics Breakdown voltage I(BR) = 5 µA Reverse current VR = 100 V Forward voltage IF = 50 mA AC Characteristics Diode capacitance VR = 5 V, f = 1 MHz VR = 0 V, f = 100 MHz VR = 0 V, f = 1 GHz VR = 0 V, f = 1.8 GHz Reverse parallel resistance VR = 0 V, f = 100 MHz VR = 0 V, f = 1 GHz VR = 0 V, f = 1.8 GHz Forward resistance I F = 5 mA, f = 100 MHz I F = 10 mA, f = 100 MHz Charge carrier life time I F = 10 mA, IR = 6 mA, measured at IR = 3 mA, RL = 100 Ω I-region width WI 13 µm τ rr rf 1.5 1 700 1.8 ns RP 25 4 2.5 Ω CT 0.35 0.35 0.25 0.23 0.55 0.9 kΩ pF Symbol min. V(BR) IR VF 150 - Values typ. 0.95 max. 20 1.2 Unit V nA V 2 2007-04-19 BAR67... Diode capacitance CT = ƒ (VR) f = Parameter Reverse parallel resistance RP = ƒ(V R) f = Parameter 10 4 KOhm F 0.5 10 3 0.4 0.35 1 MHz 100 MHz 1 GHz 1.8 GHz CT Rp 10 2 100 MHz 0.3 10 1 0.25 1.8 GHz 1 GHz 0.2 10 0 0.15 10 -1 0 0.1 0 5 10 15 20 25 30 V 40 5 10 15 20 25 30 V 40 VR VR Forward resistance rf = ƒ (IF ) f = 100MHz 10 3 Ohm Forward current IF = ƒ (VF) TA = Parameter 10 0 A 10 -1 10 2 10 -2 10 1 IF 10 -3 rf 10 -4 10 0 10 -5 -40 °C 25 °C 85 °C 125 °C 10 -1 -2 10 10 -1 10 0 10 1 mA 10 2 10 -6 0 0.2 0.4 0.6 0.8 V 1.2 IF VF 3 2007-04-19 BAR67... Forward current IF = ƒ (T S) BAR67-02V Forward current IF = ƒ (T S) BAR67-04 250 mA 220 mA 200 175 180 160 IF 90 105 120 °C IF 140 120 150 125 100 100 80 75 50 25 0 0 60 40 20 15 30 45 60 75 150 0 0 20 40 60 80 100 120 °C 150 TS TS Permissible Puls Load RthJS = ƒ (tp) BAR67-02V 10 3 K/W Permissible Pulse Load IFmax / I FDC = ƒ (t p) BAR67-02V 10 2 10 2 IFmax/IFDC 10 1 10 0 D=0.5 0.2 0.1 0.05 0.02 0.01 0.005 0 10 1 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 RthJS 10 -1 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 10 0 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 tP tP 4 2007-04-19 BAR67... Permissible Puls Load RthJS = ƒ (tp) BAR67-04 10 3 K/W 10 2 R thJS 10 1 10 0 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 10 -1 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 0 tP 5 2007-04-19 Package SC79 BAR67... Package Outline 0.2 0.8 ±0.1 10˚MAX. M A 0.13 -0.03 +0.05 2 1.6 ±0.1 0.55 ±0.04 Foot Print 1.35 0.35 Marking Layout (Example) 2005, June Date code 0.35 BAR63-02V Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel ø330 mm = 10.000 Pieces/Reel Standard 4 Reel with 2 mm Pitch 2 0.2 1.33 1.96 Cathode marking 0.4 0.93 8 0.2 ±0.05 0.66 Cathode marking 1 0.3 ±0.05 Cathode marking 10˚MAX. 1.2 ±0.1 A 6 2007-04-19 BAR67... Date Code marking for discrete packages with one digit (SCD80, SC79, SC75 1) ) CES-Code M onth 2 0 03 01 02 03 04 05 06 07 08 09 10 11 12 a b c d e f g h j k l n 2 0 04 p q r s t u v x y z 2 3 2005 A B C D E F G H J K L N 2006 P Q R S T U V X Y Z 4 5 2 0 07 a b c d e f g h j k l n 2008 p q r s t u v x y z 2 3 2009 A B C D E F G H J K L N 2010 P Q R S T U V X Y Z 4 5 2011 a b c d e f g h j k l n 2012 p q r s t u v x y z 2 3 2 0 13 A B C D E F G H J K L N 2014 P Q R S T U V X Y Z 4 5 1 ) New Marking Layout for SC75, implemented at October 2005. . 7 2007-04-19 Package SOT23 BAR67... Package Outline 0.15 MIN. 1 ±0.1 0.1 MAX. 1.3 ±0.1 2.9 ±0.1 3 B 2.4 ±0.15 10˚ MAX. 0.4 +0.1 -0.05 1) 1 2 10˚ MAX. C 0.95 1.9 0.08...0.1 A 5 0...8˚ 0.25 M B C 0.2 M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 0.9 0.8 1.2 Marking Layout (Example) Manufacturer EH s Pin 1 0.9 1.3 2005, June Date code (YM) BCW66 Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.9 2.13 2.65 0.2 8 Pin 1 3.15 1.15 8 2007-04-19 BAR67... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com ). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 9 2007-04-19
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