BSC059N03SG

BSC059N03S G OptiMOS™2 Power-Transistor Features • Fast switching MOSFET for SMPS • Optimized technology for notebook DC/DC converters • Qualified according to JEDEC1 for target applications • Logic level / N-channel • Excellent gate charge x RDS(on) product (FOM) • Very low on-resistance RDS(on) • Superior thermal resistance • Avalanche rated; dv/dt rated • Pb-free lead plating; RoHS compliant • Halogen-free according to IEC61249-2-21 Type BSC059N03S G Package PG-TDSON-8 Marking 59N03S Product Summary V DS R DS(on),max ID 30 5.5 73 PG-TDSON-8 V mΩ A Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Continuous drain current Symbol Conditions ID T C=25 °C T C=100 °C T A=25 °C, R thJA=45 K/W 2) Pulsed drain current Avalanche energy, single pulse Reverse diode d v /dt Gate source voltage Power dissipation I D,pulse E AS dv /dt V GS P tot T C=25 °C T A=25 °C, R thJA=45 K/W 2) Operating and storage temperature IEC climatic category; DIN IEC 68-1 Rev. 1.56 page 1 T j, T stg T C=25 °C3) I D=50 A, R GS=25 Ω I D=50 A, V DS=24 V, di /dt =200 A/µs, T j,max=150 °C Value 73 46 17.5 200 150 6 ±20 48 2.8 -55 ... 150 55/150/56 2009-10-22 °C mJ kV/µs V W Unit A BSC059N03S G Parameter Symbol Conditions min. Thermal characteristics Thermal resistance, junction - case R thJC bottom top Thermal resistance, junction - ambient R thJA minimal footprint 6 cm2 cooling area2) 2.6 20 62 45 K/W Values typ. max. Unit Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current V (BR)DSS V GS=0 V, I D=1 mA V GS(th) I DSS V DS=V GS, I D=35 µA V DS=30 V, V GS=0 V, T j=25 °C V DS=30 V, V GS=0 V, T j=125 °C Gate-source leakage current Drain-source on-state resistance I GSS R DS(on) V GS=20 V, V DS=0 V V GS=4.5 V, I D=50 A V GS=10 V, I D=50 A Gate resistance Transconductance RG g fs |V DS|>2|I D|R DS(on)max, I D=50 A 30 1.2 1.6 0.1 2 1 µA V 0.4 42 10 10 6.9 4.6 0.9 84 100 100 8.6 5.5 1.8 Ω S nA mΩ 1) 2) J-STD20 and JESD22 2 Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 3) See figure 3 Rev. 1.56 page 2 2009-10-22 BSC059N03S G Parameter Symbol Conditions min. Dynamic characteristics Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics 4) Gate to source charge Gate charge at threshold Gate to drain charge Switching charge Gate charge total Gate plateau voltage Gate charge total, sync. FET Output charge Reverse Diode Diode continous forward current Diode pulse current Diode forward voltage IS I S,pulse V SD T C=25 °C V GS=0 V, I F=48 A, T j=25 °C V R=15 V, I F=I S, di F/dt =400 A/µs 0.87 48 200 1.1 V A Q gs Q g(th) Q gd Q sw Qg V plateau Q g(sync) Q oss V DS=0.1 V, V GS=0 to 5 V V DD=15 V, V GS=0 V V DD=15 V, I D=25 A, V GS=0 to 5 V 6.3 3.2 4.0 7.1 15 3.1 14 17 8.4 4.3 6.0 10 21 18 23 V nC nC C iss C oss Crss t d(on) tr t d(off) tf V DD=15 V, V GS=10 V, I D=25 A, R G=2.7 Ω V GS=0 V, V DS=15 V, f =1 MHz 2010 720 93 5.7 4.8 22 3.8 2670 950 140 8.5 7.2 33 5.7 ns pF Values