SP0000-87993

IPB25N06S3L-22 IPI25N06S3L-22, IPP25N06S3L-22 OptiMOS®-T Power-Transistor Features • N-channel - Logic Level - Enhancement mode • Automotive AEC Q101 qualified • MSL1 up to 260°C peak reflow • 175°C operating temperature • Green package (lead free) • Ultra low Rds(on) • 100% Avalanche tested • ESD Class 1C (HBM) EIA/JESD22-A114-B Product Summary V DS R DS(on),max (SMD version) ID 55 21.3 25 V mΩ A PG-TO263-3-2 PG-TO262-3-1 PG-TO220-3-1 Type IPB25N06S3L-22 IPI25N06S3L-22 IPP25N06S3L-22 Package PG-TO263-3-2 PG-TO262-3-1 PG-TO220-3-1 Ordering Code SP0000-87994 SP0000-87996 SP0000-87993 Marking 3N06L22 3N06L22 3N06L22 Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Continuous drain current1) Symbol ID Conditions T C=25 °C, V GS=10 V T C=100 °C, V GS=10 V2) Pulsed drain current2) Avalanche energy, single pulse3) Drain gate voltage2) Gate source voltage4) Power dissipation Operating and storage temperature IEC climatic category; DIN IEC 68-1 I D,pulse E AS V DG V GS P tot T j, T stg T C=25 °C T C=25 °C I D=12 A Value 25 25 100 60 55 ±16 50 -55 ... +175 55/175/56 mJ V V W °C Unit A Rev. 1.0 page 1 2005-09-16 IPB25N06S3L-22 IPI25N06S3L-22, IPP25N06S3L-22 Parameter Symbol Conditions min. Thermal characteristics2) Thermal resistance, junction - case Thermal resistance, junction ambient, leaded SMD version, device on PCB R thJC R thJA R thJA minimal footprint 6 cm2 cooling area5) Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current V (BR)DSS V GS=0 V, I D= 1 mA V GS(th) I DSS V DS=V GS, I D=20 µA V DS=55 V, V GS=0 V, T j=25 °C V DS=55 V, V GS=0 V, T j=125 °C2) Gate-source leakage current Drain-source on-state resistance I GSS R DS(on) V GS=16 V, V DS=0 V V GS=5 V, I D=11 A V GS=5 V, I D=11 A, SMD version V GS=10 V, I D=17 A V GS=10 V, I D=17 A, SMD version 55 1.2 1.7 0.01 2.2 1 µA V 3.3 62 62 40 K/W Values typ. max. Unit - 1 1 32.9 32.6 100 100 39.9 39.6 nA mΩ - 18.4 21.6 - 18.1 21.3 Rev. 1.0 page 2 2005-09-16 IPB25N06S3L-22 IPI25N06S3L-22, IPP25N06S3L-22 Parameter Symbol Conditions min. Dynamic characteristics2) Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics2) Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Reverse Diode Diode continous forward current2) Diode pulse current2) Diode forward voltage Reverse recovery time2) IS I S,pulse V SD t rr T C=25 °C V GS=0 V, I F=25 A, T j=25 °C V R=27.5 V, I F=I S, di F/dt =100 A/µs 0.6 0.9 32 25 100 1.3 V ns A Q gs Q gd Qg V plateau V DD=11 V, I D=25 A, V GS=0 to 10 V 11 6 31 4.7 47 V nC C iss C oss Crss t d(on) tr t d(off) tf V DD=27.5 V, V GS=10 V, I D=25 A, R G=14.8 Ω V GS=0 V, V DS=25 V, f =1 MHz 2260 283 270 9 26 30 43 ns pF Values typ. max. Unit Reverse recovery charge2) 1) Q rr - 28 - nC Current is limited by bondwire; with an R thJC = 3.3 K/W the chip is able to carry 31 A at 25°C. For detailed information see Application Note ANPS071E at www.infineon.com/optimos 2) Defined by design. Not subject to production test. See diagrams 12 and 13. Qualified at -5V and +16V. 3) 4) 5) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. Rev. 1.0 