typ. max. Unit Reverse recovery charge Q rr - - 10 nC 4) See figure 16 for gate charge parameter definition Rev. 1.56 page 3 2009-10-22 BSC059N03S G 1 Power dissipation P tot=f(T C) 2 Drain current I D=f(T C); V GS≥10 V 60 80 50 60 40 P tot [W] 30 I D [A] 0 40 80 120 160 40 20 20 10 0 0 0 40 80 120 160 T C [°C] T C [°C] 3 Safe operating area I D=f(V DS); T C=25 °C; D =0 parameter: t p 103 1000 4 Max. transient thermal impedance Z thJC=f(t p) parameter: D =t p/T 101 10 limited by on-state resistance 1 µs 102 10 µs 100 0.5 100 µs DC 100 1 101 10 Z thJC [K/W] 0.2 I D [A] 1 ms 0.1 0.05 10 ms 10-1 0.1 0.02 100 1 0.01 single pulse 10-1 0.1 0.1 1 10 100 10-2 2 0.01 0 0 0 0 0 0 10 -1 10 0 V DS [V] 10 1 10 10-6 10-5 10-4 t p [s] 10-3 10-2 10-1 Rev. 1.56 page 4 2009-10-22 BSC059N03S G 5 Typ. output characteristics I D=f(V DS); T j=25 °C parameter: V GS 120 10 V 4.5 V 6 Typ. drain-source on resistance R DS(on)=f(I D); T j=25 °C parameter: V GS 25 2.8 V 3.4 V 3.7 V 4V 100 3.2 V 4V 20 3V 80 3.7 V 60 R DS(on) [mΩ ] 15 I D [A] 10 4.5 V 40 3.4 V 3.2 V 20 5 10 V 3V 2.8 V 0 0 1 2 3 0 0 20 40 60 80 100 V DS [V] I D [A] 7 Typ. transfer characteristics I D=f(V GS); |V DS|>2|I D|R DS(on)max parameter: T j 160 8 Typ. forward transconductance g fs=f(I D); T j=25 °C 140 140 120 120 100 100 80 g fs [S] 150 °C 25 °C I D [A] 80 60 60 40 40 20 20 0 0 1 2 3 4 5 0 0 20 40 60 80 V GS [V] I D [A] Rev. 1.56 page 5 2009-10-22 BSC059N03S G 9 Drain-source on-state resistance R DS(on)=f(T j); I D=50 A; V GS=10 V 10 Typ. gate threshold voltage V GS(th)=f(T j); V GS=V DS parameter: I D 10 2.5 8 2 350 µA R DS(on) [mΩ ] 6 98 % V GS(th) [V] 1.5 35 µA typ 4 1 2 0.5 0 -60 -20 20 60 100 140 180 0 -60 -20 20 60 100 140 180 T j [°C] T j [°C] 11 Typ. capacitances C =f(V DS); V GS=0 V; f =1 MHz 12 Forward characteristics of reverse diode I F=f(V SD) parameter: T j 104 10000 103 150 °C Ciss 150°C, 98% 25 °C 102 25°C, 98% 103 1000 Coss 101 C [pF] I F [A] 100 102 Crss 100 10-1 101 10 10-2 5 10 15 20 25 30 0 0.4 0.8 1.2 1.6 0 V DS [V] V SD [V] Rev. 1.56 page 6 2009-10-22 BSC059N03S G 13 Avalanche characteristics I AS=f(t AV); R GS=25 Ω parameter: T j(start) 100 14 Typ. gate charge V GS=f(Q gate); I D=25 A pulsed parameter: V DD 12 10 125 °C 100 °C 25 °C 6V 15 V 8 24 V 10 V GS [V] 1 10 100 1000 I AV [A] 6 4 2 1 0 0 10 20 30 t AV [µs] Q gate [nC] 15 Drain-source breakdown voltage V BR(DSS)=f(T j); I D=1 mA 16 Gate charge waveforms 36 V GS 34 Qg 32 30 V BR(DSS) [V] 28 26 V g s(th) 24 22 Q g(th) Q gs -60 -20 20 60 100 140 180 Q sw Q gd Q g ate 20 T j [°C] Rev. 1.56 page 7 2009-10-22 BSC059N03S G Package Outline PG-TDSON-8: Outline PG-TDSON-8 Rev. 1.56 page 8 2009-10-22 BSC059N03S G Package Outline PG-TDSON-8: Tape Dimensions in mm Rev. 1.56 page 9 2009-10-22 BSC059N03S G Published by Infineon Technologies AG 81726 Munich, Germany © 2008 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.56 page 10 2009-10-22