page 3 2005-09-16 IPB25N06S3L-22 IPI25N06S3L-22, IPP25N06S3L-22 1 Power dissipation P tot = f(T C); V GS ≥ 4 V 2 Drain current I D = f(T C); V GS ≥ 4 V 50 30 40 20 30 P tot [W] 20 10 10 0 0 50 100 150 200 I D [A] 0 0 50 100 150 200 T C [°C] T C [°C] 3 Safe operating area I D = f(V DS); T C = 25 °C; D = 0 parameter: t p 1000 4 Max. transient thermal impedance Z thJC = f(t p) parameter: D =t p/T 101 0.5 100 100 10 µs 0.1 Z thJC [K/W] limited by on-state resistance I D [A] 100 µs 10-1 10 1 ms 10-2 single pulse 1 0.1 1 10 100 10-3 10-7 10-6 10-5 10-4 10-3 10-2 10-1 100 V DS [V] t p [s] Rev. 1.0 page 4 2005-09-16 IPB25N06S3L-22 IPI25N06S3L-22, IPP25N06S3L-22 5 Typ. output characteristics I D = f(V DS); T j = 25 °C parameter: V GS 100 10 V 10V 8V 8V 6 Typ. drain-source on resistance R DS(on) = f(I D); T j = 25 °C parameter: V GS 60 55 7V 4.5 V 5V 5.5 V 80 6.5 V 50 45 I D [A] 6V R DS(on) [mΩ] 60 40 35 6V 40 5.5 V 30 6.5 V 5V 25 20 15 7V 8V 10 V 20 4.5 V 0 0 2 4 6 10 0 10 20 30 40 50 V DS [V] I D [A] 7 Typ. transfer characteristics I D = f(V GS); V DS = 4 V parameter: T j 60 8 Typ. drain-source on-state resistance R DS(on) = f(T j); I D = 25 A; V GS = 10 V 35 50 30 -55 °C 40 R DS(on) [mΩ ] 6 25 I D [A] 25 °C 30 175 °C 20 20 10 15 0 0 1 2 3 4 5 10 -60 -20 20 60 100 140 180 V GS [V] T j [°C] Rev. 1.0 page 5 2005-09-16 IPB25N06S3L-22 IPI25N06S3L-22, IPP25N06S3L-22 9 Typ. gate threshold voltage V GS(th) = f(T j); V GS = V DS parameter: I D 3 104 10 Typ. capacitances C = f(V DS); V GS = 0 V; f = 1 MHz 2.5 Ciss 2 V GS(th) [V] C [pF] 200µA 1.5 20µA 103 Coss 1 Crss 0.5 0 -60 -20 20 60 100 140 180 0 5 10 15 20 25 30 T j [°C] V DS [V] 11 Typical forward diode characteristicis IF = f(VSD) parameter: T j 102 12 Typ. avalanche characteristics I AV = f(t AV) parameter: T j(start) 100 I AV [A] I F [A] 25°C 101 10 100°C 175 °C 25 °C 150°C 100 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1 1 10 100 1000 V SD [V] t AV [µs] Rev. 1.0 page 6 2005-09-16 IPB25N06S3L-22 IPI25N06S3L-22, IPP25N06S3L-22 13 Typical avalanche energy E AS = f(T j); parameter: I D 180 160 140 120 100 8A 5A 14 Drain-source breakdown voltage V BR(DSS) = (T j); I D = 1 mA 66 64 62 60 V BR(DSS) [V] 50 100 150 200 58 56 54 52 50 48 46 E AS [mJ] 80 60 40 20 0 0 12A -60 -20 20 60 100 140 180 T j [°C] T j [°C] 15 Typ. gate charge V GS = f(Q gate); I D = 25 A pulsed parameter: V DD 12 16 Gate charge waveforms 10 11 V 44 V VG Qg 8 V GS [V] 6 4 2 Qgat Qg Qg 0 0 10 20 30 40 50 Q gate [nC] Rev. 1.0 page 7 2005-09-16 IPB25N06S3L-22 IPI25N06S3L-22, IPP25N06S3L-22 Published by Infineon Technologies AG St.-Martin-Straße 53 D-81541 München © Infineon Technologies AG 2004 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices, please contact your nearest Infineon Technologies Office (www.infineon.com) Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact your nearest Infineon Technologies Office. Infineon Technologies' components may only be used in life-support devices or systems with the expressed written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.0 page 8 2005-09-16